Datasheet UBA1707T, UBA1707TS Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

UBA1707

Cordless telephone, answering
machine line interface

Product specification
Supersedes data of 1998 Jun 11
File under Integrated Circuits, IC03

1999 Feb 17

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

FEATURES
Line interface

• Low DC line voltage; operates down to 1.2 V (excluding
polarity guard)

• Voltage regulator with adjustable DC voltage

• DC mask for voltage or current regulation (CTR 21)

• Line current limitation for protection

• Electronic hook switch control input

• Transmit amplifier with:

– Symmetrical inputs
– Fixed gain
– Large signals handling capability.

• Receive amplifier with fixed gain

• Transmit and receive amplifiers AGC for line loss

compensation.

Auxiliary amplifier

• Fixed gain.

Loudspeaker channel

• Dual inputs

• Rail-to-rail output stage for single-ended load drive

• High output current capability

• Dynamic limiter to prevent distortion

• Digital volume control

• Fixed maximum gain.

General purpose switches

• Three switches with open-collector.

3-wires serial bus interface

UBA1707

• AGC:
– On/off
– Slope
–I

line current.

start

• Auxiliary amplifier mute function

• Loudspeaker channel:

– Input selection
– Volume setting
– Dynamic limiter inhibition
– Power-down mode.

• General purpose switches state

• Global power-down mode.

Supply

Operates with external supply voltage from 3.0 to 5.5 V.

APPLICATIONS

• Cordless base stations

• Answering machines

• Mains or battery-powered telephone sets.

GENERAL DESCRIPTION

The UBA1707 is a BiCMOS integrated circuit intended for
use in mains-powered telecom terminals. It performs all
speech and line interface functions, DC mask for voltage
or current regulation and electronic hook switch control.
The device includes an auxiliary amplifier, a loudspeaker
channel and general purpose switches.

Most of the characteristics are programmable via a 3-wire
serial bus interface.

Allows to control:

• DC mask (voltage or current regulation)

• Receive amplifier mute function

ORDERING INFORMATION

TYPE

NUMBER

UBA1707T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
UBA1707TS SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1

1999 Feb 17 2

NAME DESCRIPTION VERSION

PACKAGE

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

QUICK REFERENCE DATA

I

= 15 mA; VCC= 3.3 V; R

line

f = 1 kHz; T

=25°C; bit AGC at logic 1, all other configuration bits at logic 0; measured in test circuit of Fig.17;

amb

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
I

I

V
R

CC

line

CC

LN

REGC

operating voltage range 3.0 − 5.5 V
current consumption from pin V

line current operating range normal operation 11 − 140 mA

DC line voltage 2.7 3.0 3.3 V
DC mask slope in current regulation

mode

G

v(trx)

voltage gain

transmit amplifier from TXI to LN V
receive amplifier from RXI to RXO V

∆G

v(trx)

gain control range for transmit and
receive amplifiers with respect to
I

=15mA

line

G
G

v(AX)
v(LSA)

voltage gain from AXI to AXO V
voltage gain from LSAI1 or LSAI2 to

LSAO for maximum volume

∆G

v(LSA)

voltage gain adjustment range for
loudspeaker channel

∆G

v(LSA)s

voltage gain adjustment step for
loudspeaker channel

=10Ω; AGC pin connected to GND; Z

SLPE

normal operation; bit PD = 0 − 2.2 3.2 mA

CC

power-down mode; bit PD = 1 − 110 150 µA

with reduced performance 3 − 11 mA

I

> 35 mA (typical);

line

R

=1MΩ; R

LVI

bit CRC = 1

= 50 mV (RMS) 10.6 11.6 12.6 dB

TXI

= 2 mV (RMS) 36.9 37.9 38.9 dB

RXI

I

=90mA − 6.5 − dB

line

= 2 mV (RMS) 30.8 31.8 32.8 dB

AXI

V

= 8 mV (RMS);

LSAI

bits LSA1 = 1 and LSA2 = 1
bits (VOL0, VOL1, VOL2)

from (0, 0, 0) to (1, 1, 1)
VOL0 from 0 to 1 − 3 − dB

line

= 7.15 kΩ;

RGL

= 600 Ω; Z

= 619 Ω; EHI = HIGH;

SET

− 1.4 − kΩ

26.5 28 29.5 dB

− 21 − dB

1999 Feb 17 3

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

BLOCK DIAGRAM

handbook, full pagewidth

V

CC

25

RXI

10

VI

2V

d

EHI

TXI+

18

TXI−

17

AGC

9

R

RGL

RGL

5

VI

RAGC2

REG

CRC

RXM

RAGC1

EHI

600 mV

UBA1707

AGC

2

SAGC,
AGC

2V

d

300 mV

LOW VOLTAGE

PART

CURRENT

LIMITATION

200 nA

LINE INTERFACE

EHI

V

CC

SLPE

UBA1707

22

GND

8

RXO

LN

2

Z

SET

R

SLPE

SLPE

1

REG

3

C

REG

EHI

11

LCC

6

CST

7

LVI

4

V

CC

TP

TN

ON-HOOK

DARL

D

TN

SW

C

CST

R

LVI

LN +

LN −

AXI

15

26

LSAI1

27

LSAI2

LSPGND 23

Bit names are given in italics.

VI

2V

d

LSPD

VI

2V

d

19

SERIAL

INTERFACE

13 14 12
EN CLK DATA

AXM

LSA1

LSA2

SUPPLY

PD

2V

d

LOUDSPEAKER CHANNEL

0.5V

CC

LSPD

DYNAMIC LIMITER

VOLUME CONTROL

3

SWC1, SWC2,
SWC3

Fig.1 Block diagram.

AUXILIARY AMPLIFIER

V

CC

DLCI

LSPD

VOL0
TO

3

VOL2

GENERAL SWITCHES

16

24

28

21
20

19

MGK705

AXO

LSAO

DLC

SWI1
SWI2
SWI3

C

DLC

1999 Feb 17 4

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

PINNING

SYMBOL PIN DESCRIPTION

SLPE 1 connection for slope resistor
LN 2 positive line terminal
REG 3 line voltage regulator decoupling
LVI 4 negative line voltage sense input
RGL 5 reference for current regulation mode
LCC 6 line current control output
CST 7 input for stability capacitor
RXO 8 receive amplifier output
AGC 9 automatic gain control/line loss

compensation adjustment
RXI 10 receiver amplifier input
EHI 11 electronic hook switch control input
DATA 12 serial bus data input
EN 13 programming serial bus enable input
CLK 14 serial bus clock input
AXI 15 auxiliary amplifier input
AXO 16 auxiliary amplifier output
TXI− 17 inverted transmit amplifier input
TXI+ 18 non-inverted transmit amplifier input
SWI3 19 NPN open-collector output 3
SWI2 20 NPN open-collector output 2
SWI1 21 NPN open-collector output 1
GND 22 ground reference
LSPGND 23 ground reference for the loudspeaker

amplifier
LSAO 24 loudspeaker amplifier output
V

CC

LSAI1 26 loudspeaker amplifier input 1
LSAI2 27 loudspeaker amplifier input 2
DLC 28 dynamic limiter timing adjustment

25 supply voltage

handbook, halfpage

SLPE

1

LN

2

REG

3

LVI

4

RGL

5

LCC

6

CST

7

UBA1707

8

RXO
AGC

9

RXI

10

EHI

11

DATA

12

EN

13

CLK

MGK704

Fig.2 Pin configuration.

