Datasheet uba2050x, uba2051x DATASHEETS (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

UBA2050(A); UBA2051(A;C)

One-chip telephone ICs with speech, dialler and ringer functions

Product speciﬁcation Supersedes data of 1998 Mar 24 File under Integrated Circuits, IC03

2000 May 19

Page 2

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

FEATURES Speech/transmission part

• Low DC line voltage; operates down to 1.45 V (excluding voltage drop over external polarity guard)

• Line voltage regulator with adjustable DC voltage

• Regulated 3.3 V supply (VDD) for the dialler part and

peripherals compatible with: – Speech mode – Ringer mode – Trickle mode.

• Unregulated supply (VCC) for the transmission part and peripherals

• Transmit stage with: – Microphone amplifier with symmetrical

high-impedance inputs

– DTMF input with confidence tone on receive output.

• Receive stage with: – Receive amplifier with asymmetrical output – Earpiece amplifier with adjustable gain (and gain

boost facility) for all types of earpieces.

• AGC: line loss compensation for microphone and receive amplifiers.

Dialler part

• Last Number Redial (LNR) (32 digits)

• Pulse dialling:

– 10 PPS and 20 PPS (resistor option) – M/B 2 : 3 and 1 : 2 (resistor option).

• DTMF timing: – Manual diallingwith minimum duration for bursts and

pauses (85/85 ms)

– Calibrated timing during redialling (85/85 ms).

• Pulse or tone mode select at start-up (resistor option)

• Flash function (600, 300, 98 and 80 ms) (resistor

options)

• Access pause time 2.0 and 3.6 s (resistor option); access pauses in series are possible

UBA2050(A); UBA2051(A;C)

•[∗/T] key (for mixed mode dialling) or separate [P → T] key

• Repertory memory integrity check

• Keytone generation (only UBA2050, UBA2050A and

UBA2051C)

• Dial Mode Output (DMO) function during pulse dialling and flash function (only UBA2050 and UBA2051)

• LED output for DTMF dialling indication (only UBA2050A and UBA2051A)

• Function keys: – [LNR/P], [R] and [P → T] – [STORE], [MEM], [M1], [M2] and [M3]

(only UBA2051, UBA2051A and UBA2051C).

• Resistor options: – [∗/T] key definition (MMS) – Pulse or Tone mode Selection (PTS) – Flash Time Selection (FTSA and FTSB) – Make/Break ratio Selection (MBS) – Pulses Per Second (PPS) – Access Pause Time (APT).

• 13 repertory numbers (only UBA2051, UBA2051A and UBA2051C):

– 3 direct memories (21 digits) – 10 indirect memories (21 digits).

• Supply and temperature independent tone output

• On-chip DTMF filtering for low output distortion

(

“CEPT CS 203”

• On-chip oscillator suitable for low-cost 3.579545 MHz quartz crystal or ceramic resonator

• Uses standard single-contact keyboard

• Keyboard entries fully debounced.

Ringer part

• Ringer input frequency discrimination

• 3-toneringer with 4 programmable melodies (selectable

via keyboard by keys [1] to [4])

• 4-level volume control (selectable via keyboard by keys [5] to [8]).

compatible)

2000 May 19 2

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Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

GENERAL DESCRIPTION

TheICs UBA2050,UBA2050A,UBA2051,UBA2051Aand UBA2051C contain all the functionsneeded to build a fully electronic telephone set.

In many places in the text, figures and tables, the description is not applicable for all the five types, but only for one or two or for a combination. These combinations will be referred to by means of short denotations as given in Table 1.

Table 1 Denotations of types

DENOTATION TYPES

UBA2050x UBA2050; UBA2050A UBA2051x UBA2051; UBA2051A; UBA2051C UBA205x UBA2050; UBA2051 UBA205xA UBA2050A; UBA2051A UBA205xx all ﬁve types

UBA2050(A); UBA2051(A;C)

When the line current is high enough, a fixed amount of current is derived from pin LN in order to create a supply point at pin V

3.3 V to supply the dialler and ringer parts and peripheral

circuits.

Dialler part

The dialler and ringer parts of the IC are responsible for the system control, system settings and the generation and detection of various signals.

The dialler offers a 32-digit last number redial function. The UBA2051x offers in addition 13 memories (3 direct + 10 indirect) of 21 digits.

During pulse dialling the DMO output of the UBA205x can be used to decrease the line voltage. During tone dialling theLED output ofthe UBA205xA is usedto indicate DTMF dialling. A keytone is available if a valid key is pressed for the types UBA2050x and UBA2051C.

. The voltage at pin VDD is regulated at

Ringer part

The devices incorporate a speech/transmission part, a dialler part and a ringer part. By offering a wide range of possible adaptations for each part, the UBA205xx applications can be easily adapted to meet different requirements.

Speech/transmission part

The speech/transmission part performs all transmission and line interface functions required in fully electronic telephone sets. It performs electronic switching between transmissionand dialling. The IC operates ataDC voltage downto 1.45 V (with reduced performance)to facilitate the use of telephone sets connected in parallel.

ORDERING INFORMATION

TYPE NUMBER

NAME DESCRIPTION VERSION

UBA2050T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2050AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2051T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2051AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2051CT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

The ringer part offers a discriminator input which enables the MDY/TONE output as soon as a valid ring frequency is detected. It offers a choice of 4 different 3-tone melodies and a 4-level volume control, both programmable via the keyboard. An external very low cost ringer output stage for a buzzer is needed. Stabilized supply (VDD) during ringer mode for dialler and ringer part is included.

PACKAGE

2000 May 19 3

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Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Speech/transmission part

line

v(TX)

v(RX)

∆G

v(QR)

∆G

v(trx)

∆G

v(trx)(m)

Dialler part

HG(LN)(rms)

LG(LN)(rms)

THD total harmonic distortion −−25 − dB

Ringer part

ring

line current operating range normal operation 11 − 140 mA

with reduced performance 1 − 11 mA

DC line voltage I

= 15 mA 4.05 4.35 4.65 V

line

internal current consumption VCC= 3.6 V − 1.25 1.5 mA supply voltage for internal circuitry

IP=0mA − 3.6 − V

(unregulated) regulated supply voltage for peripherals speech mode;

3.0 3.3 3.6 V

IDD= −2.6 mA ringer mode; I

= 75 mA 3.0 3.3 3.6 V

available supply current for peripherals −−−2.6 mA typical voltage gain for microphone

= 4 mV (RMS) 43.2 44.2 45.2 dB

MIC

ampliﬁer typical voltage gain for receiving ampliﬁer VIR= 4 mV (RMS) 32.4 33.4 34.4 dB gain setting range for earpiece ampliﬁer RE1= 100 kΩ−14 − +12 dB gain control range for microphone and

receive ampliﬁers gain reduction for microphone and receive

= 85 mA; referenced to

line

=15mA

line

− 6.0 − dB

in DTMF mode − 80 − dB

ampliﬁers

high group frequency voltage (RMS value) on line

low group frequency voltage (RMS value) on line

DTMF1

DTMF2

DTMF1

DTMF2

=20kΩ; = 2.74 kΩ

353 435 536 mV

277 341 420 mV

pre-emphasis of group 1.5 2.0 2.5 dB

ringer detection frequency 13 −−Hz

2000 May 19 4

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ll pagewidth

BLOCK DIAGRAM

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

dialler and ringer functions

R1 R2 R3 R4 C1 C2 C3 C4

XTAL CE/CSI CE/FDI

DIALLER

PART

KEYBOARD DETECTOR

TIMING/

CONTROL

FLASH

KEYTONE

TONE

GENERATOR

DMODP/FLKT

PULSE

MDY

RINGER

PART

DETECTOR/

GENERATOR

LED

DTMF

INDICATION

MUTE

DTMF/

RINGER

UBA205xx

DTMF

REGULATOR

SLPE

SPEECH/TRANSMISSION

PART

EARPIECE

AMPLIFIER

RECEIVE

AMPLIFIER

TRANSMIT AMPLIFIER

SUPPLY

AGC

GAR

AGC

REG

FCA138

UBA2050(A); UBA2051(A;C)

UBA2050 and UBA2050A: C4 output not available. UBA2051 and UBA2051A: KT output not available. UBA2050 and UBA2051: DMO output available, LED output not available. UBA2050A and UBA2051A: LED output available, DMO output not available. UBA2051C: KT output available, DMO and LED outputs not available.

MDY/TONE

Fig.1 Block diagram.

