Datasheet tea6811v DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA6810V; TEA6811V

Front-end and PLL synthesizers for
car radios

Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC01

1996 Jun 18

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

FEATURES

• Synthesizer function which includes a Voltage
Controlled Oscillator (VCO), dividers, phase detector,
charge-pump and in-lock detector

• FM mixer with AGC

• AM RF amplifier with AGC

• AM mixer.

APPLICATIONS

• Car radios.

GENERAL DESCRIPTION

The TEA6810V and TEA6811V, together with TEA6821V
forms an AM/FM receiving concept for electronically tuned
car radios.

The TEA681xV is an FM/AM front-end with one local
synthesized oscillator for both AM and FM which is used
together with the TEA6821T in a double-conversion
concept. It delivers a first FM-IF of 72.2 MHz and, for
MW/LW, a first AM-IF of 10.7 MHz.

TEA6810V; TEA6811V

Minimum alignments are required due to wideband RF
inputs and the common AM/FM VCO.

High dynamic behaviour and minimum distortion is
obtained by a special RF input design combined with AGC.
High sensitivity is possible in combination with RF input
FETs.

Minimum interference is experienced due a to special
synthesizer loop design and ensuring that the I
inoperative in the locked-tuned condition.

The reference frequency for the synthesizer and the
I2C-bus information is delivered by the TEA6821V.

The programmable local/dx switch enables switching the
gain of the FM mixer from normal AGC control (FM dx) to
the forced 4th level of AGC (FM local).

2

C-bus is

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA1

V

CCA2

V

AMant

V

FMant

f

AMant

f

FMant

T

amb

analog supply voltage (pin 2) 4.75 5.0 5.25 V
analog supply voltage (pin 13) 8.1 8.5 8.9 V
AM AGC range see Fig.4 0.3 − 6.0 V
FM AGC range see Fig.5 10 − 600 mV
AM input frequency 0.144 − 22 MHz
FM input frequency 60 − 108 MHz
operating ambient temperature −40 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TEA6810V VSO40 plastic very small outline package; 40 leads SOT158-1
TEA6811V VSO40 plastic very small outline package; 40 leads; face down SOT158-2

1996 Jun 18 2

1996 Jun 18 3

n

dbook, full pagewidth

BLOCK DIAGRAM

car radios

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

V

TUNE

CHPOUT

LCKDET

V

CCA2

AGND2

OSCFDB

OSCGND

36 35 37 38 34 32 30 31 11 12 33 27 28 25 24 26

AM/FM

OSCILLATOR

39

CHARGE

40

3

13
14

PUMP

LOCK

DETECTOR

AGND1

f

refNfrefPVCCA1

V

CCOSC

OSCTNK IPIDIO FMRFIP

FMAGC

ref

PIN DIODE

DRIVER

BUFFER

BUFFER

PROGRAMME

DIVIDER N1

n.c. n.c. n.c. n.c. SCL SDA

FMRFIN

FMIFON

I2C-BUS CONTROLPHASE DETECTOR

FMIFOP

FM

AM/FM

N2

FMAGCC

DGND

AMAGCC

V

CCD

AMPREC

AM/FM

AM

159845201023172761

AMMON

AMMOP

AMSB2

AM RF

TEA6810V
TEA6811V

16 21 29

AMPREI

AMSB1

AM/FM

AM/FM

BAND

GAP

AMMGND RFGND

22

18

19

AMPREO

AMMIN

V

ref

MGE727

TEA6810V; TEA6811V

Fig.1 Block diagram.

