Datasheet TISP4260M3LM, TISP4400M3LM, TISP4300M3LM, TISP4350M3LM, TISP4080M3LM Datasheet (Power Innovations)

...
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TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,

device symbol

LMF PACKAGE
(LM PACKAGE WITH FORMED LEADS)
(TOP VIEW)
NC - No internal connection on pin 2
NC
T(A)
R(B)
MD4XAKB
1 2 3
LM PACKAGE
(TOP VIEW)
NC - No internal connection on pin 2
NC
T(A)
R(B)
MD4XAT
1 2 3
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999Copyright © 1999, Power Innovations Limited, UK
TELECOMMUNICATION SYSTEM MEDIUM CURRENT OVERVOLTAGE PRO TECTORS
4 kV 10/700, 100 A 5/310 ITU-T K20/21 rating
Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge
V
DEVICE
‘4070 58 70 ‘4080 65 80 ‘4095 75 95 ‘4125 100 125 ‘4145 120 145 ‘4165 135 165 ‘4180 145 180 ‘4220 160 220 ‘4240 180 240 ‘4260 200 260 ‘4300 230 300 ‘4350 275 350 ‘4400 300 400
Rated for International Surge Wave Shapes
WAV E SHAP E STANDARD
2/10 µs GR-1089-CORE 300 8/20 µs IEC 61000-4-5 220
10/160 µs FCC Part 68 120 10/700 µs 10/560 µs FCC Part 68 75
10/1000 µs GR-1089-CORE 50
Low Differential Capacitance . . . 43 pF max.
DRM
V
ITU-T K20/21
FCC Part 68
V
(BO)
V
I
TSP
A
100
T
R
Terminals T and R correspond to the alternative line designators of A and B
Ordering Information
DEVICE TYPE PACKAGE TYPE
TISP4xxxM3LM Straight Lead DO-92 Bulk Pack TISP4xxxM3LMR Straight Lead DO-92 Tape and Reeled TISP4xxxM3LMFR Formed Lead DO-92 Tape and Reeled
SD4XAA

