Page 1
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
PC2794GS
FREQUENCY DOWN CONVERTER FOR
VHF TO UHF BAND TV/VCR TUNER
DESCRIPTION
The µPC2794GS is a Silicon monolithic IC designed for TV/VCR tuner applications. This IC consists of a double
balanced mixer (DBM), local oscillator, preamplifier for precscaler operation, IF amplifier, regulator, UHF/VHF
switching circuit, and so on. This one-chip IC covers a wide frequency band from VHF to UHF bands. This IC is
packaged in 20-pin SOP (Small Outline Package) suitable for surface mounting.
FEATURES
• VHF to UHF bands operation.
• Low distortion CM: VHF (@fRF = 470 MHz) 96 dB
UHF (@fRF = 890 MHz) 92 dB
• Supply voltage : 9 V
• Packaged in 20-pin SOP suitable for surface mounting
µ
µ
ORDERING INFORMATION
Part Number Package Package Style
µ
PC2794GS-E1 20-pin plastic SOP (300 mil) Embossed tape 24 mm wide. 2.5 k/REEL.
Pin 1 indicates pull-out direction of tape
For evaluation sample order, please contact your local NEC office. (Part number for sample order: µPC2794GS)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. P11888EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan
Caution electro-static sensitive device
The mark shows major revised points.
©
1996,1999
Page 2
PIN CONFIGURATION (Top View)
µ
PC2794GS
1
10
INTERNAL BLOCK DIAGRAM
20 19 18 17 16 15 14 13 12 11
20
11
UHF OSC Collector
1.
UHF OSC Base
2.
UHF OSC Base
3.
UHF OSC Collector
4.
UB
5.
OSC OUTPUT
6.
GND
7.
VHF OSC Base
8.
VHF OSC Base
9.
VHF OSC Collector
10.
REG
11.
IF OUTPUT
12.
V
13.
CC
14.
MIX OUTPUT
15.
MIX OUTPUT
16.
VHF RF INPUT
17.
VHF RF INPUT
18.
GND
19.
UHF RF INPUT
20.
UHF RF INPUT
IF
Amp
(Tr. 1)
(Tr. 2)
(Tr. 1)
(Tr. 2)
(Tr. 1)
(Tr. 2)
(Tr. 1)
REG.
V OSCU OSC
12345678910
2
Data Sheet P11888EJ3V0DS00
Page 3
PIN EXPLANATION
Pin Voltage TYP.
Pin No. Symbol
1 UOSC 6.90
collector Assemble LC resonator with 2
(Tr. 1)
2 UOSC 6.00
base (Tr. 2) with balance amplifier. Connected
3
UOSC
base (Tr. 1)
4 UOSC 6.90
collector
(Tr. 2)
5 UB — Switching pin for VHF or UHF
6 OSC 5.40 UHF and VHF oscillator output
output pin. In case of F/S tuner
above: VHF mode
below: UHF mode
6.25
3.90
6.00
3.90
6.25
9.0
Function and Explanation Equivalent Circuit
Collector pin of UHF oscillator.
pin through capacitor ~ 1 pF to
oscillate with active feedback loop.
Base pin of UHF oscillator
to LC resonator through feedback
capacitor ~ 300 pF.
Base pin of UHF oscillator
with balance amplifier.
Connected to LC resonator
through feedback capacitor ~ 300 pF.
Collector pin of UHF oscillator
with balance amplifier. Assemble
LC resonator with 3 pin through
capacitor ~ 1 pF to oscillate with
active feedback loop.
Double balanced oscillator with
transistor 1 and transistor 2.
operation.
VHF operation = open
UHF operation = 9.0 V
application, connected PLL
symthesizer IC’s input pin.
µ
PC2794GS
4 213
5
REG
5.40
7 GND 0.0 GND pin of VHF and UHF
0.0
8 VOSC 3.50 Base pin of VHF oscillator.
base Grounded through capacitor
(Tr. 1)
9 VOSC 3.50 Base pin of VHF oscillator.
base Assemble LC resonator with
(Tr. 2)
10 VOSC 6.20 Collector pin of VHF oscillator.
collector Connected to LC resonator
(Tr. 1)
5.90
5.90
6.90
oscillator.