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

PINNING

(1)

SYMBOL

TEA6810 TEA6811

AGND1 1 1 analog ground 1
V

CCA1

LCKDET 3 3 lock detector flag
SDA 4 4 serial data input/output; I
SCL 5 5 serial clock input; I
f

refN

f

refP

DGND 8 8 digital ground
V

CCD

n.c. 10 10 not connected
FMIFON 11 11 FM mixer negative output (72.2 MHz)
FMIFOP 12 12 FM mixer positive output (72.2 MHz)
V

CCA2

13 13 analog supply voltage 2 (+8.5 V)
AGND2 14 14 analog ground 2
AMMOP 15 15 AM mixer positive output (10.7 MHz)
AMMON 16 16 AM mixer negative output (10.7 MHz)
n.c. 17 17 not connected
AMMIN 18 18 AM mixer RF input
V

ref

19 19 reference voltage output from AM band gap
n.c. 20 20 not connected
AMMGND 21 21 AM mixer ground
AMPREO 22 22 AM preamplifier output
n.c. 23 23 not connected
AMSB1 24 24 AM feedback switch SB1
AMSB2 25 25 AM feedback switch SB2
AMPREI 26 26 AM preamplifier input
AMAGCC 27 27 AM AGC capacitor
AMPREC 28 28 AM preamplifier decoupling capacitor
RFGND 29 29 RF ground
FMRFIP 30 30 RF positive input for FM mixer
FMRFIN 31 31 RF negative input for FM mixer
IPIDIO 32 32 pin diode drive
FMAGCC 33 33 FM AGC integrating capacitor
FMAGC

ref

34 34 FM AGC reference voltage
OSCFDB 35 35 oscillator feedback input
OSCGND 36 36 oscillator ground
OSCTNK 37 37 oscillator tank output

PIN

DESCRIPTION

2 2 analog supply voltage 1 (+5 V)

2

C-bus

2

C-bus
6 6 reference frequency input from TEA6821 N-terminal
7 7 reference frequency input from TEA6821 P-terminal

9 9 digital supply voltage (+5 V)

1996 Jun 18 4

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

(1)

SYMBOL

V

CCOSC

V

TUNE

CHPOUT 40 40 charge pump output

Note

1. Pins 10, 17, 20 and 23 should be connected to a common ground.

TEA6810 TEA6811

38 38 oscillator supply voltage (+8.5 V)
39 39 tuning voltage

PIN

TEA6810V; TEA6811V

DESCRIPTION

1996 Jun 18 5

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

handbook, halfpage

AGND1

V

LCKDET

FMIFON
FMIFOP

V

AGND2
AMMOP
AMMON

AMMIN

CCA1

SDA

SCL

f

refN

f

refP

DGND

V

CCD

n.c.

CCA2

n.c.

V

ref

n.c.

1
2
3
4
5
6
7
8
9

10

TEA6810V

11
12
13
14
15
16
17
18
19
20

MGE725

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

CHPOUT
V

TUNE

V

CCOSC

OSCTNK
OSCGND
OSCFDB

FMAGC

FMAGCC
IPIDIO
FMRFIN
FMRFIP
RFGND
AMPREC
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
AMPREO
AMMGND

ref

handbook, halfpage

OSCGND

FMAGC

FMAGCC

AMAGCC

AMPREO

AMMGND

CHPOUT

V

TUNE

V

CCOSC

OSCTNK

OSCFDB

ref

IPIDIO
FMRFIN
FMRFIP

RFGND

AMPREC

AMPREI

AMSB2
AMSB1

n.c.

TEA6810V; TEA6811V

MGE726

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20

AGND1
V

CCA1

LCKDET
SDA
SCL
f

refN

f

refP

DGND
V

CCD

n.c.
FMIFON
FMIFOP
V

CCA2

AGND2
AMMOP
AMMON
n.c.
AMMIN
V

ref

n.c.

40
39
38
37
36
35
34
33
32
31

TEA6811V

30
29
28
27
26
25
24
23
22
21

Fig.2 Pin configuration (TEA6810).

1996 Jun 18 6

Fig.3 Pin configuration (TEA6811).

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

I2C-BUS ORGANIZATION

The TEA6810V; TEA6811V is controlled via the I2C-bus which is driven from the TEA6821V. For programming purposes
a module address and four data bytes are required. When used partially, the transmission must be ended by a stop
condition.

