The µPD31172 (commercial name: VRC4172) is a companion chip designed for NEC’s µPD30121 microprocessor
(commercial name: VR4121).
The VRC4172 has the following functions available on chip: a USB host controller, an IEEE1284 parallel controller,
a 16550 serial controller, a PS/2 controller, general-purpose ports (GPIO), programmable chip select (PCS), and a
PWM controller (a duty modulated light pulse generation function for LCD backlighting).
The VRC4172 can be directly connected to the VR4121, allowing a reduction in the man-hours required for
development of a Windows™ CE system.
Detailed function descriptions are provided in the following user’s manual. Be sure to read it before
designing.
RC
•
V
4172 User’s Manual (U14386E)
FEATURES
• Directly connectable to VR4121
• On-chip USB host controller
• USB ports: 2
• Compliant with the USB OpenHCI specifications, release 1.0
• Communicates with USB device asynchronously with host CPU
• Full-speed (12 Mbps) and low-speed (1.5 Mbps) modes supported
• System clock: 48 MHz
• On-chip PS/2 controller
• On-chip IEEE1284 parallel controller
• On-chip 16550 serial controller
• General-purpose ports (GPIO): 24
• On-chip PWM controller
• Duty modulated light pulse generation function for LCD backlighting
• Internal maximum operating frequency: 48 MHz
• Power supply voltage: VDD = 3.3 V ± 0.3 V
• Package: 208-pin plastic FBGA
TM
TM
APPLICATIONS
Battery-driven portable information devices
•
Peripheral devices for PCs, etc.
•
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. U14388EJ2V0DS00 (2nd edition)
Date Published May 2000 N CP(K)
Printed in Japan
The mark shows major revised points.
Page 2
ORDERING INFORMATION
Part NumberPackageInternal Maximum Operating Frequency
ACK#:AcknowledgeMRAS (0:1)#:DRAM Row Address Strobe
AD (0:24):Address BusOCI (1:2):Over Current Interrupt
ARBCLKSEL:Arbitration Clock SelectPE:Paper End
AUTOFEED#:AutofeedPPON (1:2):Port Power ON
BUSAK (0:1)#:Bus AcknowledgePS2CLK:PS2 Clock
BUSCLK:System Bus ClockPS2DATA:PS2 Data
BUSRQ (0:1)#:Bus RequestPS2INT:PS2 Interrupt
BUSY:BusyRD#:Read
CD (0:7):Centronics DataRESET:Reset
CKE:Clock EnableRI#:Ring Indicator
CLKOUT48M:Clock Out of 48 MHzROMCS (2:3)#:ROM Chip Select
CTS#:Clear to SendRTS#:Request to Send
DATA (0:31):Data BusRXD:Receive Data
DCD#:Data Carrier DetectColumn Address Strobe for
DIR1284:Direction of 1284
DN (1:2):USB D
DP (1:2):USB D+SELECT:Select
DSR#:Data Set ReadySELECTIN#:Select in
DTR#:Data Terminal ReadySMI#:USB System Interrupt
ERROR#:ErrorRow Address Strobe for
EXCS (0:5)#:External CS
GND:GroundSTROBE#:Strobe
GPIO (0:23):General Purpose I/OTXD:Transmit Data
HOLDAK#:Hold AcknowledgeUCAS#:Upper Column Address Strobe
HOLDRQ#:Hold RequestLower Byte of Upper Column
IEN:USB Input Enable
INIT#InitializeUSBINT#:USB Interrupt
INTRP:InterruptUSBRST#:USB Reset
IOCHRDY:I/O Channel ReadyUpper Byte of Upper Column
IOCS16#:IO Chip Select 16
IOR#:I/O ReadVDD:Power Supply Voltage
IOW#:I/O WriteWAKE:Wake Up Interrupt
IRQ:I/O RequestWR#:Write
LCAS#:Lower Column Address StrobeXIN48M:Clock In of 48 MHz
LCDBAK:LCD Back LightXOUT48M:Clock Out of 48 MHz
LCDCS#:LCD Chip Sel ect
LCDRDY:LCD Ready
−
SCAS#:
SDRAM
SCLK:SDRAM Clock
SRAS#:
SDRAM
ULCAS#:
Address Strobe
UUCAS#:
Address Strobe
Remark
# indicates active low.
Data Sheet U14388EJ2V0DS00
5
Page 6
INTERNAL BLOCK DIAGRAM AND EXTERNAL BLOCK CONNECTION EXAMPLE
1.1Pin Function List .......................................................................................................................................8
1.2Special Status Pins .................................................................................................................................11
1.3External Processing of Pins and Drive Capacity.................................................................................. 13
1.4Recommended Connection of Unused Pins......................................................................................... 15
Signal NameI/OFunction
SCLKI/OThis i s the SDRAM operating clock .
