Datasheet UPC2782GR-E1, UPC2782GR Datasheet (NEC)

DATA SHEET

DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

PC2782GR

µµµµ

L BAND DOWN CONVERTER IC

DESCRIPTION

The µPC2782GR is a Silicon monolithic IC designed for use as L band downconverter. This IC consists of a
Gilbert cell mixer, two stages of LO buffering, local oscillator, external filter port, or a high output IF AGC amplifier and
IF output buffer amplifier.

The package is 20 pins SSOP (shrink small outline package) suitable for high-density surface mount.

FEATURES

• Broad band operation fRF = 0.9 to 2.1 GHz

• 25 dB variable gain IF AGC amplifier

• Low distortion IIP3 = +4.5 dBm (fRF = 2.1 GHz)

• Supply Voltage 5 V

• Packaged in 20 pins SSOP suitable for high-density surface mount

ORDERING INFORMATION

Part Number Package Package Style

µ

PC2782GR-E1 20 pin plastic SSOP (225 m i l ) Embossed tape 12 mm wide. 2. 5 k/REEL.

Pin 1 indicates pull-out di rection of tape

For evaluation sample order, please contact your local NEC sales office. (Part number for sample order:

PC2782GR)

µ

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

Document No. P11758EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan

Caution electro-static sensitive devices.

The mark shows major revised points

©

1996, 1999

INTERNAL BLOCK DIAGRAM

µµµµ

PC2782GR

V

CC

(IF)

V

CC

(MIX)

GND (MIX)

RF IN

GND (MIX)

IF OUT

V

AGC

IF IN

GND (IF)

IF IN

10

1
2
3
4
5
6
7
8
9

Bias
CKT

V

20
19

V

18

GND (LO)

17

LO OUT

16

LO (B2)

15

LO (C1)

14

LO (C2)

13

LO (B1)

12

GND (LO)

11

IF OUT

CC

(LO)

CC

(LO OUT)

2

Data Sheet P11758EJ3V0DS00

µµµµ

PC2782GR

Pin No. Symbol

Pin Volt
TYP.(V)

Functions and Explanation Equivalent Circuit

1VCC (IF) 5.00 Power supply pin of IF AGC A mp.

2VCC (MIX) 5.00 Power supply pin of Mixer

3 GND (MIX) 0.00 Ground pin of Mixer.

4 RF IN 2.00 RF signal input pin.

5 GND (MIX) 0.00 Ground pin of Mixer.

6 IF OUT 1.85 Output pin of Mi xer. This pin is

assigned for the emitter follower
output.

2

OSC

4

Reg

5

3

2

MIX

6

Reg

35

7V

AGC

0 to 5 Gain control pin.

This pin’s bias govern the A G C
output level.

AGC

AGC

= 0 V

= 5 V

Maximum gain at V
Minimum gain at V

8 IF IN 2.36 IF signal input pin of IF A G C A m p.

In case of single input, this pin
should be grounded through 1 000
pF capacitor.

9 GND (IF) 0.00 Ground pin of IF AGC Amp.

10 IF IN 2.36 IF signal input pi n of IF AGC Amp.

1

3 kΩ

7

1

VAGC

8

V

AGC

9

10

Reg

9

Data Sheet P11758EJ3V0DS00

3

µµµµ

PC2782GR

Pin No. Symbol

Pin Volt
TYP.(V)

Functions and Explanation Equivalent Circuit

11 IF OUT 2.55 Out put pi n of IF AGC Amp.

This pin is assigned for em i tter follo­wer push-pull output.

12 GND (LO) 0.00 Ground pin of Oscillator amplifier,

Buffer amplifier, Oscillator output.

13 LO (B1) 2.30 Base pin of oscillator. Connected to

14 pin through capacitor.

14 LO (C2) 5.00 Collector pin of oscillator.

Connected to 15 pin through capa­citor. Oscillator frequency band­width is depended on this capaci tor.
This pin should be connected to V
through 150 Ω resistor.

