Page 1
DATA SHEET
GaAs INTEGRATED CIRCUIT
µµµµ
PG158TB
L, S- BAND SPDT SWITCH
DESCRIPTION
The µPG158TB is a L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
cellular, cordless telephone and other L, S-band wireless application. The device can operate from 500 MHz to 2.5
GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual
6-pin minimold easy to install and contributes to miniaturizing the system.
FEATURES
• Low Insertion Loss: L
• High isolation: ISL = 27 dB TYP. @V
• Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm)
INS
= 0.3 dB TYP. @V
INS
L
= 0.4 dB TYP. @V
INS
L
= 0.5 dB TYP. @V
CONT
= +3.0 V/0 V, f = 1 GHz
CONT
= +3.0 V/0 V, f = 2 GHz
CONT
= +3.0 V/0 V, f = 2.5 GHz
CONT
= +3.0 V/0 V, f = 0.5 to 2 GHz
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• PCS, WLAN, WLL and Bluetooth applications
ORDERING INFORMATION
Part Number Marking Package Supplying Form
µ
PG158TB-E3 G1M 6-pin super minimold Embossed tape 8 mm wide.
Pin 1, 2, 3 face to tape perf oration side.
Qty 3 kp/reel.
Remark
Caution The IC must be handled with care to prevent static discharge because its circuit is composed of
To order evaluation samples, please contact your local NEC sales office. (Part number for sample
order:
GaAs MES FET.
PG158TB)
µ
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14267EJ2V0DS00 (2nd edition)
Date Published November 1999 N CP(K)
Printed in Japan
The mark shows major revised points.
1999©
Page 2
µµµµ
PG158TB
ABSOLUTE MAXIMUM RATINGS (TA = +25
Parameter Symbol Ratings Unit
Control Voltage 1, 2 V
Input Power P
Total Power Dissipat i on P
Operating Temperature T
Storage Temperature T
Condition 2.5 ≤ | V
Note
Remarks1.
CONT1
Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85 °C
Operation in excess of any one of these parameters may result in permanent damage.
2.
− V
CONT2
| ≤ 6.0 V
PIN CONNECTIONS
Pin No. Connection Pin No. Connection
1OUT14V
2GND5 IN
3OUT26V
CONT2
CONT1
C)
°°°°
CONT1, 2
in
tot
A
stg
6.0 to +6.0
−
(T op Vie w)
3 4
2 5
1 6
Note
+28 dBm
0.15 W
45 to +85
−
45 to +150
−
(Bottom View)
4 3
5 2
6 1
V
C
°
C
°
RECOMMENDED OPERATING CONDITIONS (TA = +25
Parameter Symbol MIN. TYP. MAX. Unit
Control Voltage (High) V
Control Voltage (Low) V
CONT
CONT
+2.5 +3.0 +5.3 V
0.2 0 +0.2 V
−
C)
°°°°
2
Data Sheet P14267EJ2V0DS00
Page 3
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25 °C, V
CONT1
= 3 V, V
blocking capacitors value; 51 pF)
Parameter Sym bol Test Condi tions MIN. TYP. MAX. Unit
CONT2
= 0 V or V
CONT1
= 0 V, V
CONT2
µµµµ
PG158TB
= 3 V, Off chip DC
Insertion Loss L
Isolation ISL
Input Return Loss RL
Output Return Loss RL
Input Power at 0.1 dB
Compression Point
Input Power at 1 dB
Compression Point
Note2
Note2
in(0.1 dB)
P
in(1 dB)
P
Switching Speed t
or P
CONT
in(1 dB)
Control Current I
Notes1.
Characteristic for reference at 2.0 to 2.5 GHz
in(0.1 dB)
P
2.
1 dB than that of linear range. All other characteristics are measured in linear range.
Cautions 1. When the
µµµµ
No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to
accommodate the frequency of operation, band width, switching speed and the condition
with actual board of your system.
The range of recommended DC blocking capacitor value is less than 100 pF.
2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as
possible to avoid parasitic parameters.
