Product specification
File under Integrated Circuits, IC02
1996 Dec 17
Page 2
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
FEATURES
• Complete 1.4 GHz single-chip system
• Adaptive DC/DC converter driver output
• On-board tuning amplifier output
• Varicap drive disable
• Four NPN open-collector output ports (10 mA)
• Four bus-controlled bidirectional ports
(NPN open-collector outputs)
• In-lock detector
• 5-step Analog-to-Digital Converter (ADC)
• Mixer/Oscillator (M/O) band-switch output
• 15-bit programmable divider
• Programmable reference divider ratio
(512, 640 or 1024)
• Programmable charge-pump current (50 or 250 µA)
2
C-bus format
• I
– Address plus four data bytes transmission
(write mode)
– Address plus one status byte transmission
(read mode)
– Four independent addresses
• Low power, low radiation.
TSA5523M
An output is provided to control a Philips mixer/oscillator IC
controlled by bits P7, P5 and P4. Depending on the
reference divider ratio (512, 640 or 1024), the phase
comparator operates at 3.90625, 6.25 or 7.8125 kHz with
a 4 MHz crystal.
The lock detector bit FL is set to logic 1 when the loop is
locked and is read on the SDA line (status byte) during a
read operation. The ADC is available for digital AFC
control. The ADC code is read during a read operation on
2
the I
C-bus. The ADC input is combined with the port P6.
In the test mode, this port is also used as a test output for
f
and f
ref
a DC/DC converter driver connected to the IDC pin to
control the amplitude of an external oscillator followed by
a voltage rectifier.
The voltage rectifier is used to generate the correct tuning
supply voltage to maintain a constant current into the
tuning amplifier. The DC/DC converter driver can be
disabled by setting the IDC pin to V
tuning supply voltage is delivered by a fixed 33 V supply.
(see Table 4). In addition, the circuit includes
div/2
in this event the
CC1
GENERAL DESCRIPTION
The device is a single chip PLL frequency synthesizer
designed for TV and VCR tuning systems. The circuit
consists of a divide-by-eight prescaler with its own
preamplifier, a 15-bit programmable divider, a crystal
oscillator and its programmable reference divider, a
phase/frequency detector combined with a charge-pump
which drives the tuning amplifier, including 33 V output.
Three NPN open-collector outputs are provided for band
switching together with five open-collector NPN outputs.
Four of these ports can also be used as input ports
(one ADC and three general purpose I/O ports).
ORDERING INFORMATION
TYPE
NUMBER
TSA5523M/C1SSOP20plastic shrink small outline package; 20 leads; body width 4.4 mmSOT266-1
NAMEDESCRIPTIONVERSION
Five serial bytes (including address byte) are required to
address the device, select the VCO frequency, program
the ports, set the charge-pump current and set the
reference divider ratio. The device has four independent
I2C-bus addresses which can be selected by applying a
specific voltage on the AS input (see Table 3).
APPLICATIONS
• Multimedia TV tuners and front-ends
• VCR tuners.
PACKAGE
1996 Dec 172
Page 3
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
TSA5523M
synthesizer
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CC1
I
CC1
f
RF
V
iRF
f
XTAL
I
NPN
T
amb
T
stg
supply voltage4.5−5.5V
supply current−2230mA
RF frequency range64−1400MHz
RF input voltage level80 to 150 MHz−25−+3dBm
150 MHz to 1 GHz−28−+3dBm
1 to 1.4 GHz−26−+3dBm
crystal oscillator frequency−4−MHz
NPN open-collector output
−1015mA
current
operating ambient temperature−20−+85°C
IC storage temperature−40−+150°C
CP10NPN open-collector I/O port
P011Port 0 NPN open-collector I/O port
P112Port 1 NPN open-collector I/O port
P213Port 2 NPN open-collector I/O port
P314Port 3 NPN open-collector output
P615Port 6 NPN open-collector
GND16ground
BS17band-switch output to
RF218RF signal input 2
RF119RF signal input 1
V
CC1
9tuning voltage output
output/ADC input
mixer/oscillator driver
20supply voltage (+5 V)
handbook, halfpage
XTAL
1
AS
2
SDA
3
SCL
4
P4
5
TSA5523M
P5
6
P7
7
8
IDC
V
9
tune
CP
10
MGG746
Fig.2 Pin configuration.