15 LO (C1) 5.00 Collector pin of oscillator.

Connected to 14 pin through capa­citor. This pin should be c onnected

CC

through 150 Ω resistor.

to V

16 LO (B2) 2.30 Base pin of oscillator. Connected to

15 pin through capacitor.
Assemble LC resonator between 13
pin and 16 pin through 2 pF capaci­tor to oscillate.

17 LO OUT 3.15 Output pin of Oscillator.

This pin is assigned for em i tter follo­wer output.

1

11

Reg

9

16 15 14 13

CC

19

Reg
Reg

12

18

18 GND (LO) 0.00 Ground pin of Oscillator amplifier,

Buffer amplifier, Oscillator output.

19 VCC (LO) 5.00 Power supply pin of Oscillator output.

20 VCC (LO) 5.00 Power supply pin of Oscillator amp-

lifier, Buffer amplifier.

4

Data Sheet P11758EJ3V0DS00

17

Reg

12 18

Absolute Maximum Ratings (TA = 25 °C unless otherwise specified)

Parameter Symbol Test Conditions Rating Unit

µµµµ

PC2782GR

Supply Votage V
Power dissipation P
Operation temperature range T
Storage temperature range T

Mounted on 50 × 50 × 1.6 mm double copper epoxy glass board.

*1

CC

TA = 85 °C

D

A

stg

*1

Recommended Operating Range

Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage V
Operating temperature range T

CC

A

4.5 5.0 5.5 V
40 +25 +85 °C

−

6.0 V

430 mW

40 to +85 °C

−

55 to +150 °C

−

Data Sheet P11758EJ3V0DS00

5

Electrical Characteristics (TA = 25 °C, VCC = 5 V)

Parameter Symbol MIN. TYP. MAX. UNIT Test Conditions

µµµµ

PC2782GR

Circuit Current I

CC

46 66 78 mA

RF Input Frequency Range RF BW 0.9 2.1 GHz PRF = −20 dBm, P

No input signal

OSC

IF

= 480 MHz, −3 dB down

f

= −10 dBm

IF Output Frequency Range IF BW 150 500 MHz fRF = 2.1 GHz, PRF = −20 dBm

OSC

= −10 dBm, −3 dB down

P
Mixer Section
Conversion Gain CG1 7 10 13 dB fRF = 900 MHz, PRF = −30 dBm

OSC

= 1 380 MHz, P

f

OSC

= −10 dBm

Conversion Gain 2 CG2 8 11 14 dB fRF = 2.1 GHz, PRF = −30 dBm

Maximum Output Power 1 P

Maximum Output Power 2 P

O (sat)

O (sat)

Noise Figure 1 NF1
Noise Figure 2 NF2

1+2 +5

2+2 +5

−

−

11.0 14.0 dB

13.5 16.5 dB

−

−

OSC

= 2.58 GHz, P

f

dBm fRF = 900 MHz, PRF = 0 dBm

OSC

= 1 380 MHz, P

f

dBm fRF = 2.1 GHz, PRF = 0 dBm

OSC

= 2.58 GHz, P

f

RF

f

= 900 MHz, P

RF

f

= 2.1 GHz, P

OSC

= −10 dBm

OSC

OSC

= −10 dBm

OSC

= −10 dBm

OSC

= −10 dBm

= −10 dBm

IF Amp. Section

AGC

AGC

= 0 V

= 0 V

IF Input Frequency Range IFinBW 150

O (sat)