description

These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning flash disturbances whic h ar e ind uc ed or co ndu cte d on to the telephone li ne. A single device provides 2-point protection and is typically u sed for the protec tion of 2 -wire tel ecommunicatio n equipment (e.g. between the Ring to Tip wires for telephones and modems). Combinations of devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground).
PRODUCT INFORMATION
Information is current as of publication date. Produc ts conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters.
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding cu rrent prevents d.c. latchup as the diverted current subsides.
1
Page 2
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
)
TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999
description (continued
This TISP4xxxM3LM range consis ts of thirteen voltage variants to meet various maximum system voltage levels (58 V to 300 V). They are guaranteed to voltage limit and withstand the listed intern ational lightning surges in both polar ities. Th ese protec tion devices are su pplied i n a DO-92 (LM) cylin drical plastic package. The TISP4xxxM3LM is a straight lead DO-92 supplied in bulk pack and on tape and reeled. The TISP4xxxM3LMF is a formed lead DO-92 supplied only on tape and reeled.
T
absolute maximum ratings,
Repetitive peak off-state voltage, (see Note 1)
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape) 300 8/20 µs (IEC 61000-4-5, combination wave generator, 1.2/50 voltage, 8/20 current) 220 10/160 µs (FCC Part 68, 10/160 µs voltage wave shape) 120 5/200 µs (VDE 0433, 10/700 µs voltage wave shape) 110
0.2/310 µs (I3124, 0.5/700 µs voltage wave shape) 100 5/310 µs (ITU-T K20/21, 10/700 µs voltage wave shape) 100 5/310 µs (FTZ R12, 10/700 µs voltage wave shape) 100 5/320 µs (FCC Part 68, 9/720 µs voltage wave shape) 100 10/560 µs (FCC Part 68, 10/560 µs voltage wave shape) 75 10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape) 50
Non-repetitive peak on-state current (see Notes 2, 3 and 5)
20 ms (50 Hz) full sine wave
16.7 ms (60 Hz) full sine wave
1000 s 50 Hz/60 Hz a.c. Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 100 A di Junction temperature T Storage temperature range T
= 25°C (unless otherwise noted)
A
RATING SYMBOL VALUE UNIT
‘4070 ‘4080 ‘4095 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4260 ‘4300 ‘4350 ‘4400
V
DRM
I
TSP
I
TSM
/dt 300 A/µs
T
J
stg
± 58 ± 65
± 75 ±100 ±120 ±135 ±145 ±160 ±180 ±200 ±230 ±275 ±300
30 32
2.1
-40 to +150 °C
-65 to +150 °C
V
A
A
NOTES: 1. See Applications Information and Figure 10 for voltage values at lower temperatures.
2. Initially the TISP4xxxM3LM must be in thermal equilibrium with T
3. T he surge may be repeated after the TISP4xxxM3LM returns to its initial conditions.
4. See Applications Information and Figure 11 for current ratings at other temperatures.
5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wir ing track widths. See Figure 8 for the current ratings at other durations. Derate current v alues at -0.61%/°C for ambient temperatures above 25 °C
= 25°C.
J
PRODUCT INFORMATION
2
Page 3
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999
electrical characterist ics for the T and R terminals, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
DRM
V
(BO)
V
(BO)
I
(BO)
V
T
I
H
dv/dt I
D
C
off
Repetitive peak off­state current
Breakover voltage dv/dt = ±750 V/ms, R
V
= ±V
D
DRM
SOURCE
= 300
dv/dt≤±1000 V/µs, Linear voltage ramp, Impulse breakover voltage
Maximum ramp value = ±500 V
di/dt = ±20 A/µs, Linear current ramp,
Maximum ramp value = ±10 A
Breakover current dv/dt = ±750 V/ms, R
SOURCE
= 300
On-state voltage IT=±5A, tW= 100 µs ±3 V Holding current IT= ±5 A, di/dt = +/-30 mA/ms ±0.15 ±0.6 A Critical rate of rise of off-state voltage
Linear voltage ramp, Maximum ramp value < 0.85V Off-state current VD=±50V TA = 85°C ±10 µA
Off-state capacitance
f = 100 kHz, V
f = 100 kHz, V
f = 100 kHz, V
f = 100 kHz, V
f = 100 kHz, V
=1V rms, VD=0,
d
=1V rms, VD=-1V
d
=1V rms, VD=-2V
d
=1V rms, VD=-50V
d
=1V rms, VD= -100 V
d
(see Note 6)
TA = 25°C T
A
DRM
‘4070 thru ‘4095 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4070 thru ‘4095 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4070 thru ‘4095 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4070 thru ‘4095 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4125 thru ‘4220 ‘4240 thru ‘4400
= 85°C
‘4070 ‘4080 ‘4095 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4260 ‘4300 ‘4350 ‘4400 ‘4070 ‘4080 ‘4095 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4260 ‘4300 ‘4350 ‘4400
±0.15 ±0.6 A
±5 kV/µs
86 60 54 80 56 50 74 52 46 36 26 20 20 16
±5 ±10 ±70 ±80 ±95
±125 ±145 ±165 ±180 ±220 ±240 ±260 ±300 ±350 ±400
±78 ±88
±102 ±132 ±151 ±171 ±186 ±227 ±247 ±267 ±308 ±359 ±410
110
80
70
96
74
64
90
70
60
47
36
30
30
24
µA
V
V
pF
NOTE 6: To avoid possible voltage clipping, the ‘4125 is tested with V
PRODUCT INFORMATION
=-98V.
D
3
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TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

thermal characteristics

PARAMETER
EIA/JESD51-3 PCB, I
= 25 °C, (see Note 7)
T
R
Junction to free air thermal resistance
θ
JA
A
265 mm x 210 mm populated line card, 4-layer PCB, I
TEST CONDITIONS
= I
T
TSM(1000)
= I
T
TSM(1000)
, TA = 25 °C
,
MIN TYP MAX UNIT
120
°C/W
57
NOTE 7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.

