Datasheet UPC2903HF, UPC2903HB, UPC2933T, UPC2933HF, UPC2912HF Datasheet (NEC)

(

)

DATA SHEET

BIPOLAR ANALOG INTEGRATED CIRCUIT

µ

PC2900 Series

THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR

The µPC2900 series of low dropout voltage three terminal positive regulators is constructed with PNP output

transistor. The µPC2900 series feature the ability to source 1 A of output current with a low dropout voltage of typically

0.7 V.

µ

The power dissipation of the
terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to
the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators (µPC2400A series).

FEATURES

• Output current in excess of 1.0 A

• Low dropout voltage V

• On-chip overcurrent and thermal protection circuit

• On-chip output transistor safe area protection circuit

PC2900 series can be drastically reduced compared with the conventional three

DIF = 0.7 V TYP. (at IO = 1 A)

PIN CONFIGURATION (Marking Side)

µ

PC2900HF Series: MP-45G

12

3

1: INPUT
2: GND
3: OUTPUT

µ

PC2900HB Series: MP-3

µ

PC2900T Series: MP-3Z

4

12

3

1: INPUT
2: GND
3: OUTPUT
4: GND

Fin

Document No. G10026EJ3V0DS00 (3rd edition)
Date Published July 1998 N CP(K)
Printed in Japan

The information in this document is subject to change without notice.

The mark shows major revised points.

©

1997

BLOCK DIAGRAM

Safe operating
area protection

µ

PC2900 Series

INPUT

Start-up
circuit

Reference
voltage

Thermal
shut down

Error
amp.

Drive
circuit

Saturation
protection

Over current
protection

ORDERING INFORMATION

Part Number Package Output Voltage

µ

PC2903HF MP-45G (Isolated TO-220) 3.0 V

µ

PC2903HB MP-3 (SC-64) 3.0 V

µ

PC2903T MP-3Z (SC-63) 3.0 V

µ

PC2933HF MP-45G (Isolated TO-220) 3.3 V

µ

PC2933HB MP-3 (SC-64) 3.3 V

µ

PC2933T MP-3Z (SC-63) 3.3 V

µ

PC2905HF MP-45G (Isolated TO-220) 5.0 V

µ

PC2905HB MP-3 (SC-64) 5.0 V

µ

PC2905T MP-3Z (SC-63) 5.0 V

µ

PC2906HF MP-45G (Isolated TO-220) 6.0 V

µ

PC2906HB MP-3 (SC-64) 6.0 V

µ

PC2906T MP-3Z (SC-63) 6.0 V

µ

PC2907HF MP-45G (Isolated TO-220) 7.0 V

µ

PC2907HB MP-3 (SC-64) 7.0 V

µ

PC2907T MP-3Z (SC-63) 7.0 V

µ

PC2908HF MP-45G (Isolated TO-220) 8.0 V

µ

PC2908HB MP-3 (SC-64) 8.0 V

µ

PC2908T MP-3Z (SC-63) 8.0 V

µ

PC2909HF MP-45G (Isolated TO-220) 9.0 V

µ

PC2909HB MP-3 (SC-64) 9.0 V

µ

PC2909T MP-3Z (SC-63) 9.0 V

µ

PC2910HF MP-45G (Isolated TO-220) 10.0 V

µ

PC2910HB MP-3 (SC-64) 10.0 V

µ

PC2910T MP3Z (SC-63) 10.0 V

µ

PC2912HF MP-45G (Isolated TO-220) 12.0 V

µ

PC2912HB MP-3 (SC-64) 12.0 V

µ

PC2912T MP-3Z (SC-63) 12.0 V

OUTPUT

GND

2

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, Unless otherwise specified.)

µ

PC2900 Series

Parameter Symbol

Input Voltage VIN 20 V
Internal Power Dissipation
Operating Ambient Temperature TA –30 to +85 °C
Operating Junction Temperature TJ –30 to +150 °C
Storage Temperature Tstg –55 to +150 °C
Thermal Resistance (Junction to Case) Rth (J-C) 7 12.5 °C/W
Thermal Resistance (Junction to Ambient)

Note

PT 15 10 W

Rth (J-A) 65 125 °C/W

µ

PC2900HF

Rating

µ

PC2900HB, µPC2900T

Note TC = 25 °C, Internally limited

When operating junction temperature rises up to 150 °C, the internal circuit shutdown output voltage.

Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability;

exceeding the ratings could cause permanent damage. The parameters apply independently. The
device should be operated within the limits specified under DC and AC Characteristics.

TYPICAL CONNECTION

D

1

Unit

PC2900

INPUT

C

IN

µ

+

OUT

C

D

OUTPUT

2

CIN : More than 0.1 µF. Required if regulator is located an appreciable distance from power supply filter. You

must use to prevent from the parasitic oscillation.

OUT : More than 47

C

µ

F. You must use the Low-impedance-type (low ESR) capacitor.
D1 : Need for VO > VIN
D2 : Need a shottky barrier diode for VO < GND.

3

µ

PC2900 Series

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Type Number MIN. TYP. MAX. Unit

Input Voltage VIN

Output Current IO all 0 1.0 A
Operating Ambient Temperature TA all –30 +85 °C
Operating Junction Temperature TJ all –30 +125 °C

µ

PC2903 4.0 16 V

µ

PC2933 4.3 16

µ

PC2905 6 16

µ

PC2906 7 16

µ

PC2907 8 16

µ

PC2908 9 18

µ

PC2909 10 18

µ

PC2910 11 18

µ

PC2912 13 18

ELECTRICAL CHARACTERISTICS µPC2903 (TJ = 25 °C, VIN = 5 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 2.88 3.0 3.12 V

0 °C ≤ TJ ≤ 125 °C, 4.0 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 4.0 V ≤ VIN ≤ 16 V 11 30 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 9 30 mV
Quiescent Current IBIAS IO = 0 A 1.9 4.0 mA

IO = 1 A 23 60
Startup Quiescent Current IBIAS (s) VIN = 2.95 V, IO = 0 A 12 30 mA

VIN = 2.95 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 52
Ripple Rejection R·R f = 120 Hz, 4.0 V ≤ VIN ≤ 16 V 48 63 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 4.5 V 1.2 1.7 3.0 A

Peak Output Current IO peak VIN = 4.5 V 1.0 1.5 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA –0.5 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 4.0 V ≤ VIN ≤ 16 V

VIN = 16 V 1.2

VIN = 16 V 1.3 1.7 2.8

2.85 3.15

3.2 20 mA

µ

Vr.m.s.

4

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2933 (TJ = 25 °C, VIN = 5 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 3.17 3.3 3.43 V

0 °C ≤ TJ ≤ 125 °C, 4.3 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 4.3 V ≤ VIN ≤ 16 V 12 33 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 23 33 mV
Quiescent Current IBIAS IO = 0 A 2.0 4.0 mA

IO = 1 A 30 60
Startup Quiescent Current IBIAS (s) VIN = 3.1 V, IO = 0 A 10 30 mA

VIN = 3.1 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 55
Ripple Rejection R·R f = 120 Hz, 4.3 V ≤ VIN ≤ 16 V 48 64 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 4.5 V 1.2 1.6 3.0 A

Peak Output Current IO peak VIN = 4.5 V 1.0 1.4 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA –0.4 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 4.3 V ≤ VIN ≤ 16 V

VIN = 16 V 1.2

VIN = 16 V 1.3 1.7 2.8

3.14 3.46

3.0 20 mA

µ

Vr.m.s.

5

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2905 (TJ = 25 °C, VIN = 8 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 4.8 5.0 5.2 V

0 °C ≤ TJ ≤ 125 °C, 6 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 6 V ≤ VIN ≤ 16 V 23 50 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 28 50 mV
Quiescent Current IBIAS IO = 0 A 2.2 4.0 mA

IO = 1 A 30 60
Startup Quiescent Current IBIAS (s) VIN = 4.5 V, IO = 0 A 10 30 mA

VIN = 4.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 90
Ripple Rejection R·R f = 120 Hz, 6 V ≤ VIN ≤ 16 V 46 61 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 6.5 V 1.15 1.8 3.0 A

Peak Output Current IO peak VIN = 6.5 V 1.1 1.5 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 0.6 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 6 V ≤ VIN ≤ 16 V

VIN = 16 V 1.1

VIN = 16 V 1.4 2.0 2.8

4.75 5.25

2.9 20 mA

µ

Vr.m.s.