MIC+ MIC−

GND

SLPE

Page 6

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

PINNING

SYMBOL

LN 11111positive line terminal SLPE 22222slope (DC resistance) adjustment REG 33333line voltage regulator decoupling IR 44444receive ampliﬁer input AGC 55555automatic gain control and line-loss

DTMF 66666DTMF transmit input V

XTAL 88888oscillator input DP/FL 99999dial pulse/ﬂash output (active LOW) DMO 10 − 10 −−dial mode output LED − 10 − 10 − DTMF mode indication output CE/CSI 11 11 11 11 11 chip enable/cradle switch input;

CE/FDI 12 12 12 12 12 chipenable/frequencydiscrimination

MDY/TONE 13 13 13 13 13 melody (ringer) output/DTMF

KT 14 14 −−10 keytone output C4 −−14 14 14 keyboard input/output C4 C3 15 15 15 15 15 keyboard input/output C3 C2 16 16 16 16 16 keyboard input/output C2 C1 17 17 17 17 17 keyboard input/output C1 R4 18 18 18 18 18 keyboard input/output R4 R3 19 19 19 19 19 keyboard input/output R3 R2 20 20 20 20 20 keyboard input/output R2 R1 21 21 21 21 21 keyboard input/output R1 GND 22 22 22 22 22 negative line terminal QR 23 23 23 23 23 earpiece ampliﬁer output GAR 24 24 24 24 24 gain adjustment earpiece ampliﬁer RX 25 25 25 25 25 receive ampliﬁer output MIC+ 26 26 26 26 26 non-inverting microphone ampliﬁer

MIC− 27 27 27 27 27 inverting microphone ampliﬁer input V

UBA2050 UBA2050A UBA2051 UBA2051A UBA2051C

77777stabilized supply for dialler and

28 28 28 28 28 supply for speech/transmission part

DESCRIPTION

compensation

ringer parts

note 1

input

generator output

input

and peripherals

Note

1. The cradle switch and the two positions ‘handset on the cradle’ and ‘handset lifted’ are further on in this document referred to as ‘hook-switch’, respectively ‘on-hook’ and ‘off-hook’ position.

2000 May 19 6

Page 7

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, halfpage

MDY/TONE

SLPE

REG

AGC

DTMF

XTAL

DP/FL

DMO CE/CSI CE/FDI

1 2 3

4 5 6 7

UBA2050T

9 10 11 12 13

MGT042

MIC−

MIC+

GAR

24 23

QR GND

22 21

R1 R2

16 1514

handbook, halfpage

MDY/TONE

UBA2050(A); UBA2051(A;C)

SLPE

REG

AGC

DTMF

XTAL

DP/FL

LED CE/CSI CE/FDI

1 2 3

4 5 6 7

UBA2050AT

9 10 11 12 13

MGT043

MIC−

MIC+

GAR

24 23

QR GND

22 21

R1 R2

16 1514

Fig.2 Pin configuration (UBA2050T).

handbook, halfpage

MDY/TONE

SLPE

REG

AGC

DTMF

XTAL

DP/FL

DMO CE/CSI CE/FDI

Fig.3 Pin configuration (UBA2050AT).

1 2 3

4 5 6 7

UBA2051T

9 10 11 12 13

MGT044

MIC−

MIC+

GAR

24 23

QR GND

22 21

R1 R2

16 1514

handbook, halfpage

MDY/TONE

SLPE

REG

AGC

DTMF

XTAL

DP/FL

LED CE/CSI CE/FDI

1 2 3

4 5 6 7

UBA2051AT

9 10 11 12 13

MGT045

MIC−

MIC+

GAR

24 23

QR GND

22 21

R1 R2

16 1514

Fig.4 Pin configuration (UBA2051T).

2000 May 19 7

Fig.5 Pin configuration (UBA2051AT).

Page 8

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, halfpage

MDY/TONE

SLPE

REG

AGC

DTMF

XTAL

DP/FL

KT CE/CSI CE/FDI

1 2 3

4 5 6 7

UBA2051CT

9 10 11 12 13

FCA128

MIC−

MIC+

GAR

24 23

QR GND

22 21

R1 R2

16 1514

UBA2050(A); UBA2051(A;C)

The reference voltage can beincreased by connectingthe resistorR connecting the resistor RVA between pins REG and LN. The voltage at pin REG is used by the internal regulator to generate V connected between pins REG and GND. This capacitor, converted into an equivalent inductance (see Section “Set impedance”), realizes the set impedance conversion from its DC value (R frequency range).

The voltage at pin SLPE is proportional to the line current, and the voltage VLNat pin LN can be calculated as follows:

VLN=V I

SLPE=Iline

where:

line

ICC= internal current consumption IP= supply current for peripheral circuits I

SUP

pin LN.

betweenpinsREGandSLPEordecreasedby

and is decoupled by capacitor C

ref

SLPE

ref+RSLPE

− ICC− IP− I

) to its AC value (RCCin the audio

× I

SLPE

SUP

REG

= line current

= current consumed by the VDD regulator from

Fig.6 Pin configuration (UBA2051CT).

FUNCTIONAL DESCRIPTION

The values given in the functional description are typical values unless otherwise specified.

For numbering of components, refer to Figs 7, 37 and 38. Voltage levels are referenced to the negative line terminal GND, except when otherwise specified.

Speech/transmission part

SUPPLY The supply for the IC andits peripheral circuits is obtained

from the telephone line (see Fig.7).

Line interface (pins LN, SLPE and REG)

The IC generates a stabilized reference voltage V

ref

between pins LN and SLPE. This reference voltage is

4.15 V, is temperature compensated and can be adjusted by means of an external resistor RVA.

Resistor R pins SLPE and GND. The preferred value for R 20 Ω. Changing the value of R

is an external resistor connected between

SLPE

will affect more than

SLPE

the DC characteristics: it also influences the microphone and DTMF gains, the gain control characteristics, the sidetone level and the maximum output swing on the line.

The DC current flowing into the set is determined by the exchange supply voltage (V resistance (R (R

) and thereference voltage (V

line

), the DC resistance of the telephone line

exch

), the feeding bridge

exch

). The excesscurrent

ref

is shunted via pin LN to pin SLPE when the line current (I

) is greater than the sum of the supply current of the

line

speech/transmission part (ICC), the current drawn by the peripheral circuitry connected to VCC(IP) and the input currentoftheVDDregulator(I I

(9 mA), the internal referencevoltage (generating V

low

).Withlinecurrents below

SUP

ref

is automatically adjusted to a lower value. This means that more sets can operate in parallel with

DC line voltages (excluding the polarity guard) down to an absolute minimum voltage of 1.45 V. At line currents below I

, the circuit has limited sending and receiving

low

levels. This is called the low voltage area.

)

2000 May 19 8

Page 9

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

Internal supply (pin VCC)

The internal transmission part circuitry is supplied from VCC. This supply voltage is derived from the voltage on pin LN by means of resistor RCC and must be decoupled by capacitor C This supply point may also be used to supply peripheral circuits e.g. an electretmicrophone taking intoaccount the supply possibilities according to Fig.8.

handbook, full pagewidth

connected between pins VCCand GND.

VCC

line

from preamp

exch

line

SUPPLY TRANSMISSION PART

REG

REGULATOR

SLPE

UBA2050(A); UBA2051(A;C)

The voltage V consumed by the transmission part and the peripheral circuits:

VCC=V

CC0

where:

CC0=VLN

= the current consumed by the output stage of the

REC

earpiece amplifier.

SUP

GND

(see Fig.9) depends on the current

− RCC× (IP+I

− ICC× R

DIALLER/

RINGER

UBA205xx

REC

)

VCC

100

ringer-

interface/

peripherals

µF

supply

electret

microphone

REG

4.7 µF

SLPE

20 Ω

Fig.7 Supply configuration.

VDD

220 µF

FCA129

2000 May 19 9

Page 10

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, halfpage

(mA)

1.9 mA

1.6 mA

VCC≥ 2.5 V; VLN= 4.35 V at I

=20Ω.

SLPE

(1) This curve is valid when the receiving amplifier is not loaded. (2) This curve is valid when the receiving amplifier is loaded;

o(rms)

12 43

= 15 mA; RCC= 619 Ω;

line

= 150 mV; RL= 150 Ω.

(2) (1)

MGL827

VCC (V)

handbook, halfpage

UBA2050(A); UBA2051(A;C)

CC0

GND

rec

PERIPHERAL

CIRCUITS

FCA130

Fig.8 Typical current IP available from VCC for

peripheral circuitry.

Regulated supply point (pin VDD)

The VDD regulator delivers a stabilized voltage to supply the internal dialler and ringer parts and peripheral circuits in transmission mode (nominal VLN) and in ringer mode (VLN= 0 V). The maximum supply current for peripherals is 1.9 mA in dialling mode (DTMF generator on) and

2.6 mA in speech mode (DTMF generator off). The supply conditions in ringer and trickle (on-hook condition) modes must not be disturbed by the peripheral supply currents.

Theregulator (see Fig.7) consistsofa sense input circuitry (pin LN), a current switch and a VDD output stabilizer (pin VDD). VDD is decoupled by capacitor C

VDD

Theregulatorfunctiondepends on the transmission, ringer and trickle modes as follows:

• Transmissionmode:Theregulatoroperatesasacurrent source at the LN input; it takes a constant current of

= 4.5 mA (at nominal conditions) from pin LN.

SUP

The current switch reduces the distortion on the line at large signal swings.

Fig.9 VCC used as supply voltage for peripheral

circuits.

Output V

follows the DC voltage at pin LN (with

typically 0.35 V difference) up to VDD= 3.3 V. The input current of the regulator is constant while the output (source) current is determined by the consumption of the peripherals. The difference between input and output current is shunted by the internal VDD stabilizer.

• Ringer mode: The regulator operates as a shunt stabilizer to keep VDD at 3.3 V. The input voltage VLNequals 0 V while the input current into pin VDD is delivered by the ringing signal.

• Trickle mode: When VDD is below typically 2 V, the regulator is inhibited. The current consumption of the VDDregulator in trickle mode is very low to save most of the trickle current for memory retention of the dialler and ringer parts.