∆

IF

AGC

G

20 23 26 dB fIF = 480 MHz, PIF = −30 dBm

3+5 +8

20 25

−

IF Power Gain G

Maximum Output Power 3 P

AGC Dynamic range

Noise Figure 3 NF3

−

500 MHz PIF = −30 dBm, V

−

−

dBm fIF = 480 MHz, PIF = 0 dBm

dB fIF = 480 MHz, PIF = −30 dBm

12.0 15.0 dB

3 dB down

−

AGC

= 0

V

AGC

= 0 V

V

AGC

= 0 to 5 V

V

IF

f

= 480 MHz, V

*2

*2

*2

*2

*2

*2

*2
*3
*3

*4

*4

*4

*4
*5

by measurement circuit 1

*2

by measurement circuit 2

*3

by measurement circuit 4

*4

by measurement circuit 5

*5

6

Data Sheet P11758EJ3V0DS00

µµµµ

PC2782GR

Standard Characteristics (TA = 25

Symbol

Mixer Section
Input Intercept Point 1 IIP31

Input Intercept Point 2 IIP32

Third Intermodulation
Distortion 1

Third Intermodulation
Distortion 2

Oscillator Output Power P
Oscillator Frequency Range f
IF Amp. Section
Output Intercept Point OIP

by measurement circuit 3

*6

by application circuit example

*7

by measurement circuit 6

*8

IM31

IM32

C, VCC = 5 V)

°°°°

OSC

OSC

3

Reference Value

MIN. TYP. MAX.

−

−

−

−

0

+4.5

50

59

−

−

−

−

−−15−

1.3

−

+15.5

−

2.6 GHz

−

UNIT Test ConditionsParameter

dBm fRF = 900, 930 MHz, f

OSC

= −10 dBm

P

dBm fRF = 2.1, 2.13 GHz, f

OSC

= −10 dBm

P

OSC

= 1 380 MHz

OSC

= 2.58 GHz

dBc fRF = 900, 930 MHz, PRF = −25 dBm each

OSC

= 1 380 MHz, P

f

OSC

= −10 dBm

dBc fRF = 2.1, 1.13 GHz, PRF = −25 dBm each

OSC

= 2.58 GHz, P

f

OSC

= −10 dBm

dBm

IF

= 480, 510 MHz

dBm

f

*6

*6

*6

*6
*7
*7

*8

Data Sheet P11758EJ3V0DS00

7

µµµµ

PC2782GR

Typical Characteristics (VCC = 5 V, TA = 25

fRF vs. CG (MIXER)

12

10

8

6

4

CG - Conversion Gain - dB

2

0

800

1 000 1 400 1 800 2 200

f

RF

- Input Frequency - MHz

Pin vs. P

10

0

out

(MIXER)

f

IF

= 480 MHz

P

OSC

= –10 dBm

C)

°°°°

IF

vs. CG (MIXER)

f

14

12

10

8

6

4

CG - Conversion Gain - dB

2

fRF = 2.1 GHz

RF

= –20 dBm

P

0 200 400 600 800

f

IF

- Intermediate Frequency - MHz

in

vs. P

out

P

(MIXER)

10

0

–10

–20

- Output Power - dBm

out

P

–30

–40

–40

–30 –20 –10 0 10

P

20

IF

= 480 MHz

f

OSC

= –10 dBm

P

18

16

14

12

NF - Noise Figure - dB

10

8

0.8 1 1.2 1.4 1.6 1.8 2 2.2

0.6
f

RF

- Input Frequency - GHz

fRF = 900 MHz

OSC

f

OSC

P

in

- Input Power - dBm

f

RF

vs. NF (MIXER)

= 1 380 MHz

= –10 dBm

–10

–20

- Output Power - dBm

out

P

–30

–40

–40

–30 –20 –10 0 10

in

P

70

60

50

40

30

- Circuit Current - mA

20

CC

I

10

0

123456

V

CC

fRF = 2.1 GHz

OSC

f

OSC

P

- Input Power - dBm

CC

vs. I

CC

V

VCC: 6 → 0 V

No input signal

- Supply Voltage - V

= 2.58 GHz

= –10 dBm

8

Data Sheet P11758EJ3V0DS00

µµµµ

PC2782GR

Pin vs. Pout (IFAGCAmp)

10

0

–10

–20

- Output Power - dBm

out

P

–30

–40

–40

–30 –20 –10 0 10

in

P

f

20

15

IF

f
V

- Input Power - dBm

IF

vs. NF (IFAGCAmp)

