Datasheet tea1111a DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA1111A

Speech circuit with dialler interface,
regulated supply and earpiece
volume control

Product specification
Supersedes data of 1999 Nov 22
File under Integrated Circuits, IC03

2000 Feb 18

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

FEATURES

• Low DC linevoltage; operates down to 1.5 V (excluding
voltage drop across external polarity guard)

• Line voltage regulator with adjustable DC voltage

• 3.25 V regulated strong supply point for peripheral

circuits compatible with:
– Speech mode
– Ringer mode
– Trickle mode.

• Transmit stage with:
– Microphone amplifier with symmetrical high

impedance inputs

– DTMF amplifier with confidence tone on earpiece.

• Receive stage with:
– Earpiece amplifier with adjustable gain and volume

control.

• MUTE input for pulse or DTMF dialling

• AGC line loss compensation for microphone and

earpiece

• LED control output.

APPLICATIONS

• Line powered telephone sets with LCD module

• Cordless telephones

• Fax machines

• Answering machines.

GENERAL DESCRIPTION

The TEA1111A is a bipolar integrated circuit that performs
all speech and line interface functions required in fully
electronic telephone sets. It performs electronic switching
between speech and dialling. The IC operates at a line
voltage down to 1.5 V DC (with reduced performance) to
facilitate the use of telephone sets connected in parallel.

When the line current is high enough, a fixed amount of
current is derived from the LN pin in order to create a
strong supply point at pin VDD. The voltage at pin VDD is
regulated to 3.25 V to supply peripherals such as dialler,
LCD module and microcontroller.

TEA1111A

QUICK REFERENCE DATA

I

= 15 mA; VEE=0V; V

line

according to test circuits given in Figs 15, 16 and 17; T

VCI

=0V; R

=20Ω; AGC pin connected to VEE; Z

SLPE

=25°C; Tj=25°C for TEA1111AUH; unless otherwise

amb

= 600 Ω; f = 1 kHz; measured

line

specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

line

line current operating range normal operation 11 − 140 mA

with reduced

1 − 11 mA

performance

V

LN

I

CC

V

CC

V

DD

I

DD

G

v(TX)

G

v(QR)

∆G

v(QR)

∆G

v(trx)

∆G

v(trx)(m)

DC line voltage 3.7 4.0 4.3 V
internal current consumption VCC= 3.3 V − 1.15 1.4 mA
supply voltage for internal circuitry (unregulated) IP=0mA − 3.3 − V
regulated supply voltage for peripherals

speech mode I
ringer mode I

= −3 mA 2.95 3.25 3.55 V

DD

= 75 mA 3.0 3.3 3.6 V

DD

available supply current for peripherals −−−3mA
typical voltage gain for microphone amplifier V

= 4 mV (RMS) 43.2 44.2 45.2 dB

MIC

typical voltage gain for earpiece amplifier VIR= 4 mV (RMS) 26.4 27.4 28.4 dB
volume control range for earpiece amplifier 0 14.5 − dB
gain control range for microphone and earpiece

amplifiers with respect to I

=15mA

line

gain reduction for microphone and earpiece

I

=85mA − 6.0 − dB

line

MUTE = LOW − 80 − dB

amplifiers

2000 Feb 18 2

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TEA1111AT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
TEA1111AUH − bare die; on foil −

BLOCK DIAGRAM

handbook, full pagewidth

receive

amplifier

VI

MUTE

4

IR

8

PACKAGE

VOLUME

CONTROL

GARVCI

129

earpiece
amplifier

11

QR

DTMF

MIC+
MIC−

V

EE

AGC

6

ATTENUATOR

13
14

microphone

amplifier

10

5

VI

VI

VI

TEA1111A

AGC

CIRCUIT

0.5V

CC

CURRENT AND

VOLTAGE

REFERENCE

V

DD

REGULATOR

LOW VOLTAGE

CIRCUIT

LED CONTROL

153

16

V

CC

7

V

DD

1

LN

2

FCA051

Fig.1 Block diagram.

