The µPD3729 is a high-speed and high sensitive color CCD (Charge Coupled Device) linear image sensor which
changes optical images to electrical signal and has the function of color separation.
µ
PD3729 has 3 rows of 5000 pixels, and it is a 2-output/color type CCD sensor with 2 rows/color of charge
The
transfer register, which transfers the photo signal electrons of 5000 pixels separately in odd and even pixels.
Therefore, it is suitable for 400 dpi/A3 high-speed color digital copiers and so on.
FEATURES
• Valid photocell: 5000 pixels × 3
• Photocell's pitch : 10 µm
• Line spacing: 40 µm (4 lines) Red line-Green line, Green line-Blue line
7
• Color filter: Primary colors (red, green and blue), pigment filter (with light resistance 10
Notes 1. MIN. of t10 shows that the φRB and φCLB overlap each other.
µ
PD3729
2. MIN. of t11 shows that the φ1L and φCLB overlap each other.
φ
1, φ2 cross points
φ
1
φ
RB
φ
CLB
φ
φ
1L
CLB
90 %
90 %
t10
90 %
t11
90 %
φ
1L, φ2 cross points
φ
2
2 V or more2 V or more
2
φ
1L
φ
2 V or more0.5 V or more
Remark Adjust cross points (φ1, φ2) and (φ1L, φ2) with input resistance of each pin.
9
DEFINITIONS OF CHARACTERISTIC ITEMS
1.Saturation voltage: Vsat
Output signal voltage at which the response linearity is lost.
2.Saturation exposure: SE
Product of intensity of illumination (I
3.Photo response non-uniformity: PRNU
The output signal non-uniformity of all the valid pixels when the photosensitive surface is applied with the light
of uniform illumination. This is calculated by the following formula.
X) and storage time (s) when saturation of output voltage occurs.
µ
PD3729
PRNU (%) =
4.Average dark signal: ADS
Average output signal voltage of all the valid pixels at light shielding. This is calculated by the following formula.
ADS (mV) =
∆x
× 100
x
∆x : maximum of x
x =
x
V
OUT
Register Dark
DC level
5000
d
j
Σ
j=1
5000
d
j
− x
5000
x
j
Σ
j=1
5000
j
: Output voltage of valid pixel number j
∆x
j
: Dark signal of valid pixel number j
x
10
µ
PD3729
5.Dark signal non-uniformity: DSNU
Absolute maximum of the difference between ADS and voltage of the highest or lowest output pixel of all the valid
pixels at light shielding. This is calculated by the following formula.
DSNU (mV) : maximum of d
− ADS
j = 1 to 5000
j
dj : Dark signal of valid pixel number j
V
OUT
ADS
Register Dark
DC level
DSNU
6.Output impedance: Z
O
Impedance of the output pins viewed from outside.
7.Response: R
Output voltage divided by exposure (Ix
•s).
Note that the response varies with a light source (spectral characteristic).
8.Image lag: IL
The rate between the last output voltage and the next one after read out the data of a line.
φ
TG
Light
V
OUT
ONOFF
V
OUT
V1
IL (%) = ×100
V
OUT
V
1
11
9.Register imbalance: RI
The rate of the difference between the averages of the output voltage of Odd and Even pixels, against the average
output voltage of all the valid pixels.
n
2
2
(V2j – 1 –V2j)
∑
n
RI (%) =
j = 1
1
∑
n
j = 1
n
×100
V j
n : Number of valid pixels
j : Output voltage of each pixel
V
10. Random noise: σ
Random noise σ is defined as the standard deviation of a valid pixel output signal with 100 times (=100 lines)
data sampling at dark (light shielding).
µ
PD3729
100
(Vi – V)
σ (mV) = , V =
Σ
i=1
2
100
i: A valid pixel output signal among all of the valid pixels for each color
V
OUT
1
100
100
Σ
i=1
Vi
V
1
V
2
…
V
100
line 1V
line 2
…
line 100
This is measured by the DC level sampling of only the signal level, not by CDS (Correlated Double Sampling).
