Datasheet UPG154TB-E3, UPG154TB Datasheet (NEC)

Page 1
DATA SHEET
GaAs INTEGRATED CIRCUIT
µµµµ
PG154TB
DESCRIPTION
The µPG154TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system.
FEATURES
• Low Insertion Loss : L
• High Power Switching: P
• Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm)
INS
= 0.65 dB TYP. @V
in (1 dB)
= +30 dBm TYP. @V
CONT
= +3.0 V/0 V, VDD = +3.0 V, CX = 2.0 pF, f = 2 GHz
CONT
= +3.0 V/0 V, VDD = +3.0 V, CX = 2.0 pF, f = 2 GHz
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• PCS, WLAN and WLL applications
ORDERING INFORMATION
Part Number Marking Package Supplying Form
µ
PG154TB-E3 G1K 6-pin super minimold Embossed tape 8 mm wide.
Pin 1, 2, 3 face to tape perf oration side. Qty 3 kp/reel.
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
PG154TB)
µ
Caution The IC must be handled with care to prevent static discharge because its circuit is composed of
GaAs MES FET.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P13656EJ2V0DS00 (2nd edition) Date Published September 1999 N CP(K) Printed in Japan
The mark shows major revised points.
1998, 1999©
Page 2
µµµµ
PG154TB
ABSOLUTE MAXIMUM RATINGS (TA = +25
Parameter Symbol Ratings Unit
– V
CONT1, 2
DD
in
tot
A
stg
CONT2
| ≤ 6.0 V
Control Voltage 1, 2 V Supply Voltage V Input Power P Total Power Dissipat i on P Operating Temperature T Storage Temperature T
Condition 2.5 ≤ | V
Note
Remarks 1.
Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, T Operation in excess of any one of these parameters may result in permanent damage.
2.
CONT1
PIN CONNECTIONS
Pin No. Connection Pin No. Connection
1OUT14V 2VDD5IN 3OUT26V
CONT2
CONT1
C)
°°°°
–6.0 to +6.0
Note
5.0 V
+31 dBm
0.15 W
–45 to +85
–55 to +150
(Top View) (Bottom View)
3 4
2 5
1 6
V
C
°
C
°
A
= +85°C
G1K
4 3
5 2
6 1
RECOMMENDED OPERATING CONDITIONS (TA = +25
Parameter Symbol MIN. TYP. MAX. Unit
Control Voltage (Low) V Control Voltage (High) V Supply Voltage V
CONT
CONT
DD
–0.2 0 +0.2 V +2.5 +3.0 +5.3 V +2.5 V
°°°°
C)
CONT(H)
CONT(H)
V
+ 0.3 V
2
Data Sheet P13656EJ2V0DS00
Page 3
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25°C, V VDD = 3.0 V, Off chip DC blocking capacitors value; 51 pF)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
CONT1
= 3 V, V
CONT2
= 0 V or V
CONT1
= 0 V, V
CONT2
= 3 V, ZO = 50 Ω,
µµµµ
PG154TB
Insertion Loss L
INS
Isolation ISL
Input Return Loss RL
Output Return Loss RL
Input Power at 0.1 dB Compression Point
Input Power at 1 dB Compression Point
Note
Note
Switching Speed t Control Current I
Note
in (1 dB)
P
and P
in (0.1 dB)
in (0.1 dB)
P
in (1 dB)
P
sw
CONT
are measured the input power level when the insertion loss increase more 1 dB or 0.1
dB than that of linear range. All other characteristics are measured in linear range.
f = 100 M to 1.0 GHz,
X
= 12.0 pF
C f = 2.0 GHz, CX = 2.0 pF f = 1.0 GHz, CX = 12.0 pF 20 24 f = 1.5 GHz, CX = 4.5 pF f = 2.0 GHz, C
in
f = 100 M to 2.0 GHz,
X
= 2.0 pF
C
out
f = 100 M to 2.0 GHz,
X
= 2.0 pF
C
X
= 2.0 pF 18 21
f = 2.0 GHz, CX = 2.0 pF
f = 2.0 GHz, CX = 2.0 pF 27 30
CONT
V
= 3 V/0 V
0.30 0.65
0.65 0.90
22
11 15
11 15
26.5
30
dBm
dBm
210
dB
dB
dB
dB
ns
A
µ
Cautions 1. The value of trap capacitor to improve the isolation performance should be chosen to
accommodate the operating frequency, band width, switching speed and the condition with actual board of your system. The distance between IC’s No.2 pin and trap capacitor C should be placed as shorter as possible to avoid parasitic parameters.
2. When the
PG154TB is used, it is necessary to use DC blocking capacitors for No.1 (OUT1),
µµµµ
No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the operating frequency, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF.