10 pF.
10 pin to oscillate with active
feedback loop.
through feedback capacitor ~
3 pF.
Data Sheet P11888EJ3V0DS00
6
8
~
10
9
REG
from
OSC
3
Page 4
Pin Voltage TYP.
Pin No. Symbol
above: VHF mode
Function and Explanation Equivalent Circuit
below: UHF mode
11 REG 6.90 Monitor pin of regulator output
6.90
voltage.
12 IF output 2.60 IF output pin of VHF-UHF
band functions.
µ
PC2794GS
13
2.60
13 VCC 9.0 Power supply pin for VHF-
9.0
14 MIX 7.10
output1
7.00
15 MIX 7.10
output2
7.00
UHF band functions.
VHF and UHF MIX output pins
These pins should be
equipped with tank circuit to
adjust intermediate frequency.
16 VRF input 2.75 Bypass pin for VHF MIX input.
(bypass) Grounded through capacitor.
2.80
17 VRF input 2.75 VRF signal input pin from
antenna.
2.80
12
.
14 15
13
from
VHF
17
OSC
16
18 GND 0.0 GND pin of MIX, IF amplifier
and regulator.
0.0
19 URF input – Bypass pin for UHF MIX input.
(bypass) Grounded through capacitor.
2.65
20 URF input – URF signal input pin from
antenna.
2.65
4
Data Sheet P11888EJ3V0DS00
19
14 15
20
13
from
UHF
OSC
Page 5
µ
PC2794GS
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C unless otherwise specified)
Parameter Symbol Condition Rating Unit
Supply Voltage 1 VCC 11.0 V
Supply Voltage 2 UB 11.0 V
Power dissipation PD TA = 80 °C*
Operating ambient temperature TA –40 to +80 °C
Storage temperature Tstg –60 to +150 °C
1
700 mW
*1 Mounted on 50 × 50 × 1.6 mm double copper epoxy glass board.
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit
Supply voltage 1 VCC 8.0 9.0 10.0 V
Supply voltage 2 UB 8.0 9.0 10.0 V
Operating ambient temperature TA –20 +25 +80 °C
ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 9 V, fIF = 45 MHz, Posc = –10 dBm)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current 1 ICC1 @VHF, no input signal *1 36.0 48.0 56.0 mA
Circuit Current 2 ICC2 @UHF, no input signal *1 37.0 50.0 60.0 mA
Conversion Gain 1 CG1 fRF = 55 MHz, PRF = –30 dBm *2 19.5 23.0 26.5 dB
Conversion Gain 2 CG2 fRF = 200 MHz, PRF = –30 dBm *2 19.5 23.0 26.5 dB
Conversion Gain 3 CG3 fRF = 470 MHz, PRF = –30 dBm *2 20.5 24.0 27.5 dB
Conversion Gain 4 CG4 fRF = 470 MHz, PRF = –30 dBm *2 28.5 32.0 35.5 dB
Conversion Gain 5 CG5 fRF = 890 MHz, PRF = –30 dBm *2 28.5 32.0 35.5 dB
Noise Figure 1 NF1 fRF = 55 MHz *3 — 11.0 14.0 dB
Noise Figure 2 NF2 fRF = 200 MHz *3 — 11.0 14.0 dB
Noise Figure 3 NF3 fRF = 470 MHz *3 — 11.0 14.0 dB
Noise Figure 4 NF4 fRF = 470 MHz *3 — 9.0 12.0 dB
Noise Figure 5 NF5 fRF = 890 MHz *3 — 10.0 13.0 dB
Maximum Output Power 1 PO (sat)1fRF = 55 MHz, PRF = 0 dBm *2 10.0 13.0 — dBm