TSA5523M
V
20
CC1
19
RF1
18
RF2
17
BS
16
GND
P6
15
P3
14
P2
13
P1
12
P0
11
1996 Dec 175
Page 6
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
FUNCTIONAL DESCRIPTION
The device is controlled via the two-wire I2C-bus.
For programming, there is one module address (7 bits)
and the R/W bit for selecting the read or the write mode.
Write mode: R/
After the address transmission (first byte), data bytes can
be sent to the device. Four data bytes are needed to fully
program the device. The bus transceiver has an
auto-increment facility which permits the programming of
the device within one single transmission
(address + 4 data bytes).
The device can also be partially programmed providing
that the first data byte following the address is Divider
Byte 1 (DB1) or Control Byte (CB). The meaning of the bits
in the data bytes is given in Table 1.
Table 1 I2C-bus data format
W=0(see Table 1)
TSA5523M
The first bit of the first data byte transmitted indicates
whether frequency data (first bit = 0) or control and ports
data (first bit = 1) will follow. Until an I
condition is sent by the controller, additional data bytes
can be entered without the need to re-address the device.
The frequency register is loaded after the 8th clock pulse
of the second Divider Byte (DB2), the control register is
loaded after the 8th clock pulse of the control byte and the
ports register is loaded after the 8th clock pulse of the
Ports Byte (PB).
2
C-bus address selection
I
The module address contains programmable address bits
(MA1 and MA0) which offer the possibility of having
several synthesizers (up to 4) in one system by applying a
specific voltage to the AS input. The relationship between
MA1 and MA0 and the input voltage on the AS input is
given in Table 2.
MA1 and MA0programmable address bits (see Table 3)
N14 to N0programmable divider bits N = N14 × 2
14+213
+ ... + N1 × 2+N0
CPcharge-pump current
CP = 050 µA
CP = 1250 µA
T2, T1 and T0test bits; normal operation; T2 = 0, T1 = 0, T0 = 1 (see Table 4)
RSA and RSBreference divider ratio select bits (see Table 5)
OStuning amplifier control bit
OS = 0normal operation; tuning voltage is ON
OS = 1tuning voltage is OFF (high impedance), IDC output voltage is LOW
P7 to P0NPN open-collector control bits
Pn = 0output n is OFF
Pn = 1output n is ON
1996 Dec 176
Page 7
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
Table 3 Address selection
INPUT VOLTAGE APPLIED TO PIN ASMA1MA0
0 V to 0.1V
open-circuit or 0.2V
0.4V
0.9V
Table 4 Test bits
T2T1T0DEVICE OPERATION
001normal mode
01Xcharge-pump is OFF
110charge-pump is sinking
111charge-pump is sourcing
100f
101f
Table 5 Ratio select bits
RSARSBREFERENCE DIVIDER
Table 6 Band-switch output levels
P7P5P4
1100.25 Vband A
1010.4V
0110.8V
111 V
CC1
to 0.3V
CC1
CC1
to 0.6V
to V
CC1
CC1
CC1
CC1
current
current
is available on P6 output
ref
is available on P6 output
div/2
X0640
011024
11512
OUTPUT
VOLTAGE
ON PIN BS
CC1
CC1
CC1
all other codesV
CC1
PHILIPS M/O
IC’s BAND
band B
band C
band C
band C
TSA5523M
00
01
10
11
Read mode: R/W=1(see Table 7)
Data can be read out of the device by setting the R/W bit
to logic 1. After the slave address has been recognized,
the device generates an acknowledge pulse and the first
data byte (status byte) is transferred on the SDA line
(MSB first). Data is valid on the SDA line during a HIGH
level of the SCL clock signal. A second data byte can be
read out of the device if the processor generates an
acknowledge on the SDA line (master acknowledge).
