Page 1
DATA SHEET
GaAs INTEGRATED CIRCUIT
PPPP
PG152TA
L-BAND SPDT SWITCH
DESCRIPTION
The PPG152TA is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low
insertion loss.
It housed in as original 6 pin mini-mold that is smaller than usual 8 pin SSOP and easy to install and contributes to
miniaturizing the system. It can be used in wide-band switching applications.
FEATURES
• Low insertion loss : L
• High power switching : Pin
• Small 6 pin mini-mold
INS
= 0.6 dB typ. @ f = 2 GHz
(1 dB)
= +30 dBm typ. @ V
CONT
= +3.0 V/0 V, f = 2 GHz
APPLICATION
• Digital cordless telephone : PHS, DECT, PCS etc.
• Digital hand-held cellular phone: PDC Antenna diversity etc.
ORDERING INFORMATION
PART NUMBER PACKAGE PACKING FORM
P
PG152TA-E3 6 pins Mini-mold Carrier tape width 8 mm, 1 pin faces toward the open end of the tape,
3000 pcs/Reel
Remark
For evaluation sample order, please contact your local NEC sales office.
(Part number for sample order:
PG152TA)
P
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
PARAMETERS SYMBOL RATING UNIT
Control Voltage 1, 2 V
Input Power P
Total Power Dissipat i on P
Operating Temperature T
Storage Temperature T
CONT1, 2
ð
6.0 to +6.0
in
tot
A
stg
ð
50 to +80 °C
ð
65 to +150 °C
Note
+31 dBm
0.4 W
V
Condition 2.7 d | V
Note
Caution The IC must be handled with care to prevent static discharge because its circuit is composed of
GaAs MES FET.
Document No. P12398EJ2V1DS00 (2nd edition)
Date Published January 1998 N CP(K)
Printed in Japan
CONT1
- V
CONT 2
| d 6.0 V
1996©
Page 2
PIN CONNECTION DIAGRAM
PPPP
PG152TA
(Top View)
(Bottom View)
PIN No. CONNECTION PIN No. CONNECTION
1OUT14V
CONT 2
2GND5 IN
3OUT26V
CONT 1
3
2
1
4
5
6
4
5
6
RECOMMENDED OPERATING CONDITIONS (TA = 25 °C)
PARAMETERS SYMBOL MIN. TYP. MAX. UNIT
P
CONT
CONT
in(1 dB)
CONT
+2.7 +3.0 +5.3 V
0.2 0 +0.2 V
ð
in
CONT2
= 3 V, Off chip DC blocking capacitors value; 51 pF)
INS
f = 100 M to 2 GHz 0.6 1.0 dB
+27 +29 dBm
f = 2.5 GHz
Note 1
f = 2.5 GHz
in
f = 100 M to 2 GHz 11 dB
out
f = 100 M to 2 GHz 11 dB
20
f = 1 GHz to 2 GHz 27 30 dBm
sw
CONT
V
= 3 V/0 V RF None 5
CONT1
= 3 V,
Note 1
0.8
30 ns
Control Voltage (OFF) V
Control Voltage (ON) V
Input Power (V
CONT
= 3 V/0 V) P
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = 25 °C, V
CONT2
V
= 0 V or V
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX . UNIT
Insertion Loss L
Isolation ISL f = 100 M to 2 GHz 20 22 dB
Input Return Loss RI
Output Return Loss RI
Input Power at 1 dB
Compression Point
Switching Speed t
Control Current I
CONT1
Note 2
= 0 V, V
3
2
1
A
P
Notes 1
2
Characteristic for reference at 2.0 to 2.5 GHz
Pin(1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of
2
linear range. All other characteristics are measured in linear range.
When the
3
PG152TA is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3
P
(OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the
frequency of operation, band width, switching speed and the condition with actual board of your system.
The range of recommended DC blocking capacitor value is less than 100 pF.
The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to
4
avoid parasitic parameters.