AD (0:24)I/OThese form a 25-bit address bus.
DATA (0:31)I/OThese form a 32-bit data bus.
LCDCS#InputThis is the LCD chip sel ec t signal. This signal becomes active when the VR4121 accesses the
LCD using the AD or data bus.
RD#I/O
WR#I/O
LCDRDYOutputT hi s is the LCD ready signal. Thi s signal becomes acti ve when a state is entered whereby t he
ROMCS (2:3)#I/OThis is an SDRAM chip select signal.
CKEI/OThis is t he SDRAM clock enable si gnal .
UUCAS#I/OThi s is an SDRAM DQM signal. This signal controls the I/O buffers for the DATA (24:31) pins.
ULCAS#I/OThis is an SDRAM DQM signal. This signal controls the I/ O buf fers for the DATA (16:23) pins.
MRAS (0:1)#I/ OThis is an SDRAM chip select s i gnal .
UCAS#I/OThis is an S DRA M DQM signal. This signal controls the I/O buffers for the DATA (8:15) pins.
LCAS#I/OThis is an SDRAM DQM si gnal . This signal controls t he I/O buffers for the DATA (0:7) pins.
IOR#InputThis is the system bus I/O read signal. This signal becomes active when any resource except
IOW#Input
RESETInputThis is the system bus reset signal.
IOCS16#OutputThi s is the dynamic bus-s i zing request signal.
IOCHRDYOutputT hi s is the system bus ready signal.
HOLDRQ#OutputThis is the system bus access right request signal.
HOLDAK#InputThis is the system bus access enable signal.
SRAS#I/OThis is the SDRAM RAS signal.
SCAS#I/OThis is the SDRAM CAS signal.
BUSRQ (0:1)#InputThis is a signal input f rom the external bus master requesting access to the system bus.
BUSAK (0:1)#OutputThis is a signal out put t o t he external bus master permitting access t o t he system bus.
INTRPOutputThis is an interrupt request signal from the 16550 serial controller or the I EEE1284 parallel
IRQOutputThis is an interrupt request signal from the general-purpose ports (GPIO (0:23)) or the
USBINT#OutputThis is an interrupt request signal f rom the USB host controller.
PS2INTOutputThis is an interrupt request signal from the PS/2 c ont rol l er.
BUSCLKInputThis is the system bus clock.
ARBCLKSELInputThis is a clock select signal for arbitrating the system bus (controls the HOLDRQ# signal)
Output: This signal becomes ac tive when the VRC4172 accesses SDRAM.
•
R
Input:This signal becomes ac tive when the V
•
host bridge.
Output: This signal becomes ac tive when the VRC4172 writes data to SDRAM.
•
Input: This signal becomes active when the V
•
bridge.
RC
V
4172 can acknowledge an access t o the LCD area from the VR4121.
the USB inside the V
This is the system bus I/O write signal. This signal becomes active when
the USB inside the V
controller.
IEEE1284 parallel controll er.
(1: Internal clock us ed, 0: BUSCLK used)
RC
4172 is accessed.
RC
4172 is accessed.
4121 reads data from the VRC4172’s PCI
R
4121 writes data to the VRC4172’s PCI host
any
resource except
PD31172
8
Data Sheet U14388EJ2V0DS00
Page 9
µµµµ
PD31172
(2) USB Interface Signals
Signal NameI/OFunction
DP (1:2)I /OThis i s the positive data s i gnal .
DN (1:2)I/OThis is the negativ e data signal.
PPON (1:2)OutputThis is the USB route-hub-port power supply control si gnal .
OCI (1:2)InputThis is the US B route-hub-port over-current status signal. Make this s i gnal active when the
current flowing through the Vbus l i ne of the USB exceeds the ref erence value.
IENInputThis is the USB buf fer input enable signal. Make t hi s signal active when the i nput signal to the
USB port is validated.