Maximum Output Power 2 PO (sat)2fRF = 200 MHz, PRF = 0 dBm *2 10.0 13.0 — dBm
Maximum Output Power 3 PO (sat)3fRF = 470 MHz, PRF = 0 dBm *2 10.0 13.0 — dBm
Maximum Output Power 4 PO (sat)4fRF = 470 MHz, PRF = 0 dBm *2 10.0 13.0 — dBm
Maximum Output Power 5 PO (sat)5fRF = 890 MHz, PRF = 0 dBm *2 10.0 13.0 — dBm
*1 By measurement circuit 1
*2 By measurement circuit 2
*3 By measurement circuit 3
Data Sheet P11888EJ3V0DS00
5
Page 6
µ
PC2794GS
STANDARD CHARACTERISTICS (Reference Values) (TA = 25 °C, VCC = 9 V)
Parameter Symbol Test Conditions Value for Reference Unit
1 % cross-modulation distortion 1 CM1 fdes = 55 MHz, fundes = fdes + 6 MHz, 100 dB
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc *1
1 % cross-modulation distortion 2 CM2 fdes = 200 MHz, fundes = fdes + 6 MHz, 100 dB
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc *1
1 % cross-modulation distortion 3 CM3 fdes = 470 MHz, fundes = fdes + 6 MHz, 96 dB
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc *1
1 % cross-modulation distortion 4 CM4 fdes = 470 MHz, fundes = fdes + 6 MHz, 94 dB
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc *1
1 % cross-modulation distortion 5 CM5 fdes = 890 MHz, fundes = fdes + 6 MHz, 92 dB
Pdes = –30 dBm, fIF = 45 MHz,
Posc = –10 dBm, AM 100 kHz, 30 %
modulation, DES/CM = 46 dBc *1
µ
µ
µ
µ
µ
*1 By measurement circuit 4
6
Data Sheet P11888EJ3V0DS00
Page 7
TYPICAL CHARACTERISTICS
µ
PC2794GS
80
VHF no
input signal
70
measurement
circuit 1
60
ICC vs. V
CC
50
40
30
- Circuit Current - mA
CC
20
I
T
A
10
0
024681012
= 80 °C
T
A
= 25 °C
T
A
= –20 °C
VCC - Supply Voltage - V
P
out
vs. P
in
20
V
CC
= 9 V
fRF = 470 MHz
f
IF
= 45 MHz
P
OSC
= –10 dBm
measurement
10
circuit 2
I
CC
vs. V
CC
50
UHF no
input signal
70
measurement
circuit 1
60
50
40
30
- Circuit Current - mA
CC
20
I
10
0
024681012
TA = 80 °C
T
A
= 25 °C
T
A
= –20 °C
VCC - Supply Voltage - V
out
vs. P
in
20
P
VCC = 9 V
fRF = 890 MHz
f
IF
= 45 MHz
P
OSC
= –10 dBm
measurement
10
circuit 2
0
- Output Power - dBm
out
–10
P
–20
–40
–30 –20 –10 0 10
Pin - Input Power - dBm
40
V
CC
= 9 V
f
IF
= 45 MHz
PRF = –30 dBm
P
OSC
= –10 dBm
measurement
30
circuit 2, 3
20
10
NF - Noise Figure - dB
CG - Conversion Gain - dB
0
0
A
= 80 °C
T
T
A
= 25 °C
T
A
= –20 °C
200 400 600 800 1 000
fRF - Input Frequency - MHz
CG, NF vs. f
0
- Output Power - dBm
out
–10
T
A
= 80 °C
T
A
= 25 °C
T
A
= –20 °C
RF
P
–20
–40
–30 –20 –10 0 10
P
in
- Input Power - dBm
CM vs. f
µ
120
V
CC
= 9 V
f
undes
= fRF + 6 MHz
RF
TA = 80 °C
T
A
= 25 °C
T
A
= –20 °C
PRF = –30 dBm
f
IF
= 45 MHz
P
OSC
110
= –10 dBm
measurement
circuit 4
100
90
T
A
= 80 °C
T
A
= 25 °C
T
A
CM - 1 % Cross-modulation Distortion - dB