2000 May 19 10

Page 11

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

exch

line

UBA205xx

line

SUP

SENSE

SWITCH

VDD regulator

GND

UBA2050(A); UBA2051(A;C)

VCC

peripherals

VDD

220 µF

100 µF

Fig.10 VDD regulator configuration.

SET IMPEDANCE In the audio frequency range, the dynamic impedance is

mainly determined by resistor RCC. The equivalent impedance of the circuit is illustrated in Fig.11.

handbook, halfpage

GND

SLPE

ref

SLPE

20 Ω

FCA131

REG V

REG

4.7 µF

FCA132

619 Ω

VCC

100 µF

2000 May 19 11

LEQ=C Internal resistance RP= 17.5 kΩ.

REG

× R

SLPE

× Rp.

Fig.11 Equivalent impedance between

LN and GND.

Page 12

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

TRANSMIT STAGES

Microphone signal ampliﬁcation (pins MIC+ and MIC−)

The UBA205xx has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC− is 64 kΩ (2 × 32 kΩ).

handbook, full pagewidth

(2)

MIC−

(1)

MIC+

UBA2050(A); UBA2051(A;C)

In speech mode, the voltage gain from pins MIC+ and MIC− to pin LN is set at 44.2 dB at 600 Ω line load. Microphone arrangements are illustrated in Fig.12.

Automatic gain control is provided on this amplifier for line loss compensation.

MIC−

MIC+

GND

MIC−

MIC+

MGT052

a. Magnetic or dynamic microphone. b. Electret microphone. c. Piezoelectric microphone.

(1) This resistor may be connected to reduce the terminating impedance. (2) Extra decoupling capacitor for the microphone supply.

Fig.12 Microphone arrangements.

DTMF ampliﬁcation (pin DTMF)

When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones are generated at pin MDY/TONE and their amplitude can be adjusted by means of an attenuator and filter network (see Fig.35) before being applied to the DTMF amplifier at pin DTMF.

The automatic gain control has no effect on the DTMF amplifier.

RECEIVE STAGES The receive part consists of a receive amplifier and an

earpiece amplifier. Thesetonesarealso sent to the receive output RX atalow level (confidence tone).

The UBA205xx has an asymmetrical DTMF input. The input impedance between pins DTMF and GND is 20 kΩ. The voltage gain from pin DTMF to pin LN is set at 26 dB at 600 Ω line load. The DC voltage between pins DTMF and GND is 0 V. So, when an external attenuator/filter network is used, there is no need for a second decoupling capacitor.

Receive ampliﬁer (pins IR and RX)

The receive amplifier transfers the received signal from

input IR to output RX. The input impedance between

pins IR and GND is 20 kΩ.

The voltage gain from pin IR to pin RX is fixed at 33.4 dB.

The RX output is intended to drive high ohmic (real) loads.

Automatic gain control is provided on thereceive amplifier.

2000 May 19 12

Page 13

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

Earpiece ampliﬁer (pins GAR and QR)

The earpiece amplifier is an operational amplifier having its output QR and inverting input GAR available. It can be used in conjunction with two resistors to get some extra gain or attenuation.

Arrangements of the receive and earpiece amplifier are illustrated in Fig.13. Earpiece connections are shown in Fig.14.

In the basic configuration (see Fig.13), output RX drives the earpiece amplifier by means of RE1 connected between pins RX and the inverting input GAR. Feedback resistor R between pins QR and GAR. Output QR drives the earpiece via a series capacitor C

The gain of the earpiece amplifier (from RX to QR) can be set between +12 and −14 dB by means of resistor R The preferred value of RE1 is 100 kΩ.

The earpiece amplifier offers a gain boost facility relative to the initial gain. Resistor R network of R Cgb as shown in Fig.13.

of the earpiece amplifier is connected

GAR

ear

has to be replaced by the

GAR

GAR1,RGAR2

and Rgb and a series capacitor

GAR

UBA2050(A); UBA2051(A;C)

= ∞.

---------V

The initial gain is defined by:

which corresponds to R

The gain boost is realised by a defined value of Rgband is

defined by:

---------V

GAR1RGAR2



--------------------------------------- -



External capacitors C

QR and GAR) and C

GAR

GARS

 

×–=

  

(connected between pins

(connected between pins GAR and GND) ensure stability. The capacitor C first-order low-pass filter. The cut-off frequency corresponds to the time constant C of C

must be 10 times the value of C

GARS

stability. The output voltages of the earpiece amplifier and the

DTMF amplifier are specified for continuous wave drive. The maximum output voltage swing depends on the DC line voltage VLN, the DC resistance RCC of the set-impedance network between pins LN and VCC, the current consumption ICCand IPfrom pin VCCand the load impedance at pin QR.

GAR1RGAR2



–=

--------------------------------------- -



----------------------------------------- R

------------------------------------------

GAR1RGAR2

GAR

× R

GAR

provides a

. The value

to ensure

handbook, full pagewidth

exch

line

UBA205xx

line

EARPIECE

AMPLIFIER

GAR

0.5V

GAR

QRLN GAR

GND

Fig.13 Receive and earpiece amplifier configuration.

2000 May 19 13

ear

C 100 µF

GARS

VCC

GAR2

Addition for gain boost of earpiece amplifier

earpiece

GAR1

GAR

GARS

RXGARQR

FCA133

Page 14

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

QR QR QR

a. Dynamic earpiece.

b. Magnetic earpiece.

UBA2050(A); UBA2051(A;C)

(1) (2)

GNDGNDGND

MGT051

c. Piezoelectric earpiece.

(1) This resistor may be connected to prevent distortion due to the inductive load. (2) This resistor is required to increase the phase margin due to the capacitive load.

Fig.14 Earpiece connections.

2000 May 19 14

Page 15

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

AUTOMATIC GAIN CONTROL (PIN AGC) The UBA205xx performs automatic line loss

compensation. The automatic gain control varies the gain of the microphone amplifier and the gain of the receive amplifier in accordance with the DC line current.

The control range is 6.0 dB. This corresponds approximately to the lossfor a cable length of 5 km withan

0.5 mm diameter twisted copper-pair, a DC resistance of 176 Ω/km and an average attenuation of 1.2 dB/km).

handbook, full pagewidth

∆G

(dB)

−2

UBA2050(A); UBA2051(A;C)

The IC can be used with different configurations of exchange supply voltage andfeeding bridge resistanceby connecting an external resistor R and GND (see Fig.15). This resistor enables the I I

line currents to be increased (the ratio between I

stop

and I

is not affected by the resistor).

stop

The AGC function is disabled when pin AGC is left open-circuit.

∞

AGC

between pins AGC

AGC

start

and

start

−4

−6

0 10 20 30 kΩ

line

Fig.15 Variation of gain as a function of line current with R

(mA)

as parameter.

AGC

10080604020 90705030100

MGT049

2000 May 19 15

Page 16

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

SIDETONE SUPPRESSION The anti-sidetone network for the UBA205xx, comprising

RCCin parallel with Z

line,Rast1,Rast2,Rast3,RSLPE

(see Fig.16), suppresses the transmitted signal in the earpiece. Maximum compensation is obtained when the following conditions are fulfilled:

× R

SLPE

bal

ast1=RCC

-----------------------------------------------------------

=k×Z

ast2

ast1RSLPE

line

× (R

+()×

ast3RSLPE

ast2+Rast3

)

The scale factor k is chosen to meet the compatibility with a standard capacitor from the E6 or E12 range for Z

In practice, Z the line length. Therefore, the value of Z

varies considerably with the line type and

line

bal

chosenfor an average linelength, which gives satisfactory sidetone suppression with short and long lines.

and Z

should be

bal

UBA2050(A); UBA2051(A;C)

The suppression also depends on the accuracy of the match between Z line.

The anti-sidetone network for the UBA205xx attenuates the received signal from the line by 32 dB before it enters the receive stage. The attenuation is almost constant over the whole audio frequency range.

A Wheatstone bridge configuration (see Fig.17) may also be used.

More information on the balancing of an anti-sidetone bridge can be obtained in our publication

Handbook for Wired Telecom Systems, IC03b”

and the impedance of the average

bal

“Application

handbook, full pagewidth

line

GND

SLPE

ast1

ast3

ast2

bal

MGT046

Fig.16 Equivalent circuit of UBA205xx anti-sidetone bridge.

2000 May 19 16

Page 17

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

SLPE

line

GND

UBA2050(A); UBA2051(A;C)

bal

ast1

MGT047

Fig.17 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.

Dialler and ringer parts

SUPPLY VOLTAGE (PIN VDD) The power supply must be maintained for repertory

memory retention (standby supply voltage) and may drop down to 1.0 V, being the minimum value of the memory retention voltage V

. Applying a large capacitor across

the supply terminals can retain the memory when power connections are broken.

The minimum operating voltage is 2.0 V (the Power-on reset voltage V

has its maximum value). Below this

POR

value, the internal Power-on reset disables the IC. A memory integrity check is performed at each start-up. In the event of a failing check, the memory is cleared.

SCILLATOR (PIN XTAL)

O The UBA205xx uses an on-chip oscillator as the master

timing source. It needs to be completed by an external

3.579545 MHz quartz crystal or ceramic resonator connected between pins XTAL and GND. When using an external ceramic resonator, additional components may be required depending upon the ceramic resonator specifications (refer to the product type specification).