PARAMETER MEASUREMENT INFORMATION

+i
I
TSP
Characteristic
I
TSM
I
T
V
T
I
H
V
I
DRM
DRM
-v
V
D
I
D
I
D
V
D
Quadrant I
Switching
V
DRM
V
(BO)
I
(BO)
I
DRM
+v
I
(BO)
V
Quadrant III
Switching
Characteristic
Figure 1. VOLTAGE-CURRENT CHARACTERISTIC FOR T AND R TERMINALS
I
H
V
(BO)
T
I
T
I
TSM
I
TSP
-i
ALL MEASUREMENTS ARE REFERENCED TO THE R TERMINAL
PMXXAAB
PRODUCT INFORMATION
4
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100
NORMALISED BREAKOVER VOLTAGE
vs
JUNCTION TEMPERATURE
TJ - Junction Temperature - °C
-25 0 25 50 75 100 125 150
Normalised Breakover Voltage
0.95
1.00
1.05
1.10
TC4MAF
NORMALISED HOLDING CURRENT
vs
JUNCTION TEMPERATURE
TJ - Junction Temperature - °C
-25 0 25 50 75 100 125 150
Normalised Holdi ng Current
0.4
0.5
0.6
0.7
0.8
0.9
1.5
2.0
1.0
TC4MAD
10
0·1
| - Off-State Current - µA
D
|I
0·01
1
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
OFF-STATE CURRENT
vs
JUNCTION TEMPERATURE
VD = ±50 V
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

TYPICAL CHARACTERISTICS

TCMAG
0·001
-25 0 25 50 75 100 125 150 TJ - Junction Temperature - °C
Figure 2. Figure 3.
ON-STATE CURRE NT
100
TA = 25 °C
70
t
W
50 40
30 20
15 10
7 5
- On-State Current - A
T
4
I
3 2
1.5 1
0.7 1.5 2 3 4 5 7110
ON-STATE VOLTAGE
= 100 µs
'4125 THRU '4220
'4240 THRU '4400
VT - On-State Voltage - V
Figure 4. Figure 5.
vs
'4070 THRU '4095
TC4MAJ
PRODUCT INFORMATION
5
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TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

TYPICAL CHARACTERISTICS

NORMALISED CAPACI T ANCE
vs
OFF-STATE VOLTAGE
1
0.9
0.8
0.7
= 0
D
0.6
0.5
0.4
0.3
Capacitance Normalised to V
0.2
0.5 1 2 3 5 10 20 30 50 100150
'4070 THRU '4095
'4125 THRU '4220
'4240 THRU '4400
VD - Off-state Voltage - V
TJ = 25°C
= 1 Vrms
V
d
Figure 6. Figure 7.
TC4MAK
DIFFERENT I AL O FF-STATE CAPACI T ANCE
vs
RATED REPETITIVE PEAK OFF-STATE VOLTAGE
50
'4070
'4080
45
40
35
30
C - Differential Off-State Capa citance - pF
∆∆
25
50 60 70 80 90 150 200 250 300100
V
- Repetitive Peak Off-State Voltage - V
DRM
'4095
'4125
'4145
∆∆∆∆C = C
'4165
'4180
off(-2 V)
'4220
- C
'4260
'4240
off(-50 V)
TC4MAL
'4300
'4350
'4400
PRODUCT INFORMATION
6
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TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
THERMAL I MP E DANCE
vs
POWER DURATI ON
t - Power Duration - s
0·1 1 10 100 1000
Z
θ
θθ
θ
JA(t)
- Transient Thermal Impedance - °C/W
4
5
6
7
8
9
15
20
30
40
50
60
70
80
90
150
10
100
TI4MAG
I
TSM(t)
APPLIED FOR TIME t
EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB T
A
= 25 °C
IMPULSE RATING
vs
AMBIENT TEMPERATURE
TA - Ambient Temperature - °C
-40-30-20-100 1020304050607080
Impulse Current - A
40
50
60
70
80
90
100
120
150
200
250
300
400
IEC 1.2/50, 8/20
ITU-T 10/700
FCC 10/560
BELLCORE 2/10
BELLCORE 10/1000
FCC 10/160
TC4MAA
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