UBA1707

DLC

28

LSAI2

27

LSAI1

26

V

25

CC

LSAO

24
23

LSPGND
GND

22
21

SWI1
SWI2

20

SWI3

19

TXI+

18

TXI−

17

AXO

16
1514

AXI

1999 Feb 17 5

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

FUNCTIONAL DESCRIPTION

All data given in this chapter are typical values, except
when otherwise specified.

Supply (pins V

The UBA1707 must be supplied with an external stabilized
voltage source between pins V

Pins GND and LSPGND must be connected together.
Without any signal, with the loudspeaker channel enabled

at minimum volume and without any general purpose
switch selected, the internal current consumption is

2.2 mA at VCC= 3.3 V. Each selected switch
(pins SWI1, SWI2, or SWI3) increases the current
consumption by 600 µA.

The supply current can be reduced when the loudspeaker
channel is not used by switching it off (bit LSPD at logic 1).
The current consumption is then decreased by
approximately 800 µA at minimum volume.

and GND; bits PD and LSPD)

CC

and GND.

CC

UBA1707

• The automatic gain control

• The DC mask management

• The low voltage area characteristics.

In the same way, changing the value of Z
the characteristics. The IC has been optimized for
V

= 2.9 V and Z

ref

8.5

handbook, halfpage

V

ref

(V)

7.5

6.5

5.5

4.5

SET

= 619 Ω.

(1)

also affects

SET

MGK706

To drastically reduce current consumption, the UBA1707
is provided with a power-down mode controlled by bit PD.
When bit PD is at logic 1, the current consumption from
VCC becomes 110 µA. In this mode, the serial interface is
the only function which remains active.

Line interface

DC

CHARACTERISTICS (PINS LN, SLPE, REG, CST, LVI,

LCC, RGL
The IC generates a stabilized reference voltage (V

AND GND; BIT CRC)

ref

)
between pins LN and SLPE. This reference voltage is
equal to 2.9 V, is temperature compensated and can be
adjusted by means of an external resistor (RVA). It can be
increased by connecting the RVA resistor between
pins REG and SLPE (see Fig.3).

The voltage at pin REG is used by the internal regulator to
generate the stabilized reference voltage and is decoupled
by a capacitor (C

) which is connected to GND. This

REG

capacitor, converted into an equivalent inductance
(see Section “Set impedance”) realizes the set impedance
conversion from its DC value (R
(Z

in the audio-frequency range). Figure 4 illustrates

SET

) to its AC value

SLPE

the reference voltage supply configuration. As can be seen
from Fig.4, part of the line current flows into the Z

SET

impedance network and is not sensed by the UBA1707.
Therefore using the RVA resistor to change value of the
reference voltage will also modify all parameters related to
the line current such as:

3.5

2.5

3

10

(1) Influence of RVA on V
(2) V

without influence of RVA.

ref

(2)

4

10

.

ref

5

10

RVA (Ω)

6

10

Fig.3 Reference voltage adjustment with RVA.

The IC regulates the line voltage at pin LN which can be
calculated as follows:

V

V

LN

refRSLPEISLPE

I

SLPEIlineIZSET

×+=

I* I

–≅––=

lineIZSET

Where:

I

= line current

line

I

= current flowing through Z

ZSET

SET

I* = current consumed between LN and GND
(approximately 100 µA).

The preferred value for R

is 10 Ω. Changing R

SLPE

SLPE

will
affect more than the DC characteristics; it also influences
the transmit gain, the gain control characteristics, the
sidetone level and the maximum output swing on the line.
However, for compliance with CTR 21 8.66 Ω is the best
value for R

SLPE

.

1999 Feb 17 6

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

handbook, full pagewidth

R

p

35 kΩ

V

R

d

4 kΩ

REG GNDSLPE

C

REG

4.7 µF

I

SLPE

LN

d

R
10 Ω

I

LN

UBA1707

SLPE

UBA1707

LN+

I

line

*I

I

ZSET

MGK707

Z

SET

619 Ω

handbook, full pagewidth

Fig.4 Reference voltage supply configuration.

I

LN

R

p

35 kΩ

V

R

d

4 kΩ

REG GND LCC EHISLPE

C

REG

4.7 µF

I

SLPE

LN

V

d

R

SLPE

10 Ω

UBA1707

ref

HOOK SWITCH
MANAGEMENT

TN

SW

V

CE

V

EHI

(TNSW)

I

line

I

ZSET

Z

SET

619 Ω

LN+

LN−

Z

line

R

exch

V

line

V

exch

MGK708

Fig.5 Line current settling simplified configuration.

1999 Feb 17 7

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

The DC line current flowing into the set is determined by
the exchange supply voltage (V
resistance (R
(R

) and the set (R

line

), the DC resistors of the telephone line

exch

), the reference voltage (V

SET

the voltage introduced by the transistor (TNSW) used as
line interrupter (see Fig.5). With a line current below I
(8 mA with Z
(V

) is automatically adjusted to a lower value. This

ref

= 619 Ω), the internal reference voltage

SET

means that more sets can operate in parallel with DC line
voltages (excluding the polarity guard) down to 1.2 V.
At line current below I

, the circuit has limited transmit

low

and receive levels. This is called the low voltage area.
Figure 6 shows in more details how the UBA1707, in

association with some external components, manages the
line interrupter (TNSWexternal transistor).

In on-hook conditions (voltage at pin EHI is LOW), the
voltage at pin LCC is pulled-up to the supply voltage level
(VCC) to turn off the TP
of the R

resistor, the TNSWand TN

PLD

are switched off. The TN
the R

resistor from the LN− line terminal in order to

LVI

transistor. As a result, because

DARL

ON-HOOK

guarantee a high on-hook impedance.

), the feeding bridge

exch

ref

ON-HOOK

transistors

transistor disconnects

) and

low

UBA1707

In off-hook conditions (voltage at pin EHI is HIGH), an
operational amplifier drives (at pin LCC) the base of
TP
association with TNSW. The line current flows through
TNSW transistor. The TN
deep saturation. A virtual ground is created at pin LVI
because of the operational amplifier. A DC current (I
sourced from pin LVI into the R
generate a voltage source. Thus the voltage between pin
GND and the negative line terminal (LN−) becomes:

VCE (TNSW)=R
The voltage V

can be calculated as follows:
V
Where:

which forms a current amplifier structure in

DARL

transistor is forced into

resistor in order to

LVI

(TN

ON-HOOK

− I

)+VCE(TNSW)

ZSET

SET

× I

LVI

between the line terminals LN+ and LN−

line

≅ V

line

ref+RSLPE

I

= line current

line

I

= current flowing through Z

ZSET

× (I

ON-HOOK

LVI+VCE

line

) is

LVI

) ≅ R

LVI

× I

LVI

.

