Datasheet UCS1003-1/UCS1003-2/UCS1003-3 Datasheet

UCS1003-1/2/3

USB Port Power Controller with Charger Emulation

Features:
• Port Power Switch with Two Current Limit Behaviors
- 2.9V to 5.5V Source Voltage Range
- Up to 3.0A Current (2.85A typical) with 55 m On Resistance
- Overcurrent Trip or Constant Current Limiting
- Selectable Current Limit
- UCS1003-1 has programmable Current Limit via the SMBus 2.0/I
- Dynamic Thermal Management
- Undervoltage and Overvoltage Lockout
- Back-Drive, Back-Voltage Protection
- Latch or Auto-Recovery (Low-Test Current) Fault Handling
- Selectable Active-High or -Low Power Switch Enable
- BC1.2 V Function
• Selectable/Automatic Cycling of Universal Serial Bus (USB) Data Line Charger Emulation Profiles
- USB-IF BC1.2 Charging Downstream Port
(CDP) and Dedicated Charging Port (DCP) modes, Chinese Telecommunications Industry Standard YD/T 1591-2009 and most Apple Inc., Samsung and RIM
- UCS1003-1 supports other Charger Emula-
tion Profiles as defined via the SMBus
2.0/I
- Supports 12W Charging Emulation
- USB 2.0 Compliant High-Speed Data Switch
(in Data Pass-Through, SDP and CDP modes)
- Nine preloaded charger emulation profiles for
maximum compatibility coverage of the peripheral devices
- UCS1003-1 has one Custom-Programmable
Charger Emulation profile for portable device support for fully host-controlled charger emulation
• Supports Active Cables
• UCS1003-1 supports Self-Contained Current Monitoring and Rationing for power-allocation applications
• UCS1003-1 and UCS1003-3 have Low-Power Attach Detection and Open-Drain (A_DET#) pin
• UCS1003-2 has Charging Active (CHRG#) Open-Drain Pin
• Ultra-Low Power Sleep State
• Optional Split Supply Support for V Low Power in System Standby states
2C™
BUS
protocol
2C™
protocol
Discharge Port Renegotiation
®
protocols standard
and VDD for
S
®
• Wake on Attach USB (UCS1003-1 and UCS1003-3)
• UCS1003-1 supports SMBus 2.0/I2C Communications
- Supports Block Write and Read
- Multiple SMBus Addresses
• Wide Operating Temperature Range: -40°C to +85°C
• IEC61000-4-2 8/15 kV Electrostatic Discharge (ESD) Immunity
Description:
The UCS1003-1/2/3 family of devices provides a USB port power switch for precise control of up to 3.0A continuous current (2.85A typical) with Overcurrent Limit (OCL), dynamic thermal management, latch or Auto-Recovery (low-test current) fault handling, selectable active-high or -low enable, undervoltage and overvoltage lockout, back-drive protection and back­voltage protection.
Split supply support for V power in system standby states. This gives battery­operated applications (such as on-board computers) the ability to detect attachments from a Sleep or Off state. After the Attach Detection is flagged, the system can decide to wake-up and/or provide charging.
In addition to Power Switching and Current Limiting modes, the UCS1003-1/2/3 will automatically charge a wide variety of portable devices, including USB-IF BC1.2, YD/T-1591 (2009), most Apple Inc., Samsung and RIM and many others. Nine preloaded charger emulation profiles maximize the compatibility coverage of the peripheral devices. Additionally, a customizable charger emulation profile is available in UCS1003-1 to accommodate unique existing and future portable device handshaking/signature requirements.
The UCS1003-1 also provides current monitoring to allow intelligent management of system power and charge rationing for controlled delivery of current, regard­less of the host power state. This is especially important for battery-operated applications that want to provide power and do not want to drain the battery excessively.
The UCS1003-1/2/3 is available in a 4 mm x 4 mm 20-pin QFN package.
and VDD is an option for low
S
Applications:
• Notebook and Netbook Computers
• Tablets and E-book readers
• Desktops and Monitors
• Docking Stations and Printers
• AC-DC Wall Adapters
2014 Microchip Technology Inc. DS200005346A-page 1
UCS1003-1/2/3
D
MOUT
2
V
BUS1
V
BUS2
M1
D
MIN
D
PIN
SEL
ALERT#
VS1V
S2
V
DD
SMCLK/S0
GND
EM_EN
A_DET#
D
POUT
M2
EP
20119 18 17
3
4
14
13
12
11
678 9
21
5
10
15
16
COMM_SEL/I
LIM
PWR_EN
SMDATA/LATCH
* Includes Exposed Thermal Pad (EP); see Table 3-1.
D
MOUT
2
V
BUS1
V
BUS2
M1
D
MIN
D
PIN
SEL
ALERT#
VS1V
S2
V
DD
S0
GND
EM_EN
CHRG#
D
POUT
M2
EP
20119 18 17
3
4
14
13
12
11
6789
21
5
10
15
16
I
LIM
PWR_EN
LATCH
UCS1003-1
4x4 QFN*
UCS1003-2
4x4 QFN*
D
MOUT
2
V
BUS1
V
BUS2
M1
D
MIN
D
PIN
SEL
ALERT#
VS1V
S2
V
DD
S0
GND
EM_EN
A_DET#
D
POUT
M2
EP
20119 18 17
3
4
14
13
12
11
6789
21
5
10
15
16
I
LIM
PWR_EN
LATCH
UCS1003-3
4x4 QFN*

Package Type

DS200005346A-page 2 2014 Microchip Technology Inc.