RATING AND THERMAL INFORMATION

NON-REPETITIVE PEAK ON -S T ATE CURRENT
vs
30
20 15
10
CURRENT DURATION
V
= 600 Vrms, 50/60 Hz
GEN
= 1.4*V
R
GEN
EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB
= 25 °C
T
A
9 8 7
6 5
4 3
GEN
/I
TSM(t)
TI4MAF
TISP4240M3LM THRU TISP4400M3LM
NOVEMBER 1997 - REVISED APRIL 1999
- Non-Repetitive Peak On-State Current - A 2
TSM(t)
I
1.5 0·1 1 10 100 1000
t - Current Duration - s
Figure 8. Figure 9.
V
DERATING FACTOR
DRM
vs
MINIMUM AM BI ENT TEMPERAT URE
1.00
0.99 '4125 THRU '4220
0.98
0.97
0.96
Derating Factor
0.95
0.94
0.93
PRODUCT INFORMATION
'4070 THRU '4095
'4240 THRU '4400
-35 -25 -15 -5 5 15 25-40 -30 -20 -10 0 10 20 T
- Minimum Ambient Temperature - °C
AMIN
Figure 10. Figure 11.
TI4MAH
7
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TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
Th3
Th2
Th1
TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

APPLICATIONS INFORMATION

deployment

These devices are two terminal overvoltage prote ctors. They may be used either singly to limit the voltage between two conductors (Figure 12) or in multiples to limit the voltage at several points in a circuit (Figure 13).
Th1
Figure 12. TWO POINT PROTECTION Figure 13. MULTI-POINT PROTECTION
In Figure 12, protector Th1 limits the maximum voltage between the two conductors to ±V configuration is nor mall y used to protect ci rcuits withou t a ground reference, such as modems. In Figure 1 3, protectors Th2 and Th3 lim it the maximum voltage be tween each cond uctor and ground to the ±V individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1 is not required.

impulse testing

To verify the wit hstand capabil ity and safety of the equipment , standards require that the equipm ent is test ed with various impulse wave forms. The table below shows some common values.
PEAK VOLTAGE
STANDARD
GR-1089-CORE
FCC Part 68 (March 1998)
I3124 1500 0.5/700 37.5 0.2/310 100 0 ITU-T K20/K21 † FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K21 10/700 impulse generator
SETTING
V
2500 2/10 500 2/10 300 1000 10/1000 100 10/1000 50 1500 10/160 200 10/160 120 2x5.6
800 10/560 100 10/560 75 3 1500 9/720 † 37.5 5/320 † 100 0 1000 9/720 † 25 5/320 † 100 0
1500 4000
VOLTAGE
WAVE FORM
µs
10/700
PEAK CURRENT
VALUE
A
37.5 100
CURRENT
WAVE FORM
µs
5/310 100 0
TISP4xxxM3
25 °C RATING
A
SERIES
RESISTANCE
11
(BO)
(BO)
. This
of the
(BO)
If the impulse generator current exceeds the protectors current rating then a series resistance can be used to reduce the curren t to the prot ectors rat ed value and so prevent possible failure. The required value of se rie s resistance for a given waveform is given by the following calculations. First, the minimum total circuit impedance is found by dividing the impulse generators peak voltage by the protectors rated current. The impulse generators fictive impedance (generators pea k voltage divided by peak shor t circuit current) is then subtracted from the minimum total circuit impedance to give the required value of series resistance.
For the FCC Part 68 10/560 waveform the following values result. The minimum total circ uit impedance is 800/75 = 10.7Ω and the generators fictive impedance is 800/100 = 8Ω. This gives a minimum series resistance value of 10.7 - 8 = 2.7Ω. After allowing for tolerance, a 3Ω ±10% resistor would be sui table. The 10/160 waveform needs a standard resistor value of 5.6Ω per conductor. These would be R1a and R 1b in
PRODUCT INFORMATION
8
Page 9
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999
Figure 15 and Figure 16. FCC Part 68 allows the equipment to be non-operational after the 10/160 (conductor to ground) and 10/560 (inter-co nductor) impu lses. The series r esistor value may be reduced to zero to pass FCC Part 68 in a non- operational mode e.g. Fi gure 14. In som e cas es th e equipme nt w ill req uire verifi catio n over a temperature range. By using the rated waveform values from Figure 11, the appropriate series resistor value can be calculated for ambient temperatures in the range of -40 °C to 85 °C.

a.c. power testing

The protector can withstan d currents applied for times not exceeding thos e shown in Figure 8 . Currents tha t exceed these times must be terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent protection devices which can be used to reduce the current fl ow. Protective fuses may range from a few hundred milliamperes to o ne ampere. In some cases it may be necessa ry to add some extra seri es resistance to prevent the fuse opening dur ing impulse testing. The current versus time cha racteristic of the overcurrent protector must be below the line shown in Figure 8. In some ca ses there may be a further time limit imposed by the test standard ( e.g. UL 1459 wiring simulator failure).