WAKEOutputThis is a wakeup interrupt request signal .
SMI#OutputThis is a system interrupt request signal.
USBRST#InputThis is the reset signal for the USB cloc k.
(3) IEEE1284 Interface Signals
Signal NameI/OFunction
CD (0:7)I/OThese are data signals
STROBE#I/OThis is the data s t robe signal.
ACK#I/OThis i s the acknowledge signal.
BUSYI/OThis is the busy signal.
PEI/OThi s is the paper-end signal.
SELECTI/OThis is t he s el ec t signal.
AUTOFEED#I/OThis is the aut of eed signal.
SLECTIN#I/OThis is t he s el ect input signal.
ERROR#I/OThis is the fault signal.
INIT#I / OThis is the initialization signal.
DIR1284OutputThis signal outputs the transfer direction status.
(4) RS-232-C Interface Signals
Signal NameI/OFunction
RXDInputThis is the receive data signal.
CTS#I nputThis is the transmit enable signal.
DSR#InputThis is the data set ready s i gnal .
TXDOutputThi s i s the transmit data signal.
RTS#OutputThis is the transmit request signal.
DTR#OutputThis is the t erm i nal equi pm ent ready signal.
DCD#InputThis is the carrier detection signal.
RI#InputThis is the c al l di s pl ay signal.
Data Sheet U14388EJ2V0DS00
9
Page 10
(5) PS/2 Interface Signals
Signal NameI/OFunction
PS2CLKI/OThis is t he PS/2 clock signal .
PS2DATAI/OThis is the PS/2 data s i gnal .
(6) General-Purpose Port Signals
Signal NameI/OFunction
GPIO (0:23)I/OThes e are general -purpose I/O signals.
(7) General-Purpose Chip Select Signals
Signal NameI/OFunction
EXCS (0:5)#OutputThese are general-purpose chip select signal s.
(8) LCD Interface Signals
Signal NameI/OFunction
LCDBAKOutputThese are signals f or controlling the LCD backlighting.
µµµµ
PD31172
(9) Clock Signals
Signal NameI/OFunction
XIN48MInputThis is the 48 MHz oscillator input pin. Connect to one side of a cryst al res onator.
XOUT48MOutputThis is the 48 MHz oscillator output pin. Connect to the ot her side of the crystal resonat or.
CLKOUT48MOutputThis is the 48 MHz cloc k output for the FIR of the VR4121.
The same specification has been made for these pins in the V
4121. If these pins have been processed in
the VR4121, there is no need to perform this processing in the VRC4172.
In full-speed mode: 50 pF, In low-speed mode: 350 pF
2.
There is no need to perform external processing if no particular external processing has been specified (−).
Data Sheet U14388EJ2V0DS00
13
Page 14
Signal NameExternal ProcessingDrive CapacityTolerance
PPON (1:2)
OCI (1:2)
IEN
WAKE
SMI#
USBRST#
CD (0:7)
STROBE#Pull up40 pF3 V
ACK#Pull up40 pF3 V
BUSYPul l down40 pF3 V
PEPull down40 pF3 V
SELECTPull down40 pF3 V
AUTOFEED#Pull up40 pF3 V
SELECTIN#Pull up40 pF3 V
ERROR#Pul l up40 pF3 V
INIT#Pull up40 pF3 V
DIR1284
RXD
CTS#
DSR#
TXD
RTS#
DTR#
DCD#
RI#
PS2CLKP ul l up40 pF5 V
PS2DATAPull up40 pF5 V
GPIO (0:23)Pull up/pull down40 pF3 V
EXCS (0:5)#
LCDBAK
CLKOUT48M
−
−−
−−
−
−
−−
−
−
−−
−−
−−
−
−
−
−−
−−
−
−
−
40 pF3 V
3 V
3 V
40 pF3 V
40 pF3 V
3 V
40 pF3 V
40 pF3 V
3 V
3 V
3 V
40 pF3 V
40 pF3 V
40 pF3 V
3 V
3 V
40 pF3 V
40 pF3 V
40 pF3 V
µµµµ
PD31172
(2/2)
Remark
14
There is no need to perform external processing if no particular external processing has been specified (−).
Data Sheet U14388EJ2V0DS00
Page 15
µµµµ
PD31172
1.4 Recommended Connection of Unused Pins
Connect unused pins as shown in the table below.