6

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2906 (TJ = 25 °C, VIN = 9 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 5.76 6.0 6.24 V

0 °C ≤ TJ ≤ 125 °C, 7 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 7 V ≤ VIN ≤ 16 V 25 60 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 29 60 mV
Quiescent Current IBIAS IO = 0 A 2.0 4.0 mA

IO = 1 A 23 60
Startup Quiescent Current IBIAS (s) VIN = 5.5 V, IO = 0 A 10 30 mA

VIN = 5.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 108
Ripple Rejection R·R f = 120 Hz, 7 V ≤ VIN ≤ 16 V 44 60 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 7.5 V 1.8 A

Peak Output Current IO peak VIN = 7.5 V 1.1 1.5 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 0.6 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 7 V ≤ VIN ≤ 16 V

VIN = 16 V 1.1

VIN = 16 V 1.4 2.0 2.8

5.70 6.30

2.2 20 mA

µ

Vr.m.s.

7

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2907 (TJ = 25 °C, VIN = 10 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 6.72 7.0 7.28 V

0 °C ≤ TJ ≤ 125 °C, 8 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 8 V ≤ VIN ≤ 16 V 27 70 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 30 70 mV
Quiescent Current IBIAS IO = 0 A 2.0 4.0 mA

IO = 1 A 24 60
Startup Quiescent Current IBIAS (s) VIN = 6.5 V, IO = 0 A 10 30 mA

VIN = 6.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 126
Ripple Rejection R·R f = 120 Hz, 8 V ≤ VIN ≤ 16 V 43 59 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 8.5 V 1.8 A

Peak Output Current IO peak VIN = 8.5 V 1.1 1.5 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 0.6 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 8 V ≤ VIN ≤ 16 V

VIN = 16 V 1.1

VIN = 16 V 1.4 2.0 2.8

6.65 7.35

2.3 20 mA

µ

Vr.m.s.

8

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2908 (TJ = 25 °C, VIN = 11 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 7.68 8.0 8.32 V

0 °C ≤ TJ ≤ 125 °C, 9 V ≤ VIN ≤ 18 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 9 V ≤ VIN ≤ 18 V 31 80 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 30 80 mV
Quiescent Current IBIAS IO = 0 A 1.9 4.0 mA

IO = 1 A 25 60
Startup Quiescent Current IBIAS (s) VIN = 7.5 V, IO = 0 A 10 30 mA

VIN = 7.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 145
Ripple Rejection R·R f = 120 Hz, 9 V ≤ VIN ≤ 18 V 42 58 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 9.5 V 1.9 A

Peak Output Current IO peak VIN = 9.5 V 1.1 1.5 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 0.6 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 9 V ≤ VIN ≤ 18 V

VIN = 18 V 1.0

VIN = 18 V 1.4 2.0 2.8

7.6 8.4

2.4 20 mA

µ

Vr.m.s.

9

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2909 (TJ = 25 °C, VIN = 12 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 8.64 9.0 9.36 V

0 °C ≤ TJ ≤ 125 °C, 10 V ≤ VIN ≤ 18 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 10 V ≤ VIN ≤ 18 V 31 90 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 32 90 mV
Quiescent Current IBIAS IO = 0 A 1.9 4.0 mA

IO = 1 A 27 60
Startup Quiescent Current IBIAS (s) VIN = 8.5 V, IO = 0 A 11 30 mA

VIN = 8.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 155
Ripple Rejection R·R f = 120 Hz, 10 V ≤ VIN ≤ 18 V 41 58 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 10.5 V 1.9 A

Peak Output Current IO peak VIN = 10.5 V 1.1 1.5 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 1.0 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 10 V ≤ VIN ≤ 18 V

VIN = 18 V 1.0

VIN = 18 V 1.4 2.0 3.0

8.55 9.45

3.0 20 mA

µ

Vr.m.s.

10

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2910 (TJ = 25 °C, VIN = 13 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 9.6 10.0 10.4 V

0 °C ≤ TJ ≤ 125 °C, 11 V ≤ VIN ≤ 18 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 11 V ≤ VIN ≤ 18 V 35 100 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 33 100 mV
Quiescent Current IBIAS IO = 0 A 2.0 4.0 mA

IO = 1 A 25 60
Startup Quiescent Current IBIAS (s) VIN = 9.5 V, IO = 0 A 10 30 mA

VIN = 9.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 180
Ripple Rejection R·R f = 120 Hz, 11 V ≤ VIN ≤ 18 V 40 56 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 11.5 V 1.7 A

Peak Output Current IO peak VIN = 11.5 V 1.1 1.6 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 2.1 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 11 V ≤ VIN ≤ 18 V

VIN = 18 V 1.0

VIN = 18 V 1.4 2.0 3.0

9.5 10.5

1.9 20 mA

µ

Vr.m.s.