1999 Feb 17 8

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1999 Feb 17 9

UBA1707

ndbook, full pagewidth

R

p

35 kΩ

LN

I

LN

I

line

LN+

Philips Semiconductors Product specification

Cordless telephone, answering machine

line interface

C

REG

4.7 µF

V

EHI

REG

EHI

CURRENT

REGULATION

MODE

MANAGEMENT

CRC

R

RGL

7.15 kΩ

TN

I

LVI

C
470 pF

ON-HOOK

LVI

R

LVI

1 MΩ

R

4 kΩ

I

LVIV

200 nA

GNDLVIRGL CST

D

PROT

d

V

d

CURRENT

LIMITATION

R

ON-HOOK

100 kΩ

R

PLU

150 kΩ

C

CST

22 pF

V

SLPE

LCC

D

R
20 kΩ

ref

SW

PLD

I

SLPE

10 Ω

DARL

ZSET

I

SLPE

8.2 V

R

V

CC

TP

Z
619 Ω

TN

SET

SW

I

line

MGK709

V

line

LN−

UBA1707

Bit names are given in italics.

Fig.6 Line interrupter management and DC mask regulation configuration.

Philips Semiconductors Product specification



Cordless telephone, answering machine
line interface

The UBA1707 offers the possibility to choose two kinds of
regulations for the DC characteristic between the line
terminals LN+ and LN− (see Fig.7):

• Voltage regulation mode

• Current regulation mode.

handbook, halfpage

V

line

I

prot

RGL

I

line

(4)

MGK710

) in

(1) (2) (3)

I

low

(1) Low voltage area.
(2) Small slope (determined by R
(3) Small slope (dashed line; determined by R

regulation mode.
High slope (full line; determined by R

current regulation mode.

(4) Current limitation.

I

knee

SLPE

).

) in voltage

SLPE

, R

LVI

and R

SLPE

Fig.7 General form of the DC mask as a function

of regulation mode.

UBA1707

Therefore VCE(TNSW) ≅ R
application (see Fig.18).

The slope ∆V
R

≅ R

REGV

line

SLPE.

/∆I

of the V

line

Current regulation mode

In current regulation mode (bit CRC at logic 1), when the
line current is lower than I

= 619 Ω), VCE(TNSW) is fixed by means of a 200 nA

Z

SET

DC constant current I

LVIV

line current is higher than 35 mA, an additional current
(proportional to the line current) flows through R
result, TN
the line current. V

()R

V

CETNSW

works as a DC voltage source increasing with

SW

(TNSW) can be calculated as follows:

CE



×≅

LVI



Where:

I

= line current

line

R

= resistor connected at pin RGL.

RGL

/∆I

The slope ∆V

line

of the V

line

determined by the ratio of resistors connected at
pins SLPE, LVI and RGL, and can be calculated as

follows: in

R

REGCRSLPERLVI

typical application (see Fig.18).

Current limitation

Whatever the selected mode is, the line current is limited
to approximately 145 mA. This current is sensed on SLPE,
for this purpose the external zener diode must be
connected between pins LN and SLPE. The speech
function no longer operates in this condition.

× I

LVI

knee

= 200 mV in typical

LVIV

, I

characteristic is

line

line

= 35 mA (with

flowing through R

R

SLPE

--------------- ­R

RGL

I

–()I

lineIknee

, I

characteristic is

line

line

R

SLPE

--------------- ­R

RGL

. When the

LVI

+×

1400 Ω=×+≅

LVI

LVIV

. As a

The regulation mode is selected by the bit CRC via the
serial interface.

The DC mask regulation is realised by adjusting the DC
voltage V

(TNSW) between pin GND and line terminal

CE

LN− as a function of the line current.

Voltage regulation mode

In voltage regulation mode (bit CRC at logic 0),
VCE(TNSW) voltage is fixed by means of a 200 nA DC
constant current I

flowing through R

LVIV

LVI

.

1999 Feb 17 10

E

LECTRONIC HOOK SWITCH CONTROL (PIN EHI)

The electronic hook switch input (EHI) controls the state of
TP
LOW, TP
pulled up to supply voltage (VCC). TNSWand TN

transistor. When the voltage applied at pin EHI is

DARL

transistor is turned off. Voltage at pin LCC is

DARL

ON-HOOK

transistors are also turned off by means of a pull-down
resistor (R
HIGH, TP

). When the voltage applied at pin EHI is

PLD

transistor is driven by the operational

DARL

amplifier at pin LCC and the regulation mode selected is
operating. An internal 165 kΩ pull-up resistor is connected
between pins LCC and VCC.

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

The EHI input can also be used for pulse dialling or
register recall (timed loop break). During line breaks
(voltage at pin EHI is LOW or open-circuit), the voltage
regulator is switched off and the capacitor at pin REG is
internally disconnected to prevent its discharge. As a
result, the voltage stabilizer will have negligible switch-on
delay after line interruptions. This minimizes the
contribution of the IC to the current waveform during pulse
dialling or register recall.

When the UBA1707 is in power-down mode (bit PD at
logic 1), the TP
whatever the voltage applied at pin EHI.

S

ET IMPEDANCE

In the audio frequency range, the dynamic impedance
between pins LN and GND (illustrated in Fig.8) is mainly
determined by the Z

The impedance introduced by the external TNSW transistor
connected between pin GND and the negative line
terminal (LN−) is negligible.

handbook, halfpage

transistor is forced to be turned off

DARL

impedance.

SET

LN

Z

L

EQ

R

P

SET

619 Ω

UBA1707

TRANSMIT AMPLIFIER (PINS TXI+ AND TXI−)
The UBA1707 has symmetrical transmit inputs TXI+ and

TXI−. The input impedance between pins TXI+ or TXI− and
GND is 21 kΩ. The voltage gain from pins TXI+ or TXI− to
pin LN is set at 11.6 dB with 600 Ω line load (Z
619 Ω set impedance. The inputs are biased at
2 × Vd≅ 1.4 V, with Vd representing the diode voltage.
Automatic gain control is provided on this amplifier for line
loss compensation.

R

ECEIVE AMPLIFIER (PINS RXI AND RXO; BIT RXM)

The receive amplifier (see Fig.9) has one input (RXI) and
one output (RXO). The input impedance between pins
RXI and GND is 21 kΩ. The rail-to-rail output stage is
designed to drive a 500 µA peak current. The output
impedance at pin RXO is approximately 100 Ω.

The voltage gain from pin RXI to pin RXO is set at 37.9 dB.
This gain value compensates typically the attenuation of
the anti-sidetone network (see Fig.10). The output as well
as the input are biased at 2 × Vd≅ 1.4 V. Automatic gain
control is provided on this amplifier for line loss
compensation. This amplifier can be muted by activating
the receive mute function (bit RXM at logic 1).

line

) and

V

SLPE

R

10 Ω

GND

Leq=C
RP= internal resistance = 35 kΩ.