INS
sw
f = 0.5 to 1.0 GHz
f = 2.0 GHz
f = 2.5 GHz
−
−
−
f = 0.5 to 2.0 GHz 22 27
f = 2.5 GHz
in
out
f = 0.5 to 2.0 GHz 13 19
f = 0.5 to 2.0 GHz 13 19
f = 1.0 GHz, V
f = 1.0 GHz, V
CONT
= 3 V/0 V
CONT
= 3 V/0 V 22.0 26.5
−
−
−
CONT
V
= 3 V/0 V
−
0.3 0.55
0.4 0.65
Note1
0.5
−
−
Note1
23
−
−
−
23.0
−
−
50 200 ns
0.5 10
dB
dB
dB
dB
dBm
dBm
A
µ
is measured the input power level when the insertion loss increases more 0.1 dB or
PG158TB is used it is necessary to use DC blocking capacitors for No. 1 (OUT1),
Data Sheet P14267EJ2V0DS00
3
Page 4
TYPICAL CHARACTERISTICS
µµµµ
PG158TB
TEST CONDITIONS: V
CH1
S11 log MAG 10 dB/ REF 0 dB
MARKER 1
1 GHz
0
–10
–20
Input Return Loss RLin (dB)
–30
–40
START 0.300 000 000 GHz
1
CONT
= 3 V/0 V, Pin = 0 dBm, TA = +25 °C
IN
2
Frequency f (GHz)
OUT1
OUT2
50 Ω
–23.433 dB
1:
1 GHz
–30.102 dB
2:
1.5 GHz
–25.504 dB
3:
2 GHz
–16.018 dB
4:
2.5 GHz
4
3
STOP 3.300 000 000 GHz
IN-OUT1 ISOLATION vs. FREQUENCYIN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S21 log MAG 10 dB/ REF 0 dB
MARKER 1
1 GHz
0
–10
Isolation ISL (dB)
–20
–30
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
1
2
Frequency f (GHz)
3
–28.047 dB
1:
1 GHz
–28.565 dB
2:
1.5 GHz
–25.835 dB
3:
2 GHz
–22.507 dB
4:
2.5 GHz
4
CH1 S21 log MAG 1 dB/ REF 0 dB
1:
–0.574 dB
1 GHz
2:
MARKER 1
1 GHz
0
–1
–2
Insertion Loss LINS (dB)
–3
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
1
2
Frequency f (GHz)
3
–0.662 dB
1.5 GHz
–0.795 dB
3:
2 GHz
–1.111 dB
4:
2.5 GHz
4
Caution This data is including loss of the test fixture.
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCYIN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S22 log MAG 10 dB/ REF 0 dB
MARKER 1
1 GHz
0
–10
–20
Output Return Loss RLout (dB)
–30
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
1
2
Frequency f (GHz)
3
1:
–22.502 dB
1 GHz
2:
–28.139 dB
1.5 GHz
3:
–25.867 dB
2 GHz
–15.601 dB
4:
2.5 GHz
4
4
Data Sheet P14267EJ2V0DS00
Page 5
µµµµ
PG158TB
TEST CIRCUIT
TA= +25 °C, V
CONT1
= +3 V, V
Off chip DC blocking capacitors value: C0 = 51 pF, C1 = 1000 pF (Bypass), Using NEC standard evaluation board
CONT2
= 0 V or V
CONT1
= 0 V, V
OUT1 OUT2
1 2 3
6 5 4
C1
CONT2
= +3 V, f = 2 GHz
C0C0
C0
C1
EVALUATION BOARD
V
CONT1
CONT1 VCONT2IN
V
IN V
CONT2
OUT2OUT1
Data Sheet P14267EJ2V0DS00
5
Page 6
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
V
CONT1
V
CONT(H)
V
CONT2
V
CONT(H)
V
CONT(L)
µµµµ
PG158TB
IN
CONT(L)
V
IN
PACKAGE DIMENSIONS
6 PIN SUPER MINIMOLD (UNIT: mm)
+0.1
0.2
–0
OUT1
OUT2
OUT1
OUT2
0.1 MIN.
IN
IN
0.15
+0.1
–0
OUT1
OUT2
OUT1
OUT2
2.1 ±0.1
1.25 ±0.1
0.65 0.65
1.3
2.0 ±0.2
0 to 0.1
0.7
0.9 ±0.1
6
Data Sheet P14267EJ2V0DS00
Page 7
µµµµ
PG158TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering method and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Solderi ng Condi tions
Infrared Reflow Package peak temperature: 235 °C or bel ow
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t: None
VPS Package peak temperature: 215 ° C or bel ow
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t: None
Wave Soldering Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limi t: None
Partial Heating Pin temperature: 300 °C
Time: 3 seconds or less (per pi n row)
Exposure limit: None
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Note
Note
Note
Note
Note
Recommended Condition
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P14267EJ2V0DS00
7
Page 8
µµµµ
PG158TB
CAUTION
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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