capacitance

The protector characteristic off-state capacitance values are given for d.c. bias voltage, VD, values of 0, -1 V,
-2 V and -50 V. Where possible values are al so gi ven for -100 V. Values for other voltages may be calculate d by multiplying the V essentially independent of frequency. Above 10 MHz the effective capacitance is strongly dependent on connection inducta nce. In many applications, such as Figur e 15 and Figure 17, the typic al conductor bias voltages will be about -2 V a nd -50 V. Figure 7 shows the differential (line u nbalance) capacitanc e c aus ed by biasing one protector at -2 V and the other at -50 V.
= 0 capacitance value by the factor given in Figure 6. Up to 10 MHz th e capacit ance is
D

normal system voltage levels

The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as r inging without the line connected , some degree of clipping is per missible. Under this condition about 10 V of clipping is normally possible without activating the ring trip circuit.
Figure 10 allows the calculation of the protector V value should not be less than the maximum nor mal system voltages. The TISP4260M3LM, wi th a V 200 V, can be used for the protection of ring generators producing 100 V rms of ring on a battery voltage of
-58 V (Th2 and Th3 in Figure 17). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. Howev er, this is the open circuit voltage and the connec tion of the line and its equipment will reduce the pe ak voltage. In the extreme case of an unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature when the V value. Figure 10 shows that this condition will occur at an ambient temperature of -28 °C. In this example, the TISP4260M3LM will allow normal equipment operation provided that the minimum expected ambient temperature does not fall below -28 °C.
value at temperatures below 25 °C. The calculated
DRM
has reduced to 190/2 00 = 0.95 of its 25 °C
DRM

JESD51 thermal measurement method

To standardise thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m cube which contains the test PCB (Printed Ci rcuit Board) horizontally mou nted at the centre. Part 3 of the standard (JESD51-3, 199 6) defines two test PCB s for surface mount components; one for packages smaller than 27 mm on a side and the other for packages up to 48 mm. The LM package measur ements used the smaller 76.2 mm x 114.3 mm (3.0 “ x 4.5 “) PCB. The JESD51-3 PCBs are designe d to have low effective thermal co nductivity ( high ther mal resis tance) and rep resent a worse c ase condition. The PCBs us ed in the majority of appli cations will achieve lower values of ther mal resistance and so can dissi pate higher power levels than indicated by the JESD51 values.
DRM
3
(1 ft3)
of
PRODUCT INFORMATION
9
Page 10
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

typical circuits

TIP
WIRE
RING WIRE
FUSE
TISP4350
OR
TISP4400
MODEM
RING DETECTOR
HOOK SWITCH
D.C. SINK
SIGNAL
AI6XBM
TIP
WIRE
RING WIRE
R1a
Th1
R1b
Th3
Th2
PROTECTED
EQUIPMENT
E.G. LINE CARD
Figure 14. MODEM INTER-WIRE PROTECTION Figure 15. PROTECTION MODULE
R1a
Th3
Th1
Th2
R1b
D.C.
SIGNAL
AI6XBL
Figure 16. ISDN PROTECTION
AI6XBK
TIP
WIRE
RING WIRE
OVER-
CURRENT
PROTECTION
R1a
R1b
RING/TEST
PROTECTION
Th3
Th1
Th2
TEST
RELAY
S1a
S1b
TEST
EQUIP-
MENT
RING
RELAY
S2a
S2b
RING
GENERATOR
Figure 17. LINE CARD RING/TEST PROTECTION
SLIC
RELAY
S3a
S3b
SLIC
PROTECTION
Th4
Th5
TISP6xxxx,
TISPPBLx,
½TISP6NTP2
C1
220 nF
SLIC
V
BAT
AI6XBJ
PRODUCT INFORMATION
10
Page 11
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,

device symbolization code

Devices will be coded as below.
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

