Datasheet TEA1097TV-C1, TEA1097H-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1998 Jun 11
File under Integrated Circuits, IC03

1999 Apr 08

INTEGRATED CIRCUITS

TEA1097

Speech and loudspeaker amplifier
IC with auxiliary inputs/outputs and
analog multiplexer

1999 Apr 08 2

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

FEATURES
Line interface

• Low DC line voltage

• Voltage regulator with adjustable DC voltage

• Symmetrical high-impedance inputs (70 kΩ) for

dynamic, magnetic or electric microphones

• Dual Tone Multi-Frequency (DTMF) input with
confidence tone on earphone and/or loudspeaker

• Receive amplifier for dynamic, magnetic or
piezo-electric earpieces (with externally adjustable gain)

• Automatic Gain Control (AGC) for true line loss
compensation.

Supplies

• Provides a strong 3.35 V regulated supply for
microcontroller or dialler

• Provides filtered power supply, optimized according to
line current and compatible with external voltage or
current sources

• Filtered 2 V power supply output for electret microphone

• Compatible with a ringer mode

• Power-Down (

PD) logic input for power-down.

Loudspeaker amplifier

• Single-ended rail-to-rail output

• Externally adjustable gain

• Dynamic limiter to prevent distortion

• Logarithmic volume control via linear potentiometer.

Auxiliary interfaces

• Asymmetrical high-impedance input for electret
microphone.

• General purpose auxiliary output for transmit and
receive

• Auxiliary transmit input with high signal level capability
dedicated to line transmission

• Auxiliary receive input with high signal level capability

• Integrated multiplexer for channels selection.

APPLICATIONS

• Telephone answering machines

• Telephones with digital handsfree

• Line powered telephone sets

• Cordless telephones

• Fax machines.

GENERAL DESCRIPTION

The TEA1097 is an analog bipolar circuit dedicated for
telephone applications. It includes a line interface, handset
microphone and earpiece amplifiers, base microphone
and loudspeaker amplifiers, some specific auxiliary
Inputs/Outputs (I/Os) and an analog multiplexer to enable
the right transmit and/or receive channels. The multiplexer
is controlled by a logic circuitry decoding four logic inputs
provided by a microcontroller. Twelve different application
modes have been defined and can be accessed by
selecting the right logic inputs.

This IC can be supplied by the line and/or by the mains if
available (in a cordless telephone or a telephone
answering machine for example). It provides a 3.35 V
supply for a microcontroller or dialler and a 2 V filtered
voltage supply for electret microphones. The IC is
designed to facilitate the use of the loudspeaker amplifier
during ringing phase.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TEA1097TV VSO40 plastic very small outline package; 40 leads SOT158-1
TEA1097H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);

body 10 × 10 × 1.75 mm

SOT307-2

1999 Apr 08 3

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

QUICK REFERENCE DATA

I

line

= 15 mA; R

SLPE

=20Ω; Z

line

= 600 Ω; f = 1 kHz; T

amb

=25°C; AGC pin connected to LN;PD = HIGH; HFC = LOW;

AUXC = LOW;

MUTT = HIGH; MUTR = HIGH; measured according to test circuits; unless otherwise specified.

Note

1. When the channel is enabled according to Table 1.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

line

line current operating range normal operation

TEA1097H 11 − 140 mA
TEA1097TV 11 − 130 mA

with reduced performance 1 − 11 mA

V

SLPE

stabilized voltage between SLPE
and GND (V

ref

)

I

line

= 15 mA 3.4 3.7 4.0 V

I

line

= 70 mA 5.7 6.1 6.5 V

V

BB

regulated supply voltage for
internal circuitry

I

line

= 15 mA 2.75 3.0 3.25 V

I

line

= 70 mA 4.9 5.3 5.7 V

V

DD

regulated supply voltage on
pin V

DD

VBB> 3.35 V + 0.25 V
(typ.)