2000 Feb 18 3

SLPELEDCREG

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

PINNING

SYMBOL

LN 1 1 positive line terminal
SLPE 2 2 slope (DC resistance) adjustment
REG 3 3 line voltage regulator decoupling
IR 4 4 receive amplifier input
AGC 5 5 automatic gain control/ line loss compensation
DTMF 6 6 dual-tone multi-frequency input
V

DD

MUTE 8 8 mute input to select speech or dialling mode (active LOW)
n.c. − 9 not connected
VCI 9 10 volume control input
V

EE

QR 11 13 earpiece amplifier output
GAR 12 14 earpiece amplifier gain adjustment
MIC+ 13 15 non-inverting microphone amplifier input
MIC− 14 16 inverting microphone amplifier input
LEDC 15 17 LED control output
V

CC

PIN PAD

DESCRIPTION

TEA1111TV TEA1111AUH

7 7 regulated supply for peripherals

10 11, 12 negative line terminal

16 18 supply voltage for internal circuit

handbook, halfpage

LN

SLPE

REG

AGC

DTMF

V

DD

MUTE

IR

1
2
3
4

TEA1111A

5
6
7
8

Fig.2 Pin configuration.

2000 Feb 18 4

FCA052

V

16

CC

LEDC

15
14

MIC−

13

MIC+

12

GAR
QR

11

V

10

EE

VCI

9

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

FUNCTIONAL DESCRIPTION

All data given in this chapter concerns typical values,
except when otherwise specified.

Supply (pins LN, SLPE, REG, VCCand VDD)

The supply for the TEA1111A and its peripherals is
obtained from the telephone line (see Fig.3).

HE LINE INTERFACE (PINS LN, SLPE AND REG)

T
The IC generates a stabilized reference voltage (V

across pins LN and SLPE. V

is temperature

ref

ref

)

compensated and can be adjusted by using an external
resistor (RVA). V

equals 3.8 V and can be increased by

ref

connecting RVA between pins REG and SLPE or
decreased by connecting R

between pins REG and LN.

VA

The voltage at pin REG is used by the internal regulator to
generate V

and is decoupled by C

ref

, which is

REG

connected to VEE. This capacitor, converted to an
equivalent inductance, (see Section “Set impedance”)
determines the set impedance conversion from its DC
value (R

) to its AC value (RCCin the audio-frequency

SLPE

range). The voltage at pin SLPE is proportional to the line
current.

Thepreferredvaluefor R
affect more than the DC characteristics; it also influences
the microphone and DTMF gains, the gain control
characteristics, the sidetone level and the maximum
output swing on the line.

The DC line current flowing into the set is determined by
the exchange supply voltage (V
resistance (R
line (R
currents below I
(generatingV

This means that several sets can operate in parallel with
DC line voltages (excluding the polarity guard) down to an
absolute minimum voltage of 1.5 V. At line currents below
I

low

This is called the low voltage area.

THE INTERNAL SUPPLY POINT (PIN VCC)
The internal circuitry of the TEA1111A is supplied from

pin V
voltage by means of a resistor (RCC) and must be
decoupled by a capacitor C
supply some external circuits.

TEA1111A

is 20 Ω.ChangingR

SLPE

), the feeding bridge

EXCH

), the DC resistance of the telephone

EXCH

) and the reference voltage (V

line

(9 mA), the internal reference voltage

low

)isautomaticallyadjusted to a lower value.

ref

). With line

ref

, the circuit has limited sending and receiving levels.

. This voltage supply is derived from the line

CC

. It may also be used to

VCC

SLPE

will

The voltage at pin LN is:
VLN=V
I

SLPE=Iline

ref+RSLPE

− ICC− IP− I

× I

SLPE

SUP

− I

LEDC

where:

I

= line current

line

ICC= current consumption of the IC
IP= supply current for external circuits
I

= current consumed between LN and VEE by the

SUP

VDD regulator
I

= supply current for external LED circuitry.

LEDC

The VCC voltage (see also Figs 4 and 5) depends on the
current consumed by the IC and the peripheral circuits as:

V

CC0=VLN

VCC=V
Where I

− RCC× I

− RCC× (IP+I

CC0

is the current consumed by the output stage of

rec

CC

rec

)

the earpiece amplifier.

2000 Feb 18 5

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

LED

CIRCUIT

R

EXCH

V

EXCH

R

line

LEDC

CONTROL

LED

I

SLPE

I

LEDC

R

20 Ω

SLPE

I

line

from preamplifier

I

LN

LN

I

SUP

REGSLPE

C

4.7 µF

REGULATOR

REG

R

CC

V

DD

V

EE

internal

circuitry

TEA1111A

TEA1111A

I

CC

V

CC

V

DD

I

DD

peripherals

C

VCC

100 µF

C

VDD

220 µF

external

circuits

FCA053

I

P

Fig.3 Supply configuration.

handbook, halfpage

V

R

CC0

CC

V

CC

I

rec

V

EE

EXTERNAL

CIRCUITS

I

P

MGK806

Fig.4 VCC used as supply voltage for external circuits.