12
STANDARD CHARACTERISTIC CURVES
DARK OUTPUT TEMPERATURE
CHARACTERISTIC
8
4
2
1
0.5
Relative Output Voltage
0.25
STORAGE TIME OUTPUT VOLTAGE
CHARACTERISTIC (T
2
1
Relative Output Voltage
0.2
µ
A = +25 °C)
PD3729
0.1
10020304050
Operating Ambient Temperature T
100
80
60
40
Response Ratio (%)
20
B
0.1
1510
A(°C)Storage Time (ms)
TOTAL SPECTRAL RESPONSE CHARACTERISTICS
(without infrared cut filter) (T
G
A
= +25 °C)
R
G
B
0
400500600700800
Wavelength (nm)
13
APPLICATION CIRCUIT EXAMPLE
µ
PD3729
+5 V
+
µ
φ
RB
φ
1
φ
2
TG
+12 V
10 Ω
+
PD3729
µ
0.1 F 47 F/25 V
µ
µ
0.1 F10 F/16 V
24
OUT
3
V
23
V
OUT
1
22
V
OUT
2
21
GND
20
CLB
19
1L
18
NC
17
NC
16
φ
2
15
φ
1
14
TG1
13
TG2
B3
B1
B2
47 Ω
47 Ω
2 Ω
2 Ω
2 Ω
2 Ω
47 Ω
2 Ω
2 Ω
2 Ω
B4
B6
B5
1
OUT
4
V
2
V
OUT
6
3
V
OUT
5
4
GND
5
V
OD
6
φφ
RB
7
NC
8
NC
9
φ
1
10
φ
2
11
φφ
TG3
12
GND
φ
φ
φ
µ
0.1 F 10 F/16 V
µµ
+
+5 V
CLB
φ
φ
1L
Remark The inverters shown in the above application circuit example are the 74AC04.
B1 to B6 EQUIVALENT CIRCUIT
4.7 kΩ
CCD
V
OUT
47 Ω
2SA1005
110 Ω
+12 V
2SC945
47 F/25 V
µ
+
µ
0.1 F
1 kΩ
14
PACKAGE DRAWING
CCD LINEAR IMAGE SENSOR 24-PIN CERAMIC DIP (400mil)
(Unit : mm)
68.0±0.4
10.03±0.15
1
10.6±0.6
The 1st valid pixel
9.4±0.7
2
µ
PD3729
0.46±0.05
27.94
10.16
1.27±0.05
2.54
(4.33)(2.33)
3.50±0.5
0.97±0.3
3.30±0.32
3
2.0±0.3
0.25±0.05
4
NameDimensionsRefractive index
Glass cap67.0 × 8.5 × 1.01.5
1 The 1st valid pixel The edge of the package
2 The 1st valid pixel The center of the pin1
3 The surface of the chip The top of the glass cap (Reference)
4 The bottom of the package The surface of the chip
24D-1CCD-PKG1-1
15
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E).
Type of Through-hole Device
µ
PD3729D: CCD linear image sensor 24-pin ceramic DIP (400 mil)
ProcessConditions
Partial heating methodPin temperature: 300 °C or below,
Heat time: 3 seconds or less (per pin)
µ
PD3729
16
[MEMO]
µ
PD3729
17
[MEMO]
µ
PD3729
18
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of
the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it once, when it has occurred. Environmental control must be
adequate. When it is dry, humidifier should be used. It is recommended to
avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded
using wrist strap. Semiconductor devices must not be touched with bare
hands. Similar precautions need to be taken for PW boards with semiconductor
devices on it.
µ
PD3729
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of CMOS
devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to VDD or GND with a resistor, if it is considered
to have a possibility of being an output pin. All handling related to the unused
pins must be judged device by device and related specifications governing the
devices.
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee outpin levels, I/O settings or contents of registers. Device is not initialized until
the reset signal is received. Reset operation must be executed immediately
after power-on for devices having reset function.
19
µ
PD3729
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
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