80
0
= –20 °C
200 400 600 800 1 000
fRF - Input Frequency - MHz
Data Sheet P11888EJ3V0DS00
7
Page 8
STANDARD CHARACTERISTICS (by application circuit example)
µ
PC2794GS
CG, NF vs. f
40
V
CC
= 9 V
f
IF
= 45 MHz
P
RF
= –30 dBm
30
20
NF - Noise Figure - dB
10
CG - Conversion Gain - dB
0
200 400 600 800 1 000
0
fRF - Input Frequency - MHz
110
100
µ
CM vs. f
RF
P
out
vs. P
in
20
V
CC
= 9 V
f
IF
= 45 MHz
fRF = 802 MHz
10
f
RF
0
- Output Power - dBm
out
–10
P
–20
–40
–30 –20 –10 0 10
= 362 MHz
CC
= 9 V
V
f
IF
= 45 MHz
Pin - Input Power - dBm
RF
6 Channel Beat
20
10
0
–10
–20
90
Distortion - dB
VCC = 9 V
f
undes
= f
RF
CM - 1 % Cross Modulation
IF
f
P
80
0
+ 6 MHz
= 45 MHz
RF
= –30 dBm
200 400 600 800 1 000
fRF - Input Frequency - MHz
30
25
20
L
15
10
- Tuning Voltage - V
tu
V
5
V
H
Vtu vs. f
–30
–40
- Output Power - dBm
out
–50
P
–60
–70
–40
OSC
–30 –20 –10 0
UV
VCC = 9 V
P
= 83.25 MHz
f
f
S
= 87.75 MHz
f
OSC
Pin - Input Power - dBm
= 129 MHz
0
0
200 400 600 800 1 000
f
OSC
- OSC Frequency - MHz
8
Data Sheet P11888EJ3V0DS00
Page 9
INPUT IMPEDANCE (by measurement circuit 5)
<VRF INPUT: 17 PIN>
µ
PC2794GS
1 45 MHz
931.31Ω −247.16Ω
2 200 MHz
358.08Ω −395.55Ω
3 470 MHz
95.062Ω −184.34Ω
1
3
2
<URF INPUT: 20 PIN>
START
STOP
0.045000000 GHz
0.500000000 GHz
3
1 400 MHz
71.531Ω −178.98Ω
2 600 MHz
31.352Ω −96.094Ω
3 890 MHz
10.85Ω −42.965Ω
1
2
START
STOP
0.400000000 GHz
1.000000000 GHz
Data Sheet P11888EJ3V0DS00
9
Page 10
OUTPUT IMPEDANCE (by measurement circuit 5)
<IF OUTPUT: 12 PIN>
1
1 45 MHz
28.862Ω 13.361Ω
µ
PC2794GS
START
STOP
0.045000000 GHz
0.065000000 GHz
10
Data Sheet P11888EJ3V0DS00
Page 11
MEASUREMENT CIRCUIT 1
µ
PC2794GS
20T
27 pF
1000
pF
VCC(9V)
1000
pF
1000
pF
OPEN
OPEN OPEN OPEN
1000
1000
pF
pF
20 19 18 17 16 15 14 13 12 11
12345678910
1000
pF
1000
pF
OPEN
1000
pF
1000
pF
1000
pF
UB(9V)
OPEN
1000
pF
1000
pF
1000
pF
REG
5pin Voltage
VHF
OPEN
UHF
9V
MEASUREMENT CIRCUIT 2
SG1
VHF
UHF
1000
pF
1000
20T
1000
pF
1000
pF
pF
27 pF
1000
pF
OPEN
1000
pF
20 19 18 17 16 15 14 13 12 11
12345678910
1000
pF
1000
pF
1000
pF
1000
pF
1000
pF
1000
pF
1000
pF
REG
VHF
UHF
Spectrum
Analyzer
SG2
5pin Voltage
VHF
OPEN
UHF
9V
Data Sheet P11888EJ3V0DS00
11
Page 12
MEASUREMENT CIRCUIT 3
Noise
Source
VHF
UHF
1000
1000
pF
pF
20 19 18 17 16 15 14 13 12 11
Noise
Meter
1000
pF
1000
pF
20T
27 pF
µ
PC2794GS
CC
(9V)
V
1000
pF
BPF
1000
pF
1000
pF
REG
12345678910
1000
pF
MEASUREMENT CIRCUIT 4
SG1
desire
SG2
VHF
UHF
1000
pF
20 19 18 17 16 15 14 13 12 11
MIX PAD
undesire
1000
pF
1000
pF
UB(9V)
1000
pF
1000
pF
1000
pF
OPEN
20T
27 pF
1000
pF
1000
pF
1000
pF
1000
pF
1000
pF
REG
VHF