2000 Feb 18 6

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, halfpage

VCC≥ 2.2 V; VLN= 4 V at I
(1) Curve 1 is valid when the earpiece amplifier is driven: V
(2) Curve 2 is valid when the earpiece amplifier is not loaded.

= 15 mA; RCC= 619 Ω; R

line

2

I

P

(mA)

1.6

1.2

0.8

0.4

0

2.2 2.6 3.4

SLPE

(1) (2)

=20Ω.

= 150 mV; RL= 150 Ω.

QR(rms)

3.0

TEA1111A

FCA054

VCC (V)

Fig.5 Typical current IP available from VCC for peripheral circuitry.

THE REGULATED SUPPLY POINT (PIN VDD)
The V

regulator delivers a stabilized voltage for the

DD

peripherals in transmission mode (nominal VLN) as well as
in ringer mode (VLN= 0 V). The regulator (see Fig.6)
consists of a sense input circuit fed by pin LN, a current
switch and a VDD output stabilizer.

Theregulatorfunctiondependsonthetransmission,ringer
and trickle modes as follows:

• Transmissionmode:Theregulatoroperatesasacurrent
source at the LN input; it takes a constant current of
I

= 4.3 mA (at nominal conditions) from pin LN.

SUP

The current switch reduces the distortion on the line at
large signal swings. Output V

follows the DC voltage

DD

at pin LN (with typically 0.35 V difference) up to
VDD= 3.25 V. The input current of the regulator is
constant while the output (source) current is determined
by the consumption of the peripherals. The difference
between input and output currents is shunted by the
internal VDD stabilizer.

• Ringer mode: The regulator operates as a shunt
stabilizer to keep V

at 3.3 V. The input voltage

DD

VLNequals 0 V while the input current into pin VDD is
delivered by the ringingsignal. VDDhas to be decoupled
by a capacitor C

VDD

.

• Trickle mode: When VDD is below 2 V, the regulator is
inhibited. The current consumption of the VDDregulator
in trickle mode is very low to save most of the trickle
current for memory retention of a dialler.

2000 Feb 18 7

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

R

EXCH

V

EXCH

R

line

TEA1111A

I

line

LN

I

SUP

I

LN

SENSE

R

CC

I

CC

V

CC

SWITCH

VDD regulator

TEA1111A

C

V

DD

I

DD

peripherals

C

VDD

V

EE

220 µF

FCA055

VCC

100 µF

Fig.6 VDD regulator configuration.

LED control (pin LEDC)

The TEA1111A gives an on-hook/off-hook status
indication. This is achieved by a current made available at
pin LEDC to drive an external LED circuit connected
between pins SLPE and LN (see Fig.7). In the low voltage
area, which corresponds to low line current conditions, no
current is available for this LED. For line currents higher
than a threshold, the LEDC current increases
proportionallyto the line current (with aratioof 1:150). The
LEDC current is internally limited to 470 µA (see Fig.8).

I

12–

For 12 mA < I

< 82 mA:

line

I

LEDC

line

=

--------------------­150

This LED circuit is referenced to SLPE. Consequently, all
theLEDsupply current will flow through the R

SLPE

resistor,

and does not affect the behaviour of the AGC.

Set impedance

In the audio frequency range, the dynamic impedance is
mainly determined by the RCC resistor. The equivalent
impedance of the circuit is illustrated in Fig.9.

BC858B

LN

24

Ω

2.4
kΩ

LEDC

SLPE

FCA056

2000 Feb 18 8

Fig.7 LED circuit configuration.

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

I

line

(mA)

FCA057

handbook, halfpage

LEQ=C
RP= internal resistance.
RP= 17.5 kΩ.

500

handbook, halfpage

I

LEDC

(µA)

400

300

200

100

0

0 20 40 100

60 80

REG

× R

V

LN

SLPE

EE

SLPE

× RP.

L

EQ

V

R

SLPE

20 Ω

ref

R

P

REG V

C

REG

4.7 µF

TEA1111A

R

CC

619 Ω

CC

C

VCC

100 µF

MBE788

Fig.8 LEDC current versus line current.