11

µ

PC2900 Series

ELECTRICAL CHARACTERISTICS µPC2912 (TJ = 25 °C, VIN = 15 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF,
unless otherwise specified.)

Parameters Symbol Conditions MIN. TYP. MAX. Unit

Output Voltage VO 11.52 12 12.48 V

0 °C ≤ TJ ≤ 125 °C, 13 V ≤ VIN ≤ 18 V,
0 A ≤ IO ≤ 500 mA

0 °C ≤ TJ ≤ 125 °C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 13 V ≤ VIN ≤ 18 V 38 120 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A 35 120 mV
Quiescent Current IBIAS IO = 0 A 2.1 4.0 mA

IO = 1 A 26 60
Startup Quiescent Current IBIAS (s) VIN = 11.5 V, IO = 0 A 10 30 mA

VIN = 11.5 V, IO = 1 A 80
Quiescent Current Change ∆IBIAS
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 210
Ripple Rejection R·R f = 120 Hz, 13 V ≤ VIN ≤ 18 V 40 52 dB
Dropout Voltage VDIF 0 °C ≤ TJ ≤ 125 °C, IO = 1 A 0.7 1.0 V
Short Circuit Current IO short VIN = 14 V 1.7 A

Peak Output Current IO peak VIN = 14 V 1.1 1.6 3.0 A

Temperature Coefficient of ∆VO/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA 2.1 mV/°C
Output Voltage

0 °C ≤ TJ ≤ 125 °C, 13 V ≤ VIN ≤ 18 V

VIN = 18 V 1.0

VIN = 18 V 1.4 2.0 3.0

11.4 12.6

1.5 20 mA

µ

Vr.m.s.

12

TYPICAL CHARACTERISTICS

Pd vs T

20

15

10

Solid line : PC2900HF Series
Broken line: PC2900HB Series

With infinite heatsink

PC2900T Series

A

µ
µ
µ

300

200

100

–100

µ

PC2900 Series

∆VO vs T

J

µ

PC2912

µ

PC2905

0

PC2933

µ

5

- Total Power Dissipation - W

d

P

1.92

1.0

Without heatsink

0

0 50 100 15085

A

- Operating Ambient Temperature -°C

T

VO vs VIN ( PC2933)

µ

4.0
T

J

= 25 °C

3.5

IO = 1.0 A

3.0

2.5

IO = 0.5 A

IO = 5 mA

2.0

1.5

- Ouput Voltage - V

O

V

1.0

0.5

07182

3564

V

IN

- Input Voltage - V

–200

- Output Voltage Deviation - mV

O

–300

∆V

IO = 5 mA

–400

–50 50

0 100 150

J

- Operating Junction Temperature - °C

T

I

BIAS

(I

BIAS (s)

) vs VIN ( PC2933)

µ

50
45
40
35
30
25

IO = 1 A

20
15

- Quiescent Current - mA

BIAS

10

I

5

0182204

6101416128

V

IN

- Input Voltage - V

IO = 0.5 A

IO = 0 A

TJ = 25 °C

1.0

V

µ

PC2933

0.8

0.6

0.4

- Dropout Voltage - V

DIF

V

0.2

0
–25 +1250 +150+75

J

- Operating Junction Temperature - °C

T

DIF

vs T

µ

PC2905

µ

PC2906

µ

PC2907
PC2908

µ

PC2909

µ
µ

PC2910

µ

PC2912

J

I

O peak

vs V

µ

DIF

( PC2933)

3.0

2.0
TJ = 0 °C

TJ = 25 °C

1.0

- Peak Output Current - A

O peak

I

TJ = 125 °C

IO = 1.0 A

+100+50+25

015520

DIF

V

10

- Dropout Voltage - V

13

I

3.0

O peak

2.0

1.0

- Peak Output Current - A

O peak

I

vs V

DIF

( PC2905)

µ

TJ = 25 °C

T

J

= 125 °C

TJ = 0 °C

80

70

µ

PC2933

60

50

40

30

R · R - Ripple Rejection - dB

20

R · R vs f

µ

PC2905

µ

PC2900 Series

J

= 25 °C

T
I

O

= 1 A

PC2912

µ

0

80

5101520
V

DIF

- Dropout Voltage - V

R · R vs IO ( PC2933)