3.1 3.35 3.6 V

otherwise − V

BB

− 0.25 − V

V

ESI(ext)

external voltage supply allowed on
pin ESI

−− 6V

I

ESI(ext)

external current supply allowed on
pin ESI

−− 140 mA

I

BB

current available on pin V

BB

speech mode − 11 − mA
handsfree mode;

HFC = HIGH

− 9.5 − mA

I

BB(pd)

current consumption on VBB during
power-down phase

PD = LOW − 460 −µA

G

v(MIC-LN)

voltage gain from pin
MIC+/MIC− to LN

V

MIC

= 5 mV (RMS) 43.3 44.3 45.3 dB

G

v(IR-RECO)

voltage gain from pin IR
(referenced to LN) to RECO

VIR= 15 mV (RMS) 28.7 29.7 30.7 dB

∆G

v(QR)

gain voltage range between pins
RECO and QR

−3 − +15 dB

G

v(TXIN-TXOUT)

voltage gain from pin TXIN to
TXOUT

V

TXIN

= 3 mV (RMS);

R

GATX

= 30.1 kΩ; note 1

13.15 14.85 16.55 dB

G

v(TXAUX-LN)

voltage gain from pin TXAUX to LN V

TXAUX

= 0.1 V (RMS);

note 1

11.5 12.5 13.5 dB

G

v(HFRX-LSAO)

voltage gain from pin HFRX to
LSAO

V

HFRX

= 20 mV (RMS);

R

GALS

= 255 kΩ; note 1

25.5 28 30.5 dB

∆G

v(trx)

gain control range for transmit and
receive amplifiers affected by the
AGC; with respect to I

line

=15mA

I

line

= 70 mA; on

G

v(MIC-LN)

, G

v(IR-RECO)

and G

v(IR-AUXO)

5.45 6.45 7.45 dB

1999 Apr 08 4

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

BLOCK DIAGRAM

Fig.1 Block diagram.

The pin numbers given in parenthesis refer to the TEA1097H.

handbook, full pagewidth

MGL392

LINE CURRENT DETECTION
LOW VOLTAGE BEHAVIOUR

TAIL

CURRENTS

SUPPLY

MANAGEMENT

SWITCH

STARTER

AGC

ATT.

ATT.

GND

V

BB

ESI
V

DD

(19) 23

MICS

PD

(10) 13

(9) 12

(20) 24

(38) 40

AGC

LN

17 (13)

22 (18)

19 (15)

REG SLPE
20

(16)18(14)

Tail currents for preamps

STAB 25 (21)

LSAO

16 (12)

DLC 11 (8)

GALS 14 (11)

TXAUX

5 (43)

MIC+

33 (31)

MIC−

32 (30)

DTMF

34 (32)

POWER-DOWN

CURRENT SOURCES

ANALOG

MULTIPLEXER

CONTROL

DYNAMIC

LIMITER

VOLUME

CONTROL

HFC(37) 39
MUTT(39) 1
MUTR(40) 2
AUXC(41) 3

GATX(27) 29

TXOUT

(26) 28

VOL(23) 27

HFRX

(1) 7

HFTX

(36) 38

IR

(17) 21

RAUX

(42) 4

GNDTX(29) 31

TXIN

30 (28)

AUXO

6 (44)

RECO

37 (35)

QR

35 (33)

GARX

36 (34)

TEA1097TV

D6

1999 Apr 08 5

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

PINNING

SYMBOL

PIN

DESCRIPTION

VSO40 QFP44

MUTT 1 39 logic input (active LOW)
MUTR 2 40 logic input (active LOW)
AUXC 3 41 logic input
RAUX 4 42 auxiliary receive amplifier input
TXAUX 5 43 auxiliary transmit amplifier input
AUXO 6 44 auxiliary amplifier output
HFRX 7 1 receive input for loudspeaker amplifier
n.c. 8 to 10,

15 and 26

2 to 7, 22,
24 and 25

not connected

DLC 11 8 dynamic limiter capacitor for the loudspeaker amplifier
ESI 12 9 external supply input
V

BB

13 10 stabilized supply for internal circuitry
GALS 14 11 loudspeaker amplifier gain adjustment
LSAO 16 12 loudspeaker amplifier output
GND 17 13 ground reference
SLPE 18 14 line current sense
LN 19 15 positive line terminal
REG 20 16 line voltage regulator decoupling
IR 21 17 receive amplifier input
AGC 22 18 automatic gain control/line loss compensation
V