Transmit stage (pins MIC+, MIC− and DTMF)

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
The TEA1111A has symmetrical microphone inputs.

The input impedance between pins MIC+ and MIC− is
68 kΩ (2 × 34 kΩ). The voltage gain from pins MIC+/MIC−
to pin LN is set at 44.2 dB (typical) at 600 Ω line load.

Automatic gain control is provided on this amplifier for line
loss compensation.

DTMF AMPLIFIER (PIN DTMF)
When the DTMF amplifier is enabled, dialling tones may

be sent on line. These tones are also sent to the receive
output QR at a low level (confidence tone), the level is
controlled by pin VCI.

The TEA1111A has an asymmetrical DTMF input. The
input impedance between DTMF and VEE is 20 kΩ and it
isbiasedatVEE.Thevoltagegainfrompin DTMFtopin LN
is set at 25.9 dB.

Automatic gain control has no effect on the DTMF
amplifier.

Fig.9 Equivalent impedance between LN and VEE.

Receiving stage (pins IR, GAR, QR and VCI)

The receive part consists of an earpiece amplifier and a
volume control block.

EARPIECE AMPLIFIER
The earpiece amplifier has one input (IR) and one output

(QR). The input impedance between pin IR and pin VEEis
22 kΩ. When pin VCI is tied to VEE, the voltage gain from
pin IR to pin QR is set at 27.4 dB (typical) which reduces
the attenuation of the receive signal by the anti-sidetone
network from 32 dB to 4.6 dB. The gain can be decreased
by connecting an external resistor R

between pins

GARext

GAR and QR; the adjustment range is 6 dB. Two external
capacitors C
and C

GARS

ensure stability. Capacitor C

(connected between pins GAR and QR)

GAR

(connected between pins GAR and VEE)

provides a first-order

GAR

low-pass filter. The cut-off frequency corresponds to the
timeconstantC

GAR

× R

GARint

.WhereR

GARint

istheinternal
resistor (123 kΩ typical) which sets the gain. The
relationship C

GARS

=10×C

must be complied with to

GAR

ensure stability.

2000 Feb 18 9

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

Theoutput voltage of the earpiece amplifier is specified for
continuous wave drive. The maximum output swing
depends on the DC line voltage, the RCC resistor, the I
current consumption of the circuit, the IP current
consumption of the peripheral circuits and the load
impedance.

Automatic gain control is provided on this amplifier for line
loss compensation.

VOLUME CONTROL (PIN VCI)
A positive DC voltage applied to pin VCI allows the gain of

the earpiece amplifier to be increased in steps of 4.85 dB.
The volume control range is 27.4 to 41.9 dB (14.5 dB
typical). A proportional voltage decoder at pin VCI defines
a gain of 27.4 dB when V

41.9 dB when V

equals VDD.

VCI

The intermediate steps correspond to:

VCI

2

=

V

-- -

DD

3

V

and .

equals VEE and a gain of

VCI

V

=

VCI

1

V

-- -

DD

3

Automatic gain control (pin AGC)

The TEA1111A performs automatic line loss
compensation. The automatic gain control varies the gain
of the microphone amplifier and the gain of the receive
amplifier in accordance with the DC line current.

The control range is 6.0 dB (which corresponds
approximately to a line length of 5 km for a 0.5 mm
diametertwisted-paircopper cable with a DC resistance of
176 Ω/km and an average attenuation of 1.2 dB/km).

The ICcan be used with differentconfigurations of feeding
bridge (supply voltage and bridge resistance) by
connecting an external resistor R
and VEE. This resistor enables the I
currents to be increased (theratio between I

between pins AGC

AGC

and I

start

stop

start

line

and I

stop

not affected by the resistor). The AGC function is disabled
when pin AGC is left open circuit.

Mute function (pin MUTE)

When MUTE is HIGH, the microphone and receiving
amplifiers inputs are enabled while the DTMF input is
disabled. The MUTE input is provided with an internal

CC

pull-up current source to VDD.

Sidetone suppression

The TEA1111A anti-sidetone network comprising
RCC// Z
suppresses the transmitted signal in the earpiece.
Maximum compensation is obtained when the following
conditions are fulfilled:

The scale factor k is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Z

In practice, Z
thelinelength.Therefore, the value of Z
average line length, which gives satisfactory sidetone
suppression with short and long lines. The suppression
also depends on the accuracy of the match between Z
and the impedance of the average line.