Block Diagram

Note 1: Available for UCS1003-1 only.
2: Available for UCS1003-2 only. 3: Available for UCS1003-3 only.
Charger Control,
Measurement,
OCL
Interface,
Logic
SMCLK (Note 1)/S0
SMDATA (Note 1)/LATCH
A_DET# (Note 1, Note 3)
ALERT#
Power Switch
Temp
PWR_EN
D
POUT
D
MOUT
D
PIN
V
DD
V
S
V
BUS
D
MIN
GND
USB 2.0 HS Data Switch &
Charger Emulator
COMM_SEL (Note 1)
/I
LIM
Attach Detector
M1
M2
SEL
EM_EN
V
DD
V
DD
UVLO,
OVLO
CHRG# (Note 2)
UCS1003-1/2/3
2014 Microchip Technology Inc. DS200005346A-page 3
UCS1003-1/2/3
NOTES:
DS200005346A-page 4 2014 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †
UCS1003-1/2/3
Voltage on VDD, VS and V
Pull-Up Voltage (V
PULLUP
Data Switch Current (I
pins ....................................................................................................................-0.3 to 6V
BUS
) ...................................................................................................................-0.3 to VDD + 0.3V
HSW_ON
), Switch On...........................................................................................................±50 mA
Port Power Switch Current ..................................................................................................................... Internally limited
Data Switch Pin Voltage To Ground (D
POUT
PIN
Differential Voltage Across Open Data Switch (D
, D
POUT
MOUT
-D
, D
); (VDD powered or unpowered)....... -0.3 to VDD+0.3V
MIN
PIN
, D
MOUT
- D
MIN
, D
PIN
- D
POUT
, D
MIN
- D
MOUT
) .............V
DD
, D
Voltage on any Other Pin to Ground ................................................................................................... -0.3 to VDD + 0.3V
Current on any Other Pin......................................................................................................................................±10 mA
Package Power Dissipation ............................................................................................................................... Tab le 1 -1
Operating Ambient Temperature Range .....................................................................................................-40 to +125°C
Storage Temperature Range.......................................................................................................................-55 to +150°C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

TABLE 1-1: POWER DISSIPATION SUMMARY

Board Package
High K (see Note 1)
Low K (see Note 1)
20-pin QFN
4x4 mm
20-pin QFN
4x4 mm
Note 1: Junction to ambient (
via design with a thermal landing soldered to the PCB ground plane with 0.3 mm (12 mil) diameter vias in a 3x3 matrix (9 total) at 0.5 mm (20 mil) pitch. The board is multi-layer with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom. A Low K board is a two-layer board without thermal via design with 2-ounce copper traces on the top and bottom.
De-Rating
JC
JA
Factor Above
+25°C
6°C/W 41°C/W 24.4 mW°/C 2193 mW 1095 mW 729 mW
6°C/W 60°C/W 16.67 mW°/C 1498 mW 748 mW 498 mW
) is dependent on the design of the thermal vias. A High K board uses a thermal
JA
TA<+25°C
Power Rating
TA<+70°C
Power Rating
TA<+85°C
Power Rating