DD

23 19 3.35 V regulated voltage supply for microcontroller
MICS 24 20 microphone supply output
STAB 25 21 reference current adjustment
VOL 27 23 loudspeaker volume adjustment
TXOUT 28 26 base microphone amplifier output
GATX 29 27 base microphone amplifier gain adjustment
TXIN 30 28 base microphone amplifier input
GNDTX 31 29 ground reference for microphone amplifiers
MIC− 32 30 negative handset microphone amplifier input
MIC+ 33 31 positive handset microphone amplifier input
DTMF 34 32 dual tone multi-frequency input
QR 35 33 earpiece amplifier output
GARX 36 34 earpiece amplifier gain adjustment
RECO 37 35 receive amplifier output
HFTX 38 36 transmit input for auxiliary receive amplifier
HFC 39 37 logic input
PD 40 38 power-down input (active LOW)

1999 Apr 08 6

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Fig.2 Pin configuration (VSO40).

handbook, halfpage

TEA1097TV

MGL393

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20

MUTT
MUTR
AUXC
RAUX

TXAUX

AUXO

HFRX

n.c.
n.c.
n.c.

DLC

ESI

V

BB

GALS

n.c.

LSAO

GND

SLPE

LN

REG

PD
HFC
HFTX
RECO
GARX
QR
DTMF
MIC+
MIC−
GNDTX
TXIN
GATX
TXOUT
VOL
n.c.
STAB
MICS
V

DD

AGC
IR

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

1999 Apr 08 7

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Fig.3 Pin configuration (QFP44).

handbook, full pagewidth

1
2
3
4
5
6
7
8

9
10
11

33
32
31
30
29
28
27
26
25
24
23

12

13

14

15

16

17

18

19

20

21

22

44

43

42

41

40

39

38

37

36

35

34

TEA1097H

FCA019

QR
DTMF
MIC+
MIC−

TXIN
GATX
TXOUT
n.c.
n.c.
VOL

HFRX

n.c.
n.c.

n.c
n.c
n.c

DLC

ESI

GALS

GNDTX

TXAUX

RAUX

AUXC

MUTR

MUTT

PD

HFTX

RECO

GARX

AUXO

HFC

GND

SLPE

LN

REG

IR

AGC

MICS

STAB

n.c

LSAO

V

DD

n.c

V

BB

FUNCTIONAL DESCRIPTION

All data given in this chapter are typical values, except
when otherwise specified.

Supplies

L

INE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE,

REG

AND V

BB

)

The supply for the TEA1097 and its peripherals is obtained
from the line. The IC generates a stabilized reference
voltage (V

ref

) between pins SLPE and GND. This
reference voltage is equal to 3.7 V for line currents lower
than 18 mA. It than increases linearly with the line current
and reaches the value of 6.1 V for line currents higher than
45 mA. For line currents below 9 mA, the internal
reference voltage generating V

ref

is automatically adjusted
to a lower value. This is the so-called low voltage area and
the TEA1097 has limited performances in this area
(see Section “Low voltage behaviour”). This reference
voltage is temperature compensated.

The voltage between pins SLPE and REG is used by the
internal regulator to generate the stabilized reference
voltage and is decoupled by means of a capacitor between
pins LN and REG.

This capacitor converted into an equivalent inductance
realizes the set impedance conversion from its DC value
(R

SLPE

) to its AC value (done by an external impedance).

The IC regulates the line voltage at pin LN and it can be
calculated as follows:

where:

I

line

= line current

Ix= current consumed on pin LN (approximately a
few µA)

I

SLPE

= current flowing through the R

SLPE

resistor.

V

LN

V

refRSLPE

I×+

SLPE

=

I

SLPEIline

Ix–=

1999 Apr 08 8

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

The preferred value for R

SLPE

is 20 Ω. Changing this value
will affect more than the DC characteristics; it also
influences the transmit gains to the line, the gain control
characteristic, the sidetone level and the maximum output
swing on the line.

As can be seen from Fig.4, the internal circuitry is supplied
by pin VBB, which is a strong supply point combined with
the line interface. The line current is flowing through the
R

SLPE

resistor and is sunk by the VBB voltage stabilizer,
becoming available for a loudspeaker amplifier or any
peripheral IC. Its voltage is equal to 3.0 V for line currents
lower than 18 mA. It than increases linearly with the line
current and reaches the value of 5.3 V for line currents
greater than 45 mA. It is temperature compensated.