The anti-sidetone network for the TEA1111A attenuates
the receive signal from the line by 32 dB before it enters
the receive stage. The attenuation is almost constant over
the whole audio frequency range.

A Wheatstone bridge configuration (see Fig.11) may also
be used.

More information on the balancing of an anti-sidetone
bridgecan be obtained in our publication

for Wired Telecom Systems; Applications Handbook

is

IC03b”

For ordering information, please contact the Philips
Semiconductors sales office.

line,Rast1,Rast2,Rast3,RSLPE

R

× R

SLPERast1

R

ast2

k

=

-----------------------------------------------------------­R

ast1RSLPE

kZ

Z

bal

×=

line

line

CC

R

+()×

ast3RSLPE

×

varies considerably with the line type and

.

R

( R

ast2

TEA1111A

and Z

ast3

(see Fig.10)

bal

)+×=

shouldbeforan

bal

“Semiconductors

bal

.

bal

The mute function performs the switching between the
speech mode and the dialling mode.

When MUTE is LOW, the DTMF input is enabled and the
microphone and receive amplifier inputs are disabled.
In this mode, the DTMF tones are sent to the receive
output at a low level (confidence tone).

2000 Feb 18 10

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

R

R

CC

SLPE

Z

line

V

EE

LN

SLPE

R

ast1

I

m

R

ast3

TEA1111A

IR

Z

R

ast2

Z

bal

ir

MBE787

handbook, full pagewidth

Fig.10 Equivalent circuit of TEA1111A anti-sidetone bridge.

LN

R

R

CC

SLPE

SLPE

Z

line

V

EE

Z

bal

ast1

IR

Z

ir

R

A

MBE786

I

m

R

Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.

2000 Feb 18 11

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

I

DD

V

CC

V

MUTE,VVCI

V

n(max)

I

line

P

tot

T

stg

T

amb

T

j

positive continuous line voltage VEE− 0.4 12 V
repetitive line voltage during switch-on or

V

− 0.4 13.2 V

EE

line interruption
maximum input current at pin V

DD

− 75 mA
supply voltage VEE− 0.4 12 V
maximum voltage on pins MUTE and VCI VEE− 0.4 VDD+ 0.4 V
maximum voltage on all pins except

VEE− 0.4 VCC+ 0.4 V

pins VDD, MUTE and VCI
line current R
total power dissipation T

=20Ω;see Fig.12 − 140 mA

SLPE

=75°C

amb

TEA1111AT; (see Fig.12) − 400 mW

TEA1111AUH; note 1 −−mW
storage temperature −40 +125 °C
ambient temperature −25 +75 °C
junction temperature − +125 °C

Note

1. Mostly dependent on the maximum required ambient temperature, on the voltage between LN and SLPE and on the
thermal resistance between die ambient temperature. This thermal resistance depends on the application board
layoutand on the materials used. Figure 13 shows the safeoperating area versus this thermalresistance for ambient
temperature T

amb

=75°C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air; note 1

TEA1111AT 110 K/W
TEA1111AUH tbf by customer

K/W

in application

Note

1. Mounted on epoxy board 40.1 × 19.1 × 1.5 mm.

2000 Feb 18 12

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

150

handbook, full pagewidth

130

I

LN

(mA)

110

90

70

50

(4) (3) (2) (1)

TEA1111A

FCA058

(1) T
(2) T
(3) T
(4) T

30

24365981110

amb
amb
amb
amb

=45°C; P
=55°C; P
=65°C; P
=75°C; P

= 0.666 W.

tot

= 0.583 W.

tot

= 0.500 W.

tot

= 0.416 W.

tot

7

Fig.12 SO16 safe operating area (TEA1111AT).

12

V

− V

SLPE

(V)

LN

2000 Feb 18 13

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

160

handbook, full pagewidth

I

line

(mA)

120

80

(7)

40

0

246810

(4)

(5)

(6)

TEA1111A

FCA159

(1)

(2)

(3)

V

SLPE

(V)

12

Fig.13 Safe operating area at T

=75°C (TEA1111AUH).

amb

LINE R

th(j-a)

(1) 40
(2) 50
(3) 60
(4) 75
(5) 90
(6) 105
(7) 130

(K/W)

2000 Feb 18 14

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

CHARACTERISTICS

I

= 15 mA; VEE=0V; V

line

according to test circuits given in Figs 15, 16 and 17; T
otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins LN, V

T

HE LINE INTERFACE (PINS LN, SLPE AND REG)