TABLE 1-2: ELECTRICAL CHARACTERISTICS

Electrica l Charact eristics: Unless otherwise specified, V
T
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Power Supply
Supply Voltage V
Source Voltage V
DD
S
4.5 5 5.5 V Note 1
2.9 5 5.5 V Note 1
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
2014 Microchip Technology Inc. DS200005346A-page 5
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
and I
PULLUP
1.68A).
LIM
= 3V to 5.5V,
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Supply Current in Active (I
DD_ACTIVE
+ I
VS_ACT
)
Supply Current in Sleep (I
DD_SLEEP
+ I
VS_SLEEP
)
Supply Current in Detect (I
DD_DETECT
+ I
VS_DETECT
)
I
650 750 µA Average current I
ACTIVE
I
SLEEP
I
DETECT
5 15 µA Average current
185 µA Average current,
Power-on Reset
Low Threshold V
V
S
Low Hysteresis V
V
S
V
Low Threshold V
DD
V
Low Hysteresis V
DD
S_UVLO
S_UVLO_HYST
DD_TH
DD_TH_HYST
—2.5— VV
—100— mVVS voltage decreasing
—4— VV
—500— mVVDD voltage decreasing
I/O Pins - SMCLK (UCS1003-1), SMDATA (UCS1003-1), EM_EN, M1, M2, PWR_EN, S0, LATCH, ALERT#, A_DET# (UCS1003-1 and UCS1003-3), CHRG# (UCS1003-2) – DC Parameters
Output Low Voltage V
Input High Voltage V
Input Low Voltage V
Leakage Current I
LEAK
OL
IH
IL
——0.4 VI
2.0 V PWR_EN, EM_EN, M1, M2,
0.8 V PWR_EN, EM_EN, M1, M2,
±5 µA Powered or unpowered,
Interrupt Pins - AC Parameters
ALERT#, A_DET# Pin
t
BLANK
—25—ms
Blanking Time
ALERT# Pin
t
MASK
—5—ms
Interrupt Masking Time
SMBus/I2C™ Timing (UCS1003-1 only)
Input Capacitance C
Clock Frequency f
Spike Suppression t
Bus Free Time Stop-to-Start t
Start Setup Time t
Start Hold Time t
Stop Setup Time t
Data Hold Time t
SU:STA
HD:STA
SU:STO
HD:DAT
IN
SMB
SP
BUF
—5—pF
10 400 kHz
1.3 µs
0.6 µs
0.6 µs
0.6 µs
0 µs When transmitting to the
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
V
no portable device attached.
SINK_IO
SMDATA, ALERT#, A_DET#, CHRG#
LATCH, S0, SMDATA, SMCLK
LATCH, S0, SMDATA, SMCLK
V
—50 nsNote 2
master
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
= 3V to 5.5V,
PULLUP
V
PULLUP
voltage increasing
S
voltage increasing
DD
DD
= 8 mA
V
PULLUP
and I
1.68A).
LIM
DD
BUS
=0mA
DS200005346A-page 6 2014 Microchip Technology Inc.
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Data Hold Time t
Data Setup Time t
Clock Low Period t
Clock High Period t
Clock/Data Fall Time t
Clock/Data Rise Time t
Capacitive Load C
Timeout t
Idle Reset t
TIMEOUT
IDLE_RESET
HD:DAT
SU:DAT
LOW
HIGH
FALL
RISE
LOAD
0.3 µs When receiving from the
0.6 µs
1.3 µs
0.6 µs
——300nsMin = 20+0.1C
——300nsMin = 20+0.1C
400 pF Per bus line, Note 2
25 35 ms Disabled by default, Note 2
350 µs Disabled by default, Note 2
High-Speed Dat a Swit ch
High-Speed Data Switch - DC Parameters
Switch Leakage Current I
HSW_OFF
Charger Resistance R
On Resistance R
On Resistance R
ON_HSW_1
Delta-On Resistance R
CHG
ON_HSW
ON_HSW
±0.5 µA Switch open - D
—2—M D
—2— Switch closed, VDD = 5V
—5— Switch closed, VDD = 5V,
—±0.3— Switch closed, VDD = 5V,
High-Speed Data Switch - AC Parameters
DP, DM Capacitance to
C
HSW_ON
4 pF Switch closed, VDD = 5V
Ground
D
, DM Capacitance to
P
C
HSW_OFF
2 pF Switch open, VDD = 5V
Ground
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
master
Note 3
Note 3
D to ground. V
ground (see Figure 1-2), BC1.2 DCP charger emulation active
test current = 8 mA, test voltage = 0.4V, see Figure 1-2
test current = 8 mA, test voltage = 3.0V, see Figure 1-2
I
TST
see Figure 1-2
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
to D
MIN
VS.
DD
or D
POUT
= 8 mA, V
and I
PULLUP
MOUT
MOUT
1.68A).
LIM
TST
= 3V to 5.5V,
ns,
LOAD
ns,
LOAD
PIN
to D
POUT
,
, or all four pins
to V
BUS
or
= 0 to 1.5V,
2014 Microchip Technology Inc. DS200005346A-page 7
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Turn-Off Time t
Turn-On Time t
HSW_OFF
HSW_ON
Propagation Delay t
Propagation Delay Skew t
Rise/Fall Time t
– DM Crosstalk X
D
P
Off Isolation O
PD
PD
F/R
TALK
IRR
400 µs Time from state control
400 µs Time from state control
—0.25— nsR
—25— psR
—10— nsR
—-40— dBR
—-30— dBR
-3 dB Bandwidth BW 1100 MHz R
To t al J it te r t
Skew of Opposite Transitions
t
J
SK(P)
—200— psR
—20— psR
of the Same Output
Port Power Switch
Port Power Switch - DC Parameter
Overvoltage Lockout V
On Resistance R
V
Leakage Current I
S
Back-Voltage Protection
LEAK_VS
V
S_OV
ON_PSW
BV_TH
—6— V
—55—m 4.75V < VS < 5.25V
2.2 µA Sleep state into VS pin
—150— mVV
Threshold
Back-Drive Current I
BD_1
I
BD_2
—0 3 µAV
—0 2 µAV
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
(EM_EN, M1, M2) switch on to switch off, R C
(EM_EN, M1, M2) switch off to switch on, R C
f= 240MHz
V
Rise Time = Fall Time = 500 ps at 480 Mbps (PRBS = 215–1)
V
Any powered power pin to any unpowered power pin. Current out of unpowered pin (Note 3)
Any powered power pin to any unpowered power pin, except for V Power state and V Active Power state. Current out of unpowered pin (Note 3)
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
PULLUP
TERM
=5pF
LOAD
TERM
=5pF
LOAD
=50, C
TERM
=50, C
TERM
=50, C
TERM
=50, C
TERM
=50, C
TERM
=50, C
TERM
DPOUT=VDMOUT
=50, C
TERM
=50, C
TERM
> VS,
BUS
> V
S
S_UVLO
< V
DD
< V
DD
and I
DD
DD_TH
DD_TH
to V
1.68A).
LIM
,
,
BUS
= 3V to 5.5V,
=50,
=50,
=5pF
LOAD
=5pF
LOAD
=5pF
LOAD
=5pF
LOAD
=5pF,
LOAD
=5pF,
LOAD
= 350 mV DC
=5pF,
LOAD
=5pF
LOAD
in Detect
to V
S
BUS
in
DS200005346A-page 8 2014 Microchip Technology Inc.
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Selectable Current Limits I
Pin Wake Time t
SMBus Wake Time t
Idle Sleep Time t
PIN_WAKE
SMB_WAKE
IDLE_SLEEP
Thermal Regulation Limit T
LIM1
I
LIM2
I
LIM3
I
LIM4
I
LIM5
I
LIM6
I
LIM7
I
LIM8
REG
—570— mAI
—1000— I
—1130— I
—1350— I
—1680—
—2050—
—2280—
2700 2850 3000 I
—3—ms
—4—msUCS1003-1 only —200— msUCS1003-1 only
110 °C Die Temperature at which
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
(minimum mA setting)
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
I
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
I
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
I
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
LIM
(UCS1003-1 only)
I
LIM
(UCS1003-2/3)
current limit will be reduced
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
PULLUP
Resistor = 0 or 47 k
Resistor = 47 k
Resistor = 10 k or 56 k
Resistor = 56 k
Resistor = 12 k or 68 k
Resistor = 68 k
Resistor = 15 k or 82 k
Resistor = 82 k
Resistor = 18 k or 100 k
Resistor = 100 k
Resistor = 22 k or 120 k
Resistor = 120 k
Resistor = 27 k or 150 k
Resistor = 150 k
Resistor = 33 k or V
Resistor = V
and I
1.68A).
LIM
= 3V to 5.5V,