The aim of the current switch TR1 and TR2 is to reduce
distortion of large AC line signals. Current I

SLPE

is supplied
to VBB via TR1 when the voltage on SLPE is greater than
VBB+ 0.25 V. When the voltage on SLPE is lower than this
value, the current I

SLPE

is shunted to GND via TR2.

The reference voltage V

ref

can be increased by connecting
an external resistor between pins REG and SLPE.
For large line currents, this increase can slightly affect
some dynamic performances such as maximum signal
level on the line for 2% THD. The voltage on pin VBB is not
affected by this external resistor. See Fig.5 for the main
DC voltages.

Fig.4 Line interface principle.

handbook, full pagewidth

MGM298

TN2

TR2

TR1

E2

D1

D1

R3

R2

R1

TN1

TP1

J2

J1

E1

GND

GND

V

BB

from

preamp

GND

REG

LN

SLPE

C

REG

4.7 µF

R

SLPE

20 Ω

1999 Apr 08 9

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Fig.5 Main DC voltages as a function of line current.

handbook, full pagewidth

0.070.06

8

6

2

0

0 0.01

voltages

(V)

0.02 0.05

MICS

V

DD

V

BB

SLPE

LN

I

line

(A)

0.040.03

4

FCA049

EXTERNAL SUPPLY (PINS ESI AND VBB)
The TEA1097 can be supplied by the line as well as by

external power sources (voltage or current sources) that
must be connected to pin ESI.

The IC will choose which supply to use according to the
voltage it can provide. A voltage supply on ESI is efficient
only if its value is greater than the working voltage of the
internal V

BB

voltage stabilizer. Otherwise the IC continues
to be line powered. The current consumed on this source
is at least equal to the internal consumption. It depends on
the voltage difference between the value forced on ESI
and the working voltage of the internal stabilizer.
The current required increases with the voltage difference
to manage. The excess current compared to the internal
consumption becomes then available for other purposes
such as supplying a loudspeaker amplifier. The voltage
source should not exceed 6 V. If the value of the external
voltage source can be lower than the working voltage of
the internal stabilizer, an external diode is required to avoid
reverse current flowing into the external power supply.

In case of current source, the voltage on VBB and ESI
depends on the current available. It is internally limited to

6.6 V. The current source should not exceed 140 mA.

V

DD

SUPPLY FOR MICROCONTROLLERS (PIN V

DD

)

The voltage on V

DD

supply point follows the voltage on V

BB

with a difference equal to 250 mV (typ.) and is internally
limited to 3.35 V. This voltage is temperature
compensated. This supply point can provide a current up
to 3 mA (typ.). Its internal consumption stays low (a few
10 nA) as long as VDD does not exceed 1.5 V (see Fig.6).

An external voltage can be connected on VDD with limited
extra consumption on VDD (typically 100 µA). This voltage
source should not be lower than 3.5 V and higher than 6 V.

VBB and VDD can supply external circuits in the limits of
currents provided either from the line or from pin ESI,
taking into account the internal current consumption.

1999 Apr 08 10

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Fig.6 Current consumption on VDD.

handbook, full pagewidth

1.0

I

DD

(pA)

1.5 2.5 3.0
VDD (V)

2.0

10

8

10

7

10

6

10

5

10

4

10

3

10

2

10

FCA050

SUPPLY FOR MICROPHONE (PINS MICS AND GNDTX)
The MICS output can be used as a supply for an electret

microphone. Its voltage is equal to 2 V; it can source
current up to 1 mA and has an output impedance equal to
200 Ω.

L

OW VOLTAGE BEHAVIOUR

For line currents below 9 mA, the reference voltage is
automatically adjusted to a lower value; the VBB voltage
follows the SLPE voltage with 250 mV difference.
The excess current available for other purposes than DC
biasing of the IC becomes small. In this low voltage area,
the IC has limited performances.

When the VBB voltage reaches 2.7 V, the VBB detector of
the receive dynamic limiter on pin LSAO acts continuously,
discharging the capacitor at pin DLC. In the DC condition,
the loudspeaker is automatically disabled below this
voltage.