= 480 MHz

AGC

= 0 V

30

25

20

Gain (dB)

15

10

30

25

20

IF

vs. CG (IFAGCAmp)

f

P

IF

= –30 dBm

AGC

= 0 V

V

0

200 400 600

IF

- Intermediate Frequency - MHz

f

AGCVoltage vs. Gain

IF

= 480 MHz

f

IF

= –30 dBm

P

10

NF - Noise Figure - dB

5

200

0

f

IF

- Intermediate Frequency - MHz

V

AGC

= 0 V

400 600 800 1 000

15

10

IF Amp Gain (dB)

5

0

–5

0

123456

V

AGC

- AGC Voltage - V

Data Sheet P11758EJ3V0DS00

9

µµµµ

PC2782GR

Standard Characteristics (VCC = 5 V, TA = 25

IM3 (MIXER)

10

–10

–30

–50

- Output Power - dBm

out

P

–70

–90

10

–40

–30 –20 –10 0 10

in

- Input Power - dBm

P

IM3 (IFAGCAmp)

RF

= 900, 930 MHz

f
f

OSC

= 1 380 MHz

OSC

= –10 dBm

P

C)

°°°°

3

(MIXER)

IM

10

–10

–30

–50

- Output Power - dBm

out

P

–70

–90

–40

ATTEN 10 dB

0 dBm 10 dB/

RL

0

–30 –20 –10 0 10

in

- Input Power - dBm

P

Oscillator Frequency Range

1.268 G

RF

= 2.1, 2.13 GHz

f
f

OSC

= 2.58 GHz

OSC

= –10 dBm

P

2.618 G

–10

–30

–50

- Output Power - dBm

out

P

–70

–90

–40

–30 –20 –10 0 10

P

IF

= 480, 510 MHz

f

AGC

= 0 V

V

in

- Input Power - dBm

–50

- Oscillator Output Power - dBm

OSC

P

CENTER 2.000 GHz SPAN 1.800 GHz

RBW 1.0 MHz VBW 1.0 MHz SWP 50 ms

10

Data Sheet P11758EJ3V0DS00

µµµµ

PC2782GR

Standard Characteristics (VCC = 5 V, TA =

fRF vs. CG (MIXER)

600

TA = –40 ˚C

TA = 85 ˚C

fIF = 480 MHz

OSC

= –10 dBm

P

1 000 1 400 1 800 2 200

f

RF

- Input Frequency - MHz

Pin vs. P

out

(MIXER)

TA = –40 ˚C

TA = 85 ˚C

12

10

8

6

4

CG - Conversion Gain - dB

2

0

10

0

–10

40

C, 85

−−−−

°°°°

C)

°°°°

IF

vs. CG (MIXER)

f

14

TA = –40 ˚C

12

10

TA = 85 ˚C

8

6

4

CG - Conversion Gain - dB

2

0

0

200 400 600 800

IF

- Intermediate Frequency - MHz

f

P

in

vs. P

out

(MIXER)

RF

= 2.1 GHz

f

RF

= –20 dBm

P

10

TA = –40 ˚C

0

TA = 85 ˚C

–10

–20

- Output Power - dBm

out

P

–30

–40

–40

–30 –20 –10 0 10

in

P

20

18

16

14

TA = –40 ˚C

12

NF - Noise Figure - dB

10

8

0.6

0.8 1 1.2 1.4 1.6 1.8 2

RF

- Input Frequency - GHz

f

RF

= 900 MHz

f

OSC

= 1 380 MHz

f
P

OSC

- Input Power - dBm

fRF vs. NF (MIXER)