DD
DD
2014 Microchip Technology Inc. DS200005346A-page 9
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Thermal Regulation
T
REG_HYST
—10— °CHysteresis for t
Hysteresis
Thermal Shutdown Threshold T
Thermal Shutdown Hysteresis T
TSD_HYST
Auto-Recovery Test Current I
Auto-Recovery Test Voltage V
Discharge Impedance R
DISCHARGE
TSD
TEST
TEST
135 °C Die temperature at which port
35 °C After shutdown due to
190 mA Portable device attached,
750 mV Portable device attached,
—100—
Port Power Switch - AC Parameters
Turn-On Delay t
Turn-Off Time t
Turn-Off Time t
Turn-Off Time t
V
Output Rise Time t
BUS
OFF_PSW_INA
OFF_PSW_ERR
OFF_PSW_ERR
Soft Turn-on Rate I
Temperature Update Time t
DC_TEMP
ON_PSW
R_BUS
BUS/t
0.75 ms PWR_EN active toggle to
0.75 ms PWR_EN inactive toggle to
1 ms Overcurrent Error, V
100 ns TSD or Back-drive Error to
1.1 ms Measured from 10% to 90% of
—100—mA/µs
200 ms Programmable (UCS1003-1
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
functionality. Temperature must drop by this value before I
LIM
operation
power switch will turn off
T temperature drop required before port power switch can be turned on again
V
V Die Temp < T
Programmable (UCS1003-1 only), 250-1000 mV, default
listed
switch on time, V not active
switch off time C
Error, or Discharge Error to switch off, C
switch off, C
V I
LIM
only) 200-1600 ms, default
listed
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
PULLUP
value restored to normal
being reached, die
TSD
= 0V, Die Temp < T
BUS
= 0V before application,
BUS
TSD
= 120 μF
BUS
BUS
BUS
BUS
, C
LOAD
= 220 μF,
= 1.0A
and I
1.68A).
LIM
= 3V to 5.5V,
REG
TSD
discharge
BUS
Min
BUS
= 120 μF
= 120 μF
DS200005346A-page 10 2014 Microchip Technology Inc.
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Short Circuit Response Time t
Short Circuit Detection Time t
SHORT_LIM
SHORT
Latched Mode Cycle Time t
Auto-Recovery Mode
t
UL
CYCLE
1.5 µs Time from detection of short to
6 ms Time from detection of short to
7 ms From PWR_EN edge transition
25 ms Time delay before error
Cycle Time
Auto-Recovery Delay t
Discharge Time t
DISCHARGE
RST
20 ms Portable device attached,
200 ms Amount of time discharge
Port Power Switch Operation With Trip Mode Current Limiting
Region 2 Current Keep-Out I
Minimum V
Allowed at
BUS
BUS_R2MIN
V
BUS_MIN
—0.12— A
1.5 2.0 2.25 V
Output
Port Power Switch Operation with Constant Current Limiting (Variable Slope)
Region 2 Current Keep-Out I
Minimum V
Allowed at
BUS
BUS_R2MIN
V
BUS_MIN
—1.68— A
1.5 2.0 2.25 V
Output
Current Measurement (UCS1003-1 only) - DC
Current Measurement Range I
Reported Current
BUS_M
D
IBUS_M
0 2988.6 mA Range 0-255 LSB (see Note 4)
11.72 mA 1 LSB
Measurement Resolution
Current Measurement Accuracy
—±2— %180mA < I
—±2—LSBI
Current Measurement (UCS1003-1 only) - AC
Sampling Rate 500 µs
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
current limit applied. No C applied
port power switch disconnect and ALERT# pin assertion.
from inactive to active to begin error recovery
condition check
Programmable (UCS1003-1 only) 10-25 ms, default listed
V this time
Programmable (UCS1003-1 only) 10-25 ms, default listed
resistor applied
Programmable (UCS1003-1 only) 100-400 ms, default
listed
BUS
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
PULLUP
must be  V
BUS
< 180 mA
and I
LIM
< I
BUS
1.68A).
= 3V to 5.5V,
BUS
after
TEST
LIM
2014 Microchip Technology Inc. DS200005346A-page 11
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Charge Rationing (UCS1003-1 only) - DC
Accumulated Current
—±4.5— %
Measurement Accuracy
Charge Rationing (UCS1003-1 only) - AC
Current Measurement Update
t
PCYCLE
—1— s
Time
Attach/Removal Detection
V
BUS
On Resistance R
Leakage Current I
Current Limit I
ON_BYP
LEAK_BYP
DET_CHG
I
BUS_BYP
/
—50—
3 µA Switch off, Note 2
—2—mAV
Attach/Removal Detection - DC
Attach Detection Threshold I
Primary Removal Detection
I
REM_QUAL_ACT
DET_QUAL
800 µA Programmable (UCS1003-1
700 µA Programmable (UCS1003-1
Threshold
I
REM_QUAL_DET
800 µA Programmable (UCS1003-1
Attach/Removal Detection - AC
Attach Detection Time t
Removal Detection Time t
Allowed Charge Time t
DET_QUAL
REM_QUAL
DET_CHARGE
100 ms Time from Attach to A_DET#
—1000— ms
—800— msC
Charger Emulation Profile
General Emulation - DC
Charging Current Threshold I
BUS_CHG
46.9 mA Default value for UCS1003-1 —175.8— mAUCS1003-2 and UCS1003-3
Charging Current
I
BUS_CHG_RNG
11.72 175.8 mA Note 5
Threshold Range
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
Bypass - DC
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
PULLUP
= 5V and V
DD
only) 200–1000 µA, default
listed
only) 100–900 µA, default
listed, Active Power state
only) 200–1000 µA, default
listed, Detect Power state (see
Section 8 .4 “Removal Detection”)
assert (UCS1003-1 and UCS1003-3 only)
= 500 µF maximum,
BUS
Programmable 200–2000 ms, default listed
LIM
and I
1.68A).
LIM
= 3V to 5.5V,
> 4.75V
BUS
DS200005346A-page 12 2014 Microchip Technology Inc.
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
DP-DM Shunt Resistor Value R
Response Magnitude
SX_RXMAG_DVDR
DCP_RES
——200 Connected between D
93 200 k Note 5 (voltage divider option resistance range)
Resistor Ratio Range
SX_RATIO 0.25 0.66 V/V Note 5
(voltage divider option)
Resistor Ratio Accuracy
SX_RATIO_ ACC
±0.5 % Average over range (voltage divider option)
Response Magnitude
SX_RXMAG_RES
1.8 150 k Note 5
(resistor option range)
Internal Resistor Tolerance (resistor option)
Response Magnitude
SX_RXMAG_RES
_ACC
SX_RXMAG_VOLT
±10 % Average over range
0.4 2.2 V Note 5
(voltage option range)
Voltage Option Accuracy
Voltage Option Accuracy
Voltage Option Accuracy
Voltage Option Output
Response Magnitude
SX_RXMAG_VOLT
_ACC
SX_RXMAG_VOLT
_ACC_ 150
SX_RXMAG_VOLT
_ACC_ 250
SX_RXMAG_VOLT
_BC
±1 % No load, average over range
-6 % 150 µA load,
-10 % 250 µA load,
0.5 V D
SX_PUPD 10 150 µA SX_RXMAG_VOLT = 0
(Zero Volt Option Range)
Pull-Down Current Accuracy
Pull-Down Current
Stimulus Voltage
SX_PUPD _ACC_3p6
SX_PUPD _ACC_BC
—±5— %D
50 µA Setting = 100 µA
SX_TH 0.3 2.2 V Note 5
Threshold Range
Stimulus Voltage Accuracy SX_TH_ ACC ±2 % Average over range
Stimulus Voltage Accuracy
SX_TH_ACC_BC
0.25 V At SX_TH = 0.3V, Note 3
General Emulation - AC
Emulation Reset Time t
Emulation Reset Time Range
t
EM_RESET_ RNG
Emulation Timeout Range t
EM_RESET
EM_ TIMEOUT
—50—msDefault
50 175 ms Note 5
0.8 12.8 s Note 5
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
and D 0V < D
average over range
average over range
Note 3
Note 5
Compliance voltage
D Compliance voltage, Note 3
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
= 3V to 5.5V,
PULLUP
,
MOUT
= D
POUT
= 0.6V, 250 µA load,
MOUT
or D
POUT
POUT
and I
or D
LIM
MOUT
MOUT
1.68A).
MOUT
POUT
< 3V
= 3.6V
= 0.15V
2014 Microchip Technology Inc. DS200005346A-page 13
UCS1003-1/2/3
TABLE 1-2: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrica l Charact eristics: Unless otherwise specified, V
= -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.
T
A
Characteristic Sym. Min. Typ. Max. Unit Conditions
Stimulus Delay,
t
STIM_DEL
0 100 ms Note 5
SX_TD Range
Emulation Delay t
RES_EM
0.5 s Time from set impedance to
Note 1: For split supply systems using the Attach Detection feature, V
2: This parameter is ensured by design and not 100% tested. 3: This parameter is characterized, but not 100% production tested. 4: The current measurement full-scale range maximum value is 3.0A. However, the UCS1003-1 cannot report
values above I
LIM
(if I
BUS_R2MIN
I
LIM
) or above I
5: The Min and Max values represent the boundaries of a programmable range for UCS1003-1 only. Each value
in the range is typical.
= 4.5V to 5.5V, VS = 2.9V to 5.5V, V
DD
impedance appears on D
Note 3
must not exceed VDD+150mV.
S
BUS_R2MIN
(if I
BUS_R2MIN
> I
LIM
and I
PULLUP
1.68A).
LIM
= 3V to 5.5V,
P/DM
,