When V

BB

becomes lower than 2.5 V, the TEA1097 is
forced in a low voltage mode whatever the levels on the
logic inputs are. It is a speech mode with reduced
performances only enabling the microphone channel
(between the MIC inputs and LN) and the earpiece
amplifier. These two channels are able to deliver signals
for line currents as small as 3 mA. The HFC input is tied to
GND sinking a current equal to 300 µA (typ.).

P

OWER-DOWN MODE (PINS PD AND AUXC)

To reduce current consumption during dialling or register
recall (flash), the TEA1097 is provided with a power-down
input (

PD). When the voltage on pins PD and AUXC is
LOW, the current consumption from VBB and VDD is
reduced to 460 µA (typ.). Therefore a capacitor of 470 µF
connected to pin VBB is sufficient to power the TEA1097
during pulse dialling or flash. The PD input has a pull-up
structure, while AUXC has a pull-down structure. In this
mode, the capacitor C

REG

is internally disconnected.

1999 Apr 08 11

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

RINGER MODE (PINS ESI, VBB, AUXC AND PD)
The TEA1097 is designed to be activated during the

ringing phase. The loudspeaker amplifier can be used for
the melody signal. The IC must be powered by an external
supply on pin ESI, while applying a HIGH level on the logic
input AUXC and a LOW level on the

PD input. Only the
HFRX input and the LSAO output are activated, in order to
limit the current consumption. Some dynamic limiting is
provided to prevent VBB from being discharged below

2.7 V.

Transmit channels (pins MIC+, MIC−, DTMF, TXAUX
and LN)

H

ANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC− AND

LN)
The TEA1097 has symmetrical microphone inputs.

The input impedance between MIC+ and MIC− is 70 kΩ
(typ.). The voltage gain between pins MIC+, MIC− and LN
is set to 44.3 dB. Without limitation from the output, the
microphone input stage can accommodate signals up to
18 mV (RMS) at room temperature for 2% of THD.
The microphone inputs are biased at one diode voltage.

Automatic gain control is provided for line loss
compensation.

DTMF

AMPLIFIER (PINS DTMF, LN AND RECO)

The TEA1097 has an asymmetrical DTMF input. The input
impedance between pin DTMF and GND is 20 kΩ (typ.).
The voltage gain between pins DTMF and LN is set to

25.35 dB. Without limitation from the output, the input
stage can accommodate signals up to 180 mV (RMS) at
room temperature for 2% of THD.

When the DTMF amplifier is enabled, dialling tones may
be sent on the line. These tones can be heard in the
earpiece or in the loudspeaker at a low level. This is called
the confidence tone. The voltage attenuation between pins
DTMF and RECO is typically equal to −16.5 dB.

The DC biasing of this input is 0 V.
The automatic gain control has no effect on these

channels.

A

UXILIARY TRANSMIT AMPLIFIER (PINS TXAUX AND LN)

The TEA1097 has an asymmetrical auxiliary input TXAUX.
The input impedance between pins TXAUX and GND is
20 kΩ (typ.). The voltage gain between pins TXAUX and
LN is set to 12.5 dB. Without limitation from the output, the
input stage can accommodate signals up to 1.2 V (RMS)
at room temperature for 2% of THD. The TXAUX input is
biased at two diodes voltage.

Automatic gain control is provided for line loss
compensation.

M

ICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC−

AND TXOUT)

The voltage gain between the microphone inputs MIC+,
MIC− and the output TXOUT is set to 49.8 dB. This
channel gives an image of the signal sent on the line while
speaking in the handset microphone. Using external
circuitry, this signal can be used for several purposes such
as sending dynamic limiting or anti-howling in a listening-in
application. The TXOUT output is biased at two diodes
voltage.

The automatic gain control has no effect on these
channels.

Receive channels (pins IR, RAUX, RECO, GARX and
QR)

RX

AMPLIFIER (PINS IR AND RECO)

The receive amplifier has one input IR which is referred to
the line. The input impedance between pins IR and LN is
20 kΩ (typ.) and the DC biasing between these pins is
equal to one diode voltage. The gain between pins IR
(referenced to LN) and RECO is typically equal to 29.7 dB.
Without limitation from the output, the input stage can
accommodate signals up to 50 mV (RMS) at room
temperature for 2% of THD.

This receive amplifier has a rail-to-rail output RECO, which
is designed for use with high-ohmic (real) loads (larger
than 5 kΩ). This output is biased at two diodes voltage.