Table 1 Bit organization

START

S byte 0 A byte 1 A byte 2 A byte 3 A byte 4 A P

Table 2 I

BYTES TO

RECEIVED

(4 BYTES)

Byte 1
program
divider N1
(Low byte)

Byte 2
program
divider N1
(High byte)

Byte 3
switching

Byte 4
testing

MODULE

ADDRESS

2

C-bus address and received bytes

BE

(1)

(1)

MSB LSB

11000100

S7 S6 S5 S4 S3 S2 S1 S0

S15 S14 S13 S12 S11 S10 S9 S8

MSB in-lock

counter

1 = 3-state
0 = normal

charge pump

PROGRAMMABLE

DIVIDER DATA

LSB in-lock

counter

1=f

div

0 = LCKDET

1 = HIGH

0 = LOW

current

tuning

oscillator

1 = test

0 = normal

in-lock

counter

SWITCH

CONTROL

BUS ADDRESS

1 = HIGH

0 = LOW

current
charge

pump

(2)

X

TEST STOP

1=FM

local

0 = FM dx

XX X X

MSB

divider

N2

LSB dividerN21=FM

0=AM

Notes

1. N1 divider ratio is (N + 2); where N is the programmed binary number composed of bytes 1 and 2. For the minimum
ratio; if N < 2048 then N1 divider ratio is {2048 + (N − 2)}.

2. X = don’t care.

Table 3 N2 divider

N2 DIVIDER MSB LSB

300

501
10 1 0
15 1 1

1996 Jun 18 7

Table 4 In-lock

IN-LOCK MSB LSB AM/FM

800FM
16 1 0 AM or FM
32 1 1 AM or FM
48 0 0 AM
64 0 1 AM

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CCA1

V

CCA2

V

CCD

V

CCOSC

P

tot

T

stg

V

es

Note

1. Machine model: equivalent to discharging a 200 pF capacitor through 0 Ω.

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.

analog supply voltage (pin 2) −0.3 12 V
analog supply voltage (pin 13) −0.3 12 V
digital supply voltage (pin 9) −0.3 12 V
oscillator supply voltage (pin 38) −0.3 12 V
maximum power dissipation − 0.55 W
storage temperature −65 +150 °C
electrostatic handling note 1 −300 +300 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 90 K/W

DC CHARACTERISTICS

V

13=V38

= 8.5 V; V9=V2= 5.0 V; T

=25°C; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

I

CCA1

analog input current (pin 2) AM mode 7 9 mA

FM mode 6 8 mA

I

CCA2

analog input current (pin 13) AM mode 17 22 mA

FM mode 15 18 mA

I

CCOSC

oscillator input current (pin 38) AM mode 4 6 mA

FM mode 6 8 mA

I

CCD

digital input current (pin 9) AM mode 32 35 mA

FM mode 27 30 mA

I

AMMO

AM mixer output current (pins 15 and 16) AM mode 8.5 − mA

FM mode 0 − mA

I

FMIFO

FM mixer output current (pins 11 and 12) AM mode 0 − mA

FM mode 10 − mA

1996 Jun 18 8

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

AC CHARACTERISTICS

All voltage and current values are RMS values; noise values are unweighted within the bandwidth 0.03 to 20 kHz;
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

AM signal channel; (note 1; see Fig.4)

PREAMPLIFIER STAGE

RF
Z

21

AGC STAGE; FI2=1MHZ
V

i2

I

AGCsink

I

AGCsource

MIXER (fO= 10.7 MHZ)
R

i

C

i

C

o

G

mC

∆G

mC

IP

3

CP −1 dB compression point 114
V

n(eq)

OSCILLATOR/N2 DIVIDER
R

N2

R

EFERENCE VOLTAGE (PIN 19)