FIGURE 1-1: USB Rise Time/Fall Time Measurement.

DS200005346A-page 14 2014 Microchip Technology Inc.
UCS1003-1/2/3
D
PIN
D
POUT
R
CHG
V
BUS
V
TST
R
CHG
I
TST
D
MIN
R
CHG
V
BUS
V
TST
R
CHG
I
TST
D
MOUT

FIGURE 1-2: Description of DC Terms.

TABLE 1-3: TEMPERATURE SPECIFICATIONS

Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operating Temperature Range T
Storage Temperature Range T
Thermal Package Resistances - see Table 1-1
-40 +85 °C
A
-55 +150 °C
A
2014 Microchip Technology Inc. DS200005346A-page 15
UCS1003-1/2/3
NOTES:
DS200005346A-page 16 2014 Microchip Technology Inc.
UCS1003-1/2/3
-1
0
1
2
3
4
5
6
-1
0
1
2
3
4
5
6
0246810
VS= VDD= 5V I
LIM
= 3A max. (2.85A typical), short applied at 2 ms
ALERT #
I
BUS
V
BUS
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
5
010203040
50
V
DD
ALERT# Pin
I
BUS
Current
Time (ms)
Voltage (V)Current (A) Voltage (V)
VS=VDD= 5V, short applied at 16 ms
-2
-1
0
1
2
3
4
5
6
02040
-2
0
2
4
6
8
10
12
14
Voltage (V)
VS=VDD= 5V, I
LIM
= 2.05A (typical),
short applied at 17.2 μs
V
I
BUS
-1
0
1
2
3
4
5
6
0 100 200 300 400 500
Voltage (V)
V
BUS
EM_EN
VS= VDD= 5V M2 = 0, M1 = PWR_EN = 1

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, V
= VS = 5V, TA = +27°C.
DD

FIGURE 2-1: USB-IF High-Speed Eye Diagram (Without Data Switch).

FIGURE 2-4: Power-Up Into a Short.

BUS
Current (A)

FIGURE 2-2: USB-IF High-Speed Eye Diagram (With Data Switch).

Voltage (V)

FIGURE 2-3: Short Applied After Power-Up.

2014 Microchip Technology Inc. DS200005346A-page 17
Time (ms)
Current (A)
Time (μs)

FIGURE 2-5: Internal Power Switch Short Response.

Time (ms)
FIGURE 2-6: V
Discharge Behavior.
BUS
UCS1003-1/2/3
0
10
20
30
40
50
60
70
80
90
0.01 0.1 1 10 100 1000
Off Isolation (dB)
D
POUT
= D
MOUT
= 0.35V
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0.01 1 100 10000
D
POUT
= D
MOUT
= 0.35V
0.0
0.5
1.0
1.5
2.0
2.5
-40 -15 10 35 60 85
On Resistance (
:
)
D
POUT
= D
MOUT
= 0.4V
0
10
20
30
40
50
60
70
-40 -15 10 35 60 85
On Resistance (m
:
)
0
20
40
60
80
100
120
140
160
180
200
-40 -15 10 35 60 85
Resistance (
:
)
D
= D
= 3V
D
POUT
= D
MOUT
= 0.15V
0.5
0.55
0.6
0.65
0.7
0.75
0.8
0.85
0.9
0.95
1
-40 -15 10 35 60 85
Time (ms)
VS= VDD= 5V
Turn on time
Note: Unless otherwise indicated, V
Frequency (MHz)
= VS = 5V, TA = +27°C.
DD

FIGURE 2-7: Data Switch Off Isolation vs. Frequency.

0
Gain (dB)
Temperature (°C)

FIGURE 2-10: Power Switch On Resistance vs. Temperature.

POUT
MOUT
Frequency (MHz)

FIGURE 2-8: Data Switch Bandwidth vs. Frequency.

Temperature (°C)

FIGURE 2-9: Data Switch On Resistance vs. Temperature.

DS200005346A-page 18 2014 Microchip Technology Inc.
Temperature (°C)
FIGURE 2-11: R
DCP_RES
Resistance
vs.Temperature.
Turn off time
Temperature (°C)

FIGURE 2-12: Power Switch On/Off Time vs. Temperature.

