The ULQ2001, ULQ2003 and ULQ2004 are high
voltage, high current darlington arrays each
containing seven open collector darlington pairs
with common emitters. Each channel rated at
500mA and can withstand peak currents of
600mA. Suppression diodes are included for
inductive load driving and the inputs are pinned
opposite the outputs to simplify board layout.
The versions interface to all common logic
families.
ULQ200XA/XD1
Seven darlington array
DIP-16
ULQ2001
ULQ20035V TTL, CMOS
ULQ20046–15V CMOS, PMOS
General purpose, DTL, TTL, PMOS,
CMOS
These versatile devices are useful for driving a
wide range of loads including solenoids, relays
DC motors, LED displays filament lamps, thermal
print-heads and high power buffers.
The ULQ2001A/2003A and 2004A are supplied in
16 pin plastic DIP packages with a copper leadframe to reduce thermal resistance. They are
available also in small outline package (SO-16) as
ULQ2003D1/2004D1.
= -40 to 105°C for DIP16 unless otherwise specified)
A
= 25 to 105°C for SO16 unless otherwise specified).
(T
J
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
= 50V, (Figure 3.)50
CE
= 105°C, VCE= 50V (Figure 3.)100
T
I
CEX
V
CE(SAT)
I
I(ON)
I
I(OFF)
V
I(ON)
h
t
PLH
t
PHL
V
1. Guaranteed by design.
Output leakage current
Collector-emitter saturation
voltage (Figure 5.)
Input current (Figure 6.)
Input current (Figure 7.)T
Input voltage (Figure 8.)
DC Forward current gain
FE
(Figure 5.)
C
Input capacitance15 25
I
Turn-on delay time0.5 VI to 0.5V
Turn-off delay time0.5 VI to 0.5V
Clamp diode leakage current
I
R
(Figure 9.)
Clamp diode forward voltage
F
(Figure 10.)
A
T
= 105°C for ULQ2004, VCE= 50V,
J
VI = 1V (Figure 4.)
500
IC = 100mA, IB = 250µA0.91.1
= 200mA, IB= 350µA1.11.3
C
= 350mA, IB= 500µA1.31.6
I
C
for ULQ2003, V
= 12V11.45
V
I
= 105°C, IC = 500µA5065µA
A
= 3.85V0.931.35
I
= 5V0.350.5
I
for ULQ2003
I
= 200mA
C
= 250mA
I
C
IC = 300mA
2.4
2.7
3
for ULQ2004
= 125mA
I
C
IC = 200mA
IC = 275mA
= 350mA
I
C
for ULQ2001, VCE = 2V,
IC = 350mA
O
O
= 50V50
V
R
= 105°C, VR = 50V100
T
A
= 350mA1.72V
I
F
1000
0.251
0.251
5
6
7
8
(1)
(1)
(1)
µA
VI
mAfor ULQ2004, V
V
pF
µs
µs
µA
6/13
Page 7
ULQ200XA/XD1Test circuits
5 Test circuits
Figure 3.Figure 4.
Figure 5.Figure 6.
Figure 7.Figure 8.
7/13
Page 8
Test circuitsULQ200XA/XD1
Figure 9.Figure 10.
8/13
Page 9
ULQ200XA/XD1Package mechanical data
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
9/13
Page 10
Package mechanical dataULQ200XA/XD1
Plastic DIP-16 (0.25) MECHANICAL DATA
mm.inch
DIM.
MIN.TYPMAX.MIN.TYP.MAX.
a10.510.020
B0.771.650.0300.065
b0.50.020
b10.250.010
D200.787
E8.50.335
e2.540.100
e317.780.700
F7.10.280
I5.10.201
L3.30.130
Z1.270.050
10/13
P001C
Page 11
ULQ200XA/XD1Package mechanical data
DIM.
A1.750.069
a10.10.250.0040.009
a21.60.063
b0.350.460.0140.018
b10.190.250.0070.010
C0.50.020
c145°(typ.)
(1)
D
E5.86.20.2280.244
e1.270.050
e38.890.350
(1)
F
G4.605.300.1810.208
L0.41.270.1500.050
M0.620.024
S8° (max.)
(1) "D" and "F" do not include mold flash or protrusio ns - Mold
flash or pro trusions sh all not exceed 0.15mm (.006inc.)
mminch
MIN.TYP.MAX.MIN.TYP.MAX.
9.8100.3860.394
3.84.00.1500.157
OUTLINE AND
MECHANICAL DATA
SO16 (Narrow)
0016020 D
11/13
Page 12
Revision historyULQ200XA/XD1
7 Revision history
Table 4.Revision history
DateRevisionChanges
05-Dec-20062Order codes has been updated and document has been reformatted.
23-May-20073Order codes has been updated.
12/13
Page 13
ULQ200XA/XD1
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