V

ref

CC

stabilized reference voltage
between pins LN and SLPE

V

LN

V

LN(Rext)

DC line voltage I

DC line voltage with an
external resistor R

∆V

LN(T)

DC line voltage variation with
temperature referenced to

25 °C
THE INTERNAL SUPPLY POINT (PIN VCC)
I

V

CC

CC

internal current consumption VCC= 3.3 V − 1.15 1.4 mA

supply voltage for internal

circuitry
THE REGULATED SUPPLY POINT (PIN VDD)
I

SUP

input current of the V

regulator (current from pin LN

not flowing through pin SLPE)
V

DD

regulated supply voltage in:

speech mode I

speech mode at reduced
performance

ringer mode I

I

DD

regulated supply current

available in:

speech mode I
speech mode at reduced

performance
trickle mode I

VCI

=0V; R

=20Ω; pin AGC connected to VEE; Z

SLPE

, SLPE, REG and VDD)

VA

DD

= 600 Ω; f = 1 kHz; measured

line

=25°Cfor TEA1111AT; Tj=25°Cfor TEA1111AUH; unless

amb

3.5 3.8 4.1 V

=1mA − 1.5 − V

line

I

=4mA − 2.5 − V

line

I

= 15 mA 3.7 4.0 4.3 V

line

I

= 140 mA − 6.7 7.2 V

line

RVA=90kΩ (between

− 3.6 − V

pins LN and REG)
T

= −25 to +75 °C −±40 − mV

amb

IP=0mA − 3.3 − V

I

=1mA − 0 − mA

line

I

=4mA − 1.2 − mA

line

I

≥ 11 mA − 4.3 − mA

line

= −3 mA;

DD

2.95 3.25 3.55 V
VLN> 3.6 V + 0.28 V (typ.);
I

≥ 11 mA

line

=4mA − VLN− 0.35 − V

I

line

= 0 mA; IDD= 75 mA 3.0 3.3 3.6 V

line

≥ 11 mA −− −3mA

line

I

=4mA −−1−mA

line

line

= 0 mA;

−− 100 nA
VCCdischarging;
VDD= 1.2 V

2000 Feb 18 15

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

LED control (pin LEDC)

I

line(h)

I

line(l)

I

LEDC(max)

highest line current for
I

<5µA

LEDC

lowest line current for
maximum I

LEDC

maximum available output
current from pin LEDC

Transmit stage (pins MIC+, MIC− and DTMF)

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
Z

 input impedance

i

differential between
pins MIC+ and MIC−

single-ended between

G

v(TX)

pins MIC+/MIC− and V

voltage gain from

EE

V

= 4 mV (RMS) 43.2 44.2 45.2 dB

MIC

pins MIC+/MIC− to pin LN

∆G

v(TX)(f)

voltage gain variation with

f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz

∆G

v(TX)(T)

voltage gain variation with

T

= −25 to +75 °C −±0.3 − dB

amb

temperature referenced to

25 °C
CMRR common mode rejection ratio − 80 − dB
V

LN(max)(rms)

V

no(LN)

maximum sending signal

(RMS value)

I

= 15 mA; THD = 2% 1.8 2 − V

line

I

= 4 mA; THD = 10% − 0.45 − V

line

noise output voltage at pin LN psophometrically weighted

(P53 curve);
pins MIC+/MIC− short
circuited through 200 Ω

DTMF AMPLIFIER (PIN DTMF)

 input impedance − 20 − kΩ

Z

i

G

v(DTMF)

∆G

v(DTMF)(f)

voltage gain from pin DTMF to

pin LN

voltage gain variation with

V

= 20 mV (RMS);

DTMF

MUTE = LOW
f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz
∆G

v(DTMF)(T)

voltage gain variation with

T

= −25 to +75 °C −±0.4 − dB

amb

temperature referenced

to 25 °C
G

v(ct)

voltage gain from pin DTMF to

pin QR (confidence tone)

V

= 20 mV (RMS);

DTMF

RL= 150 Ω;
MUTE = LOW; V

VCI

=0V

− 13 − mA

− 82 − mA

− 470 −µA

− 68 − kΩ

− 34 − kΩ

−−77 − dBmp

24.9 25.9 26.9 dB

−−15.6 − dB

2000 Feb 18 16

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Receive stage (pins IR, GAR, QR and VCI)