Page 3
TYPICAL CHARACTERISTICS (TA = 25 °C)
This data is including loss of the test fixture
Note
PPPP
PG152TA
IN-OUT1 INSERTION LOSS vs. FREQUENCY
+2.0
+1.0
V
CONT1
V
CONT2
P
in
= 0 dBm
0
–1.0
- Insertion Loss - dB
INS
L
–2.0
–3.0
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
INS
L
IN
50 Ω
= 0 V
= +3 V
OUT1
OUT2
IN-OUT1 ISOLATION vs. FREQUENCY
0
–10
V
V
P
–20
–30
ISL - Isolation - dB
–40
–50
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
ISL
IN
50 Ω
CONT1
= +3 V
CONT2
= 0 V
in
= 0 dBm
OUT1
OUT2
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
+10
0
V
CONT1
V
CONT2
P
in
= 0 dBm
= 0 V
= +3 V
–10
–20
- Input Return Loss - dB
in
–30
RL
–40
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
RL
in
OUT1
IN
50 Ω
OUT2
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
+10
0
V
CONT1
V
CONT2
P
in
= 0 dBm
= 0 V
= +3 V
–10
–20
- Output Return Loss - dB
–30
out
RL
–40
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
RL
out
OUT1
IN
50 Ω
OUT2
3
Page 4
PPPP
PG152TA
IN-OUT2 INSERTION LOSS vs. FREQUENCY
+2.0
+1.0
V
CONT1
V
CONT2
P
in
= 0 dBm
0
–1.0
- Insertion Loss - dB
INS
L
–2.0
–3.0
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
IN
INS
L
= +3 V
= 0 V
OUT1
50 Ω
OUT2
IN-OUT2 ISOLATION vs. FREQUENCY
0
–10
V
V
P
–20
–30
ISL - Isolation - dB
–40
–50
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
IN
ISL
CONT1
= 0 V
CONT2
= +3 V
in
= 0 dBm
OUT1
50 Ω
OUT2
IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY
+10
0
V
CONT1
V
CONT2
P
in
= 0 dBm
= +3 V
= 0 V
–10
–20
- Input Return Loss - dB
in
–30
RL
–40
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
RL
IN
in
OUT1
50 Ω
OUT2
IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY
+10
0
V
CONT1
V
CONT2
P
in
= 0 dBm
= +3 V
= 0 V
–10
–20
- Output Return Loss - dB
–30
out
RL
–40
100 M 200 M 500 M 1 G 2 G 3 G
f - Frequency - Hz
OUT1
50 Ω
IN
OUT2
RL
out
4
Page 5
Temperature characteristics
34
32
30
28
VCONT1 = +3.0 V
V
CONT2 = 0 V
f = 2 GHz
Non-modulated
Signal input (cw)
Temperature Characteristics of Input/Output
PPPP
PG152TA
26
Pout (dBm)
24
TA = –50 °C
A = –10 °C
T
T
A = 30 °C
A = 50 °C
T
A = 90 °C
T
22
20
18
18 20 22 24 26 28 30 32 34 36
in (dBm)
P
5
Page 6
TEST CIRCUIT
PPPP
PG152TA
TA = 25 °C, V
CONT1
= +3 V, V
CONT2
= 0 V or V
CONT1
= 0 V, V
CONT2
= +3 V, f = 2 GHz
Off chip DC blocking capacitors value; 51 pF, Using NEC standard evaluation board
IN
ZO = 50 Ω
OUT2
V
CONT2
51 pF
1000 pF
4
3
51 pF
O
= 50 Ω ZO = 50 Ω
Z
6
1
51 pF
1000 pF
V
CONT1
OUT1
6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm)
+0.2
–0.3
2.8
+0.2
123
–0.1
1.5
654
+0.1
0.3
–0.0
0.95 0.95
1.9
2.9 ±0.2
1.1
0.8
+0.2
–0.1
0.13 ±0.1
0 to 0.1
6
Page 7
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
CONT1
V
+3 V 0 V
PPPP
PG152TA
V
CONT2
EVALUATION BOARD
OUT1 OUT2
+3 V
0 V
IN
IN
UPG152TA
OUT1
OUT2
OUT1
OUT2
IN
IN
OUT1
OUT2
OUT1
OUT2
0.4 mm thickness
teflon glass
V
CONT1
RF IN
V
CONT2
7
Page 8
PPPP
PG152TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process Soldering conditions
Infrared ray reflow Package peak temperature: 235 ° C
Hour: within 30 s. (more than 210 °C)
Time: 3 times, Limited days: no.
VPS Package peak temperature: 215 ° C
Hour: within 40 s. (more than 200 °C)
Time: 3 times, Limited days: no.
Wave Soldering Soldering tub temperature: les s than 260 °C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin part heating Pin area tem perature: less than 300 °C, Hour: wit hi n 3 s.
Limited days: no.
It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 %, RH.
Note
Note
Note
Note
Note
Recommended condition
symbol
IR35-00-3
VP15-00-3
WS60-00-1
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
8
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[MEMO]
PPPP
PG152TA
9
Page 10
[MEMO]
PPPP
PG152TA
10
Page 11
[MEMO]
PPPP
PG152TA
11
Page 12
PPPP
PG152TA
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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