By connecting a capacitor with a value of a few pico-farad in parallel with the resonator, the oscillator frequency can be decreased. By connecting a capacitor with a value of a few ten pico-farad in series with the resonator, the oscillator frequency can beincreased. The oscillatorstarts when V

reaches the operating voltage level V

POR

and

pin CE/FDI or pin CE/CSI goes HIGH. Recommended resonator types: Murata

CSA 3.58MG300FGA or CSAC 3.58MGC300FGA.

2000 May 19 17

Page 18

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

INTERNAL RESET CIRCUIT (PINS CE/FDI AND CE/CSI) A reset signal is internally generated to initialize the

UBA205xx as follows (see Fig.18):

• Bythe on-chip Power-On Reset (POR) circuitas long as VDDis lower than V

• When the voltage on pin CE/CSI and on pin CE/FDI are both LOW for a time greater than the reset delay time tRD.

When reset conditions are fulfilled, pins MDY/TONE and DP/FL are set to high-impedance; pins DMO, KT, LED, R1 to R4 and C1 to C4 are set to LOW.

handbook, halfpage

CE/CSI CE/FDI

POR

NOR

reset

MGM334

UBA2050(A); UBA2051(A;C)

HIP ENABLE/CRADLE SWITCH INPUT (PIN CE/CSI)

To distinguish between different operating states an extra CE/CSIinput is used. Comparabletothe CE/FDI input, the CE/CSI activates the dialler part. From that moment the dialler part polls this input and the CE/FDI input regularly for line power breaks during on-line states. When pins CE/CSI and CE/FDI are set LOW for a time greater than tRD, the standby state is entered. Pin CE/CSI is set HIGH during the off-hook situation (basic application). The basic states are shown in Table 2.

Table 2 UBA205xx basic states

INPUT CE/CSI INPUT CE/FDI STATE

LOW LOW standby HIGH X; note 1 handset LOW HIGH ringer; note 2

Notes

1. Don’t care.

2. AC signal at pin CE/FDI.

Fig.18 Internal reset.

HIP ENABLE AND FREQUENCY DISCRIMINATOR INPUT

C (PIN CE/FDI)

This input is used to activate and initialize part of the system. This pin together with the pin CE/CSI determines which mode to enter (see Table 2) and detects line power breaks during on-line states. To prevent the dialler from reacting on voltage disturbances on the telephone line, a time-out is active. The dialler returns to the standby state if the voltage on both pins CE/CSI and CE/FDI is LOW for a time greater than tRD.

Inthe exchange, several AC signalscan be superimposed on the DC signal, e.g. dialling tone, busy tone, disturbances (such as line power breaks) and ringer signal. The ringer signal is evaluated and checked if its frequency is above a specified ringer frequency f

ring

. It is assumed that the frequency at pin CE/FDI is the same as the ringer frequency present on the telephone line.

The signal at this pin is half-wave rectified so that the dialler can easily detect zero-crossing, especially at high frequency.

During switching (on-hook/off-hook and pulse dialling) this pin is protected by its ESD diodes. The maximum input current on these diodes should be below 1 mA.

INGER MELODY (PIN MDY/TONE)

When an incoming ringer signal at pin CE/FDI is valid, the UBA205xx starts generating a melody via the MDY/TONE output ringer hardware (see Fig.35). The signal at pin MDY/TONE is a square wave signal (see Fig.19).

This melody follows the cadence of the ringer signal. Both the melody and the volume can be selected via the keyboard.

The melody frequencies and the duration are given in Table 3. Table 8 shows how a melody can be selected by pressing a key during ringing. The melody setting will be stored in the memory.

The volume of the ringer circuit can be controlled by changing the amplitude of the square wave. The voltage level at pin MDY/TONE can be changed as shown in Table 9. The volume setting will be stored in the memory.

MDY/TONE is a push-pull output. MDY/TONE is high-impedance when VDD<V

POR

2000 May 19 18

Page 19

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

Table 3 Ringer melodies

NAME FREQUENCIES (Hz) DURATION (ms)

Bell 1 (default) 770+ 943 + 1341 28 + 28 + 28 Bell 2 852 + 943 + 1206 28 + 28 + 28 Bell 3 943 + 1206 + 1341 28 + 28 + 28 Bell 4 1206 + 1341 + 1482 28 + 28 + 28

handbook, full pagewidth

CE/FDI

sync

sample

MDY/TONE

time

GND

MGT050

Fig.19 Ringer frequency detection.

PULSE DIALLER (PINS DP/FL, DMO AND LED) The pulse dialling system uses line current interruptions to

signal the digits dialled to the exchange. The number of line current interruptions corresponds to the digit dialled except for the digit [0] which is characterized by 10 interruptions. After each digit there is an inter-digit pause time (t

idp

). When dialling, the transmission part is muted. The [∗/T] key definition, the dialling mode, the make/break

ratio, repetition rate (pulse dialling), the flash time and the access pause time depend on the resistor options: MMS, PTS, MBS, PPS, FTSA, FTSB and APT (see Fig.25 and Table 7).

Valid keys are the digits [0] to [9], [R], [LNR/P], [P → T] and [∗/T] (when MMS resistor option is off).

To allow start-up from C

discharged, no ESD diode is

VDD

implemented between pin DP/FL and pin VDD. Pin DP/FL is an open-drain output and is set HIGH (via an

external pull-up resistor) when VDD<V

POR

Pin DMO of the UBA205x is used to enable external hardware (see Fig.37) which decreases the DC voltage overtheA and Bnetwork exchange terminals during pulse dialling. Several countries require this feature. Pin DMOis a push-pull output and is LOW when VDD<V

POR

Figure 20 shows thetiming diagram in pulse dialling mode for the UBA205x when keys [3], [3], [LNR/P] and [4] are pressed.

Figure 20 is also valid for the UBA2051C, with the exception of the DMO signal.

In pulse dialling mode, pin LED of the UBA205xA is set LOW after off-hook and becomes HIGH when the first DTMF code is sent after switching over to DTMF dialling. Pin LED is a push-pull output and is LOW when VDD<V

POR

Figure 21 shows thetiming diagram in pulse dialling mode for the UBA205xA when keys [3], [3], [P → T] and [4] are pressed.

2000 May 19 19

Page 20

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

[3].........[3]......... [LNR/P].........[4]

KEYS

internal

tb= break time. tm= make time. t

= interdigit pause time.

idp

MUTE

DP/FL

DMO

pdp

tap= access pause time. t

= mute holdover time.

mho

= pre-digit pause.

pdp

idp

pdp

UBA2050(A); UBA2051(A;C)

idp

pdp

idp

mho

MGU139

handbook, full pagewidth

tb= break time. tm= make time. t

= interdigit pause time.

idp

tap= access pause time.

Fig.20 Timing diagram in pulse dialling mode for the UBA205x.

pdp

...................

idp

mho

KEYS

internal

MUTE

DP/FL

MDY/TONE

LED

mho

pdp

tt= burst time. tp= pause time.

....[3].............. [3].........[P->T] [4]

pdp

= mute holdover time.

= pre-digit pause.

idp t

MGU140

Fig.21 Timing diagram in pulse dialling mode for the UBA205xA.

2000 May 19 20

Page 21

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

TONE DIALLER (PINS MDY/TONE AND LED) The digits are transmitted as two simultaneously

generated tones: the Dual-Tone Multi-Frequency (DTMF) system. These dual tones which are provided at the MDY/TONEoutputareinternally generated with two digital sine wave synthesizers together with digital-to-analog converters. Their amplitudes are precisely scaled according to a band gap voltage reference. This ensures tone output levels independent of the supply voltage and temperature. The two sine waves are summed and then filtered by an on-chip switched capacitor filter, followed by an active RC low-pass filter. These guarantee that all DTMF tones generated fulfil the CEPT CS203 recommendations with respect to amplitude, frequency deviation, total harmonic distortion and suppression of unwanted frequency components. Tone digits are separated by a pause time (tp).

At dialling, the DTMF input of the transmission part is enabled while the microphoneand receive amplifierinputs are disabled. The signal at the DTMF input is sent to the receive output at a low level [see Section “DTMF amplification (pin DTMF)”].

UBA2050(A); UBA2051(A;C)

Valid keys are the digits [0] to [9], [∗/T], [#], [R], [LNR/P] and [P → T].

The dialling mode, the flash time and the access pause time depend on the resistor options: PTS, FTSA, FTSB and APT (see Fig.25 and Table 7).

Figure 22 shows the timing diagram in tone dialling mode when keys [3], [3], [LNR/P], [4], [R] and [2] are pressed.

In DTMF dialling mode, pin LED of the UBA205xA is set LOW after the hook-switch changes to off-hook and becomes HIGH as soon as a key is pressed and the first DTMF code is sent. Pin LED is a push-pull output and is LOW when VDD<V

The DTMF standard frequencies are implemented as shown in Table 4.

POR

handbook, full pagewidth

tt= burst time. tp= pause time. tap= access pause time. tfl= flash time. t

= interflash pause time.

ifp

KEYS

internal

MUTE

DP/FL

MDY/TONE

LED

......

.....[3]

(1)

..............

[3]

mho

fho

Note: themaximumtone burst and pause times areequalto the real key press/release time. (1) pin LED only available inUBA205xA.

.......................

[LNR/P]

= mute holdover time.

= flash holdover time.

..............

[4]

Fig.22 Timing diagram in tone dialling mode.

.......................