THE EARPIECE AMPLIFIER (PINS IR AND QR)

 input impedance − 22 − kΩ

Z

i

G

v(QR)

∆G

v(QR)(f)

∆G

v(QR)(T)

∆G

v(QR)

V

QR(max)(rms)

V

no(QR)(rms)

VOLUME CONTROL (PIN VCI)
∆G

v(QR)max

∆G

v(QR)step

Automatic gain control (pin AGC)

∆G

v(trx)

I

start

I

stop

Mute function (pin MUTE)

V

IL

V

IH

I

MUTE

∆G

v(trx)(m)

voltage gain from pin IR to

pin QR

voltage gain variation with

VIR= 4 mV (RMS);
V

=0 V

VCI

26.4 27.4 28.4 dB

f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz

voltage gain variation with

T

= −25 to +75 °C −±0.3 − dB

amb

temperature referenced to

25 °C

voltage gain reduction range externalresistorconnected

−− 6dB
between
pins GAR and QR

maximum receiving signal on
pin QR (RMS value)

IP= 0 mA; sine wavedrive;
RL= 150 Ω; THD = 2%;
V

VCI=VDD

I

= 0 mA; sine wavedrive;

P

0.5 0.6 − V

0.8 0.9 − V
RL= 450 Ω; THD = 2%;
V

VCI=VDD

noise output voltage at pin QR
(RMS value)

IR open circuit;
RL= 150 Ω; V

VCI

−−90 − dBVp

=0V;
psophometrically weighted
(P53 curve)

−−75 − dBVp

12 14.5 17 dB

maximum increase in voltage
gain

V

VCI=VDD

VIR= 4 mV (RMS);
V

VCI=VDD

step voltage gain VIR= 4 mV (RMS) 3.85 4.85 5.85 dB

voltage gain control range for

I

=85mA − 6.0 − dB

line

microphone and earpiece
amplifiers w.r.t. I

highest line current for

=15mA

line

− 23 − mA

maximum gain
lowest line current for min. gain − 59 − mA

LOW-level input voltage VEE− 0.4 − VEE+ 0.3 V
HIGH-level input voltage VEE+ 1.5 − VDD+ 0.4 V
input current −10 −2 −µA
voltage gain reduction for:

microphone amplifier
earpiece amplifier
DTMF amplifier

MUTE = LOW − 80 − dB
MUTE = LOW − 80 − dB
MUTE = HIGH − 80 − dB

2000 Feb 18 17

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEST AND APPLICATION INFORMATION

C

ast3

R

prot

Cz

Dz

C

V
10 V

IR

DTMF

V

SLPE

DD

peripheral

supply

V

EE

R
20 Ω

emc

d

10 nF

SLPE

C

REG

4.7 µF

R

C

DTMF

220 nF

C
220 µF

AGC

VDD

REG

AGC

DTMF

V

MUTE

Rz

LN

IR

TEA1111A

DD

MUTE

handbook, full pagewidth

AB

BA

C

bal

220 nF

D1 D2

1N4004

D3 D4

R

ast1

130 kΩ

100 nF

R

ast2

3.92 kΩ
R

392 Ω

R

bal1

130 Ω

R

bal2

820 Ω

R

CC

619 Ω

V

CC

LEDC

MIC−

MIC+

QR

GAR

V

EE

VCI

R

GARext

R

100 µF

TX3

C

VCC

2R

TEA1111A

2.4

24 Ω

kΩ

BC858

TX1

TX2

C
100 pF

GAR

VCI

VCI

1

0

C

MIC−

C

MIC+

C

10 µF

1 nF

C

GARS

MIC−

MIC+

EAR

earpiece

FCA059

R

R

R

Fig.14 Basic application diagram.

2000 Feb 18 18

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

I

line

I

line

V

R

CC

619 Ω

24 Ω 2.4 kΩ

I

LN

V

DTMF

LEDC

IR

MIC−

MIC+

DTMF

BC858

100

µF

O

V

MIC

600 Ω

R

SLPE

20 Ω

LN

REG AGCSLPE

TEA1111A

C

REG

4.7 µF

TEA1111A

C

VCC

3 mA

S1

I

DD

V

DD

QR

R

GAR

VCIMUTE

GARext

I

CC

V

CC

V

EE

100 µF

C

VDD

220 µF

10 µF

C

GAR

C

R

GARS

L

V

Voltage gain defined as Gv= 20 log ; VI=V
Microphone gain: S1 = open.
DTMF gain: S1 = closed.
Inputs not being tested should be open circuit.