REG

× R

SLPE

× R

P

ref

SLPE

REG

C

REG

4.7 µF

MGL215

Fig.8 Equivalent impedance between

LN and GND.

1999 Feb 17 11

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

handbook, full pagewidth

RXI

2V

Bit names are given in italics.

VI

d

from AGC

Fig.9 Receive amplifier.

SIDETONE SUPPRESSION
The UBA1707 anti-sidetone network comprising

Z

//Z

, R

, R

, R

, R

SET

line

ast1

ast2

ast3

SLPE

and Z

(see Fig.10)

bal

suppresses the transmitted signal in the received signal.
Maximum compensation is obtained when the following
conditions are fulfilled:

RXM

UBA1707

2V

d

VI

UBA1707

Therefore, the value chosen for Z
average line length which gives satisfactory sidetone
suppression with short and long lines.

The suppression also depends on the accuracy of the
match between Z
line.

RXO

MGK711

should be for an

bal

and the impedance of the average

bal

R

× R

k

Z

SLPE

=

bal

ast1=ZSET

R

ast2

-------------------------------------------------------------------­R

ast1RSLPE

=k×Z

line

× (R

ast2+Rast3

R

+()×()

ast3RSLPE

)

×()

The scale factor ‘k’ is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Z

In practice, Z

varies considerably with the line type and

line

bal

.

the line length.

handbook, full pagewidth

Z

line

GND

Z

R

SET

SLPE

LN

SLPE

The anti-sidetone network for the UBA1707 (see Fig.18)
attenuates the receiving signal from the line by 38 dB
before it enters the receiving amplifier. The attenuation is
almost constant over the whole audio frequency range.
A Wheatstone bridge configuration (see Fig.11) may also
be used.

More information on the balancing of an anti-sidetone
bridge can be obtained in our publication

Handbook for Wired Telecom Systems, IC03b”

R

ast1

I

m

R

ast3

RXI

Z

RXI

R

ast2

Z

bal

MGL216

“Applications

.

Fig.10 Equivalent circuit of UBA1707 anti-sidetone bridge.

1999 Feb 17 12

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

handbook, full pagewidth

Z

line

GND

Z

R

SET

SLPE

LN

SLPE

UBA1707

Z

bal

ast1

RXI

Z

RXI

R

A

MGL217

I

m

R

Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.

AUTOMATIC GAIN CONTROL (PIN AGC; BITS RAGC1,
RAGC2, SAGC

AND AGC)

The UBA1707 performs automatic line loss compensation.
The automatic gain control varies the gain of the transmit
amplifier and the gain of the receive amplifier in
accordance with the DC line current. The control range is

6.5 dB (which roughly corresponds to a line length of

5.5 km for a 0.5 mm diameter twisted-pair copper cable
with a DC resistance of 176 Ω/km and an average
attenuation of 1.2 dB/km).

When the line current is greater than I
gains are minimum. When the line current is less than I

, the voltage

stop

start

the voltage gains are maximum. When the AGC pin is
connected to pin GND, the start line current (I

start

) can be
chosen between 22.5 and 29.5 mA via bits RAGC1 and
RAGC2 through the serial interface. Two values for the
I

stop/Istart

ratio (slope of the AGC) are possible via the bit
SAGC through the serial interface. When bit SAGC is at
logic 0 then I

stop

= 2.7 × I

(optimized for voltage

start

regulation mode). When SAGC is at logic 1 then
I

stop

= 1.9 × I

(optimized for current regulation mode).

start

An external resistor R
and AGC) enables the I
increased (the ratio between I

(connected between pins GND

AGC

start

and I

line currents to be

stop

and I

start

stop

is not affected
by this external resistor). So internal and external
adjustments of the automatic gain control allow
optimization of the IC for many configurations of exchange
supply voltage and feeding bridge resistance. Part of the
line current flows into the Z
has been optimized for Z
value slightly modifies I

impedance network. The IC

SET

= 619 Ω. Changing this 619 Ω

SET

stop

and I

line currents as well as

start

the value of the two AGC slopes.
The automatic gain control function can be disabled by

,

setting the AGC bit to logic 0 via the serial interface or
when pin AGC is left open-circuit. In this case both of the
voltage gains are maximum.

1999 Feb 17 13

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

Auxiliary amplifier (pins AXI and AXO; bit AXM)

The auxiliary amplifier (see Fig.12) has one input (AXI) and one output (AXO). The input impedance between pins AXI
and GND is 3.8 kΩ. The rail-to-rail output stage is designed to drive a 500 µA peak current. The output impedance at pin
AXO is approximately 100 Ω.

The output as well as the input are biased at 2 × Vd≅ 1.4 V DC voltage. The voltage gain from pin AXI to pin AXO is set
at 31.8 dB.The amplifier can be muted by setting bit AXM at logic 1 via the serial interface. In this case, the input
impedance between pins AXI and GND is infinite.

handbook, full pagewidth

AXI

UBA1707

AXM

2V

AXO

d

MGK712

Bit names are given in italics.

Fig.12 Auxiliary amplifier.

Loudspeaker channel (see Fig.13)
L

OUDSPEAKER AMPLIFIER (PINS LSAI1, LSAI2, LSAO AND

LSPGND; BITS LSPD, LSA1 AND LSA2)
The loudspeaker amplifier has two symmetrical inputs

LSAI1 and LSAI2 selectable independently by the bits
LSA1 and LSA2 respectively. The input impedance
between pins LSAI1or LSAI2 and GND is typically 21 kΩ.
Each of these two inputs stages can accommodate signals
up to 500 mV (RMS) at room temperature for less than 2%
of Total Harmonic Distortion (THD) at minimum voltage
gain.

The inputs are biased at 2 × Vd≅ 1.4 V DC voltage
(whatever the state of bits LSA1 and LSA2).

The rail-to-rail output stage is designed to power a
loudspeaker connected as a single-ended load (between
pins LSAO and LSPGND). The output LSAO is able to
drive at least a 150 mA peak current.

As a result, it can drive loudspeaker loads down to 8 Ω at
V

= 4.0 V and 16 Ω at VCC= 5.5 V. The output is biased

CC

1

at

⁄2VCC. Its output voltage capability is specified for

continuous wave drive and depends on the value of V

CC

In order to avoid crosstalk from the loudspeaker to other
amplifiers, the loudspeaker current flows via pin LSPGND.
This pin must be externally connected to pin GND.

The nominal value of the voltage gain for maximum
volume from pins LSAI1 or LSAI2 to pin LSAO is set at
28 dB.

This amplifier is no longer supplied by setting the LSPD bit
at logic 1 via the serial interface.

.