[R]

fho

high impedance

[2]

ifp

mho

MGU141

2000 May 19 21

Page 22

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

Table 4 DTMF standard frequencies and their implementation

DTMF FREQUENCY (Hz)

697 697.90 0.13 0.90 770 770.46 0.06 0.46 852 850.45 −0.18 −1.55

941 943.23 0.24 2.23 1209 1206.45 −0.21 −2.55 1336 1341.66 0.42 5.66 1477 1482.21 0.35 5.21

Note

1. Assuming f

= 3.579545 MHz.

xtal

FLASH FUNCTION (PINS DP/FL AND DMO) Pressing the flash function key [R] results in a calibrated

pulsewhichdrivestheelectronicline current interrupter via pin DP/FL. The DMO output is also activated during pulse production (see Fig.23). After a flash pulse, an interflash pause time t

of 800 ms is inserted to recover the power

ifp

supply for the dialler part.

FREQUENCY AT

MDY/TONE (Hz)

(1)

The duration of the flash time depends on the resistor options FTSA and FTSB (see Fig.25 and Table 7).

During tfl+t

UBA2050(A); UBA2051(A;C)

DEVIATION (%) DEVIATION (Hz)

, the reset delay time is inhibited.

fho

handbook, full pagewidth

(1) pin DMO available only on UBA205x. tfl= flash time. t

= flash holdover time.

fho

= interflash pause time.

ifp

KEYS

internal

MUTE

DP/FL

DMO

[R] ............................[R]

(1)

fho

..........................

ifp

fho

ifp

MGU142

Fig.23 Flash timing diagram.

2000 May 19 22

Page 23

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

KEYBOARD DETECTOR (PINS C1 TO C4 AND R1 TO R4) The pins are directly connected to a traditional single

contact keyboard. The keyboard is normally static with outputs R1 to R4 at LOW level and inputs C1 to C4 with internal pull-up resistors. When any key is pressed, scanning is done to detect which key has been pressed. A second key entry will be valid after having released the first key entry. Simultaneously pressing several keys will result in no action.

handbook, full pagewidth

tdd= depress debounce time. trd= release debounce time.

key entry

key valid

UBA2050(A); UBA2051(A;C)

A key entry becomes valid when the depress debounce time tdd has elapsed (see Fig.24). After the release of a valid key, the scanning is frozen when the release debounce time trd has elapsed.

The pins R1 to R4 are LOW and pull-down resistors replace pull-up resistors at pins C1 to C4 when VDD<V

POR

MGM341

Fig.24 Timing diagram debouncing.

2000 May 19 23

Page 24

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

Keyboard structure

The UBA205xx supports the keyboard structure given in Fig.25. Pin C4 is not available in the UBA2050x. For key definitions, see Table 5.

handbook, full pagewidth

MBS

APT

PPS

PTS

MMS

FTSA

MEM

P->T

LNR/P

FTSB

STORE

GND

FCA139

Fig.25 Keyboard structure.

Table 5 Key deﬁnitions

KEYS DEFINITION

[0] to [9] and [#]

(2)

; [P → T] switch over to DTMF dialling (mixed mode dialling)

[∗/T]

(1)

; [∗/T]

(1)

digits; see Table 6

[LNR/P] last number redial if this key is the ﬁrst key pressed after going off-hook; access pause if

this key is not the ﬁrst key pressed after going off-hook [M1] to [M3] direct memories [MEM] indirect memory recall [R] recall (ﬂash function) [STORE] memory programming

Notes

1. In tone dialling mode.

2. In pulse dialling mode, when MMS resistor option is off (see Table 7).

2000 May 19 24

Page 25

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

Table 6 Digits keypad activation and corresponding

DTMF frequency pairs

DIGIT

FREQUENCIES

KEYS

fL(Hz) fH(Hz)

[0] 941 1336 10 [1] 697 1209 1 [2] 697 1336 2 [3] 697 1477 3 [4] 770 1209 4 [5] 770 1336 5 [6] 770 1477 6 [7] 852 1209 7 [8] 852 1336 8 [9] 852 1477 9 [#] 941 1477 −

[∗/T] 941 1209 −

GENERATED DTMF

NUMBER

PULSES

UBA2050(A); UBA2051(A;C)

Resistor options

The resistors are connected between the pins of the keyboard (C1 to C3 and R1 to R4) and pin GND. One resistor connection is shown in Fig.26. The resistor options are read after each reset of the dialler.

handbook, halfpage

Fig.26 Resistor connection.

MBS

MGT048

Table 7 Resistor functions

RESISTOR TO PIN FUNCTION CONDITIONS ON

FTSA C2 ﬂash time select FTSB = off;

300 ms 98 ms

(1)

OFF

(1)

note 2 FTSB = on;

80 ms 600 ms

note 2 MMS C1 [∗/T] key deﬁnition [∗/T] becomes [∗] [∗/T] becomes [P → T] MBS R1 make/break ratio select 33/66 40/60 APT R2 access pause time select 3.6 s 2.0 s PPS R3 pulses per second 20 pps 10 pps PTS R4 pulse/tone select pulse mode DTMF mode

Notes

1. On = option resistor present; off = option resistor not present.

2. Pin C3 belongs to resistor option FTSB.

2000 May 19 25

Page 26

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

KEY TONE (PIN KT) A keytone with a frequency fkt= 597 Hz and a duration tkt= 30 ms (see Fig.27) is generated each time a valid key is

pressed resulting in the expected action, digit keys in tone dialling mode excepted. Pin KT is a push-pull output and is set LOW when VDD<V

handbook, full pagewidth

keytone

tkt= keytone time. fkt= keytone frequency.

Fig.27 Keytones via KT output.

POR

MGM344

Key sequences

The behaviour of the UBA205xx can be represented as a State Transition Diagram (STD).

The STD contains the states (rectangles in Fig.28) and statetransitions (arrows) ofthe set. The upperarrow in the figure pointing to the standby state means that the set is initially in the standby state. When, for instance, an incoming call is detected, the set enters the ringer state, waiting for end ofa ringer signalor off-hook. If theset goes off-hook, the UBA205xx enters the on-line state.

The UBA205xx has 3 basic states:

• Standby state

• Ringer state

• On-line state.

Each state with its own functional requirements is described in the following sections.

STANDBY STATE In the standby state theUBA205xx is inactive. The current

drawn is for memory retention; the loads on the inputs/outputsof the dialler have influenceonthe retention current.

The UBA205xx leaves the standby state if:

• The set goes off-hook (lift handset)

• A ringer signal is available on the line.

The UBA205xx returns to the standby state if:

• The set goes on-hook (handset on-hook)

• A line-break occurs with a duration greater than t

• The ringer signal becomes invalid.

RINGER STATE Iftheset is in standby state, a ringersignalcanbe received

from the line. After evaluating the incoming ringer signal (and the ringer signal is valid), the UBA205xx starts a melody via the MDY/TONE output and ringer hardware; this melody is stopped when the ringer signal is no longer valid. After going off-hook, the ringer signal stops and the set is in the conversation (on-line) state.

While ringing, the melody can be changed according to Table 8 and the volume according to Table 9.

As long as memory retention conditions are fulfilled, melody and volume are stored.

2000 May 19 26

Page 27

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

ringer signal

ringer invalid

power-on

STANDBY

off-hook

UBA2050(A); UBA2051(A;C)

off-hook

on-hook/line break

ON-LINERINGER

MGU186

Fig.28 UBA205xx standby, ringer and on-line states.

Table 8 Melody selection during ringer state Table 9 Ringer volume setting during ringing

MELODY KEY

Bell 1 [1] (default) Bell 2 [2] Bell 3 [3] Bell 4 [4]

KEY VOLUME ATTENUATION

[8]

highest 0 dB V

(default)

[7] high −6dB

[6] low −12 dB

[5] lowest −18 dB

AMPLITUDE

MDY/TONE

------------------------ -

0.7–

0.7+

2000 May 19 27

Page 28

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

ON-LINE STATE This section describes all the actions of the UBA205xx

during the on-line state. This state starts with making output DP/FL HIGH (external pull-up resistor), which makes line current flow possible.

handbook, full pagewidth

RINGER

off-hook

ON-LINE

[LNR/P], [M1 to M3], [MEM] + [0] to [9]

end of recall

UBA2050(A); UBA2051(A;C)

The on-line state contains a number of sub-states (see Fig.29):

• Conversation state

• Dialling state

• Memory recall state

• Program state.

STANDBY

on-hook/line breakoff-hook

[M1 to M3], [MEM] + [0] to [9]

CONVERSATION

[STORE]

dial keys

Fig.29 On-line states.

Conversation state

In this state, conversation is possible.

Dialling state

During the dial-key entries the UBA205xx starts immediately with transmission of the digit(s); the minimum transmission time is unaffected by the speed of the entry. Transmission continues as long as further dial-key entries have to be processed.

end

PROGRAMDIALLINGMEMORY RECALL

MGU187

However when more than 32 digits are dialled the LNR memory will overflow and the last number redial function will be inhibited.

There are two dial modes: pulse dialling and tone dialling. The initial dialling mode is determined by resistor option PTS.

The state machine which controls the dialling mode is illustrated in Fig.30.

2000 May 19 28

Page 29

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

CONVERSATION

PTS = on PTS = off

DIALLING

[

/T] or [P->T]

[R] + PTS = on

UBA2050(A); UBA2051(A;C)

enddial keys

TONE DIALLINGPULSE DIALLING

MGM347

Fig.30 Dialling mode state machine.