V

o

Z

o

I

o(max)

transimpedance 40 65 − kΩ

HF input voltage AGC start level 1 − 750 − mV

AGC start level 2 − 850 − mV
AGC stop level 1 − 145 − mV

AGC stop level 2 − 170 − mV
AGC sink current V18=V19+ 0.5 V; V27=V
AGC source current V18=V19- 0.5 V; V27=V

input resistance between pins

19

19

− 1 −µA

− 2 − mA

(2)

15

20 − kΩ

18 and 21
input capacitance between

− 5 − pF

pins 18 and 21
output capacitance between

−− 5

(2)

pF

pins 15 and 16
conversion transconductance

(I15to I16/V18to V

19

variation in conversion

2.4 2.75 3.1 mS

−−0.005 − mS/K

transconductance
third-order intermodulation 130

(2)

137 − dBmV

(2)

120 − dBmV

equivalent input noise voltage − 9 − nV/√Hz

internal divider ratio (N2) set by I2C-bus; see Table 3 − 15 −

− 10 −

− 5 −

− 3 −

output reference voltage − 2.75 − V
output impedance − 40 −Ω
maximum output current −− 0.1 mA

1996 Jun 18 9

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

FM signal channel (note 3; see Fig.5)

MIXER
R

i

input resistance between
pins 30 and 31

C

i

input capacitance between
pins 30 and 31

R

o

output resistance between
pins 11 and 12

C

o

output capacitance between
pins 11 and 12

G

m

T variation in transconductance

∆G

m

transconductance I11to I12/V30to V31<V

I

to I12/V30to V31<V

11

I

to I12/V30to V31<V

11

I

to I12/V30to V31>V

11

<VAGC1 −−0.015 − mS/K

AGC1
AGC2
AGC3
AGC3

with temperature

F noise figure

f

= 72.2 MHz; PLL tuned − 7

i

(both sidebands)

IP

3

third-order intermodulation 135

CP −1 dB compression point 120

α

IF1

V

AGC(S)

1st IF rejection 25
AGC start voltage between

pins 30 and 31

start level 1 4.8 6.2 7.8 mV

start level 2 − 15 − mV

start level 3 − 39 − mV

V

AGC(H)

AGC hysteresis voltage hysteresis level 1 − 1 − mV

hysteresis level 2 − 2 − mV

hysteresis level 3 − 3 − mV

R

33

I

pin

V

pin

FM AGC output resistance − 5 − kΩ
pin diode current V32 = 1.4 V 4 −−mA
start level pin diode voltage

Io=1mA − 57 − mV
between pins 30 and 31

OSCILLATOR
f

osc

∆f

/∆T oscillator temperature

osc

oscillator frequency 116.8 − 207 MHz

dependence

(2)

1.65

3.4

2 − kΩ

(2)

4 4.5

(2)

pF

10 −−kΩ

6.5

(2)

89

(2)

pF

5.5 6.3 6.9 mS

− 4.7 − mS

− 2.3 − mS

− 1.0 − mS

(2)

(2)

139 − dBmV

(2)

127 − dBmV

(2)

30 − dB

− dB

−−90 − 10−6/K

1996 Jun 18 10

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

SYNTHESIZER (see Fig.6)

Reference frequency input (pins 6 and 7)

V

ref(p-p)

t

trans

f

ref

Phase detector/charge pump

I

OL

I

OH

V

OL

V

OH

I

oz

∆f

r(p-p)

t

lock

reference frequency input

− 0.4 − V
voltage (V6to V7)
(peak-to-peak value)

reference frequency transition

−− 50 ns
time

input reference frequency for: tuning step (kHz) N2

FM 50 −−50 − kHz
AM standard SW1 5 10 − 50 − kHz
AM full-band MW (USA) 10 5 − 50 − kHz
FM 25 −−25 − kHz
AM full-band SW1 5 5 − 25 − kHz
AM standard MW/LW 1 15 − 15 − kHz
AM full-band MW/LW 3 5 − 15 − kHz
AM full-band SW2 5 3 − 15 − kHz
FM 10 −−10 − kHz
AM standard SW1 1 10 − 10 − kHz
AM full-band MW/LW 1 5 − 5 − kHz
AM full-band SW1 1 5 − 5 − kHz
AM full-band SW2 1 3 − 5 − kHz