Signal NameRecommended ConnectionSignal Nam eRecommended Connection
SCLKPul l upPPON (1:2)Leave open
AD (0:24)
DATA (0:31)
LCDCS#Pull upWAKELeave open
RD#Pull upSMI#Leave open
WR#Pull upUSBRST#Pull down
LCDRDYLeave openCD (0:7)Pull down
ROMCS (2:3)#Pull upSTROBE#Pull up
CKEPull downACK#Pull up
UUCAS#Pull upBUSYPull down
ULCAS#Pull upPEPull down
MRAS (0:1)#Pull upSELECTPull down
UCAS#Pull upAUTOFEED#Pull up
LCAS#Pull upSELECTIN#Pull up
IOR#
IOW#
RESET
IOCS16#
IOCHRDY
HOLDRQ#Leave openDSR#Pull up
HOLDAK#Pull upTXDLeave open
SRAS#Pull upRTS#Leave open
SCAS#Pull upDTR#Leave open
BUSRQ (0:1)#Pull upDCD#Pull up
BUSAK (0:1)#Leave openRI#Pull up
INTRPLeave openPS2CLKPul l up
IRQLeave openPS2DATAPull up
USBINT#Leave openGPIO (0: 23)Pull down
PS2INTLeave openEXCS (0:5)#Leave open
BUSCLKPull upLCDBAKLeave open
ARBCLKSELPull downXIN48MPull up
DP (1:2)Pull downXOUT48MLeave open
DN (1:2)Pull downCLKOUT48MLeave open
−
−
−
−
−
−
−
OCI (1:2)Pull down
IENPull down
ERROR#Pull up
INIT#Pull up
DIR1284Leave open
RXDPull down
CTS#Pull up
Remark
Pins with no particular specification (−) cannot be left unconnected.
VI < VDD + 0.5 V
VI < VDD + 3.0 V, DP (2:1), DN (2:1), PS2CLK,
PS2DATA pins
O
VO < VDD + 0.5 V
VO < VDD + 3.0 V, DP (2:1), DN (2:1), PS2CLK,
PS2DATA pins
A
stg
Cautions 1. Do not simultaneously short multiple outputs.
2. Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on
the verge of suffering physical damage, and therefore the product must be used under
conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and
conditions displayed in DC Characteristics and AC Characteristics in this section indicate the
ranges in which normal operation and product quality can be guaranteed.
Applicable to SCLK, AD (24:0), DATA (31:0), RD#, WR#, ROMCS (3:2)#, CKE#, UUCAS#, ULCAS#, MRAS
(1:0)#, UCAS#, LCAS#, SRAS#, and SCAS# pins.
Applicable to PS2CLK and PS2DATA pins.
2.
(2) DP (2:1), DN (2:1) pins
ParameterSymbolConditionsMIN.MAX.Unit
Output voltage, highV
Output voltage, lowV
Differential input sens i tivityV
Differential common mode
range
Input voltage, highV
Input voltage, lowV
Remark
Refer to the USB specification, revision 1.0, for details.