End of transmission will occur if no master acknowledge
occurs. The device will then release the data line to allow
the processor to generate a STOP condition. When Ports
P0 to P2 are used as inputs, the corresponding bits must
be logic 0 (high-impedance state). The Power-On Reset
flag (POR) is set to logic 1 at power-on. It is reset when an
end-of-data is detected by the device (end of a read
sequence). Control of the loop is made possible with the
in-lock flag FL (FL = 1) which indicates when the loop is
locked. The bits I2, I1 and I0 represent the status of the I/O
Ports P2, P1 and P0 respectively.
A logic 0 indicates a LOW level and a logic 1 indicates a
HIGH level (see threshold level in the “Characteristics”).
A built-in ADC is available on pin P6. This converter can be
used to feed AFC information to the controller from the IF
section of the television. The relationship between bits
A2, A1 and A0 is given in Table 9.
At power-on, the device is reset as follows: all ports are set
to the high-impedance state, except P4, P5 and P7 which
are set to logic 1. The tuning amplifier is in the
high-impedance state (OS = 1). The POR level is fixed to
3 × V
(2.1 V typ.). If V
BE
circuit is reset.
goes below the POR level the
CC1
1996 Dec 177
Page 8
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
TSA5523M
synthesizer
Table 7 Read data format
BYTEMSB
(1)
Address Byte (ADB)11000MA1MA01A
Status Byte (SB)PORFLI2I1I0A2A1A0−
Notes
1. MSB is transmitted first.
2. A: Acknowledge.
Table 8 Explanation to Table 7
SYMBOLDESCRIPTION
PORpower-on reset flag (POR = 1 at power-on)
FLin-lock flag (FL = 1 when the loop is phase-locked)
I2, I1 and I0digital levels for I/O ports P2, P1 and P0 respectively
A2, A1 and A0digital outputs of the 5-level ADC
tuning voltage outputsee Fig.3−0.3+40V
band-switch output voltage−0.3V
CC1
serial clock input voltage−0.3+6V
serial data input/output voltage−0.3+6V
data output current−1+5mA
address selection input voltage−0.3V
crystal input voltage−0.3V
CC1
CC1
IC storage temperature−40+150°C
maximum junction temperature−+150°C
short-circuit time every pin to V
or GND−10s
CC1
V
V
V
V
V
V
handbook, halfpage
3
I
max
(mA)
2
1
0
020408060
Fig.3 Rating power on V
1996 Dec 179
output pin.
tune
V
tune
MGG751
(V)
Page 10
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
TSA5523M
synthesizer
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling bipolar devices.
Every pin withstands the ESD test in accordance with
Every pin withstands the EDS test in accordance with Philips Semiconductors Machine Model 0 Ω, 200 pF (200 V).
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-a
thermal resistance from junction to ambient in free air120K/W
CHARACTERISTICS
= 4.5 to 5.5 V; T
V
CC1
= −20 to +85 °C; see note 1; unless otherwise specified.
Fig.5 Prescaler Smith chart (S11) of typical input impedance (ZL=50Ω; pin 2).
APPLICATION INFORMATION
Tuning amplifier
The tuning amplifier is able to drive the varicap voltage
without an external transistor. The V
output must be
tune
connected to an external load of 27 kΩ connected to the
tuning voltage supply. Figures 6 and 7 illustrate a possible
loop filter. The component values depend on the oscillator
characteristics and the selected reference frequency.
1
MGG753
Crystal oscillator
The crystal oscillator uses a 4.0 MHz crystal in series with
an 18 pF capacitor. The crystal operates in the series
resonance mode. The connection to V
is preferred, but
CC1
it can also be connected to GND.