UHF
5pin Voltage
VHF
UHF
SG1
Spectrum
Analyzer
OPEN
9V
12
12345678910
1000
pF
1000
1000
pF
Data Sheet P11888EJ3V0DS00
pF
OPEN
1000
pF
1000
pF
VHF
UHF
5pin Voltage
VHF
UHF
SG3
OPEN
9V
Page 13
MEASUREMENT CIRCUIT 5
1000
1000
pF
pF
20 19 18 17 16 15 14 13 12 11
1000
pF
1000
pF
VCC(9V)
1000
pF
1000
pF
1000
pF
REG
Network
Analyzer
µ
PC2794GS
12345678910
1000
pF
1000
pF
1000
pF
OPEN
1000
pF
OPEN
1000
pF
UB(9V)
OPEN
5pin Voltage
VHF
OPEN
UHF
9V
Data Sheet P11888EJ3V0DS00
13
Page 14
APPLICATION CIRCUIT EXAMPLE
URF IN VRF IN VCC IF OUT
µ
PC2794GS
1 000
pF
1 000
pF
1 000
pF
1 000
pF
20T
27pF
1 000
pF
20 19 18 17 16 15 14 13 12 11
12345678910
4 pF
1 pF
3 pF
Vtu
0.5 pF
47 k
1T363
6 pF
8 pF
1 pF
360 pF360 pF
2T
47 k
1 000
pF
1 000
pF
OSC
OUT
10 pF 200 pF
47 k
Vtu
UB
1 000 pF
1 000
pF
75
47 k
7T
1 000
pF
REG.
3 pF
1T363 × 2
4T
82 pF
1 000 pF
1 000 pF
47 k
HB
47 k
LB
2.7 k
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
14
Data Sheet P11888EJ3V0DS00
Page 15
µ
PC2794GS
ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Surface)
1000p
IF OUT
VLO IN
OSC OUT
µ
1
VRF IN
A B
URF IN
Data Sheet P11888EJ3V0DS00
ULO IN PC2794GS
15
Page 16
µ
PC2794GS
ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Back side)
Vtu
A B
1000p 1000p
1000p
6p,8p
4p
47k
1p
360p
3p
1p
360p
20T 27p
1000p
V
CC
1T363×2
3p
47k 82p
1000p
47k
7T
2.7k 1000p
1000p 1000p
4T
1000p
47k
0.5p
2T
1000p
1T363
200p
75
47k
47k
10p
1000p
UB
16
⋅
⋅
represents cutout
represents short-circuit strip
LB HB
Data Sheet P11888EJ3V0DS00
Page 17
PACKAGE DIMENSIONS
20 PIN PLASTIC SOP (300 mil) (UNIT: mm)
110
µ
PC2794GS
1120
detail of lead end
+7°
3°
–3°
12.7±0.3
7.7±0.3
1.55±0.1
0.4±0.1
1.27
0.12
0.78 MAX.
M
0.10
0.20
5.6±0.2
0.6±0.2
+0.10
–0.05
0.1±0.1
1.8 MAX.
NOTE
Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
1.1
Data Sheet P11888EJ3V0DS00
17
Page 18
µ
PC2794GS
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to V
CC line.
(5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µ
PC2794GS
Soldering Process Soldering Conditions
Infrared ray reflow Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 3, Exposure limit*1: None
VPS Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 3, Exposure limit*1: None
Partial heating method Terminal temperature: 300 ° C or below,
Flow time: 3 seconds or below,
Exposure limit*1: None
Symbol
IR35-00-3
VP15-00-3
*1 Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
18
Data Sheet P11888EJ3V0DS00
Page 19
[MEMO]
µ
PC2794GS
Data Sheet P11888EJ3V0DS00
19
Page 20
µ
PC2794GS
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8
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