1999 Feb 17 14

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

handbook, full pagewidth

LSAI1

LSAI2

2V

2V

d

d

LSPD

VI

VI

LSPD

LSA1

LSA2

0.5V

IV

CC

LSPD

V

CC

DYNAMIC LIMITER

VOLUME CONTROL

UBA1707

DLCI

LSPD

VOL0
TO

3

VOL2

MGK713

LSAO

DLC

C

DLC

LSPGND

UBA1707

C

LSAO

LSP

Bit names are given in italics.

Fig.13 Loudspeaker channel.

DYNAMIC LIMITER (PIN DLC; BIT DLCI)
The dynamic limiter of the UBA1707 prevents clipping of

the loudspeaker output stage and protects the operation of
the circuit when the supply voltage at VCC falls below

2.7 V.
Hard clipping of the loudspeaker output stage is prevented

by rapidly reducing the gain when the output stage starts
to saturate. The time in which gain reduction is effected
(clipping attack time) is approximately a few milliseconds.
The circuit stays in the reduced gain mode until the peaks
of the loudspeaker signals no longer cause saturation.
The gain of the loudspeaker amplifier then returns to its
normal value within the clipping release time (typically
250 ms). Both attack and release times are proportional to
the value of the capacitor C

. The total harmonic

DLC

distortion of the loudspeaker output stage, in reduced gain
mode, stays below 5% up to 10 dB (minimum) of input
voltage overdrive [providing V

LSAI

is below

500 mV (RMS)].

When the supply voltage drops below an internal threshold
voltage of 2.7 V, the gain of the loudspeaker amplifier is
rapidly reduced (approximately 1 ms). When the supply
voltage exceeds 2.7 V, the gain of the loudspeaker
amplifier is increased again.

The hard clipping of the dynamic limiter can be inhibited by
setting the DLCI bit at logic 1, via the serial interface.

The dynamic limiter is no longer supplied by setting the
LSPD bit at logic 1. In this case, the C

capacitor charge

DLC

is maintained to allow the gain of the loudspeaker amplifier
to return to its nominal value as soon as the loudspeaker
channel is supplied again.

V

OLUME CONTROL (BITS VOL0, VOL1 AND VOL2)

The loudspeaker amplifier voltage gain can be reduced in
steps of 3 dB via the serial interface (via bits VOL0, VOL1
and VOL2). These bits provide 7 steps of voltage gain
adjustment. The voltage gain is maximum when all bits are
at logic 1 and is reduced by 21 dB when all bits are at
logic 0.

1999 Feb 17 15

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

General purpose switches (pins SWI1, SWI2 and
SWI3; bits SWC1, SWC2 and SWC3)

The UBA1707 is equipped with 3 general purpose
open-collector switches which short the pins SWI1, SWI2
and SWI3 to ground. They are respectively controlled by
bits SWC1, SWC2 and SWC3 and have an operating
voltage limited to 12 V. The outputs have to be current
biased.

For a bias current between 2 and 20 mA, the AC
impedance is 30 Ω maximum.

Serial interface (pins DATA, CLK and EN)

A simple 3-wire unidirectional serial bus is used to program
the circuit. The 3 wires of the bus are EN, CLK and DATA.
The data sent to the device is loaded in bursts framed by
EN. Programming clock edges (falling edges) and their
appropriate data bits are ignored until EN goes active
HIGH. The programmed information is loaded into the
addressed register when EN returns inactive (LOW) or left
open-circuit.

UBA1707

During normal operation, EN should be kept LOW. Only
the last 8 bits serially clocked into the device are retained
within the programming register. Additional leading bits
are ignored and no check is made on the number of clock
pulses. It can always capture new programming data even
during global power-down (bit PD at logic 1).

Data is entered with the most significant bit first.
The leading 6 bits make up the data field (bits D0 to D5)
while the trailing 2 bits are the address field
(bits ADO and AD1). The first bit entered is D5, the last
bit AD0. This organisation allows to send only the number
of bits of the addressed register.

Figure 16 shows the serial timing diagram. Table 1 gives
the list of registers.

When the supply voltage V
register files are set in the initial state (see Table 1) defined
by the power-up reset. At start-up, the circuit is in
power-down mode.

In the event that the IC is used in a noisy environment, it is
advised to periodically refresh the content of registers.

drops below 2.5 V, all

CC

1999 Feb 17 16

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

Table 1 Register description

BIT

NAME

Register 0: general purpose switches state and DC mask regulation mode

SWC1 SWI1 output connection 0: SWI1 switched off D0 (AD1, AD0) = (0,0) 0

SWC2 SWI2 output connection 0: SWI2 switched off D1 0

SWC3 SWI3 output connection 0: SWI3 switched off D2 0

un unused must be set to logic 0 D3 0
CRC current regulation mode 0: voltage regulation D4 0

Register 1: automatic gain control

RAGC1 AGC range selection 1 D0 (AD1, AD0) = (0,1) 0
RAGC2 AGC range selection 2 D1 0
SAGC AGC slope selection 0: 2.7 type slope; note 1 D2 0

AGC line loss compensation mode 0: AGC inhibited D3 0

Register 2: loudspeaker channel

LSA1 loudspeaker channel input 1

selection

LSA2 loudspeaker channel input 2

selection

LSPD loudspeaker channel power-down 0: channel on D2 0

VOL0 volume control (least significant bit) D3 0
VOL1 volume control D4 0
VOL2 volume control (most significant bit) D5 0

Register 3: mute functions and power-down

AXM auxiliary amplifier mute 0: amplifier enabled D0 (AD1, AD0) = (1,1) 0

RXM receive amplifier mute 0: amplifier enabled D1 0

PD reduced consumption mode 0: normal operating mode D2 1

DLCI dynamic limiter inhibit 0: limiter enabled D3 0

FUNCTION POLARITY DATA ADDRESS

1: SWI1 switched on

1: SWI2 switched on

1: SWI3 switched on

1: current regulation

1: 1.9 type slope; note 1

1: AGC enabled

0: LSAI1 unselected D0 (AD1, AD0) = (1,0) 0
1: LSAI1 selected
0: LSAI2 unselected D1 0
1: LSAI2 selected

1: channel in power-down

1: amplifier muted

1: amplifier muted

1: power-down mode

1: limiter inhibited

STATE AT

POWER-UP

RESET

Note

1. See Section “Automatic gain control (pin AGC; bits RAGC1, RAGC2, SAGC and AGC)”.

1999 Feb 17 17

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

LN

V

SWIn

V

n(max)

I

LN

I

SWIn

P

tot

T

stg

T

amb

supply voltage on pin V

CC

GND − 0.4 5.5 V
positive continuous line voltage on pin LN GND − 0.4 12.0 V
repetitive line voltage during switch-on or

GND − 0.4 13.2 V
line interruption

voltage on pins SWI1, SWI2, and SWI3 continuous GND − 0.4 12.0 V

during switching GND − 0.4 13.2 V
maximum voltage on all other pins GND − 0.4 VCC+ 0.4 V
current sunk by pin LN see Figs 14 and 15 − 150 mA
continuous current sunk by

bit SWCn = 1 − 20 mA

pins SWI1, SWI2, and SWI3
total power dissipation T

UBA1707T − 625 mW

=75°C;

amb

see Figs 14 and 15

UBA1707TS − 416 mW
IC storage temperature −40 +125 °C
operating ambient temperature −25 +75 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