LOW level output charge

V40= 4 V 120 175 215 µA

pump current
HIGH level output charge

V40= 4 V 0.85 1 1.2 mA

pump current
LOW level tuning voltage at

IO= 0.5I

; V13= 8.5 V 0.2 − 8.25 V

charge

charge pump LOW
HIGH level tuning voltage at

IO= 0.5Icharge; V13 = 8.5 V 0.4 − 8.0 V

charge pump HIGH
3-state output current V40=4V −5 − +5 nA
residual FM frequency

(peak-to-peak value)

B = 300 Hz to 20 kHz;
I

charge=IOL

; fi= 100 MHz

− 916

(2)

Hz

lock time FM = 88 to 108 MHz − 2 − ms

FM = 108 to 88 MHz − 2 − ms
AM = 510 to 1710 kHz − 2 − ms
AM = 1710 to 510 kHz − 2 − ms

1996 Jun 18 11

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Programmable divider

N

min

N

max

DR divider ratio for: tuning step (kHz) N2

In-lock detector (reset by any start condition on I2C-bus)

V

OH

V

OL

t

d

Notes

1. fi1= 1053 kHz; f

2. Not measured 100% in production.

3. Vi1= 1 mV; fi1= 98 MHz; f

minimum programmable ratio − 2050 −
maximum programmable ratio − 65537 −

FM 50 − 2050 − 3 604
FM 25 − 6388 − 7208
FM 10 − 15970 − 18020
FM 5 − 31940 − 36040
AM standard MW/LW 1 15 10844 − 12420
AM standard SW1 5 10 3320 − 4140
AM standard SW1 1 10 16600 − 20700
AM full-band MW/LW 3 5 10448 − 10973
AM full-band MW/LW 1 5 31344 − 32920
AM full-band SW1 5 5 6700 − 8240
AM full-band SW1 1 5 33500 − 41200
AM full-band SW2 5 3 8240 − 10640
AM full-band SW2 1 3 41200 − 53200
AM full-band MW (USA) 10 5 3172 − 3292

in-lock HIGH level output

4.0 − 5.0 V
voltage (pin 3)

in-lock LOW level output

0 − 0.4 V

voltage (pin 3)
in-lock delay counter length = N − N ×1⁄

= 400 Hz; m = 0.3; Vi1=Vi2= 1 mV; N2 divider switched to divide-by-15.

mod

= 1 kHz; ∆f=±22.5 kHz.

mod

fref

− ms

1996 Jun 18 12

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

50 Ω

handbook, full pagewidth

50

Ω

1 nF

BB515

10
kΩ

V

i1

20 kΩ50 Ω

8.5 V

50
nH

4.7 nF

10 kΩ

10 kΩ

33 µF

1.5 µF

V

CCOSC

1.8 pF

2.7 pF

20

kΩ

V

22

26

24

25

28

27
29

38

37

OSCILLATOR

35

36

o1

AM
RF

AGC

AM/FM

10 nF

50

Ω

18 19

AM

V

i2

AM/FM

1 mH

TEA6810V
TEA6811V

N2

AM/
FM

2

AM/

FM

I C BUS

CONTROL

V

BAND

GAP

ref

TEA6810V; TEA6811V

33 µF

21

16

15

V

13

CCA2

12

1:1

200

Ω

22
nF

33 µH

100nF33

µF

V

o2

8.5 V

V

TUNE

V

CCD

100 nF

Fig.4 AM test circuit.