• Pulse dialling Inthismode all valid keys aredialledbythe pulse dialler.

When,during pulse dialling, either[∗/T]when MMS is off or [P → T] is pressed, the UBA205xx switches over to tonedialling(mixedmodedialling).After the switch over, valid keys are dialled by the tone dialler. The temporary tone mode is terminated by going on-hook or flash (Recall).

• Tone dialling The UBA205xx converts valid key entries into data for

the on-chip DTMF generator. Tones are transmitted via output MDY/TONE with a minimum tone burst/pause duration. The maximum tone burst duration is equal to the key pressing time.

• Flash function The [R] key will result in pin DP/FL being set to LOW to

generate a flash (line current interruption) with a selected time (FTSA and FTSB resistor options). Pressing one digit after [R] key is pressed clears the LNR memory. When going on-hook after the [R] key is pressed, then digits previously dialled in the LNR memory are kept.

• Access pause When the [LNR/P] button is not the first key pressed, an

access pause is entered for repertory or redialling procedures.

• Last number redial If the first key pressed is [LNR/P], the number stored in

the LNR memory is dialled and sent. A maximum number of 32 digits can be stored in the LNR memory. If this maximum is exceeded the redial function is inhibited. Pauses, which are stored in the LNR memory, are also dialled.

The tone switch keys [∗/T] (when MMS is off) and [P → T] are also stored in the LNR memory. When a [∗/T] key (when MMS is on) or [#] key occurs during pulse dialling, its code is not stored in the LNR memory.

The LNR memory is always cleared when the [STORE] key is pressed. Its content may also be programmed (see Section “Program state (only UBA2051x)”).

2000 May 19 29

Page 30

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

Memory recall state (only UBA2051x)

Repertory numbers can be dialled out after or before entering manual dialling, last number redial and by entering the memory locations in successive order. Repertory recall is not possible as long as a dial out is pending.The three direct memory locationsare numbered [M1] to [M3] and the ten indirect memory locations [MEM] [1] to [MEM] [0].

The stored numbers can be dialled by using one of the following procedures:

Press one of the direct memory keys [M1] to [M3] or Press [MEM], followed by one of the numeric keys

[1] to [0], corresponding to the memory locations 1 to 10. In case [R] is included in one memory location, when the

LNR capacity is exceeded by using it, the LNR function is inhibited.

Program state (only UBA2051x)

The program state can be entered from the conversation mode (on-line) when no dial out is pending. Pressing the [STORE] key in this state puts the UBA2051x in the program state and also clears the LNR memory. Pressing the [STORE] keyagain in the program state will restart the program sequence.

• Leaving the program state The program state can be left in one of the following

ways: – By going on-hook;the entered digits are stored in the

LNR memory

– Byending the storeprocedures properly (see below),

resulting in a proper store of the programmed item.

• Programming repertory numbers A maximum number of 32 digits can be stored in the

memoryofrepertorynumbers(includingaccesspauses, tone switch and flash) and can be achieved by using the following procedure:

UBA2050(A); UBA2051(A;C)

– Press [STORE]; the LNR memory is cleared – Press the sequence of digits that must be stored; the

keys [0] to [9], [#], [LNR/P], [∗/T], [P → T] or [R] may be used

– Store the number in the memory.

• Memory overflow If more than 21 digits are entered the old memory

contents is kept and the LNR memory is cleared. All the following digits are ignored, except the [STORE] key. The memory overflow state can be left:

– By going on-hook – By pressing the [STORE] key again to restart the

program sequence.

• Clear repertory numbers Clearing a memory location is possible by using the

same procedure as for storing a number, except that no telephone number is entered:

– Press [STORE]; the LNR memory will be cleared – Press one of the memory keys.

• Notepad function In the conversation state it is possible to store a 21 digit

number into the LNR memory, which may be dialled after an on-hook/off-hook action. The procedure is as follows:

– Press [STORE], the LNR memory will be cleared – Press the sequence of digits that must be stored; the

keys [0] to [9], [#], [LNR/P], [∗/T], [P → T] or [R] may be used

– Go on-hook/off-hook.

2000 May 19 30

Page 31

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

tot

amb

stg

total power dissipation R

ambient temperature −25 +75 °C storage temperature −40 +125 °C junction temperature − 125 °C

Speech/transmission part

V V

LN LN(R)

positive continuous voltage on pin LN GND − 0.4 12 V repetitive voltage on pin LN during switch-on

or line interruption

line current R

supply voltage for the speech/transmission part and peripherals

stabilized supply voltage for the dialler and ringer parts

input current at pin VDD for the dialler and ringer parts

voltage on pins SLPE, IR, REG, AGC, DTMF, RX, QR, GAR, MIC+ and MIC−

Dialler and ringer parts

voltage on pins 8 to 21 GND − 0.4 VDD+ 0.4 V DC sink/source current for pins 8 to 21 −10 +10 mA

SLPE

=20Ω;

− 625 mW

note 1

GND − 0.4 13.2 V

SLPE

=20Ω;

− 140 mA

note 2

GND − 0.4 12 V

IDD≤ 75 mA GND − 0.4 3.6 V

=0mA − 75 mA

line

GND − 0.4 VCC+ 0.4 V

Notes

1. Calculated for T

=75°C and Tj= 125 °C.

amb

2. Mostly dependent on the maximum required ambient temperature and on the voltage between pins LN and SLPE (see Fig.31).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

thermal resistance from junction to ambient in free air; note 1 70 K/W

Note

1. Mounted on glass epoxy board 28.5 × 19.1 × 1.5 mm.

2000 May 19 31

Page 32

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

150

handbook, halfpage

(mA)

110

(1) T (2) T (3) T (4) T

amb amb amb amb

=45°C; P =55°C; P =65°C; P =75°C; P

= 1.000 W.

tot

= 0.875 W.

tot

= 0.750 W.

tot

= 0.625 W.

tot

212

46810

VLN−V

UBA2050(A); UBA2051(A;C)

FCA134

(1)

(2)

(3)

(4)

(V)

SLPE

Fig.31 Safe operating area.

2000 May 19 32

Page 33

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

CHARACTERISTICS

= 15 mA; GND = 0 V; R

line

=25°C; measured according to the test circuits of Figs 32, 33 and 34; see also Figs 37 and 38; unless otherwise

amb

speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

INE INTERFACE (PIN LN)

L I

line

ref

line current operating range normal operation 11 − 140 mA

stabilized reference voltage between pins LN and SLPE

LN(Rext)

DC line voltage I

DC line voltage with external resistor

∆V

LN(T)

DC line voltage variation with

temperature INTERNAL SUPPLY VOLTAGE (PIN VCC) I

internal current consumption VCC= 3.6 V − 1.25 1.5 mA

supply voltage for

speech/transmission part and

peripherals REGULATED SUPPLY VOLTAGE (PIN VDD) I

SUP

input current of the V

regulator

regulated supply voltage speech mode;

=20Ω; pin AGC connected to GND; Z

SLPE

reduced performance 1 − 11 mA

=1mA − 1.45 − V

line

=4mA − 2.0 − V

line

= 15 mA 4.05 4.35 4.65 V

line

= 140 mA − 7.1 7.55 V

line

external resistor RVA= 44.2 kΩ (between pins LN and REG)

= −25 to +75 °C;

amb

referenced to T

IP=0mA − 3.6 − V

current from pin LN not ﬂowing through pin SLPE

=1mA − 0 − mA

line

=4mA − 2.15 − mA

line

≥ 11 mA − 4.5 − mA

line

IDD= −2.6 mA; VLN> 3.6 V + 0.25 V (typ.); I

≥ 11 mA

line

speech mode at reduced performance; I

ringer mode; I IDD=75mA

amb

line

=25°C

=4mA

= 0 mA;

= 600 Ω; f = 1 kHz; f

line

= 3.579545 MHz;

xtal

3.9 4.15 4.4 V

− 3.6 − V

−±40 − mV

3.0 3.3 3.6 V

− VLN− 0.35 − V

3.0 3.3 3.6 V

2000 May 19 33

Page 34

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DD(MR)

DD(POR)

Transmit stages

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC− AND LN)

 input impedance differential between

Z

v(TX)

∆G

v(TX)

∆G

v(TX)(f)

∆G

v(TX)(T)

CMRR common mode rejection ratio − 80 − dB V

LN(max)(rms)

n(LN)

DTMF AMPLIFIER (PIN DTMF)

Z

 input impedance − 21 − kΩ

v(DTMF)

∆G

v(DTMF)

∆G

v(DTMF)(f)

available supply current for

peripherals in on-line mode

≥ 11 mA;

line

DTMF generator on;

−−−1.9 mA

no AC signal on the line I

≥ 11 mA;

line

−−−2.6 mA DTMF generator off; no AC signal on the line

memory retention current (internal consumption on VDD)

= 0 mA;

line

VCCdischarging; VDD= 1.2 V

−−300 nA

memory retention voltage 1.0 − 3.6 V Power-on reset trip level note 1 1.3 1.65 2.0 V