OH
RL = 15 kΩ (connected to GND)2.83.6V
OL
RL = 1.5 kΩ (connected to VDD)0.3V
DI
CMVDI
V
IH_USB
IL_USB
< 200 mV0.82.5V
0.2V
2.0V
0.8V
Data Sheet U14388EJ2V0DS00
17
Page 18
µµµµ
PD31172
AC Characteristics (TA =
AC test input waveform
V
DD
0 V
AC test output test points
V
DD
0 V
40 to +85
−−−−
C, VDD = 3.3
°°°°
1.4 VAll output pins
1.4 VAll output pins
0.3 V)
±±±±
1.4 VTest points
1.4 VTest points
18
Data Sheet U14388EJ2V0DS00
Page 19
µµµµ
PD31172
Load Conditions
(a) SCLK, AD (0:24), DATA (0:31), RD#, WR#, ROMCS (2:3 )#, CLK#, UUCAS#, ULCAS#, ULCAS#, MRAS
(0:1)#, UCAS#, LCAS#, SRAS#, SCAS#
SCLK, AD (0:24), DATA (0:31),
RD#, WR#, ROMCS (2:3)#, CLK#,
UUCAS#, ULCAS#, MRAS (0:1)#,
UCAS#, LCAS#, SRAS#, SCAS#
DUT
CL = 80 pF
(b) DP (1:2), DN (1:2)
DP (1:2), DN (1:2)
(c) Other output pins
Output pins (except for (a) and (b) above)
DUT
DUT
In full-speed mode: CL = 50 pF
In low-speed mode: C
L
= 350 pF
CL = 40 pF
Data Sheet U14388EJ2V0DS00
19
Page 20
(1) Clock parameters
ParameterSymbolConditionsMIN.TYP.MAX.Unit
XIN48M clock frequenc yf
(2) Reset parameters
ParameterSymbolConditionsMIN.MAX.Unit
RESET signal high-level widtht
USBRST# signal low-level widtht
(3) SDRAM interface parameters
ParameterSymbolConditionsMIN.MAX.Unit
SCLK cyclet
SCLK high-level widtht
SCLK low-level widtht
Data output hold timet
Data output delay timet
Data input setup timet
Data input hold timet
CLK
RST
USBRST
SCLK
SCLKH
SCLKL
SDM
SDO
SDS
SDH
µµµµ
PD31172
48.050.0MHz
30ns
30ns
20.8ns
8ns
8ns
2ns
15ns
9.5ns
2ns
SCLK (I/O)
AD (24:0), WR#,
ROMCS (3:2)#,
UUCAS#, ULCAS#,
UCAS#, LCAS#,
MRAS (1:0)#, SRAS#,
SCAS#, CKE (I/O)
DATA (31:0) (output)
DATA (31:0) (input)
t
SCLKL
t
SDStSDH
t
SDM
t
SCLKH
t
SDO
Hi-ZHi-Z
t
SCLK
20
Data Sheet U14388EJ2V0DS00
Page 21
(4) System bus interface parameters
(a) Access to I/O area
ParameterSymbolConditionsMIN.MAX.Unit
Command signal low-level wi dtht
Address setup time (t o command signal)t
Address hold time (from c ommand signal)t
IOCS16# valid delay tim et
IOCS16# floating delay ti m et
Data output hold timet
Data output delay timet
Data input setup timet
Data input setup time
Data input hold timet
During 16550-compatible serial communication
Note
Note
CLCH
AVCL
CHAV
AVCV
AVCZ
DM
DO
DS1
DS2
t
DH
µµµµ
PD31172
130ns
10ns
10ns
12ns
10ns
625ns
30ns
10ns
10ns
10ns
AD (24:0)
(input)
IOR#/IOW#
(input)
t
AVCV
IOCS16#
(output)
DATA (31:0)
(input)
DATA (31:0)
(input)
Note
DATA (31:0)
(output)
During 16550-compatible serial communication
Note
Remark
The broken lines indicate high impedance
t
AVCL
t
DS2
t
t
CLCH
t
DS1tDH
t
DO
CHAV
t
AVCZ
t
DH
t
DM
Data Sheet U14388EJ2V0DS00
21
Page 22
(b) Access to LCD area
ParameterSymbolConditionsMIN.MAX.Unit
Command signal low-level wi dtht
Address setup time (t o command signal)t
Address hold time (from c ommand signal)t
LCDRDY valid delay tim et
LCDRDY set delay timet
LCDRDY floating delay ti m et
Data output hold timet
Data output delay timet
Data output valid timet
Data input setup timet
Data input hold timet
(i) When accessing the internal PCI bus
CLCH
AVCL
CHAV
AVRH
CLRL
AVRZ
DM
DO
DV
DS
DH
µµµµ
PD31172
90ns
10ns
10ns
15ns
12ns
10ns
625ns
30ns
10ns
10ns
10ns
Remark
AD (24:0)
(input)
LCDCS#
(input)
t
AVCL
RD#/WR#
(input)
t
AVRH
t
LCDRDY
(output)
t
DS
DATA (31:0)
(input)
DATA (31:0)
(output)
The broken lines indicate high impedance
CLRL
t
CLCH
t
CHAV
t
AVRZ
t
DH
t
t
DV
DM
22
Data Sheet U14388EJ2V0DS00
Page 23