1996 Jun 18 13

9845

10 kΩ

10 kΩ

5 V

SDA SCL

MLB828

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

handbook, full pagewidth

f

i1

1 nF

75

Ω

V

o3

50 Ω

50

Ω

V

8.5 V

BB515

10
kΩ

V

o2

V

TUNE

i1

1 Ω

50
nH

100 nF

50 Ω

V

CCOSC

1.6 pF

2.7 pF

33
29

31

30

34
32

38

37

35

36

AGC

FM

PIN
DIODE
DRIVE

BUFFER

AM/FM

OSCILLATOR

2

I C BUS

CONTROL

TEA6810V
TEA6811V

AM/FM

TEA6810V; TEA6811V

11

12

13

14

V

CCA2

56
pF

100nF33

µF

1 mH

1 kΩ

V

o1

8.5 V

9845

V

CCD

10 kΩ

100 nF

10 kΩ

5 V

Fig.5 FM test circuit.

1996 Jun 18 14

MLB829

SDA SCL

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

handbook, full pagewidth

V

1 nF

2.2
kΩ

12
nF

BB515

V

120 nF

3.6
kΩ

CCOSC

8.5 V

1.8 pF

50

2.7 pF

nH

1 Ω

o1

10
kΩ

3.3
nF

38

37

35

36

39

40

OSCILLATOR

TEA6810V
TEA6811V

AM/FM

CHARGE

PUMP

2

I C BUS

CONTROL

BUFFER

PROGRAM

DIVIDER

N1

PHASE

DETECTOR

LOCK

DETECTOR

TEA6810V; TEA6811V

V

2

CCA1

13

14

1

8 pF

1.2 kΩ

1.2 kΩ

5 V

V

iref

0.4 V (p p)

9845

V

CCD

10 kΩ

100 nF

10 kΩ

5 V

SDA SCL

Fig.6 Synthesizer test circuit.

1996 Jun 18 15

3

MLB830

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

AGND1

V

LCKDET

DGND

V

FMIFON

CCA1

SDA

SCL

f

refN

f

refP

CCD

n.c.

1

2

3

4

5
6

7
8

9

10
11

TEA6810V
TEA6811V

TEA6810V; TEA6811V

40

CHPOUT

39

V

TUNE

38

V

CCOSC

37

OSCTNK

36

OSCGND

35

OSCFDB

34

FMAGC

ref

33

FMAGCC

32

IPIDIO

FMIFOP

V

CCA2

AGND2

AMMOP
AMMON

n.c.

AMMIN

V

n.c.

ref

12

13
14

15
16

17

18

19

20

31

30
29

28

27

26
25
24
23
22

21

MGE728

FMRFIN

FMRFIP
RFGND

AMPREC

AMAGCC

AMPREI
AMSB2
AMSB1
n.c.
AMPREO

AMMGND

Fig.7 Internal pin configuration.

