Datasheet tza1027 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TZA1027

Analog current buffer for CD-R and
CD-RW systems

Preliminary specification
File under Integrated Circuits, IC01

1999 Sep 17

Philips Semiconductors Preliminary specification

Analog current buffer for CD-R and CD-RW

TZA1027

systems

FEATURES

• Eight amplifiers for servo and power calibration
functions

• Gain selector for CD-R and CD-RW discs

• Separate dataamplifier for read speed up to thirty times

nominal data speed.

GENERAL DESCRIPTION

The TZA1027 is an analog current buffer IC for CD-R and
CD-RW systems with a 3-spot push-pull tracking system.
The IC interfaces directly to the photo diodes and
TZA1020. A HF current amplifier is implemented to detect
the actual HF data signal.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
I

i(cd)

I

i(sd)

B
t

d(f)

G

T

DD

CAHF

SS

amb

supply voltage 4.5 5.0 5.5 V
central diode input current WRON = 1 0 − 3400 µA
satellite diode input current WRON = 1 0 − 520 µA
bandwidth Ci= 5 pF 72 −−MHz
flatness delay Ci= 5 pF; f = 0.1 to 32 MHz − 30 200 ps
servo satellite detector gain HG = 1 − 32 −

HG=0 − 8 −

ambient temperature 0 − 70 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TZA1027HL LQFP32 plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm SOT401-1

1999 Sep 17 2

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

BLOCK DIAGRAM

handbook, full pagewidth

A1

A2

B1

B2

TZA1027

TZA1027

237

A1LF

282

A2LF

246

B1LF

273

B2LF

C1

C2

C3

C4

n.c.

PDWN

WRON

HG

1

8

5

4

9, 10, 11, 12,
17, 20, 32

21
31

GAIN

SELECTOR

30

16

V

DDA

+

15 13 14

V

AGND

DDD

DGND

29

C1LF

22

C2LF

25

C3LF

26

C4LF

19

CAHF

18

HFGND

MGR881

Fig.1 Block diagram.

1999 Sep 17 3

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

PINNING

SYMBOL PIN DESCRIPTION

C1 1 central photo diode current input
A2 2 satellite diode current input
B2 3 satellite diode current input
C4 4 central photo diode current input
C3 5 central photo diode current input
B1 6 satellite diode current input
A1 7 satellite diode current input
C2 8 central photo diode current input
n.c. 9 not connected
n.c. 10 not connected
n.c. 11 not connected
n.c. 12 not connected
AGND 13 analog ground
DGND 14 digital ground
V

DDD

V

DDA

n.c. 17 not connected
HFGND 18 ground connection of CAHF output stage
CAHF 19 central aperture high-frequency output
n.c. 20 not connected
PDWN 21 digital input power-down
C2LF 22 C2 central detector signal output
A1LF 23 A1 satellite detector signal output
B1LF 24 B1 satellite detector signal output
C3LF 25 C3 central detector signal output
C4LF 26 C4 central detector signal output
B2LF 27 B2 satellite detector signal output
A2LF 28 A2 satellite detector signal output
C1LF 29 C1 central detector signal output
HG 30 digital input high gain selection
WRON 31 digital input write on gain selection
n.c. 32 not connected

15 digital power supply
16 analog power supply

TZA1027

1999 Sep 17 4

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

handbook, full pagewidth

WRON

n.c.
32

HG

C1LF

31

30

29

A2LF
28

B2LF
27

C4LF
26

TZA1027

C3LF
25

C1
A2
B2
C4
C3
B1
A1
C2

1
2
3
4

24
23
22
21

B1LF
A1LF
C2LF
PDWN

TZA1027HL

5
6
7
8

9

n.c.

10
n.c.

11

n.c.

12
n.c.

13

AGND

14

DGND

15

DDD

V

16

DDA

V

20
19
18
17

n.c.
CAHF
HFGND
n.c.

MGR882

Fig.2 Pin configuration.

1999 Sep 17 5

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW

TZA1027

systems

FUNCTIONAL DESCRIPTION

All detector signals are applied to wide-band amplifiers for servo and laser power calibration functions of the TZA1020.
Signals from the central detector are added and amplified to suitable levels for the decoder circuit. Current gain can be
selected for CD-R and CD-RW discs.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETERS MIN. MAX. UNIT

V

DD

T

stg

T

amb

V

es

THERMAL CHARACTERISTICS

supply voltage 0 5.5 V
storage temperature −6.5 +150 °C
ambient temperature 0 70 °C
electrostatic handling:

Machine model −100 +100 V
Human body model −500 +500 V

SYMBOL PARAMETER CONDITION VALUE UNIT

R

th(j-a)

LOGIC FUNCTIONS

Note

1. X = don’t care.

thermal resistance from junction to
ambient

PDWN WRON HG MODE

1 X; note 1 X; note 1 power-down
0 0 0 CD-R read
0 0 1 CD-RW read
0 1 0 CD-R write
0 1 1 CD-RW write

in free air 95 K/W

1999 Sep 17 6

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW

TZA1027

systems

CHARACTERISTICS

V

DDA=VDDD

PDWN = 0; WRON = 0; HG = 0 and C
otherwise specified. Signals available on the IC pins are upper case. Signals not visible on the IC pins are lower case.

SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V

DDA

V

DDD

∆V

DD

I

DDA

I

DDD

Detector inputs

I

NPUT CURRENT RANGE

I

i(cd)

I

i(sd)

I

NPUT VOLTAGE LEVEL

V

i(cd)

V

i(sd)

I

NPUT RESISTANCE

R

i(cd)

R

i(sd)

Transfer functions

=5V; T

amb

=25°C; I

=25µA with x = 1LF to 4LF; I

i(cd)

cd=Csd

= 5 pF; the given maximum and minimum values are 4σvalues; unless

=4µA with y = A or B and z = 1LF or 2LF;

i(sd)

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
difference between

V

and V

DDA

DDD

−0.3 − +0.3 V

analog supply current PDWN = 1 − 0.1 − mA

− 13 − mA

digital supply current PDWN = 1 − 0 − mA

− 14 − mA

central diode input current 1.0 − 75 µA

WRON = 1 0 − 3400 µA

satellite diode input current 0.6 − 9 µA

WRON = 1 0 − 520 µA

central diode input voltage level 2.5 2.9 3.3 V

WRON = 1 2.6 3.0 3.4 V

satellite diode input voltage level 1.6 1.9 2.2 V

WRON = 1 1.7 2.0 2.3 V

central diode input resistance − 420 −Ω

WRON = 1; I

=1mA − 220 −Ω

i(cd)

satellite diode input resistance − 620 −Ω

WRON = 1; I

= 200 µA − 370 −Ω

i(cd)

SERVO OUTPUTS CD
G

cd

servo central detector gain −0.93 −1 −1.07

HG = 1 −2.8 −3 −3.2
WRON = 1 −0.94 −1 −1.06
WRON = 1; HG = 1 −0.93 −1 −1.07

G

mm

B

cd

gain mismatch 3σ−−3%
bandwidth 33 44 − MHz

HG = 1; I

i(cd)

WRON = 1; I
WRON = 1; HG = 1; I

1999 Sep 17 7

=6µA1822−MHz

= 1000 µA 150 230 − MHz

i(cd)

= 250 µA 100 130 − MHz

i(cd)

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW

TZA1027

systems

SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT

t

r

t

d

SERVO OUTPUTS SD
G

SS

B

S

t

r

t

d

DATA OUTPUT; PIN CAHF
G

SS

B

CAHF

t

d(f)

I

n

Output pins

V

o(cd)

V

o(sd)

V

o(CAHF)

R

o(cd)

R

o(sd)

R

CAHF

Digital control signals

rise time WRON = 1; 30 µA<I
delay time WRON = 1;

30 µA<I

< 520 µA

i(cd)

< 520 µA − 2 − ns

i(cd)

− 2.5 − ns

servo satellite detector gain HG = 1 −2.85 −3.05 −3.25

WRON = 0; HG = 0 −0.96 −1.02 −1.08
WRON = 1; HG = 0 −0.88 −0.95 −1.02
WRON = 1; HG = 1 −0.88 −0.95 −1.02

bandwidth HG = 1; I

=1µA24−− MHz

i(cd)

WRON = X; note 1; HG = X; note 1 46 −− MHz
rise time WRON = 1; 4 µA<I
delay time WRON = 1; 4 µA<I

<65 µA − 3.6 − ns

i(cd)

<65 µA − 4.5 − ns

i(cd)

servo satellite detector gain 7.5 8.1 8.7

HG = 1 29 32 35

WRON = 1; HG = X; note 1 − 0 −
bandwidth 80 −− MHz

HG = 1; I

=6µA72−− MHz

i(cd)

flatness delay − 30 200 ps

HG = 1; I

=6µA − 170 − ps

i(cd)

noise current − 1.4 −µA

HG = 1; I

central diode output voltage −0.2 − V
satellite diode output voltage −0.2 − V
data output voltage 1 − V

=6µA − 2 −µA

i(cd)