UBA1707T 70 K/W

UBA1707TS 104 K/W

1999 Feb 17 18

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

150

handbook, full pagewidth

I

LN

(mA)

130

110

90

∆ V

70

50

30

23456 891011

with power delivered to the loudspeaker

UBA1707

MGK714

no power delivered to the loudspeaker

(1)(2)(3)(4)

ref

7

V

− V

LN

SLPE

12

(V)

LINE T

(1) 45 1000

The line current value can be calculated from ILN value as follows:

ILNR

=

----------------------------------------------------------------------------------------------

line

When power is delivered to a loudspeaker with RL impedance, the curves must be shifted to the left by:

=

------------------------------------------

ref

2 π2RLILN×××

+()V

SETRSLPE

R

2

V

CC

LNVSLPE

SET

with maximum power dissipated by the loudspeaker amplifier (dotted line given for V

–+×

where R

is the resistive part of Z

SET

SET

.I

(2) 55 875
(3) 65 750
(4) 75 625

Fig.14 Safe operating area (UBA1707T).

CC

amb

= 5.5 V, RL=16Ω).∆V

(°C) P

(mW)

tot

1999 Feb 17 19

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

140

handbook, full pagewidth

I

LN

(mA)

120

100

80

60

40

20

24 8

with power delivered to the loudspeaker

(4)

∆ V

ref

637510119

no power delivered to the loudspeaker

(1)(2)(3)

UBA1707

MGK715

12

V

− V

SLPE

(V)

LN

LINE T

(1) 45 666

The line current value can be calculated from ILN value as follows:

ILNR

=

----------------------------------------------------------------------------------------------

line

When power is delivered to a loudspeaker with RL impedance, the curves must be shifted to the left by:

=

------------------------------------------

ref

2 π2RLILN×××

+()V

SETRSLPE

R

2

V

CC

LNVSLPE

SET

with maximum power dissipated by the loudspeaker amplifier (dotted line given for V

–+×

where R

is the resistive part of Z

SET

SET

.I

(2) 55 583
(3) 65 500
(4) 75 416

Fig.15 Safe operating area (UBA1707TS).

(°C) P

amb

= 5.5 V, RL=16Ω).∆V

CC

(mW)

tot

1999 Feb 17 20

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

CHARACTERISTICS

I

= 15 mA; VCC= 3.3 V; R

line

f = 1 kHz; T

=25°C; bit AGC at logic 1, all other configuration bits at logic 0; measured in test circuit of Fig.17;

amb

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins V

V

CC

I

CC

I

CC(pd)

and GND; bit PD)

CC

operating supply voltage 3.0 − 5.5 V
current consumption from

pin V

CC

current consumption from
pin VCC in power-down mode

Line interface (pins LN, SLPE and REG)

DC

CHARACTERISTICS

V

ref

stabilized voltage between
pins LN and SLPE

V

LN

DC line voltage between pins
LN and GND

V

LN(Rext)

DC line voltage between pins
LN and GND with an external

∆V

LN(T)

resistor R
DC line voltage variation with

VA

temperature referenced to
25 °C

=10Ω; AGC pin connected to GND; Z

SLPE

bit PD = 1 − 110 150 µA

I

= 11 to 140 mA 2.6 2.9 3.2 V

line

I

=2mA − 1.2 − V

line

I

=4mA − 1.8 − V

line

I

= 15 mA 2.7 3.0 3.3 V

line

I

= 140 mA − 4.35 − V

line

R

VA(SLPE−REG)

T

= −25 to +75 °C − 8.0 − mV

amb

= 600 Ω; Z

line

= 619 Ω; EHI = HIGH;

SET

− 2.2 3.2 mA

=8kΩ− 4.5 − V

Masks regulation (pins LCC, LVI, CST and RGL; bit CRC)

DC

CHARACTERISTICS

I

LCC(max)

maximum current sunk by
pin LCC

R

int(LCC)

internal resistance between
pins VCCand LCC

Voltage regulation mode

I

LVIV

current sourced from pin LVI bit CRC = 0 − 200 − nA

Current regulation mode

I

knee

start line current for current

bit CRC = 1 − 35 − mA

regulation mode

R

REGC

DC mask slope in current
regulation mode

I

line>Iknee

R

RGL

; R

= 7.15 kΩ; bit CRC = 1

Current limitation

I

prot

current limitation level − 145 − mA

1999 Feb 17 21

=1 MΩ;

LVI

500 −− µA

− 165 − kΩ

− 1.4 − kΩ

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Electronic hook-switch control (pin EHI)

V

IH

V

IL

I

bias

Transmit amplifier (pins TXI+, TXI− and LN)
Z

 input impedance between pins TXI+ and GND

i

G

v(TX)

∆G

v(TX)(f)

∆G

v(TX)(T)

CMRR common mode rejection ratio − 65 − dB
PSRR power supply rejection ratio − 36 − dB
V

LN(max)(rms)

V

iTX(max)(rms)

V

no(LN)

HIGH-level input voltage 2.3 − VCC+ 0.4 V
LOW-level input voltage VCC= 3.0 to 5.5 V GND − 0.4 − 0.3V

CC

V

input bias current input level = HIGH 1 2 5 µA

− 21 − kΩ

or TXI− and GND
between pins TXI+ and TXI−− 36 − kΩ

voltage gain from TXI+/TXI−

V

= 50 mV (RMS) 10.6 11.6 12.6 dB

TXI

to LN
voltage gain variation with

f = 300 to 3400 Hz −±0.3 − dB

frequency referenced to 1 kHz
voltage gain variation with

T

= −25 to +75 °C −±0.3 − dB

amb

temperature referenced to
25 °C

maximum sending signal
(RMS value)

maximum transmit input
voltage (RMS value) for
2% THD on pin LN

noise output voltage at pin LN pins TXI+ and TXI−

I

= 15 mA; THD = 2% 1.2 1.4 − V

line

I

= 4 mA; THD = 10% − 0.26 − V

line

I

=15mA − 0.35 − V

line

I

=90mA − 0.75 − V

line

−−74 − dBmp
short-circuited through
200 Ω in series with 10 µF;
psophometrically weighted
(P53 curve)

Receive amplifier (pins RXI and RXO; bit RXM)

Zi input impedance between pins

− 21 − kΩ

RXI and GND
G
∆G

v(RX)

v(RX)(f)

voltage gain from RXI to RXO V

voltage gain variation with

= 2 mV (RMS) 36.9 37.9 38.9 dB

RXI

f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz
∆G

v(RX)(T)

voltage gain variation with

T

= −25 to +75 °C −±0.3 − dB

amb

temperature referenced to

25 °C
PSRR power supply rejection ratio − 68 − dB
THD total harmonic distortion V