TA = 85 ˚C

IF

= 480 MHz

f

OSC

= –10 dBm

P

= –10 dBm

–20

- Output Power - dBm

out

P

–30

–40

–40

–30 –20 –10 0 10

in

P

70

60

TA = 85 ˚C

50

40

30

- Circuit Current - mA

20

CC

I

10

12 3 45

0

CC

V

RF

= 2.1 GHz

f
f

OSC

= 2.58 GHz

OSC

P

- Input Power - dBm

V

CC

vs. I

CC

TA = –40 ˚C

No input signal

CC

: 6 → 0 V

V

- Supply Voltage - V

= –10 dBm

6

Data Sheet P11758EJ3V0DS00

11

µµµµ

PC2782GR

10

–10

–30

–50

- Output Power - dBm

out

P

–70

–90

–40

–30 –20 –10 0 10

P

10

–10

TA = 85 ˚C

–30

IM3 (MIXER)

TA = 85 ˚C

fRF = 900, 930 MHz

OSC

f

OSC

P

in

- Input Power - dBm

IM3 (IFAGCAmp)

TA = –40 ˚C

= 1 380 MHz

= –10 dBm

10

–10

–30

–50

- Output Power - dBm

out

P

–70

–90

–40

–30 –20 –10 0 10

P

P

10

TA = 85 ˚C

0

–10

IM

3

(MIXER)

f

RF

= 2.1, 2.13 GHz

f

OSC

= 2.58 GHz

OSC

P

in

- Input Power - dBm

in

vs. P

out

(IFAGCAmp)

TA = –40 ˚C

TA = –40 ˚C

TA = 85 ˚C

= –10 dBm

–50

- Output Power - dBm

out

P

–70

TA = –40 ˚C

–90

–40

–30 –20 –10 0 10

P

f

30

25

TA = –40 ˚C

20

Gain - dB

15

10

0

200 400 600

f

IF

- Intermediate Frequency - MHz

IF

f

AGC

V

in

- Input Power - dBm

IF

vs. CG (IFAGCAmp)

TA = 85 ˚C

V
P

= 480,510 MHz

= 0 V

AGC

= 0 V

IF

= –30 dBm

–20

- Output Power - dBm

out

P

–30

–40

–40

–30 –20 –10 0 10

P

25

20

15

10

TA = 85 ˚C

5

IF Amp Gain - dB

0

–5

–10

0

12345

V

f
V

in

- Input Power - dBm

AGCVoltage vs. Gain

TA = –40 ˚C

AGC

- AGC Voltage - V

IF

= 480 MHz

AGC

= 0 V

f

IF

= 480 MHz

P

IF

= –30 dBm

6

12

Data Sheet P11758EJ3V0DS00

Measurement Circuit 1

OSC

OUT

µµµµ

PC2782GR

V

CC

Measurement Circuit 2

150 Ω

1 000
pF

1 000
pF

1 000

1 000

pF

pF

150 Ω

20 19 18 17 16 15 14 13 12 11

Bias CKT

12345678910

1 000 pF

RF IN IF OUT

1 000 pF

SG1

(50 Ω)

NF
METER

OSC
OUT

150 Ω

1 000
pF

1 000
pF

1 000

1 000

pF

pF

150 Ω

20 19 18 17 16 15 14 13 12 11

Bias CKT

12345678910

1 000 pF

Noise Source

1 000 pF

V

CC

SG1

(50 Ω)

Data Sheet P11758EJ3V0DS00

13

Measurement Circuit 3

OSC
OUT

µµµµ

PC2782GR

V

CC

1 000

1 000

pF

pF

150 Ω

20 19 18 17 16 15 14 13 12 11

Bias CKT

12345678910

1 000 pF

Spectrum
Analyzer
(50 Ω)

SG1

(50 Ω)

SG2

(50 Ω)

1 000 pF

150 Ω

1 000
pF

1 000
pF

SG3

(50 Ω)

Measurement Circuit 4

Spectrum
Analyzer
(50 Ω)

20 19 18 17 16 15 14 13 12 11

Bias CKT

12345678910

1 000

pF

VCC

1 000

pF

VAGC

1 000

pF

SG1

(50 Ω)

1 000 pF

1 000 pF

14

Data Sheet P11758EJ3V0DS00

Measurement Circuit 5

Spectrum
Analyzer
(50 Ω)