(ii) When accessing the configuration register of the PCI host controller
AD (24:0)
(input)
LCDCS#
(input)
t
AVCL
RD#/WR#
(input)
t
CLCH
t
CHAV
µµµµ
PD31172
LCDRDY
(output)
DATA (31:0)
(input)
DATA (31:0)
(output)
Hi-Z
t
DS
t
DH
t
t
DO
DM
Hi-ZHi-Z
Data Sheet U14388EJ2V0DS00
23
Page 24
(5) GPIO parameters
ParameterSymbolConditionsMIN.MAX.Unit
GPIO (23:0) output delay ti m et
GPIO (23:0) interrupt request generat i on timet
GPIO (23:0) interrupt request clear timet
(a) In output mode
IOW#
(input)
GPIO (23:0)
(output)
(b) In input mode
GIC
µµµµ
PD31172
GO
GI
30ns
30ns
35ns
t
GO
GPIO (23:0)
(input)
IRQ (output)
(level trigger
interrupt)
IRQ (output)
(edge trigger
interrupt)
IOW# (input)
(edge interrupt
request clear)
t
t
GI
GI
t
GIC
24
Data Sheet U14388EJ2V0DS00
Page 25
(6) PCS (Programmable Chip Select) parameters
ParameterSymbolConditionsMIN.MAX.Unit
EXCS output delay tim et
AD (24:0)
(I/O)
EXCS (5:0)#
(output)
EO
t
EO
(7) PWM (Pulse Width Modulation) parameters
ParameterSymbolConditionsMIN.MAX.Unit
LCDBAK output delay timet
LO
µµµµ
PD31172
30ns
t
EO
SCLK
8 t
ns
IOW#
(input)
LCDBAK
Note
(output)
High level: enable, Low level: disable
Note
t
LO
Data Sheet U14388EJ2V0DS00
25
Page 26
(8) PS/2 parameters
ParameterSymbolConditionsMIN.MAX.Unit
PS2CLK clock high-l e vel widtht
PS2CLK clock low-level widtht
PS2CLK output delay tim et
Transmission start t i m et
Transmit data output delay timet
Receive data setup timet
Receive data hold timet
Receive disable setup ti met
PSCH
PSCL
PSO
PSGO
PSDO
PSDS
PSDH
PSN
µµµµ
PD31172
3 Tns
3 Tns
T + 20ns
20ns
3 T + 20ns
0ns
4 Tns
3 Tns
Remark
T = 125 ns (cycle of internal clock for controlling PS/2)
(a) Transmission
IOW#
(input)
PS2CLK
(I/O)
PS2DATA
(I/O)
PS/2 interface
disabled
Transmit data
setting
t
PSO
PS/2 interface
enabled
t
PSGO
t
PSO
Start bit
t
PSCLtPSCH
t
PSDO
DATA0
DATA (1:7),
parity bit
InputInputOutput
Stop bit
InputInputOutput
(b) Reception
26
PS2CLK
(I/O)
PS2DATA
(I/O)
t
PSDS
t
PSCL
t
PSDH
DATA0
Data Sheet U14388EJ2V0DS00
PSN
t
InputOutput
DATA (1:7),
parity bit
Stop bitStart bit
Page 27
µµµµ
PD31172
(9) 16550-compatible serial interface parameters
ParameterSymbolConditionsMIN.TYP.MAX.Unit
Transmit clock division ratioN1216 − 1
Transmit clock rising edge delay time (from CLK
Transmit clock f al l i ng edge del ay time (from CLK
Transmit clock pulse low-level widtht
Transmit clock pulse high-level widtht
Interrupt cancellation time (from IOR# ↑, when reading
LSR register)
Interrupt cancellation time (from IOR# ↓, when reading
RBR register)
Sample clock delay time (from RCLK)t
Interrupt generation time (from valid data reception,
reception error)
Interrupt cancellation time (from IOW# ↓, when writing to
THR register)
Interrupt cancellation time (from IOR# ↑, when reading
IIR register)
Transmission start t i m et
Interrupt generation time (from IOW# ↑, when writing to
THR register)
Interrupt generation time (from stop bit)t
Note 1
Note 1
)
)
t
t
BHD
BLD
LW
10ns
15ns
N = 10.5CLKCns
N = 21CLKCns
N = 32CLKCns
N > 32CLKCns
HW
N = 10.5CLKCns
N = 21CLKCns
N = 31CLKCns
N > 3(N − 2)
CLKC
RINT1
t
RINT2
t
SCD
SINT
t
40ns
30ns
10ns
1 RCLKC
+ 20
HR
t
IR
t
IRS
8 BAUC24 BAUC
30ns
40ns
+ 20
SI
t
16 BAUC24 BAUC
+ 20
STI
8 BAUC +20ns
Note 2
ns
ns
ns
ns
RTS#, DTR delay time (from IOW# ↑, when writing to
MCR register)
Interrupt cancellation time (from IOR# ↓, when reading
MSR register)
Interrupt cancellation time (from RI# ↑, CTS#, DSR#,
DCD#)
Notes 1.