UCS1003-1/2/3
5.9
5.91
5.92
5.93
5.94
5.95
5.96
5.97
5.98
5.99
6
-40 -15 10 35 60 85
Threshold Voltage (V)
VDD= 5V
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3
-40 -15 10 35 60 85
V
S
Threshold Voltage (V)
Threshold
Hysteresis
VDD= 5V
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0 500 1000 1500 2000 2500 3000 3500 4000
VS= VDD= 5V S0 = '1' PWR_EN disabled
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
-40 -15 10 35 60 85
VS= VDD= 5V I
LIM
= 3.0 A max. (2.85A typical)
Note: Specification is 0% maximum and -10% minimum
Current Limit Accuracy (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
00.511.522.53
Accuracy (%)
VS= VDD= 5V
0
100
200
300
400
500
600
700
800
-40 -15 10 35 60 85
Supply Current (μA)
I
DD
VS= VDD= 5V
IDD+ I
S
I
S
Note: Unless otherwise indicated, V
Temperature (°C)
= VS = 5V, TA = +27°C.
DD

FIGURE 2-13: VS Overvoltage Threshold vs. Temperature.

Temperature (°C)

FIGURE 2-16: Trip Current Limit Operation vs. Temperature.

Temperature (°C)
FIGURE 2-14: V vs. Temperature.
Voltage (V)
FIGURE 2-15: Detect State V
2014 Microchip Technology Inc. DS200005346A-page 19
Undervoltage Threshold
S
Current (μA)
vs. I
BUS
BUS
Current (A)
FIGURE 2-17: I
Measurement
BUS
Accuracy.
Temperature (°C)
.

FIGURE 2-18: Active State Current vs. Temperature.

UCS1003-1/2/3
0
50
100
150
200
250
-40 -15 10 35 60 85
Detect Current (μA)
I
DD
VS= VDD= 5V
IDD+ I
S
I
S
0
1
2
3
4
5
6
7
8
9
10
-40 -15 10 35 60 85
I
DD
VS= VDD= 5V
IDD+ I
S
I
S
0%
5%
10%
15%
20%
25%
30%
0%
5%
10%
15%
20%
25%
30%
35%
40%
Samples (%)
0%
5%
10%
15%
20%
25%
30%
Samples (%)
0%
5%
10%
15%
20%
25%
30%
35%
Samples (%)
Note: Unless otherwise indicated, V
Temperature (°C)
= VS = 5V, TA = +27°C.
DD

FIGURE 2-19: Detect State Current vs. Temperature.

Sleep Current (μA)
0.928
0.940
0.952
0.964
0.976
0.988
1.000
1.012
1.024
V
BUS
Current (A)
1.036

FIGURE 2-22: ILIM2 Trip Current Distribution.

1.048
1.060
1.072
Temperature (°C)

FIGURE 2-20: Sleep State Current vs. Temperature.

Samples (%)
0.534
0.540
0.546
0.552

FIGURE 2-21: ILIM1 Trip Current Distribution.

DS200005346A-page 20 2014 Microchip Technology Inc.
0.558 V
BUS
0.564
0.570
Current (A)
0.576
0.582
0.588
0.594
0.600
0.606
1.090
1.100
1.110
V
BUS
1.120
1.130
1.140
Current (A)
1.150
1.160
1.070
1.080

FIGURE 2-23: ILIM3 Trip Current Distribution.

1.260
1.275
1.290
1.305
1.320
1.335
1.350
1.365
1.380
V
BUS
Current (A)
1.395

FIGURE 2-24: ILIM4 Trip Current Distribution.

1.170
1.410
1.180
1.425
1.190
1.440
UCS1003-1/2/3
0%
5%
10%
15%
20%
25%
30%
35%
40%
0%
5%
10%
15%
20%
25%
30%
0%
5%
10%
15%
20%
25%
30%
Samples (%)
0%
5%
10%
15%
20%
25%
Note: Unless otherwise indicated, V
Samples (%)
1.560
1.580
1.600
1.620
1.640
1.660 Current (A)
BUS
1.680
V
= VS = 5V, TA = +27°C.
DD
1.700
1.720
1.740

FIGURE 2-25: ILIM5 Trip Current Distribution.

Samples (%)
1.760
1.780
1.800
2.160
2.180
2.200
2.220
2.240
2.260
2.280
2.300
2.320
V
BUS
Current (A)
2.340

FIGURE 2-27: ILIM7 Trip Current Distribution.

30%
Samples (%)
2.360
2.380
2.400
1.942
1.960
1.978
1.996
2.014
2.032
2.050
2.068
2.086
2.104
2.122
2.140
V
Current (A)
BUS

FIGURE 2-26: ILIM6 Trip Current Distribution.

2.158

FIGURE 2-28: ILIM8 Trip Current Distribution.

2.700
2.725
2.750
2.775
2.800 V
BUS
2.825
2.850
Current (A)
2.875
2.900
2.925
2.950
2.975
3.000
2014 Microchip Technology Inc. DS200005346A-page 21
UCS1003-1/2/3
NOTES:
DS200005346A-page 22 2014 Microchip Technology Inc.
2014 Microchip Technology Inc. DS200005346A-page 23