X
Data Sheet P13656EJ2V0DS00
3
Page 4
TYPICAL CHARACTERISTICS (Cx = 12 pF)
µµµµ
PG154TB
TEST CONDITIONS: V
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S
11
(dB)
in
Input Return Loss RL
–10 –20 –30 –40
MARKER 1 1 GHz
0
1
CONT
= 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board.
IN
OUT1 OUT2
50
IN-OUT1 ISOLATION vs. FREQUENCY
10 dB/REF 0 dB
1:
–15.819 dB
CH1 S12log MAGlog MAG 10 dB/REF 0 dB
1 GHz
2:
–17.331 dB
1.5 GHz
3:
–15.135 dB
2 GHz
4:
–12.383 dB
2.5 GHz
2
3
4
Isolation ISL (dB)
–10 –20
MARKER 1 1 GHz
0
2
1
–30 –40
1:
–25.11 dB
1 GHz
2:
–16.514 dB
1.5 GHz
3:
–9.938 dB
2 GHz
4:
–5.895 dB
2.5 GHz
3
4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S21log MAG 1 dB/REF 0 dB
–0.705 dB
1:
1 GHz
–0.913 dB
2:
1.5 GHz
3:
(dB)
INS
MARKER 1 1 GHz
0
–1 –2
Insertion Loss L
–3
1
2
3
–1.684 dB
4:
–3.617 dB
4
2 GHz
2.5 GHz
–4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Caution This data is including loss of the test fixture.
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S22log MAG 10 dB/REF 0 dB
–16.072 dB
1:
–16.268 dB
2:
(dB)
out
–10
0
MARKER 1 1 GHz
1
2
3:
–11.895 dB
4:
–8.346 dB
4
3
–20 –30
Output Return Loss RL
–40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
1 GHz
1.5 GHz 2 GHz
2.5 GHz
4
Data Sheet P13656EJ2V0DS00
Page 5
TYPICAL CHARACTERISTICS (Cx = 4.5 pF)
µµµµ
PG154TB
TEST CONDITIONS: V
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S
11
(dB)
in
Input Return Loss RL
–10 –20 –30 –40
MARKER 2
1.5 GHz
0
1
CONT
= 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board.
IN
OUT1 OUT2
50
IN-OUT1 ISOLATION vs. FREQUENCY
10 dB/REF 0 dB
1:
–16.788 dB
CH1 S12log MAGlog MAG 10 dB/REF 0 dB
1 GHz
2:
–17.799 dB
1.5 GHz
3:
–14.495 dB
2 GHz
4:
–10.133 dB
2.5 GHz
2
3
4
Isolation ISL (dB)
–10 –20
MARKER 2
1.5 GHz
0
1
2
–30 –40
–14.948 dB
1:
1 GHz
–22.345 dB
2:
1.5 GHz
–13.136 dB
3:
2 GHz
–5.559 dB
4:
2.5 GHz
3
4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S21log MAG 1 dB/REF 0 dB
1:
–0.802 dB
1 GHz
2:
–0.744 dB
1.5 GHz
3:
(dB)
INS
MARKER 2
1.5 GHz
0
–1 –2
Insertion Loss L
–3
1
2
3
–1.241 dB
4:
–3.255 dB
2.5 GHz
4
2 GHz
–4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Caution This data is including loss of the test fixture.
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S22log MAG 10 dB/REF 0 dB
–17.437 dB
1:
–19.166 dB
2:
(dB)
out
–10
0
MARKER 2
1.5 GHz
1
2
3:
–13.512 dB
4:
–8.162 dB
4
3
–20 –30
Output Return Loss RL
–40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
1 GHz
1.5 GHz 2 GHz
2.5 GHz
Data Sheet P13656EJ2V0DS00
5
Page 6
TYPICAL CHARACTERISTICS (Cx = 2 pF)
µµµµ
PG154TB
TEST CONDITIONS: V
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S
11
(dB)
in
Input Return Loss RL
–10 –20 –30 –40
MARKER 3 2 GHz
0
1
CONT
= 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board.
IN
OUT1 OUT2
50
IN-OUT1 ISOLATION vs. FREQUENCY
10 dB/REF 0 dB
1:
–16.635 dB
CH1 S12log MAGlog MAG 10 dB/REF 0 dB
1 GHz
2:
–20.537 dB
1.5 GHz
3:
–16.53 dB
2 GHz
4:
–10.019 dB
2.5 GHz
4
2
3
Isolation ISL (dB)
–10 –20
0
MARKER 3 2 GHz
1
2
–30 –40
1:
–12.2 dB
1 GHz
2:
–13.778 dB
1.5 GHz
3:
–20.075 dB
2 GHz
4:
–11.954 dB
2.5 GHz
4
3
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S21log MAG 1 dB/REF 0 dB
1:
–0.980 dB
1 GHz
2:
–0.927 dB
1.5 GHz
3:
(dB)
INS
MARKER 3 2 GHz
0
–1 –2
Insertion Loss L
1
2
3
–0.952 dB
4:
–1.972 dB
2.5 GHz
4
2 GHz
–3 –4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Caution This data is including loss of the test fixture.