− 1V

DDD

− 1V

DDD

+ 0.2 V

DDD

central diode output resistance − 1 − MΩ
satellite diode output resistance − 5 − MΩ
data output resistance − 40 − kΩ

INPUT VOLTAGE LEVELS; PINS PDWN, WRON AND HG
V

IL

V

IH

LOW-level input voltage −0.2 − +1.2 V
HIGH-level input voltage 1.8 − V

INPUT CURRENT
I

LI

input leakage current −1 − +1 µA

DELAY TIME
t

d

delay time − 0.3 −µs

Note

1. X = don’t care.

1999 Sep 17 8

DDD

+ 0.2 V

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

I

i(sd)(AC)

V

bias(sd)

I

i(cd)(AC)

V

bias(cd)

50

50

Ω

Ω

+5 V

100 nF

470 kΩ

100 nF

470 kΩ

100 nF

470 kΩ

100 nF

470 kΩ

100 nF

470 kΩ

100 nF

470 kΩ

100 nF

470 kΩ

100 nF

470 kΩ

3.3 kΩ

3.3 kΩ

3.3 kΩ

3.3 kΩ

3.3 kΩ

3.3 kΩ

3.3 kΩ

3.3 kΩ

3.9
pF

3.9
pF

3.9
pF

3.9
pF

3.9
pF

3.9
pF

3.9
pF

3.9
pF

PDWN

WRON

A1

A2

B1

B2

C1

C2

C3

C4

HG

1

8

5

4

21

31

30

GAIN

SELECTOR

TZA1027

+

237

282

246

273

29

22

25

26

19

18

A1LF

A2LF

B1LF

B2LF

C1LF

C2LF

C3LF

C4LF

CAHF

HFGND

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω

4.7 kΩ

50 Ω
1 kΩ

TZA1027

+5 V

16

V

DDA

+5 V

Fig.3 Test diagram.

1999 Sep 17 9

15 13 14

V

DDD

AGND

DGND

MGR883

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

handbook, full pagewidth

+12 V

A1

A2

B1

B2

C1

TZA1027

A1LF

237

A2LF

282

B1LF

246

B2LF

273

C1LF

1

29

SA1

SA2

SB1

SB2

C1

4

8

5

9

10

TZA1020

TZA1027

SAA7399

C2

C3

C4

PDWN

WRON

HG

8

5

4

+

21
31

GAIN

SELECTOR

30

16 15 13 14

V

DDA

+5 V

V

DDD

AGND

22

25

26

19

18

DGND

C2LF

C3LF

C4LF

CAHF

HFGND

C2

C3

C4

3

6

7

to block

SAA7392

decoder/
encoder

MGR884

Fig.4 Application diagram.

1999 Sep 17 10

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

PACKAGE OUTLINE

LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm

c

y

X

24

25

17

Z

16

E

A

TZA1027

SOT401-1

e

pin 1 index

32

1

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

1.60

A

1A2A3bp

0.15

1.5

1.3

0.25

0.05

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

w M

b

p

D

H

D

cE

0.27

0.18

0.17

0.12

9

8

Z

D

B

0 2.5 5 mm

(1) (1)(1)

D

5.1

4.9

w M

b

p

v M

v M

scale

(1)

eH

H

5.1

4.9

0.5

7.15

6.85

D

E

A

B

H

E

E

7.15

6.85

A

A

LL

p

0.75

1.0

0.45

2

A

1

detail X

Z

D

0.2

0.12 0.1

0.95

0.55

(A )

3

L

p

L

Zywv θ

E

0.95

0.55

o

7

o

0

θ

OUTLINE
VERSION

SOT401-1

IEC JEDEC EIAJ

REFERENCES

1999 Sep 17 11

EUROPEAN

PROJECTION

ISSUE DATE

95-12-19
97-08-04

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

SOLDERING
Introduction to soldering surface mount packages

Thistextgives a very brief insight to a complextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wavesoldering is notalways suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screenprinting,stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling)vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

TZA1027

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• Forpackageswithleadson four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

During placement and before soldering, thepackage must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A
mildly-activated flux will eliminate the need for removal of
corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Sep 17 12

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW

TZA1027

systems

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

(3)(4)
(5)

SOLDERING METHOD

(1)

suitable

suitable
suitable

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Sep 17 13

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

NOTES

TZA1027

1999 Sep 17 14

Philips Semiconductors Preliminary specification

Analog current bufferforCD-R and CD-RW
systems

NOTES

TZA1027

1999 Sep 17 15

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Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

68

Printed in The Netherlands 545002/01/pp16 Date of release: 1999 Sep 17 Document order number: 9397 750 04724