3.0 PIN DESCRIPTION

Descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

UCS1003-
1/2/3
4x4 QFN
1 M1 Active mode selector input #1 DI Connect to ground or V
2 M2 Active mode selector input #2 DI Connect to ground or V
3V
4V
5 COMM_SEL/I
6 SEL Selects polarity of PWR_EN control and, in the
7V
8
9VDDMain power supply input for chip functionality Power n/a
10 PWR_EN Port power switch enable input.
11 SMDATA/LATCH SMDATA (UCS1003-1 only)- SMBus data input/output
Note 1: Total leakage current from pins 3 and 4 (V
2: It is recommended to use 2 M pull-down resistors on the D
ger Emulation profile with the high-speed data switch open. The 2 M value is based on BC1.1 impedance characteristics for Dedicated Charging Ports.
3: To ensure operation, the PWR_EN pin must be enabled, as determined by the SEL pin decode, when it is not driven by an external device. Furthermore,
one of the M1, M2 or EM_EN pins must be connected to V M1, M2 and EM_EN pins are connected to ground, the UCS1003-1 will remain in the Sleep or Detect state unless activated via the SMBus (UCS1003-2 and UCS1003-3 will remain in Sleep or Detect state indefinitely).
Symbol Function Pin Type Connection Type if Pin Not Used
BUS1
BUS2
Voltage output from Power Switch. These pins are internally connected and must be tied together.
COMM_SEL (UCS1003-1 only) - Selects SMBus or
LIM
Hi-Power
Note 1
AIO n/a
Leave open
Stand-Alone mode of operation (see Table 11-1).
I
- Selects the hardware current limit at power-up.
LIM
AIO n/a
UCS1003-1, SMBus address (see Table 11-2).
S1
V
S2
Voltage input to Power Switch. These pins are internally connected and must be tied together.
Hi-Power Connect to ground
DI Connect to ground or VDD (see Note 3)
Polarity determined by SEL pin.
DIOD n/a
(requires pull-up resistor)
LATCH - In Stand-Alone mode, Latch/Auto-Recovery
DI
fault handling mechanism selection input (see
Section 7 .5 “Fault Handling Mechanism”)
) to ground must be less than 100 µA for proper Attach/Removal Detection operation.
BUS
and/or D
POUT
if all three are not driven from an external device. If the PWR_EN pin is disabled or all of the
DD
pin if a portable device stimulus is expected when using the Customer Char-
MOUT
(see Note 3)
DD
(see Note 3)
DD
UCS1003-1/2/3
DS200005346A-page 24 2014 Microchip Technology Inc.
TABLE 3-1: PIN FUNCTION TABLE
UCS1003-1/2/3
UCS1003-
1/2/3
Symbol Function Pin Type Connection Type if Pin Not Used
4x4 QFN
12 SMCLK/S0 SMCLK (UCS1003-1 only) - SMBus Clock Input
DI n/a
(requires pull-up resistor)
S0 - In Stand-Alone mode, enables Attach/Removal Detection feature (see Section 5.3.6 “S0 Input”)
13 ALERT# Active-low error event output flag
OD Connect to ground
(requires pull-up resistor)
14 D
PIN
USB data input (plus) AIO Connect to ground or ground through a
resistor
15 D
MIN
USB data input (minus) AIO Connect to ground or ground through a
resistor
16 D
17 D
MOUT
POUT
18 A_DET#
(UCS1003-1 and UCS1003-3)
CHRG#
(UCS1003-2)
19 EM_EN Active mode selector input DI Connect to ground or V
20
GND Ground Power n/a
21 EP Exposed Thermal Pad. Must be connected to electrical
USB data output (minus) AIO (see Note 2) Connect to ground
USB data output (plus) AIO (see Note 2) Connect to ground
Active-low device Attach Detection output flag
OD Connect to ground
(requires pull-up resistor)
Active-low “Charging Active” output flag (requires pull-up
OD Connect to ground
resistor)
EP n/a
(see Note 3)
DD
ground.
Note 1: Total leakage current from pins 3 and 4 (V
2: It is recommended to use 2 M pull-down resistors on the D
) to ground must be less than 100 µA for proper Attach/Removal Detection operation.
BUS
POUT
and/or D
pin if a portable device stimulus is expected when using the Customer Char-
MOUT
ger Emulation profile with the high-speed data switch open. The 2 M value is based on BC1.1 impedance characteristics for Dedicated Charging Ports.
3: To ensure operation, the PWR_EN pin must be enabled, as determined by the SEL pin decode, when it is not driven by an external device. Furthermore,
one of the M1, M2 or EM_EN pins must be connected to V
if all three are not driven from an external device. If the PWR_EN pin is disabled or all of the
DD
M1, M2 and EM_EN pins are connected to ground, the UCS1003-1 will remain in the Sleep or Detect state unless activated via the SMBus (UCS1003-2 and UCS1003-3 will remain in Sleep or Detect state indefinitely).

TABLE 3-2: PIN TYPES DESCRIPTION

Pin Type Description
Power This pin is used to supply power or
ground to the device
Hi-Power This pin is a high-current pin
AIO Analog Input/Output - this pin is used
as an I/O for analog signals.
DI Digital Input - this pin is used as a
digital input. This pin will be glitch-free.
DIOD Open-Drain Digital Input/Output - this
pin is bidirectional. It is open-drain and requires a pull-up resistor. This pin will be glitch-free.
OD Open-Drain Digital Output - used as a
digital output. It is open-drain and requires a pull-up resistor. This pin will be glitch-free.
EP Exposed Thermal Pad
UCS1003-1/2/3
2014 Microchip Technology Inc. DS200005346A-page 25
UCS1003-1/2/3
NOTES:
DS200005346A-page 26 2014 Microchip Technology Inc.
UCS1003-1/2/3

4.0 TERMS AND ABBREVIATIONS

Note: In the case of UCS1003-1, the M1, M2, PWR_EN and EM_EN pins each have configuration bits (<pin
name>_SET in Section 10.4.3 “Switch Configuration Register”) that may be used to perform the same
function as the external pin state. These bits are accessed via the SMBus/I respective pin. This OR’d combination of pin state and register bit is referenced as the <pin name> control.