1996 Jun 18 16

1996 Jun 18 17

d

6.4

MHz

47 pF

1 kΩ

470 kΩ

100 kΩ

12 pF

150 nF

CTC

RTC

V

RS

MR

O8

O7

O9

DD

9

10

11

12

HEF4060B

13

14

15

16

12.5 kHz

100 Ω

book, full pagewidth

APPLICATION INFORMATION

car radios

DGND

V

CCA1VCCD

LCKDET

SDA
SCL

47 µF

V

SS

8

O3

7

O6

6

O4

5

O5

4

O13

3

O12

2

O11

1

kHz

50

1 kΩ

1 kΩ

FMOUT

AMOUT

AMMIN

1 kΩ

TR4

47 kΩ

TR3

ANZAC

TP103

ANZAC

TP103

TR2
TR1

220 nF
22 kΩ

1 kΩ

10 nF

50 Ω

100 nF

4.7
nF

4.7
nF

4.7
nF

4.7
nF

1 mH

10 kΩ

10 kΩ

1 kΩ

1 kΩ

100 Ω

100 Ω

100 nF

100 Ω

100 Ω

47 µF

1 mH

47
µF

1

2

3

4

5

6

7

8

9

10

TEA6810V
TEA6811V

11

12

13

14

15

16

17

18

19

20

47
µF

V

CCA2

1 mH

47
µF

12 nF

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

3.3 nF

10 kΩ

100 nF

1.8 pF

50 nH

2.7 pF

120 nF

1 nF

1 nF

20 kΩ

10 kΩ

10 kΩ

5 kΩ

120 nF

50 Ω

47 µF

2.2 µF

10 µF

3.6 kΩ

1 pF

2.2 kΩ

1 nF

50 kΩ

120 nF

ANZAC

TP101

1 kΩ
1 kΩ

MGE729

V

TUNE

OSCTNK

FMAGC

FMAGCC

IPIDIO

FMIN

AMAGCC
AMPREI

AMSB2

AMSB1

AMPREO

ref

TEA6810V; TEA6811V

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

Fig.8 Test board diagram.

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

PACKAGE OUTLINES

VSO40: plastic very small outline package; 40 leads

D

y

Z

40

TEA6810V; TEA6811V

SOT158-1

E

c

H

E

21

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT A1A2A

mm

inches

Notes

1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

2.70

0.11

0.3

0.1

0.012

0.004

2.45

2.25

0.096

0.089

3

0.25

0.010

b

0.42

0.30

0.017

0.012

p

0.22

0.14

0.0087

0.0055

(1)E(2)

cD

15.6

15.2

0.61

0.60

20

w M

b

p

scale

eHELLpQywv θ

7.6

0.762 2.25

7.5

0.30

0.03 0.089

0.29

12.3

11.8

0.48

0.46

Q

A

2

A

1

1.7

1.5

0.067

0.059

detail X

1.15

0.2

1.05

0.045

0.008 0.004

0.041

L

p

L

0.1 0.1

0.004

(A )

A

3

θ

(1)

Z

0.6

0.3

0.024

0.012

o

7

o

0

OUTLINE
VERSION

SOT158-1

IEC JEDEC EIAJ

REFERENCES

1996 Jun 18 18

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-01-24

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

VSO40: plastic very small outline package; 40 leads; face down

D

y

c

Z

40 21

TEA6810V; TEA6811V

SOT158-2

E

H

E

L

L

p

A

X

v M

A

θ

pin 1 index

201

w M

b

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.70

0.11

0.3

0.1

0.012

0.004

2.45

2.25

0.096

0.089

3

0.25

0.010

b

p

0.42

0.30

0.017

0.012

0.22

0.14

0.0087

0.0055

UNIT A1A2A

inches

Note

1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

(1)E(2)

cD

15.6

15.2

0.61

0.60

p

scale

eHELLpQywv θ

7.6

0.762

7.5

0.30

0.03

0.29

12.3

11.8

0.48

0.46

A

2

2.25

0.089

Q

A

1

1.7

1.5

0.067

0.059

detail X

1.15

0.2

1.05

0.045

0.008 0.004

0.041

(A )

0.1 0.1

0.004

3

A

(1)

Z

0.6

0.3

0.024

0.012

o

7

o

0

OUTLINE
VERSION

SOT158-2

IEC JEDEC EIAJ

REFERENCES

1996 Jun 18 19

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-01-24

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all VSO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

TEA6810V; TEA6811V

Wave soldering

Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Jun 18 20

Philips Semiconductors Product specification

Front-end and PLL synthesizers for

TEA6810V; TEA6811V

car radios

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1996 Jun 18 21

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

TEA6810V; TEA6811V

NOTES

1996 Jun 18 22

Philips Semiconductors Product specification

Front-end and PLL synthesizers for
car radios

TEA6810V; TEA6811V

NOTES

1996 Jun 18 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone], Fax. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970),
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel. [phone]/1642, Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 517021/02/pp24 Date of release: 1996 Jun 18 Document order number: 9397 750 00916

Internet: http://www.semiconductors.philips.com/ps/
(1) ADDRESS CONTENT SOURCE April 6, 1998