Remark
CLK is the internal system clock of the 16550 serial controller, and has a frequency of 1.8462 MHz.
When bit 0 of the FCR register is 1, t
2.
During a timeout interrupt, t
SINT
= 8 RCLKC + 20 (ns).
CLKC:CLK (internal system clock of 16550 serial controller) cycle
RCLKC: RCLK (on-chip serial controller receive clock) cycle
BAUC: BAUDOUTB (on-chip serial controller transmit clock) cycle
RCLKC = BAUC in this case.
MDO
t
RIM
t
SIM
t
SINT
= 3 RCLKC + 20 (ns).
Data Sheet U14388EJ2V0DS00
30ns
30ns
30ns
27
Page 28
(a) Serial BAUDOUT timing
µµµµ
PD31172
(internal, 1.8462 MHz)
CLK
BAUDOUTB
(1 cycle) (internal)
t
BLD
BAUDOUTB
(2 cycles) (internal)
t
BLD
BAUDOUTB
(3 cycles) (internal)
t
BLD
BAUDOUTB
(N cycles, N > 3)
(internal)
(b) Serial receive timing
(BAUDOUTB)
Internal sample clock
RCLK
t
BHD
t
BHD
t
BLD
t
BHD
t
BHD
8 RCLKC
t
HW
t
LW
t
HW
t
LW
t
HW
t
LW
t
LW
t
SCD
16 RCLKC
t
HW
RXD (input)
Internal sample clock
INTRP (output)
(receive data existence interrupt
INTRP (output)
(receive status interrupt
IOR# (input)
(reading RBR register)
IOR# (input)
(reading LSR register)
Notes 1.
Dependant on the existence of receive data. At this time, bit 0 of the IER register is 1, and bits 3 to
1 of the IIR register are 0, 1, 0, respectively.
Dependant on the receive line status. At this time, bit 2 of the IER register is 1, and bits 3 to 1 of the
2.
IIR register are 0, 1, 1, respectively.
Note 1
Note 2
Start bitStop bit
DATA (5:8)
)
)
Parity bit
t
SINT
t
RINT1
t
RINT2
28
Data Sheet U14388EJ2V0DS00
Page 29
(c) Serial transmission timing
µµµµ
PD31172
RXD
(input)
Note
INTRP
(output)
IOW# (input)
t
HR
Start bitParity bitStart bitStop bit
t
IRS
t
SI
DATA (5:8)
t
STI
t
HR
(writing to THR
register)
IOR# (input)
(reading IIR
register)
Dependant on whether the transmit buffer is empty. At this time, bit 1 of the IER register is 1, and bits 3
Note
to 1 of the IIR register are 0, 0, 1, respectively.
(d) Serial modem control timing
IOW# (input)
(writing to MCR
register)
RTS#, DTR#
(output)
t
MDO
t
MDO
t
IR
CTS#, DSR#,
DCD# (input)
t
INTRP
Note
SIM
t
SIM
(output)
IOR# (input)
RIM
t
RIM
t
(reading MSR
register)
t
SIM
RI# (input)
Dependant on the modem status. At this time, bit 3 of the IER register is 1, and bits 3 to 1 of the IIR
ParameterSymbolConditionsMIN.MAX.Unit
Parallel interface internal clock frequencyt
CD (7:0) output delay time (writ i ng to DATA register)t
INIT#, STROBE#, AUTOFEED#, SELECTIN# setup timet
DIR1284 setup timet
ParameterSymbolConditionsMIN.MAX.Unit
CD (7:0) setup timet
STROBE# pulse width
BUSY response timet
CD (7:0) hold time
CD (7:0) hold time
STROBE# setup time
Note 1
Note 2
(from STROBE# ↑)
Note 2
(from BUSY ↓)
Note 3
t
1
t
2
t
3
4
5
t
6
7
t
8
t
9
t
24 Tns
24 Tns
12 Tns
24 Tns
0ns
24 Tns
Notes 1.