20 19 18 17 16 15 14 13 12 11

Bias CKT

12345678910

1 000

pF

1 000 pF

µµµµ

PC2782GR

Measurement Circuit 6

VAGC

1 000

pF

1 000

pF

1 000

pF

VCC

20 19 18 17 16 15 14 13 12 11

Bias CKT

12345678910

1 000 pF

1 000 pF

SG1

(50

SG2

(50 Ω)

NF
METER

Noise
Source

Ω)

VCC

1 000

pF

1 000

pF

VAGC

Data Sheet P11758EJ3V0DS00

1 000 pF

15

Application Circuit Example

20 19 18 17 16 15 14 13 12 11

Bias CKT

1 000

pF

OSC
OUT

12

k

2 pF

V

T

12 kΩ

150Ω150

to 15 nH

Ω

µµµµ

PC2782GR

4 pF

VCC

* Cv: HVU316

1 000

pF

IF OUT

CVCV

12

k

3 pF1.5 pF3 pF

2 pF

12345678910

1 000

VAGC

pF

1 000

pF

1 000 pF

IF IN

1 000 pF

RF IN IF

OUT

1 000

pF

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

16

Data Sheet P11758EJ3V0DS00

Illustration of The Application Circuit Assembled on Evaluation Board

V

CC

V

TU

LO OUT LO IN

µµµµ

PC2782GR

RF IN

C1

C2

C13

C11

R5

R3

C12

R2 R1

C10 C6

C9 C7

C8

C14

C3

R4

L

C

V

10

upc2782

AGC OUT

50.0000

C5

AGC INIF OUT

C4

AGC

V

50.0000

C1 to C5 : 1 000 pF
C6, C10 : 2 pF
C7, C9 : 3 pF
C8 : 1.5 pF
C11 to C14 : 1 000 pF
R1 to R3 : 12 kΩ
R4, R5 : 150 Ω

V

: HVU316

C
L : to 15 nH

Data Sheet P11758EJ3V0DS00

φ

pattern should be removed on this application*

: 0.5 mm

7 to 8 mm

17

PACKAGE DIMENSIONS

20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)

µµµµ

PC2782GR

20

110

6.7 ± 0.3

1.8 MAX.

1.5 ± 0.1

11

detail of lead end

3˚

6.4 ± 0.2

4.4 ± 0.1

+7˚
–3˚

1.0 ± 0.2

0.5 ± 0.2

0.15

+0.10
–0.05

0.10

0.15

M

0.575 MAX.

0.65

+0.10

0.22

–0.05

0.1 ± 0.1

Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.

NOTE

18

Data Sheet P11758EJ3V0DS00

µµµµ

PC2782GR

Recommended Soldering Conditions

The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under

different conditions.

For details of recommended soldering conditions for surface mounting, refer to information document SEMI

CONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

PC2782GR

µµµµ

Soldering process Soldering conditions Symbol

Infrared ray reflow Peak package’s surface temperature: 235 °C or below,

Reflow time: 30 seconds or bel ow (210 °C or higher),
Number of reflow process: 3, Exposure limit

VPS Peak package’s surface temperature: 215 °C or below,

Reflow time: 40 seconds or bel ow (200 °C or higher),
Number of reflow process: 3, Exposure limit

Wave soldering Solder temperature: 260 °C or below,

Reflow time: 10 seconds or bel ow,
Number of reflow process: 1, Exposure limit

Partial heating method Terminal temperature: 300 °C or below,

Flow time: 3 seconds or below,
Exposure limit

Exposure limit before soldering after dry-pack package is opened.

Note

Note

: None

Note

Note

: None

Note

: None

: None

Storage conditions: 25 °C and relative humidity at 65 % or less.

Caution Do not apply more than single process at once, except for “Partial heating method”.

IR35-00-3

VP15-00-3

WS60-00-1

Data Sheet P11758EJ3V0DS00

19

µµµµ

PC2782GR

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98. 8