= 2 mV (RMS) − 0.03 − %

RXI

= 12.5 mV (RMS) − 2 − %

V

RXI

V

= 19.5 mV (RMS);

RXI

I

=90mA

line

− 2 − %

1999 Feb 17 22

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT

V

no(RXO)(rms)

∆G

v(RX)(m)

Automatic gain control (pin AGC; bits RAGC1, RAGC2, SAGC and AGC)

∆G

v(trx)

I

start

I

stop

∆G

v(trxoff)

noise output voltage at

pin RXO (RMS value)

voltage gain reduction from

pin RXI to RXO when muted

gain control range for transmit

and receive amplifiers with

respect to I

=15mA

line

highest line current for

maximum gain

lowest line current for

minimum gain when

I

=23mA

start

gain variation for transmit and

receive amplifiers when AGC

is off

RXI open-circuit;

−−81 − dBVp
psophometrically weighted
(P53 curve)

V

= 10 mV (RMS);

RXI

− 80 − dB
bit RXM = 1

I

=90mA − 6.5 − dB

line

bits RAGC1 = 1; RAGC2 = 1 − 22.5 − mA
bits RAGC1 = 1; RAGC2 = 0 − 25 − mA
bits RAGC1 = 0; RAGC2 = 1 − 27 − mA
bits RAGC1 = 0; RAGC2 = 0 − 29.5 − mA
bits SAGC = 0; RAGC1 = 1;

− 62 − mA
RAGC2 = 1

bits SAGC = 1; RAGC1 = 1;

− 43 − mA
RAGC2 = 1

bit AGC = 0;
I

= 15 to 140 mA

line

−−±0.2 dB

Amplifiers

A

UXILIARY AMPLIFIER (PINS AXI AND AXO; BIT AXM)

 input impedance between pins

Z

i

− 3.8 − kΩ

AXI and GND

G

v(AX)

voltage gain from pin

V

= 2 mV (RMS) 30.8 31.8 32.8 dB

AXI

AXI to AXO

∆G

v(AX)(f)

voltage gain variation with

f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz

∆G

v(AX)(T)

voltage gain variation with

T

= −25 to +75 °C −±0.2 − dB

amb

temperature referenced to

25 °C
PSRR power supply rejection ratio − 79 − dB
V

no(AXO)(rms)

noise output voltage at

pin AXO (RMS value)

pin AXI connected to pin
GND through 200 Ω in series

−−83 − dBVp

with 10 µF;
psophometrically weighted
(P53 curve)

∆G

v(AX)(m)

voltage gain reduction from

pin AXI to AXO when amplifier

V

= 10 mV (RMS);

AXI

bit AXM = 1

− 80 − dB

muted

1999 Feb 17 23

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

LOUDSPEAKER CHANNEL (PINS LSAI1, LSAI2, LSAO, DLC AND LSPGND;

BITS LSA1, LSA2, LSPD, VOL0, VOL1, VOL2 AND DLCI)

Loudspeaker amplifier

Zi input impedance between pins

LSAI1 or LSAI2 and GND
G

v(LSA)

voltage gain from LSAI1 or

LSAI2 to LSAO for maximum

volume
∆G

v(LSA)(f)

voltage gain variation with

frequency referenced to 1 kHz
∆G

v(LSA)(T)

voltage gain variation with

temperature referenced to

25 °C
V

LSAI(rms)

maximum input voltage

between pins LSAI1 or

LSAI2 and GND (RMS value)
V

no(LSAO)(rms)

noise output voltage at

pin LSAO (RMS value)

Output capability

V

LSAO(p-p)

output voltage capability at pin

LSAO (peak-to-peak value)

I

LSAO(max)

 maximum current capability at

pin LSAO (peak value)

bits LSA1 = 1, LSA2 = 1 − 21 − kΩ

V

= 8 mV (RMS);

LSAI

26.5 28 29.5 dB

bits LSA1 = 1, LSA2 = 1

V

= 8 mV (RMS);

LSAI

−±0.3 − dB

f = 300 to 3400 Hz
T

= −25 to +75 °C −±0.3 − dB

amb

VCC= 5.0 V; G

v(LSA)

= 7 dB;

− 500 − mV

for 2% of THD in input stage

pin LSAI1 (with bits

−−80 − dBVp
LSA1 = 1, LSA2 = 0) or pin
LSAI2 (with bits LSA1 = 0,
LSA2 = 1) connected to pin
GND through 200 Ω in series
with 10 µF;
psophometrically weighted
(P53 curve)

VCC= 5.0 V;
G
V

= 28 dB;

v(LSA)

= 100 mV (RMS);

LSAI

3.0 3.6 − V

RL=16Ω

= 3.3 V;

V

CC

G
V

= 28 dB;

v(LSA)

= 100 mV (RMS);

LSAI

− 2.0 − V

RL=8Ω

150 −− mA

1999 Feb 17 24

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Dynamic limiter

t

att

t

rel

THD total harmonic distortion at

Volume control

∆G

v(LSA)

∆G

v(LSA)(s)

Switches (pins SWI1, SWI2 and SWI3; bits SWC1, SWC2 and SWC3)

 AC impedance between pins

Z

i(off)

Z

 AC impedance between pins

i(on)

attack time VCC= 3 V; G

when V

LSAI

=28dB

v(LSA)

jumps from

−−5ms

20 mV (RMS) to
20 mV (RMS) + 10 dB;
bit DLCI = 0

when V

drops below

CC

− 1 − ms

2.7 V; bit DLCI = don’t
care

release time VCC= 3 V; G

when V

LSAI

jumps from

v(LSA)

= 28 dB;

− 250 − ms

20 mV (RMS) + 10 dB to
20 mV (RMS); bit DLCI = 0

VCC=3V; G

= 20 mV (RMS) + 10 dB

V

LSAI

t>t

att

voltage gain adjustment range bits (VOL0, VOL1, VOL2)

v(LSA)

= 28 dB;

− 0.5 5 %

− 21 − dB

from (0, 0, 0) to (1, 1, 1)

voltage gain adjustment step VOL0 from 0 to 1 − 3 − dB

bit SWCn = 0 700 −− kΩ

SWIn and GND when not
selected

SWIn and GND when selected

2mA<I
bit SWCn = 1

SWIn

< 20 mA;

−−30 Ω

Serial interface (pins DATA, CLK and EN)

V
V
I
C

IH
IL

bias

i

HIGH-level input voltage 2.3 − VCC+ 0.4 V
LOW-level input voltage VCC= 3 to 5.5 V GND − 0.4 − 0.3V
input bias current input level = HIGH 1 2 5 µA
input capacitance at pins

DATA, CLK and EN

1999 Feb 17 25

CC

V

− 4 − pF

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

SERIAL BUS TIMING CHARACTERISTICS

V

= 3.3 V; T

CC

SYMBOL PARAMETER MIN. MAX. UNIT

Serial programming clock; pin CLK

f

clk

Enable programming; pin EN

t

START

t

END

t

W(min)

t

SU;EN

Serial data; pin DATA

t

SU;DATA

t

HD;DATA

=25°C; unless otherwise specified.