Remark
30
When there is no reaction from BUSY at a low level, STROBE# continues to output a low level.
Data is held while BUSY is high level.
2.
When the FIFO buffer is empty, this signal is held at a high level.
ParameterSymbolConditionsMIN.MAX.Unit
CD (7:0), AUTOFEED# setup timet
BUSY response time (from STROBE# ↓)t
STROBE# response timet
BUSY response time (from STROBE# ↑)t
CD (7:0) hold timet
STROBE# setup time
When the FIFO buffer is empty, this signal is held at a high level.
Applicable to the DP (2:1) and DN (2:1) pins. Refer to the USB specification, revision 1.0, for details.
ParameterSymbolConditionsMIN.MAX.Unit
Full-speed
mode
Rise timet
Fall timet
tR, tF matchingt
Differential output si gnal
crossover point
Low-speed
mode
tR, tF matchingt
Differential output si gnal
crossover point
ImpedanceImp.2843
R
F
RFM
CRS
V
R
CL = 50 pF420ns
CL = 50 pF420ns
F
tR/t
90110%
1.32.0V
CL = 50 pF75nsRise timet
CL = 350 pF300ns
F
CL = 50 pF75nsFall timet
CL = 350 pF300ns
RFM
CRS
V
tR/t
F
80120%
1.32.0V
µµµµ
PD31172
Ω
DP (2:1), DN (2:1)
10%
90%90%
t
R
V
CRS
10%
t
F
Data Sheet U14388EJ2V0DS00
37
Page 38
3. PACKAGE DRAWING
208-PIN PLASTIC FBGA (15x15) OUTLINE DRAWINGS
µµµµ
PD31172
4–R0.3
INDEX MARK
25°
D
D1
y1
w
SB
ZD
B
17
ZE
16
15
14
13
12
A
E1 E
11
10
9
8
7
6
5
4
3
2
1
PNMLKJHGFEDCBA
w
SA
RTU
4–C1.0
A
S
A2
S
y
S
208– b
e
M
φ
φ
x
A1
SAB
ITEM MILLIMETERS
15.00±0.10
D
D114.4
E15.00±0.10
14.4
E1
w0.20
e0.80
1.51±0.15
A
A10.35±0.10
1.16
A2
b0.50
x0.08
y0.10
y1
ZD
ZE1.1
+0.05
−0.10
0.20
1.1
P208S1-80-2C
38
Data Sheet U14388EJ2V0DS00
Page 39
µµµµ
PD31172
4. RECOMMENDED SOLDERING CONDITIONS
The µPD31172 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 4-1. Surface Mounting Type Soldering Conditions
Soldering MethodSoldering ConditionsRecommended
Semiconductor Device
Condition
Symbol
Infrared reflowPack age peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less, Exposure limit: 7 day s
10 to 72 hours)
VPSPackage peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Three times or less, Exposure limit: 7 day s
10 to 72 hours)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Note
Note
(after that, prebake at 125°C f or
Note
(after that, prebake at 125°C f or
IR35-107-3
VP15-107-3
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U14388EJ2V0DS00
39
Page 40
[MEMO]
µµµµ
PD31172
40
Data Sheet U14388EJ2V0DS00
Page 41
[MEMO]
µµµµ
PD31172
Data Sheet U14388EJ2V0DS00
41
Page 42
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
DD
pin should be connected to V
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
or GND with a resistor, if it is considered to have a possibility of
µµµµ
PD31172
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
42
Data Sheet U14388EJ2V0DS00
Page 43
µµµµ
PD31172
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet U14388EJ2V0DS00
43
Page 44
µµµµ
PD31172
Related Documents:VRC4172 User’s Manual (U14386E)
R
V
4121 User’s Manual (U13569E)
R
V
4121 Data Sheet (U14691E)
Reference Materials:Electrical Characteristics for Microcomputer (IEI-601)
The related documents indicated in this publication may include preliminary versions. However, preliminary
versions are not marked as such.
R4121 and VRC4172 are trademarks of NEC Corporation.
V
Windows is either a registered trademark or trademark of Microsoft Corporation in the United States
and/or other countries.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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