Fig. 2: Correlation between maximum average
power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal
resistances heatsink + contact.
P (W)Tcase ( C)
7
6
5
4
3
2
1
0
020406080100120140
=180
o
Tamb ( C)
o
o
Rth = 0 C/W
o
5C/W
o
10 C/W
o
15 C/W
o
-110
-115
-120
-125
2/4
Page 3
TYN606 TYN1006
Fig. 3: Average on-state current versus case tem-
perature.
I(A)
T(AV)
7
6
5
4
3
2
1
0
0 102030405060708090100110120130
=180
o
Tcase ( C)
DC
o
Fig. 5: Relative variation of gate trigger current
versus junction temperature.
Fig. 4: Relative variation of thermal impedance
versus pulse duration.
Zth/Rth
1
Zth(j-c)
0.1
0.01
1E-31E-21E-11E+01E+11E+2 5E+2
Zth(j-a)
tp(s)
Fig. 6: Non repetitive surge peak on-state current
versus number of cycles.
Fig. 7: Non repetitive surge peak on-state current
forasinusoidalpulsewithwidth: t ≤ 10ms, andcorresponding value of I
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