− 68 − kΩ pins MIC+ and MIC−

single-ended between

− 34 − kΩ pin MIC+ or MIC− and GND

voltage gain from pins

= 4 mV (RMS) 43.2 44.2 45.2 dB

MIC

MIC+ or MIC− to LN voltage gain reduction of

internal MUTE active − 80 − dB

microphone ampliﬁer voltage gain variation with

frequency voltage gain variation with

temperature

maximum sending signal voltage level (RMS value)

noise output voltage at pin LN psophometricallyweighted

f = 300 to 3400 Hz;

−±0.2 − dB referenced to f = 1 kHz

= −25 to +75 °C;

amb

referenced to T

= 15 mA; THD = 2% 1.8 2.15 − V

line

= 4 mA; THD = 10% − 0.35 − V

line

amb

=25°C

−±0.3 − dB

−−78 − dBmp

(P53 curve); pins MIC+ and MIC− shorted through 200 Ω

voltage gain from pin DTMF to pin LN

voltage gain reduction of

in tone dialling mode; V

= 20 mV (RMS)

DTMF

− 26 − dB

internal MUTE inactive − 80 − dB

DTMF ampliﬁer voltage gain variation with

frequency

f = 300 to 3400 Hz; referenced to f = 1 kHz

−±0.2 − dB

2000 May 19 34

Page 35

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆G

v(DTMF)(T)

v(ct)

Receive stages

RECEIVE AMPLIFIER (PINS IR AND RX)

 input impedance − 21.5 − kΩ

Z

v(RX)

∆G

v(RX)

∆G

v(RX)(f)

∆G

v(RX)(T)

o(RX)(max)

RX(max)(rms)

n(RX)(rms)

EARPIECE AMPLIFIER (PINS GAR AND QR) G

v(QR)

∆G

v(QR)

QR(max)(rms)

n(QR)(rms)

voltage gain variation with temperature

voltage gain from pin DTMF to pin RX (conﬁdence tone)

= −25 to +75 °C;

amb

referenced to T

amb

=25°C

in tone dialling mode; V

= 20 mV (RMS);

DTMF

−±0.4 − dB

−−9.2 − dB

RL2=10kΩ;

voltage gain from

VIR= 4 mV (RMS) 32.4 33.4 34.4 dB

pin IR to pin RX voltage gain reduction of

internal MUTE active − 80 − dB

receive ampliﬁer voltage gain variation with

frequency voltage gain variation with

temperature maximum source and sink

f = 300 to 3400 Hz;

−±0.2 − dB referenced to f = 1 kHz

= −25 to +75 °C;

amb

referenced to T

amb

=25°C

−±0.3 − dB

IP= 0 mA; sine wave drive 50 −−µA

current on pin RX (peak value)

maximum receiving signal on pin RX (RMS value)

noiseoutputvoltageat pin RX (RMS value)

IP= 0 mA; sine wavedrive; without RL2; THD = 2%

pin IR open-circuit; RL2=10kΩ;

0.4 −−V

−−86 − dBVp

psophometrically weighted (P53 curve)

voltage gain from pin RX to pin QR

VIR= 4 mV (RMS); RE1=R

GAR

= 100 kΩ

− 0 − dB

voltage gain setting range RE1= 100 kΩ−14 − +12 dB maximum receiving signal on

pin QR (RMS value)

IP= 0 mA; sine wavedrive; RL1= 150 Ω; THD = 2%

= 0 mA; sine wavedrive;

0.3 0.38 − V

0.46 0.56 − V RL1= 450 Ω; THD = 2%

noise output voltage at pin QR (RMS value)

IR open-circuit; RL1= 150 Ω; RE1=R

GAR

= 100 kΩ;

−−86 − dBVp

psophometrically weighted (P53 curve)

R R

E1 GAR

= 100 kΩ;

=25kΩ

−−98 − dBVp

2000 May 19 35

Page 36

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Automatic gain control (pin AGC)

∆G

v(trx)

voltage gain control range for microphone and receive ampliﬁers

start

highest line current for maximum gain

stop

lowest line current for minimum gain

Oscillator (pin XTAL)

V R

XTAL

e(Zi)

DC voltage level − 0.5V real part of input impedance

of pin XTAL

Control inputs (pins CE/CSI and CE/FDI)

LOW-level input voltage GND − 0.4 − 0.2V HIGH-level input voltage 0.8V

input leakage current GND < Vi<V Keyboard inputs/outputs (pins C1 to C4, R1 to R4); note 2 V

V I

OH1

IL IH

LOW-level input voltage 0 − 0.2V

HIGH-level input voltage 0.8V

port sink current LOW VOL= 0.15 V 0.7 1.6 − mA

port pull-up source 1 current

HIGH I

OH2

port pull-up source 2 current

HIGH

Control output (pin DP/FL)

input leakage current GND < Vi<V

port sink current LOW Vo= 0.15 V 1 2.5 − mA

Control outputs (pins DMO, KT and LED)

port sink current LOW Vo= 0.4 V 1.5 4 − mA

port source current HIGH Vo=VDD− 0.15 V −1 −2 − mA

DTMF/ringer output

= 85 mA; referenced to

line

=15mA

line

= 100 mV (RMS);

XTAL

= 3.57 MHz

xtal

VOH=V V VOH=V V

IH(min)

OL=VIL(max)

IH(min)

OL=VIL(max)

− 6.0 − dB

− 23 − mA

− 59 − mA

− V

−−6−kΩ

− VDD+ 0.4 V

−500 − +500 nA

− V

15 35 −µA

− 70 140 µA 30 80 − nA

− 150 300 nA

−500 − +500 nA

TONE GENERATOR (PIN MDY/TONE); note 3

I

 maximum output current 70 100 −µA

HG(rms)

high group frequency voltage

DTMF mode − 181 − mV

(RMS value) V

LG(rms)

low group frequency voltage

DTMF mode − 142 − mV

(RMS value) G

pre-emphasis of group 1.5 2.0 2.5 dB

DC voltage level − 0.5V

− V

2000 May 19 36

Page 37

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Zo output impedance − 100 500 Ω THD total harmonic distortion note 4 −−25 − dB

RANSMIT CHANNEL (PIN LN)

HG(LN)(rms)

high group frequency voltage

(RMS value) V

LG(LN)(rms)

low group frequency voltage

(RMS value)

MDY output (pin MDY/TONE)

o(p-p)

ringer volume output voltage

(peak-to-peak value)

Notes

1. When this level is reached at rising VDD, the internal reset signal is deactivated. There is no hysteresis in the switching level, only hysteresis in the time domain.

2. At start-up the output has a pull-up source I source will be I

OH1

3. MDY/TONE has three modes: a) In speech mode or DTMF mode: 0.5VDD output. b) In ringer mode: push-pull output stage. c) In standby mode: high-impedance output.

4. Related to the low group frequency component (CEPT CS203 compatible).

5. In the event of a valid ringer signal present at pin CE/FDI.

R R

DTMF1 DTMF2

=20kΩ; = 2.74 kΩ

353 435 536 mV

277 341 420 mV

VDD= 3.3 V; note 5

Key [8] − 3.2 − V Key [7] − 2.0 − V Key [6] − 1.4 − V Key [5] − 1.1 − V

for detection of the resistor options. After initializing theoutput pull-up

OH2

2000 May 19 37

Page 38

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

TIMING CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Timing

KEYBOARD INPUTS/OUTPUTS (PINS C1 TO C4 AND R1 TO R4) t

keyboard depress debounce time

keyboard release

debounce time KEY TONE OUTPUT (PIN KT) t

keytone time − 30 − ms

keytone frequency − 597 − Hz DIAL PULSE/FLASH OUTPUT (PIN DP/FL) t

idp

fho

mho

ifp

pdp

interdigit pause time dialling rate 10 pps − 800 − ms

ﬂash holdover time − 40 − ms

mute holdover time − 15 − ms

access pause time resistor APT is not

interﬂash pause time − 800 − ms

pre-digit pause − 40 − ms

make time dialling rate 10 pps

dialling rate 20 pps − 500 − ms

present resistor APT is present − 3.6 − s

resistor MBS is not present

resistor MBS is present

dialling rate 20 pps

resistor MBS is not present

resistor MBS is present

− 20 − ms

− 2.0 − s

− 40 − ms

− 33 − ms

− 20 − ms

− 16 − ms

2000 May 19 38

Page 39

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ﬂ

IAL TONE OUTPUT (PIN MDY/TONE)

CHIP ENABLE INPUTS (PINS CE/CSI AND CE/FDI) t

Timing

ring

d(res)(ring)

brake time dialling rate 10 pps

resistor MBS is not

− 60 − ms

present resistor MBS is

− 66 − ms

present

dialling rate 20 pps

resistor MBS is not

− 30 − ms

present resistor MBS is

− 33 − ms

present

ﬂash time resistor FTSB is not

present

resistor FTSA is not

− 98 − ms

present resistor FTSA is

− 300 − ms

present

resistor FTSB is present

resistor FTSA is not

− 600 − ms

present resistor FTSA is

− 80 − ms

present

burst time − 85 − ms

pause time − 85 − ms

reset delay time − 280 − ms

ringer detection frequency 13 −−Hz

ringer response delay <1.5 frequency cycle;

VDD>V

POR

−−150 ms

2000 May 19 39

Page 40

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

LNCE/CSI C2 C3

REG AGC SLPE

REG

4.7 µF

line

100 µF

line

600

Ω

MIC

DP/FL MIC−

MIC+ MDY/TONE DTMF

DTMF

619 Ω

R2 R3 R4

UBA205xx

GND

SLPE

20 Ω

UBA2050(A); UBA2051(A;C)

VDD

3.58 MHz

CE/FDI

XTAL

GAR

220 µF

GAR

100 kΩ

VCC

100 µF

ear

GAR

GARS

100 nF

10 kΩ

FCA135

Voltage gain defined as Gv= 20 log ; VI=V

Microphone gain: S1 = open. DTMF gain and confidence tone: S1 = closed. Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin 4 must be open-circuit.

