The µPC2791TB and µPC2792TB are silicon monolithic integrated circuits designed as 2nd IF buffer amplifier for
DBS tuners. These ICs are packaged in super minimold package which is smaller than conventional minimold. So,
in the case of reducing your system size, µPC2791TB and µPC2792TB are suitable. Among the 6-pin mini/superminimold amplifiers, µPC2791TB and µPC2792TB have unique pin locations taken over from conventional 4-pin
minimold µPC1675G, µPC1676G and µPC1688G.
These ICs are manufactured using NEC’s 10GHz fT NESAT™ II AL silicon bipolar process. This process uses
silicon nitride passivation film. The material can protect chip surface from external pollution and prevent
corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
PC2792TB pin locations are different from the other 6-pin mini/super-minimold
µµµµ
(Bottom View)
4
5
6
Pin No.Pin Name
3
2
1
1GND
2GND
3OUTPUT
4V
5GND
6INPUT
amplifiers.
PRODUCT LINE-UP (TA = +25
u
Part Number
PC1675G1.9+4.0125.5174-pin minimoldC1A
µ
PC2791TB6-pin super minimoldC2S
µ
PC1688G1.1+4.0214.0194-pin minimoldC1C
µ
PC1676G1.2+5.0224.5194-pin minimoldC1B
µ
PC2792TB203.56-pin super minimoldC2T
µ
f
(GHz)
C, VCC = 5.0 V, ZS = ZL = 50
°°°°
o(sat)
P
(dBm)
G
(dB)
P
NF
(dB)
ΩΩΩΩ
)
CC
I
(mA)
PackageMarking
CC
Remarks
CautionThis document is to specified for
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
PC2791TB and
µµµµ
mentioned in this document, the data sheet of each part number should be referred.
SYSTEM APPLICATION EXAMPLE
Example of DBS tuners (2nd frequecy converter block)
1st IF input
from DBS converter
PC2712TB
µ
BPFSAW
PC2711TB
µ
OSC
MIX
PC2791TB
µ
PC2792TB
µ
PC2711TB
µ
LPF
PC2792TB. For the other part numbers
µµµµ
Baseband output
Prescaler
AGC Amp.
PLL Synth.
FM Demo.
2
Data Sheet P11863EJ2V0DS00
Page 3
,
PIN EXPLANATION
µµµµ
PC2791TB
µµµµ
PC2792TB
Pin
No.
Pin
Name
1
2
5
3OUTPUT
4VCC4.5 to 5.5
6INPUT
GND0
Applied
Voltage
(V)
Pin
Voltage
Note
(V)
3.92
3.96
1.11
0.92
Function and ApplicationsInternal Equivalent Circ ui t
PC2791TB
Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground pattern
on the board should be formed as wide
as possible.
All the ground pins must be c onnected
together with wide ground pattern to
decrease impedance differenc e.
Signal output pin. A internal matching
circuit, configured with resistors, enables
50 Ω connection over a wide band.
This pin must be coupled to next stage
with capacitor for DC cut.
Power supply pin. This pin s houl d be
externally equipped with bypas s
capacity to minim i ze ground
impedance.
Signal input pin. A internal matching
circuit, configured with resistors, enables
50 Ω connection over a wide band.
A multi-feedback circuit is designed to
cancel the deviations of h
resistance.
This pin must be coupled to front stage
with capacitor for DC cut.
MIN.TYP.MAX.MIN.TYP.MAX.
No signal121722141924mA
f = 500 MHz101214172022dB
3 dB down from
flat gain
in
f = 500 MHz912
f = 500 MHz811
f = 500 MHz,
in
P
= 0 dBm
1.61.9
+2.0+4.0
A
= +85°C)
ΩΩΩΩ
5.57.0
)
1.01.2
2428
1215
912
+3.0+5.0
200mW
40 to +85
−
55 to +150
−
PC2792TB
µ
3.56.0dB
C
°
C
°
C
°
Unit
GHz
dB
dB
dB
dBm
4
Data Sheet P11863EJ2V0DS00
Page 5
,
TEST CIRCUIT
50
INOUT
C1C2
Ω50 Ω
1 000 pF1 000 pF
EXAMPLE OF APPLICATION CIRCUIT
V
CC
1 000 pF
3
C
µµµµ
PC2791TB
CC
V
4
36
1, 2, 5
µµµµ
PC2792TB
1 000 pF
C
3
4
C
50 Ω50 Ω
INOUT
1
6
1 000 pF1 000 pF1 000 pF
3
1, 2, 5
C
4
C
5
6
R
1
50 to 200 Ω
To stabilize operation,
please connect R
1
, C
1 000 pF
C
6
4
3
1, 2, 5
5
2
C
1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output
pins.
Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be
supplied against VCC fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF
capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).]
Data Sheet P11863EJ2V0DS00
5
Page 6
µµµµ
,
PC2791TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-3
Top View
1
2
3
C2S
6
5
4
Mounting direction
(Marking is an example
for PC2791TB)
µ
IN
C
V
CC
C
C
OUT
µµµµ
PC2792TB
COMPONENT LIST
Value
C1 000 pF
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E).
(1) Observe precautions for handiling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering MethodSoldering ConditionsRecommended Condition Symbol
Infrared ReflowPackage peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limi t: None
VPSPackage peak temperature: 215° C or bel ow
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limi t: None
Partial HeatingPin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Note
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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