1996 Dec 1713
Page 14
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
handbook, full pagewidth
P0
P1
P2
P3
P6
BS
RF
RF
+5 V
10 nF
1 nF
1 nF
GND
V
P0
P1
P2
P3
P6
BS
RF2
RF1
CC1
V
tune
11
12
13
14
15
TSA5523M
16
17
18
19
201
18 pF
4 MHz
10 nF
100 nF
CP
10
V
tune
9
IDC
8
P7
7
6
5
4
3
2
P5
P4
SCL
SDA
AS
XTAL
UHF
VHFH
VHFL
SCL
SDA
AS
27 kΩ
2.2 nF
27 kΩ
22 kΩ
BAV99
10 nF
200 kΩ
10 nF
33 nF
220 pF
4.7 nF
2 nF
1 mH
BC847
TSA5523M
1 mH
56 Ω
33 nF
MGG749
+5 V
handbook, full pagewidth
P0
P1
P2
P3
P6
BS
RF
RF
+5 V
Fig.6 Typical application with DC/DC converter.
V
tune
10 nF
100 nF
4 MHz
CP
10
V
tune
9
IDC
8
P7
7
P5
6
P4
5
SCL
4
SDA
3
AS
2
XTAL
MGG750
10 nF
1 nF
1 nF
GND
V
P0
P1
P2
P3
P6
BS
RF2
RF1
CC1
11
12
13
14
15
TSA5523M
16
17
18
19
201
18 pF
27 kΩ
2.2 nF
27 kΩ
+33 V
+5 V
UHF
VHFH
VHFL
SCL
SDA
AS
Fig.7 Standard application.
1996 Dec 1714
Page 15
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
handbook, full pagewidth
XTAL
SDA
SCL
1
2
AS
3
4
5
P4
1 kΩ
1 kΩ
3 kΩ
1 kΩ
V
CC1
V
CC1
AS
V
CC
V
CC
V
CC1
TSA5523M
TSA5523M
20
V
CC1
V
to prescaler
V
ref
V
CC1
CC1
19
RF1
V
CC1
18
RF2
V
CC1
17
BS
16
GND
V
V
6
P5
7
P7
8
IDC
9
V
tune
10
CP
CC1
V
CC1
CONTROL
DOWN
UP
V
CC1
V
CC1
V
CC1
CC1
×4
V
CC1
V
CC1
V
CC1
V
CC1
V
CC1
V
CC1
V
CC1
V
CC1
15
P6
14
P3
13
P2
12
P1
11
P0
Fig.8 Input/output pin schematic.
1996 Dec 1715
MGG748
Page 16
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
20
D
c
y
Z
11
E
H
TSA5523M
SOT266-1
A
X
v M
E
A
pin 1 index
110
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNITA1A
mm
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
1.5
0.1501.4
1.2
2
A3b
0.25
p
0.32
0.20
p
cD
0.20
6.6
0.13
6.4
02.55 mm
scale
(1)E(1)
eHELLpQZywv θ
4.5
0.651.00.2
4.3
6.6
6.2
Q
A
2
A
1
detail X
0.65
0.75
0.45
0.45
(A )
L
p
L
A
3
θ
0.130.1
0.48
0.18
(1)
o
10
o
0
OUTLINE
VERSION
SOT266-1
IEC JEDEC EIAJ
REFERENCES
1996 Dec 1716
EUROPEAN
PROJECTION
ISSUE DATE
90-04-05
95-02-25
Page 17
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SSOP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering isnot recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
(order code 9398 652 90011).
TSA5523M
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Dec 1717
Page 18
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
TSA5523M
synthesizer
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
1996 Dec 1718
Page 19
Philips SemiconductorsProduct specification
1.4 GHz I2C-bus controlled multimedia
synthesizer
NOTES
TSA5523M
1996 Dec 1719
Page 20
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands537021/1200/01/pp20 Date of release: 1996 Dec 17Document order number: 9397 750 01313
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