amb

clock frequency 0 300 kHz

delay to falling clock edge 1 −µs
delay from last rising clock edge 0.1 −µs
minimum inactive pulse width 1.5 −µs
enable set-up time to next clock edge 0.1 −µs

input data to clock set-up time 2 −µs
input data to clock hold time 2 −µs

handbook, full pagewidth

t

CLK

DATA

EN

t

SU;DATA

D5 D4 AD1 AD0

t

START

HD;DATA

1/f

clk

Fig.16 Serial bus timing diagram.

t

SU;EN

t

END

t

W

MGK716

1999 Feb 17 26

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d

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1999 Feb 17 27

V

LN

book, full pagewidth

from

microcontroller

V

RXI

C

RXI

220 nF

TEST AND APPLICATION INFORMATION

Philips Semiconductors Product specification

Cordless telephone, answering machine

line interface

I

line

C

line

100 µF

Z

SET

619 Ω

Z

line

600 Ω

C

EMC

10 nF

C
10 µF

TN

SW

BUX86

VCC

V

VCC

TP

DARL

MPSA92

D

SW

1N4148

LN SWI3GND SWI1 EHISWI2

222 2019 21 11

TXI+

18

V

TXI

TXI−

17

I

CC

V

CC

25

674 3

LCC CST REGLVI

C

R

PLD

20 kΩ

LCC

6.8 pF

R

C

22 pF

ON-HOOK
100 kΩ

D
1N4148

CST

PROT

R

LVI

1 MΩ

TN

ON-HOOK

MPSA42

C

LVI

470 pF

UBA1707

C

4.7 µF

DATA12EN13CLK14RXI10RXO

5

AGC9RGL

R

REG

RGL

7.15 kΩ

8

DLC

28

AXI

15

AXO

16

LSAI2

27

LSAI1

26

LSAO

123

SLPE

R
10 Ω

24

LSPGND

SLPE

C

DLC

220 nF

C

AXI

1 µF

C

LSAI2

220 nF

C

LSAI1

220 nF

C

LSAO

220 µF

R

LSAO

16 Ω

V

V

LSAI2

V

LSAI1

AXI

MGK717

UBA1707

Fig.17 Test circuit.

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1999 Feb 17 28

full pagewidth

Philips Semiconductors Product specification

Cordless telephone, answering machine

line interface

a/b

b/a

BRIDGE

4 × BAS11

BOD
BR211-240

Z

SET

619 Ω

C
10 nF

TN

BUX86

(MPSA42

EMC

SW

(1)

(3)

C

VCC

10 µF

)

C

100 nF

C

100 nF

I

CC

V

VCC

TP

DARL

MPSA92

D

SW

1N4148

TXIP

TXIM

TXI+

TXI−

V

R

PLD

20 kΩ

R

ast1

260 kΩ

V

LN

LN SWI2 SWI1 EHISWI3

2192021 11

18

17

CC

25

674 3

LCC CST REGLVI

(4)

C

LCC

6.8 pF

R

ON-HOOK
100 kΩ

C

CST

22 pF

D

PROT

1N4148

R
1 MΩ

LVI

TN

ON-HOOK

MPSA42

C
470 pF

LVI

MICROCONTROLLER

UBA1707

C

(2)

REG

4.7 µF

BZX79C8V2

C

RXI

100 nF

DATA12EN13CLK14RXI10RXO

5

AGC9RGL

R

7.15 kΩ

RGL

DLC28LSPGND

C

DLC

220 nF

R

ast2

3.92 kΩ

C

8

15

16

27

22

26

24

23

RXO

1

SLPE

AXI

AXO

LSAI2

GND

LSAI1

LSAO

Z

R

ast3

392 Ω

C

100 nF

C

C

LSAI2

100 nF

C

LSAI1

100 nF

C
220 µF

bal

R

SLPE

10 Ω

AXI

AXO

LSAO

LSP
16 Ω

MGK718

(1) In case of low line current in voltage regulation mode.
(2) Only required in current regulation mode.
(3) To improve EMC performance; necessary for stability.
(4) To improve stability only in current regulation mode.

UBA1707

Fig.18 Typical application.

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

PACKAGE OUTLINES

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

15

UBA1707

SOT136-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

18.1

7.6

17.7

7.4

0.71

0.30

0.69

0.29

14

w M

b

p

scale

eHELLpQ

1.27

0.050

10.65

10.00

0.419

0.394

1.4

0.055

Q

A

2

A

1

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

detail X

0.25

0.01

(A )

L

p

L

0.25 0.1

0.01

A

3

θ

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

o

8

o

0

OUTLINE
VERSION

SOT136-1

IEC JEDEC EIAJ

075E06 MS-013AE

REFERENCES

1999 Feb 17 29

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

D

c

y

Z

28 15

UBA1707

SOT341-1

E

H

E

A

X

v M

A

pin 1 index

114

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.0

0.21

0.05

1

A2A

1.80

1.65

0.25

b

0.38

0.25

p

cD

0.20

0.09

3

UNIT A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

0 2.5 5 mm

scale

(1)E(1) (1)

10.4

10.0

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

Q

A

2

A

1

detail X

1.03

0.9

0.63

0.7

(A )

L

p

L

0.13 0.10.2

A

3

θ

1.1

0.7

o

8

o

0

OUTLINE
VERSION

SOT341-1 MO-150AH

IEC JEDEC EIAJ

REFERENCES

1999 Feb 17 30

EUROPEAN

PROJECTION

ISSUE DATE

93-09-08
95-02-04

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

UBA1707

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Feb 17 31

Philips Semiconductors Product specification

Cordless telephone, answering machine

UBA1707

line interface

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

(3)(4)
(5)

SOLDERING METHOD

(1)

suitable

suitable
suitable

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Feb 17 32

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

NOTES

UBA1707

1999 Feb 17 33

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

NOTES

UBA1707

1999 Feb 17 34

Philips Semiconductors Product specification

Cordless telephone, answering machine
line interface

NOTES

UBA1707

1999 Feb 17 35

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax.[phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax.[phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax.[phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax.[phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax.[phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax.[phone]
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Tel. [phone], Fax.[phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie BesantRoad, Worli, MUMBAI 400025,
Tel. [phone], Fax.[phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext.2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax.[phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax.[phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax.[phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax.[phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax.[phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax.[phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box2108 MCC,MAKATI,
Metro MANILA, Tel. [phone],Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax.[phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax.[phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax.[phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax.[phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax.[phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax.[phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax.[phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax.[phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax.[phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax.[phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1999 SCA62
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 465002/750/03/pp36 Date of release: 1999 Feb 17 Document order number: 9397 750 04964