MECHANICAL DATA

DEVICE
TISP4070M3 4070M3 TISP4080M3 4080M3 TISP4095M3 4095M3 TISP4125M3 4125M3 TISP4145M3 4145M3 TISP4165M3 4165M3 TISP4180M3 4180M3 TISP4220M3 4220M3 TISP4240M3 4240M3 TISP4260M3 4260M3 TISP4300M3 4300M3 TISP4350M3 4350M3 TISP4400M3 4400M3
SYMOBLIZATION
CODE

carrier information

Devices are shipped in one of the carriers below. A reel contains 2 000 devices.
PACKAGE TYPE CARRIER ORDER #
Straight Lead DO-92 Bulk Pack TISP4xxxM3LM Straight Lead DO-92 Tape and Reeled TISP4xxxM3LMR Formed Lead DO-92 Tape and Reeled TISP4xxxM3LMFR
PRODUCT INFORMATION
11
Page 12
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

MECHANICAL DATA

LM002 (DO-92) 2-pin cylindrical plastic package
This single-in-lin e package consists of a circui t mounted on a lead frame an d encapsulated with in a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. .
LM002 Package (DO- 92)
5,21 4,44
3,43 MIN.
2,67 2,03
2,20 MAX.
0,56 0,40
1,40 1,14
2
1 3
5,34 4,32
12,7 MIN.
4,19 3,17
2,67 2,03
A
0,41 0,35
2
3 1
VIEW A
2,67 2,41
ALL LINEAR DIMENSIONS IN MILLIMETERS
PRODUCT INFORMATION
12
MD4XARA
Page 13
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

MECHANICAL DATA

LM002 (DO-92) - Formed Leads V ersion 2-pin cylindrical plastic package
This single-in-line package c onsists of a circuit mounted on a lead frame and encapsulated withi n a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LMF002 (DO-92) - Formed Leads Version of LM002
5,21 4,44
3,43 MIN.
2,67 2,03
2,20 MAX.
0,56 0,40
2,90 2,40
2
1 3
5,34 4,32
4,00 MAX.
2,90 2,40
4,19 3,17
2,67 2,03
A
3 1
0,41 0,35
2
VIEW A
ALL LINEAR DIMENSIONS IN MILLIMETERS
PRODUCT INFORMATION
MD4XASA
13
Page 14
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

MECHANICAL DATA

tape dimensions
LM002 Package (Straight Lead DO-92) Tape LM002 Tape Dimensions Conform to
13,70 11,70
32,00 23,00
27,68 17,66
11,00
8,50
Adhesive Tape on Reverse
Side - Shown Dashed
2,50 MIN.
3,14 2,14
VIEW A
5,48 4,68
13,00 12,40
the Requirements of EIA-468-B
Body Indent Visible
0,50 0,00
9,75 8,50
19,00
5,50
φφφφ
19,00 17,50
4,30 3,70
Flat of DO-92 Body Towards Reel Axis
Tape Section
Shown in
View A
Direction of Feed
ALL LINEAR DIMENSIONS IN MILLIMETERS
MD4XAPC
PRODUCT INFORMATION
14
Page 15
tape dimensions
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM,
TISP4240M3LM THRU TISP4400M3LM
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999

MECHANICAL DATA

LMF002 Package (Formed Lead DO-92) Tape LMF002 Tape Dimensions Conform to
13,70 11,70
32,00 23,00
27,68 17,66
Adhesive Tape on Reverse
16,53 15,50
Side - Shown Dashed
11,00
8,50
2,50 MIN.
5,28 4,88
4,21 3,41
13,00 12,40
the Requirements of EIA-468-B
9,75 8,50
VIEW A
Body Indent Visible
0,50 0,00
19,00
5,50
φφφφ
19,00 17,50
4,30 3,70
Flat of DO-92 Body
Towards Reel Axis
Tape Section
Shown in
View A
Direction of Feed
ALL LINEAR DIMENSIONS IN MILLIMETERS
MD4XAQC
PRODUCT INFORMATION
15
Page 16
TISP4070M3LM THRU TISP4095M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
NOVEMBER 1997 - REVISED APRIL 1999
IMPORTANT NOTICE
Power Innovations Limited (PI) re se rves the r ig ht t o make chan g es t o it s pr od uc ts o r t o di sc ont inu e any s em ic o nduc t or p r o duct or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard w arr anty. Testing and other quality cont rol tec hn iqu es are uti li z ed to the exten t PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
PI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORISED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1999, Power Innovations Limited
PRODUCT INFORMATION
16
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