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S22log MAG 10 dB/REF 0 dB
1:
–16.683 dB
2:
–21.59 dB
(dB)
out
MARKER 3 2 GHz
0
–10
1
–20 –30
Output Return Loss RL
2
3:
–17.13 dB
4:
–9.277 dB
4
3
–40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
1 GHz
1.5 GHz 2 GHz
2.5 GHz
6
Data Sheet P13656EJ2V0DS00
Page 7
TYPICAL CHARACTERISTICS (Cx = 13 pF)
µµµµ
PG154TB
TEST CONDITIONS: V
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S
11
(dB)
in
Input Return Loss RL
–10 –20 –30 –40
MARKER 1 1 GHz
0
1
CONT
= 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer.
IN
OUT1 OUT2
50
IN-OUT1 ISOLATION vs. FREQUENCY
10 dB/REF 0 dB
1:
–14.995 dB
CH1 S12log MAGlog MAG 10 dB/REF 0 dB
1 GHz
2:
–18.465 dB
1.5 GHz
3:
–19.04 dB
2 GHz
4:
–14.189 dB
2.5 GHz
2
3
4
Isolation ISL (dB)
–10 –20
MARKER 1 1 GHz
0
2
1
–30 –40
1:
–26.751 dB
1 GHz
2:
–16.888 dB
1.5 GHz
3:
–10.56 dB
2 GHz
4:
–6.652 dB
2.5 GHz
3
4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S21log MAG 1 dB/REF 0 dB
–0.626 dB
1:
1 GHz
–8.29 dB
2:
1.5 GHz
3:
(dB)
INS
MARKER 1 1 GHz
0
–1 –2
Insertion Loss L
1
2
3
–1.398 dB
4:
–2.818 dB
4
2 GHz
2.5 GHz
–3 –4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Caution This data is including loss of the test fixture.
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S22log MAG 10 dB/REF 0 dB
–14.449 dB
1:
–19.088 dB
2:
(dB)
out
MARKER 1 1 GHz
3:
–18.88 dB
4:
–13.6 dB
0
–10
1
2
4
3
–20 –30
Output Return Loss RL
–40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
1 GHz
1.5 GHz 2 GHz
2.5 GHz
Data Sheet P13656EJ2V0DS00
7
Page 8
TYPICAL CHARACTERISTICS (Cx = 5.5 pF)
µµµµ
PG154TB
TEST CONDITIONS: V
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S
11
(dB)
in
Input Return Loss RL
–10 –20 –30 –40
MARKER 2
1.5 GHz
0
1
CONT
= 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer.
IN
OUT1 OUT2
50
IN-OUT1 ISOLATION vs. FREQUENCY
10 dB/REF 0 dB
1:
–14.995 dB
CH1 S12log MAGlog MAG 10 dB/REF 0 dB
1 GHz
2:
–18.465 dB
1.5 GHz
3:
–19.04 dB
2 GHz
4:
–14.189 dB
2.5 GHz
2
3
4
Isolation ISL (dB)
–10 –20
MARKER 2
1.5 GHz
0
1
2
–30 –40
–14.383 dB
1:
1 GHz
–23.015 dB
2:
1.5 GHz
–13.513 dB
3:
2 GHz
–7.75 dB
4:
2.5 GHz
4
3
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S21log MAG 1 dB/REF 0 dB
1:
–0.79 dB
1 GHz
2:
–0.728 dB
1.5 GHz
3:
(dB)
INS
0
MARKER 2
1.5 GHz
1
2
3
–1.105 dB
4:
–2.404 dB
2.5 GHz
2 GHz
–1 –2
Insertion Loss L
4
–3 –4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Caution This data is including loss of the test fixture.
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S22log MAG 10 dB/REF 0 dB
–14.449 dB
1:
–19.088 dB
2:
(dB)
out
MARKER 2
1.5 GHz
3:
–18.88 dB
4:
–13.36 dB
0
–10
1
2
4
3
–20 –30
Output Return Loss RL
–40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
1 GHz
1.5 GHz 2 GHz
2.5 GHz
8
Data Sheet P13656EJ2V0DS00
Page 9
TYPICAL CHARACTERISTICS (Cx = 3 pF)
µµµµ
PG154TB
TEST CONDITIONS: V
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S
11
(dB)
in
Input Return Loss RL
–10 –20 –30 –40
MARKER 3 2 GHz
0
1
CONT
= 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer.