TABLE 4-1: TERMS AND ABBREVIATIONS

Term/Abbreviation Description
Active mode Active power state operation mode: Data Pass-through, BC1.2 SDP, BC1.2 CDP, BC1.2 DCP
or Dedicated Charger Emulation Cycle.
Attach Detection An Attach Detection event occurs when the current drawn by a portable device is greater than
I
DET_QUAL
for longer than t
DET_QUAL
Attachment The physical insertion of a portable device into a USB port that UCS1003-1/2/3 is controlling.
CC Constant Current
CDM Charged Device Model. JEDEC model for characterizing susceptibility of a device to damage
from ESD.
CDP or USB-IF BC1.2 CDP
Charging Downstream Port. The combination of the UCS1003-1/2/3 CDP handshake and an active standard USB host comprises a CDP. This enables a BC1.2 compliant portable device to simultaneously draw current up to 1.5A while data communication is active. The USB high-speed data switch is closed in this mode.
Charge Enable When a charger emulation profile has been accepted by a portable device and charging
commences.
Charger Emulation Profile
Representation of a charger comprised of D a defined set of signatures or handshaking protocols.
Connection USB-IF term which refers to establishing active USB communications between a USB host
and a USB device.
Current Limiting Mode
Determines the action that is performed when the I opens the port power switch. Constant Current (variable slope) allows V the portable device.
DCE Dedicated Charger Emulation. Charger emulation in which the UCS1003-1/2/3 can deliver
power only (by default). No active USB data communication is possible when charging in this mode (by default).
DCP or USB-IF BC1.2 DCP
Dedicated Charging Port. This functions as a dedicated charger for a BC1.2 portable device. This allows the portable device to draw currents up to 1.5A with Constant Current Limiting (and beyond 1.5A with Trip Current Limiting). No USB communications are possible (by default).
DC Dedicated Charger. A charger which inherently does not have USB communications, such as
an A/C wall adapter.
Disconnection USB-IF term which refers to the loss of active USB communications between a USB host and
a USB device.
Dynamic Thermal Management
The UCS1003-1/2/3 automatically adjusts port power switch limits and modes to lower internal power dissipation when the thermal regulation temperature value is approached.
Enumeration A USB-specific term indicating that a host is detecting and identifying USB devices.
Handshake Application of a charger emulation profile that requires a response. Two-way communication
between the UCS1003-1/2/3 and the portable device.
HBM Human Body Model
HSW High-speed switch
I
BUS_R2MIN
Current limiter mode boundary
.
POUT
, D
and V
MOUT
current reaches the I
BUS
2
C and are OR’d with the
signaling, which make up
BUS
threshold. Trip
LIM
to be dropped by
BUS
2014 Microchip Technology Inc. DS200005346A-page 27
UCS1003-1/2/3
TABLE 4-1: TERMS AND ABBREVIATIONS (CONTINUED)
Term/Abbreviation Description
I
LIM
Legacy USB devices that require non-BC1.2 signatures be applied on the D
OCL Overcurrent limit
POR Power-on Reset
Portable Device USB device attached to the USB port.
Power Thief A USB device that does not follow the handshaking conventions of a BC1.2 device or Legacy
Removal Detection A Removal Detection event occurs when the current load on the V
Removal The physical removal of a portable device from a USB port that the UCS1003-1/2/3 is controlling.
Response An action, usually in response to a stimulus, in charger emulation performed by the UCS1003-
SDP or USB-IF SDP Standard downstream port. The combination of the UCS1003-1/2/3 high-speed switch being
Signature Application of a charger emulation profile without waiting for a response. One-way communi-
Stand-Alone Mode Indicates that the communications protocol is not active and all communications between the
Stimulus An event in charger emulation detected by the UCS1003-1/2/3 device via the USB data lines.
The I port power switch is opened. In Constant Current mode, when the current exceeds I ation continues at a reduced voltage and increased current; if V V
current threshold used in current limiting. In Trip mode, when I
BUS
BUS_MIN
, the port power switch is opened.
is reached, the
LIM
voltage drops below
BUS
and D
POUT
MOUT
, oper-
LIM
pins to
enable charging.
devices and draws current immediately upon receiving power (i.e., a USB book light, portable fan, etc).
pin drops to less than
I
REM_QUAL
for longer than t
REM_QUAL
.
BUS
1/2/3 device via the USB data lines.
closed with an upstream USB host present comprises a BC1.2 SDP. This enables a BC1.2 compliant portable device to simultaneously draw current up to 0.5A while data communication is active.
cation from the UCS1003-1/2/3 to the portable device.
UCS1003-1/2/3 and a controller are done via the external pins only (M1, M2, EM_EN, PWR_EN, S0 and LATCH as inputs, and ALERT# and A_DET# as outputs).
DS200005346A-page 28 2014 Microchip Technology Inc.
UCS1003-1/2/3
UCS1003-1
ALERT#
3V– 5.5V
Device
D
POUT
D
MOUT
5V
V
BUS1
V
BUS2
V
S1
V
S2
A_DET#
5V Host
C
BUS
USB Host
3V– 5.5V
C
IN
V
DD
D
PIN
D
MIN
V
DD
EM_EN
M1
M2
PWR_EN
SMDATA
SMCLK
SEL
COMM_SEL/I
LIM
GND
V
DD

5.0 GENERAL DESCRIPTION

The UCS1003-1/2/3 family of devices provides a single USB port power switch for precise control of up to 3.0A continuous current with Overcurrent Limit (OCL), dynamic thermal management, latch or Auto-Recovery fault handling, selectable active-high or -low enable, undervoltage and overvoltage lockout, and back­voltage protection.
Split supply support for V low power in system standby states.
In addition to power switching and current limiting, the UCS1003-1/2/3 provides charger emulation profiles to charge a wide variety of portable devices, including USB­IF BC1.2 (CDP or DCP modes), YD/T-1591 (2009), 12W charging, most Apple, Samsung and RIM portable
devices and many others (refer to Section 9.0 “Active State” for more information on preloaded charger
emulation profiles). The UCS1003-1 has a custom programmable charger emulation profile for portable device support for fully host controlled charger emulation.
and VDD is an option for
BUS
The UCS1003-1 also provides current monitoring to allow intelligent management of system power and charge rationing for controlled delivery of current regardless of the host power state. This is especially important for bat­tery-operated applications that need to provide power without excessively draining the battery, or that require power allocation depending on application activities.
Figure 5-1 shows a UCS1003-1 full-featured system
configuration in which the UCS1003-1 provides a port power switch and low-power Attach Detection with wake-up signaling (wake on USB). The current limit is established at power-up. It can be lowered if required after power-up via the SMBus/I also provides configurable USB data line charger emulation, programmable current limiting (as determined by the accepted charger emulation profile), active current monitoring and port charge rationing.
2
C. This configuration

FIGURE 5-1: UCS1003-1 System Configuration (with Charger Emulation, SMBus Control and USB Host).

2014 Microchip Technology Inc. DS200005346A-page 29
UCS1003-1/2/3
UCS1003-X
LATCH
ALERT#
PWR_EN
3V– 5.5V
GND
Device
D
PIN
D
MIN
D
POUT
D
MOUT
V
DD
5V
V
BUS1
V
BUS2
V
S1
V
S2
COMM_SEL/I
LIM
3V– 5.5V
Auto-Recovery
Upon Fault
Latch Upon
Fault
EM_EN
M1
M2
SEL
5V Host
C
BUS
USB Host
S0
Disable
Detect
State
Enable
Detect
State
C
IN
V
DD
A_DET# / CHRG#
Figure 5-2 shows a system configuration in which the
UCS1003-1/2/3 provides a USB data switch, port power switch, low-power Attach Detection and portable device Attach/Removal Detection signaling. This configuration does not include configurable data line charger emulation, programmable current limiting or current monitoring and rationing.

FIGURE 5-2: UCS1003-1/2/3 System Configuration (Charger Emulation, No SMBus, with USB Host).

DS200005346A-page 30 2014 Microchip Technology Inc.
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