O

------­V

I

Fig.15 Test circuit for defining transmit gains.

MIC

or V

DTMF

FCA060

.

2000 Feb 18 19

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

I

handbook, full pagewidth

line

I

line

BC858

100

µF

600 Ω

24 Ω 2.4 kΩ

V

IR

220
nF

V

DTMF

LEDC

IR

MIC−

MIC+

DTMF

R

LN

REG AGCSLPE

SLPE
20 Ω

R

619 Ω

I

LN

TEA1111A

C

REG

4.7 µF

CC

TEA1111A

C

VCC

V

O

100 µF

C

VDD

220 µF

10 µF

C

GAR

C

GARS

R

L

3 mA

S1

I

DD

V

DD

QR

R

GARext

VCIMUTE

GAR

E

VCI

I

CC

V

CC

V

EE

V

Voltage gain defined as Gv= 20 log ; VI=VIRor V
Earpiece gain: S1 = open.
Confidence tone: S1 = closed.
Inputs not being tested should be open circuit.

O

------­V

I

Fig.16 Test circuit for defining earpiece gains.

DTMF

FCA061

.

2000 Feb 18 20

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

V

CC

IR
MIC−
MIC+
DTMF
LEDC

REG AGC SLPE

C

REG

4.7 µF

LN

R

CC

619 Ω

TEA1111A

R

SLPE

20 Ω

V

V

CC

EE

V

MUTE

DD

QR

GAR

VCI

TEA1111A

V

DD

10 µF

I

DD

Inputs not being tested should be open circuit.

Fig.17 Test circuit for defining regulated supply (VDD) performance in ringer and trickle modes.

FCA062

2000 Feb 18 21

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

BONDING PAD LOCATIONS FOR TEA1111AUH

All x/y coordinates represent the position of the centre of the pad (in µm) with respect to the origin (x/y = 0/0) of the die
(see Fig.18). The size of all pads is 80 µm × 80 µm.

SYMBOL PAD

xy

LN 1 110 578.5
SLPE 2 110 260
REG 3 155 110
IR 4 432 110
AGC 5 967.2 110
DTMF 6 1203.2 110
V

DD

7 1394.5 115.5
MUTE 8 1400 350.8
n.c. 9 1400 537.8
VCI 10 1400 1013
V

EE

V

EE

11 1398.5 1249

12 1397.8 1360
QR 13 1238.2 1360
GAR 14 1032.5 1360
MIC+ 15 370.8 1360
MIC- 16 150.5 1360
LEDC 17 110.8 1211.2
V

CC

18 110 980.5

COORDINATES

handbook, full pagewidth

LEDC

V

CC

LN

SLPE

x

0,0

MIC−

17

18

REG

y

MIC+

16

15

1

2

3 7

4

IR

Fig.18 TEA1111AUH bonding pad locations.

2000 Feb 18 22

GAR

14 13

5 6

AGC

QR

DTMF

V

EE

12

V

11

EE

VCI

10

n.c.

9

8

MUTE

V

FCA156

DD

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

9

TEA1111A

SOT109-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A

0.25

0.10

0.010

0.004

2

1.45

1.25

0.057

0.049

A

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

9.8

0.39

0.38

8

b

p

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.244

0.228

A

2

1.05

0.041

Q

A

1

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.020

0.016

(A )

L

p

L

0.25 0.1

0.25

0.01

0.01 0.004

A

3

θ

0.7

0.3

0.028

0.012

o

8

o

0

OUTLINE

VERSION

SOT109-1

IEC JEDEC EIAJ

076E07 MS-012

REFERENCES

2000 Feb 18 23

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not alwayssuitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

– smaller than 1.27 mm, the footprint longitudinal axis

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

TEA1111A

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

must be parallel to the transport direction of the
printed-circuit board.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Feb 18 24

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

SOLDERING METHOD

suitable

(3)(4)
(5)

suitable
suitable

(1)

.

2000 Feb 18 25

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern
processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors
assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of
the die. It is the responsibility of the customer to test and qualify their application in which the die is used.

2000 Feb 18 26

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

NOTES

TEA1111A

2000 Feb 18 27

Philips Semiconductors – a w orldwide compan y

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Tel. [phone], Fax. [phone]
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252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 403502/03/pp28 Date of release: 2000 Feb 18 Document order number: 9397 750 06725