IN
OUT1 OUT2
50
IN-OUT1 ISOLATION vs. FREQUENCY
10 dB/REF 0 dB
1:
–14.995 dB
CH1 S12log MAGlog MAG 10 dB/REF 0 dB
1 GHz
2:
–18.465 dB
1.5 GHz
3:
–19.04 dB
2 GHz
4:
–14.189 dB
2.5 GHz
2
3
4
Isolation ISL (dB)
–10 –20
0
MARKER 3 2 GHz
1
2
–30 –40
1:
–11.549 dB
1 GHz
2:
–13.477 dB
1.5 GHz
3:
–20.71 dB
2 GHz
4:
–11.895 dB
2.5 GHz
4
3
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
CH1 S21log MAG 1 dB/REF 0 dB
1:
–0.991 dB
1 GHz
2:
–0.899 dB
1.5 GHz
3:
(dB)
INS
MARKER 3 2 GHz
0
–1 –2
Insertion Loss L
1
2
3
–0.847 dB
4:
–1.530 dB
2.5 GHz
4
2 GHz
–3 –4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Caution This data is including loss of the test fixture.
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S22log MAG 10 dB/REF 0 dB
1:
–14.449 dB
2:
–19.088 dB
(dB)
out
MARKER 3 2 GHz
3:
–18.88 dB
4:
–13.6 dB
0
–10
1
2
4
3
–20 –30
Output Return Loss RL
–40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
1 GHz
1.5 GHz 2 GHz
2.5 GHz
Data Sheet P13656EJ2V0DS00
9
Page 10
TEST CIRCUIT
µµµµ
PG154TB
A
= +25°C, V
T
CONT1
= +3 V, V
CONT2
= 0 V or V
CONT1
= 0 V, V
CONT2
= +3 V, VDD = +3.0 V, f = 2 GHz, ZO = 50
Off chip DC blocking capacitors value: C0 = 51 pF C1 = 1 000 pF (Bypass: Select a suitable value for your application, especially concerning switching speed), CX = 2.0 pF (In case of 2 GHz), using NEC standard evaluation board
V
DD
C1
Cx
OUT1
C0
C0
321
OUT2
G1K
456
C1
C1
EVALUATION BOARD
OUT1
CONT1
V
C0
CONT1
INV
V
CONT2
Board for customer Evaluation board
V
DD
OUT2
CONT2
V
IN
CONT1
V
DD
INV
V
OUT2OUT1
CONT2
10
Data Sheet P13656EJ2V0DS00
Page 11
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
CONT1
V
CONT(H)
V
CONT(L)
V
µµµµ
PG154TB
V
CONT2
CONT(H)
V
IN
CONT(L)
V
IN
PACKAGE DIMENTIONS
6 PIN SUPER MINIMOLD (Unit: mm)
+0.1
0.2
–0
OUT1
OUT2
OUT1
OUT2
0.1 MIN.
IN
OUT1
OUT2
OUT1
IN
OUT2
+0.1
0.15
–0
2.1 ±0.1
1.25 ±0.1
0.65 0.65
1.3
2.0 ±0.2
0 to 0.1
0.7
0.9 ±0.1
Data Sheet P13656EJ2V0DS00
11
Page 12
µµµµ
PG154TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering method and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Soldering Conditions Recommended Condition Symbol
Infrared Reflow Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C) Count: 3, Exposure limi t: None
VPS Package peak temperat ure: 215°C or below
Time: 40 seconds or less (at 200°C) Count: 3, Exposure limi t: None
Wave Soldering Soldering bath temperature: 260°C or below
Time: 10 seconds or less Count: 1, Exposure limi t: None
Partial Heating Pin temperature: 300°C
Time: 3 seconds or less (per pi n row) Exposure limit: None
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Note
Note
Note
Note
Note
Caution Do not use different soldering methods together (except for partial heating).
IR35-00-3
VP15-00-3
WS60-00-1
12
Data Sheet P13656EJ2V0DS00
Page 13
[MEMO]
µµµµ
PG154TB
Data Sheet P13656EJ2V0DS00
13
Page 14
[MEMO]
µµµµ
PG154TB
14
Data Sheet P13656EJ2V0DS00
Page 15
[MEMO]
µµµµ
PG154TB
Data Sheet P13656EJ2V0DS00
15
Page 16
µµµµ
PG154TB
Caution
The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8
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