70

60

50

R · R - Ripple Rejection - dB

40

30

0.2 0.4 0.6 1.0
I

O

- Output Current - A

6

VO vs IO ( PC2933)

5

µ

4.3 V ≤ VIN ≤ 16 V
f = 120 Hz

µ

0.80

T

J

= 25 °C

0

10

100 1 k 10 k 100 k

1.0

0.8

0.6

0.4

- Dropout Voltage - V

DIF

V

0.2

0

0

0.2 0.4 0.6 1.0

f - Frequency - Hz

V

DIF

I

O

- Output Current - A

µ

vs IO ( PC2933)

TJ = 25 °CTJ = 25 °C

0.8

4

3

2

- Output Voltage - V

O

V

1

0 0.4 0.8 1.2 2.4

14

VIN = 16 V

I

O

- Output Current - A

VIN = 5 V

1.6

2.0

PACKAGE DRAWINGS

µ

PC2900HF Series

3PIN PLASTIC SIP (MP-45G)

µ

PC2900 Series

A

E

B

I

D

132

H

J

Z

C

FG

NOTE

Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.

M

L

M

K

Y

V

N
P

U

ITEM MILLIMETERS

A 10.0±0.2

B 7.0±0.2
C 1.50±0.2
D 17.0±0.3

φ

E

F 0.75±0.10
G 0.25
H 2.54 (T.P.)

I 5.0±0.3
J
K
L 8.5±0.2

M 8.5±0.2
N

P 2.8±0.2

U 2.4±0.5

V
Y 8.9±0.7
Z 1.30±0.2

3.3±0.2

2.46±0.2

5.0±0.2

4.5±0.2

0.65±0.10

P3HF-254B-4

15

µ

PC2900HB Series

MP-3 (SC-64) (Unit: mm)

6.5±0.2

5.0±0.2

4

+0.2

–0.1

1.5

2.3±0.2

0.5±0.1

µ

PC2900 Series

1.6±0.2

1.1±0.1

µ

PC2900T Series

MP-3Z (SC-63) (Unit: mm)

123

2.3 2.3

6.5±0.2

5.0±0.2

0.5

5.5±0.27.0 MIN.

+0.2
–0.1

0.75

+0.2

–0.1

1.5

13.7 MIN.

+0.2

0.5

–0.1

2.3±0.2

0.5±0.1

16

4.3 MAX.0.8

1.1±0.2

4

123

0.9 MAX.

2.3 2.3

5.5±0.2

10.0 MAX.

2.0 MIN.

0.8 MAX.

1.0 MIN.

1.5 TYP.

0.5

0.8

µ

PC2900 Series

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.

Fof more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Surface mount devices

µ

PC2900T Series: MP-3Z

Process Conditions Symbol

Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), IR35-00-2

Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.

VPS Peak temperature: 215 °C or below (Package surface temperature), VP15-00-2

Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.

Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1

Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).

Partial heating method Pin temperature: 300 °C or below, —

Heat time: 3 seconds or less (Per each side of the device).

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

Through-hole devices

µ

PC2900HF Series: MP-45G

µ

PC2900HB Series: MP-3

Process Conditions

Wave soldering Solder temperature: 260 °C or below,
(only to leads) Flow time: 10 seconds or less.

Partial heating method Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (Per each pin).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

17

µ

PC2900 Series

CAUTION ON USE

When using the µPC2900 series at the input voltage which is lower than in the recommended operating condition,
the big quiescent current flows through devices because the transistor of the output paragraph is saturated (Refer
to IBIAS (IBIAS (s)) vs VIN curves in TYPICAL CHARACTERISTICS). The µPC2900 series have saturation protection
circuits, but they sometimes need about 80 mA current. Therefore the power supply on the input needs the enough
current capacity to pass this quiescent current when the devices startup.

REFERENCE DOCUMENTS

QUALITY GRADE ON NEC SEMICONDUCTOR DEVICES C11531E
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E
IC PACKAGE MANUAL C10943X
GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES MEI-1202
SEMICONDUCTORS SELECTION GUIDE X10679E
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL IEI-1212
SYSTEM-THREE TERMINAL REGULATOR

18

[MEMO]

µ

PC2900 Series

19

µ

PC2900 Series

[MEMO]

No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.

20

M4 96.5