------V

MIC

or V

DTMF

Fig.32 Test circuit for defining transmit gains.

2000 May 19 40

Page 41

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

LNCE/CSI C2 C3

REG AGC SLPE

REG

4.7 µF

line

100 µF

600

Ω

line

220

DTMF

100 nF

DTMF1

20 kΩ

line

IR DP/FL MIC−

MIC+ MDY/TONE

DTMF

DTMF2

2.74 kΩ

619 Ω

R2 R3 R4

UBA205xx

GND

SLPE

20 Ω

UBA2050(A); UBA2051(A;C)

VDD

220 µF

VCC

100 µF

GAR

100 kΩ

ear

GAR

GARS

100 nF

10 kΩ

FCA136

3.58 MHz

CE/FDI

XTAL

GAR

Voltage gain defined as Gv= 20 log ; VO=VQRor VRX.

Receive and earpiece gains: S1 = open. Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin R4 must be open-circuit.

------V

Fig.33 Test circuit for defining receive gains and DTMF dialling levels.

2000 May 19 41

Page 42

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

IR MIC− MIC+

DTMF MDY/TONE DP/FL

REG AGC SLPE

REG

4.7 µF

LNR4R3R2C3C2

UBA205xx

GND C1 R1

SLPE

20 Ω

619 Ω

UBA2050(A); UBA2051(A;C)

XTAL

GAR

CE/CSI CE/FDI

3.58 MHz

10 µF

FCA137

Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin R4 must be open-circuit.

Fig.34 Test circuit for defining regulated supply (VDD) performance in ringer and trickle mode.

2000 May 19 42

Page 43

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

470 kΩ

TR1 BSP254A

470 kΩ

handbook, full pagewidth

S1-1

prot

3.9 Ω TR2

BZX79C

470 kΩ

BC558

(8.2 V)

BF420

S1-2

TR3

BZD23C

(10 V)

BZV85C

(10 V)

CSI

470 kΩ

UBA2050(A); UBA2051(A;C)

620 Ω

130 kΩ

ast1

ast2

bal1

bal2

3.92 kΩ

130 Ω

820 Ω

ast3

392 Ω

100 nF

REG

C 220 nF

SLPE

20 Ω

bal

4.7 µF (25 V)

SLPE

REG

A/B

B/A

trickle

15 MΩ

ring

2.2 kΩ (2 W)

1 µF

BR211

(220 V)

ringer

22 µF

vrr

(35 V)

D2 BAS11D3BAS11

D4 BAS11D5BAS11

BZX79C

(18 V)

TR4

BC547

TR5

BC557

BC547

TR6

vol

100 kΩ

12 kΩ

FDI

470 kΩ

100 kΩ

BZX79C

(16 V)

220 µF

VDD

(16 V)

220 kΩ

BAS45

dtmf2

mdy

100 kΩ

2.74 kΩ

dtmf1

20 kΩ

dtmf

100 nF

3.58 MHz

MDY/TONE

keytone

AGC

DTMF

XTAL

DP/FL

DMO

CE/CSI

CE/FDI

IC1

MGT053

Fig.35 Application of the UBA2050 (continued in Fig.36).

2000 May 19 43

Page 44

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

feed

100 µF

VCC

(10 V)

feed

MIC−

100 kΩ

GAR

MIC+

GAR

GND

tx3

ear

earpiece

8.2 kΩ

100 pF

18 nF

IC1

456

789

P->T

LNR/P

tx1

tx2

GARS

1 nF

GAR

47 kΩ

10 µF (16 V)

1 kΩ

47 µF (25 V)

312

tx1

22 kΩ

tx2

22 kΩ

micm

micp

1 kΩ

MGT054

UBA2050(A); UBA2051(A;C)

MIC1

1 MΩ

(7×)

R R R R R R

MBS APT PPS PTS MMS FTSA FTSB

1 2 3 4 5 6 7 8

MBS

APT

PPS

PTS

MMS

FTSA

FTSB

87654321

Fig.36 Application of the UBA2050 (continued from Fig.35).

2000 May 19 44

Page 45

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

470 kΩ

TR1 BSP254A

220 kΩ

BZD23C

(10 V)

BZV85C

(10 V)

handbook, full pagewidth

A/B

BR211

(220 V)

B/A

1 µF

S1-1

ring

trickle

15 MΩ

2.2 kΩ (2 W)

ring

D2 BAS11D3BAS11

D4 BAS11D5BAS11

prot

3.9 Ω TR2

BZX79C

470 kΩ

BC558

(8.2 V)

TR3

BF420

S1-2

TR7

CSI

470 kΩ

UBA2050(A); UBA2051(A;C)

SLPE

REG

AGC

DTMF

XT AL

DP/FL

620 Ω

BZX79C

(4.3 V)

BSN254A

DMO

470 kΩ

DMO

130 kΩ

ast1

ast2

bal1

bal2

VDD

3.92 kΩ R

392 Ω

130 Ω

820 Ω

ast3

REG

220 µF (16 V)

100 nF

C 220 nF

SLPE

20 Ω

bal

3.58 MHz

IC1

BZX79C

(15 V)

TR4

ringer

22 µF

vrr

(35 V)

BC547

TR5

BC557

TR6

BC547

vol

100 kΩ

12 kΩ

FDI

470 kΩ

100 kΩ

BZX79C

(16 V)

BAS45

Fig.37 Application of the UBA2051 (continued in Fig.38).

2000 May 19 45

220 kΩ

dtmf2

100 kΩ

mdy

2.74 kΩ

dtmf1

20 kΩ

dtmf

100 nF

DMO

MDY/TONE

DMO

CE/CSI

CE/FDI

MGT055

Page 46

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

handbook, full pagewidth

feed

100 µF

VCC

(10 V)

feed

MIC−

100 kΩ

MEM

tx3

GAR

earpiece

P->T

MIC+

GAR

GND

IC1

STORE

tx1

18 nF

8.2 kΩ

tx2

18 nF

GARS

1 nF

100 pF

10 µF

ear

(16 V)

456

789

LNR/P

1 kΩ

47 µF (25 V)

22 kΩ

312

UBA2050(A); UBA2051(A;C)

1 kΩ

micp

tx1

tx2

micm

1 kΩ

MGT056

MIC1

1 2 3 4 5 6 7 8

22.1 kΩ R

22.1 kΩ

gb1

18.2 kΩ

87654321

GAR1

GAR2

1 µF

(50 V)

kΩ

1 MΩ

(7×)

gb3

3.65 kΩ

GAIN BOOST

MBS

APT

PPS

PTS

MMS

FTSA

FTSB

gb2

7.15

MBS

APT

PPS

PTS

MMS

FTSA

FTSB

Fig.38 Application of the UBA2051 (continued from Fig.37).

2000 May 19 46

Page 47

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm

UBA2050(A); UBA2051(A;C)

SOT136-1

v M

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

2.65

0.10

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

18.1

7.6

17.7

7.4

0.71

0.30

0.69

0.29

w M

scale

eHELLpQ

1.27

0.050

10.65

10.00

0.419

0.394

1.4

0.055

0.043

0.016

1.1

0.4

0.25 0.1

0.01

(A )

detail X

1.1

0.25

1.0

0.043

0.01

0.039

ywv θ

0.9

0.4

0.035

0.004

0.016

OUTLINE VERSION

SOT136-1

IEC JEDEC EIAJ

075E06 MS-013

REFERENCES

2000 May 19 47

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22

99-12-27

Page 48

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

SOLDERING Introduction to soldering surface mount packages

Thistextgives a very brief insight toacomplextechnology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wavesoldering is notalways suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuit board by screenprinting, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.

UBA2050(A); UBA2051(A;C)

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackageswithleads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended forsurfacemountdevices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

If wave soldering is used the following conditions must be observed for optimal results:

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

2000 May 19 48

Page 49

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

Suitability of surface mount IC packages for wave and reﬂow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4) (5)

suitable

suitable suitable

(1)

2000 May 19 49

Page 50

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech,

UBA2050(A); UBA2051(A;C)

dialler and ringer functions

DATA SHEET STATUS

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseor at any other conditionsabovethosegiven in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarrantythatsuch applications will be suitable for the specified use without further testing or modification.

PRODUCT

STATUS

DEFINITIONS

product development. Speciﬁcation may change in any manner without notice.

published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

DISCLAIMERS Life support applications  These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personalinjury. Philips Semiconductorscustomersusingorsellingtheseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuseofany of these products, conveys no licence ortitle under any patent, copyright, or mask work right to these products,and makes no representations orwarrantiesthat these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

(1)

2000 May 19 50

Page 51

Philips Semiconductors Product speciﬁcation

One-chip telephone ICs with speech, dialler and ringer functions

NOTES

UBA2050(A); UBA2051(A;C)

2000 May 19 51

Page 52

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 403502/02/pp52 Date of release: 2000 May 19 Document order number: 9397 750 06723