Automatic gain control is provided for line loss
compensation.

1999 Apr 08 12

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

EARPIECE AMPLIFIER (PINS GARX AND QR)
The earpiece amplifier is an operational amplifier having

its output (QR) and its inverting input (GARX) available.
Its input signal comes, via a decoupling capacitor, from the
receive RECO output. It is used in combination with two
resistors to get the required gain or attenuation compared
to the receive gain. It can be chosen between −3 and
+15 dB.

Two external capacitors C

GAR

(connected between pins

GARX and QR) and C

GARS

(connected between pins

GARX and GND) ensure stability. The C

GAR

capacitor
provides a first-order low-pass filter. The cut-off frequency
corresponds to the time constant C

GAR

× Re2.

The relationship C

GARS

≥ 10 × C

GAR

must be fulfilled.

The earpiece amplifier has a rail-to-rail output QR, biased
at two diodes voltage. It is designed for use with low-ohmic
(real) loads (150 Ω) or capacitive loads (100 nF in series
with 100 Ω).

When the amplifier is turned off, the signal present on the
earpiece is equal to the ratio between the load on QR and
Re1+R

e2

AUXILIARY RECEIVE AMPLIFIER (PINS RAUX AND RECO)
The auxiliary receive amplifier has an asymmetrical input

RAUX; it uses the RECO output. Its input impedance
between pins RAUX and GND is typically equal to 20 kΩ.
The voltage gain between pins RAUX and RECO is equal
to−2.4 dB. Without any limitation from the output, the input
stage can accommodate signals up to 0.95 V (RMS) at
room temperature for 2% of THD.

This auxiliary amplifier has a rail-to-rail output RECO,
which is designed for use with high ohmic (real) loads
(larger than 5 kΩ). This output is biased at two diodes
voltage.

The automatic gain control has no effect on this channel.

Auxiliary amplifiers using AUXO (pins MIC+, MIC−,
HFTX, IR and AUXO)

The TEA1097 has an auxiliary output AUXO, biased at two
diodes voltage. This output stage is a rail-to-rail one,
designed for use with high-ohmic (real) loads (larger than
5kΩ). The AUXO output amplifier is used in three different
channels, two transmit channels and one receive channel.

A

UXILIARY AMPLIFIERS USING THE MICROPHONE INPUTS

(PINS MIC+, MIC− AND AUXO)
The auxiliary transmit amplifier using the microphone

MIC+ and MIC− inputs has a gain of 25.5 dB referenced to
AUXO. Without limitation from the output, the input stage
can accommodate signals up to 16 mV (RMS) at room
temperature for 2% of THD.

The automatic gain control has no effect on this channel.

A

UXILIARY AMPLIFIERS USING HFTX (PINS HFTX AND

AUXO)
The auxiliary transmit amplifier using the HFTX input has

a gain of 15.2 dB referenced to AUXO.
The automatic gain control has no effect on this channel.

RX

AMPLIFIER USING IR (PINS IR AND AUXO)

The auxiliary receive amplifier uses pin IR as input.
The input is referenced to pin LN and the DC biasing
between these two pins is one diode voltage. The voltage
gain between the input IR (referenced to LN) and the
output AUXO is typically equal to 32.8 dB, which
compensates typically the attenuation provided by the
anti-sidetone network.

Automatic gain control is provided for line loss
compensation.

Automatic gain control (pin AGC)

The TEA1097 performs automatic line loss compensation,
which fits well with the true line attenuation. The automatic
gain control varies the gain of some transmit and receive
amplifiers in accordance with the DC line current.
The control range is 6.45 dB for G

v(MIC-LN)

, G

v(IR-RECO)

and

G

v(IR-AUXO)

and 6.8 dB for G

v(TXAUX-LN)

, which corresponds
approximately to a line length of 5.5 km for a 0.5 mm
twisted-pair copper cable.

To enable this gain control, the pin AGC must be shorted
to pin LN. The start current for compensation corresponds
to a line current equal to typically 23 mA and the stop
current to 57 mA. The start current can be increased by
connecting an external resistor between pins AGC and LN.
It can be increased to 40 mA (using a resistor typically
equal to 80 kΩ). The start and stop current will be
maintained in a ratio equal to 2.5. By leaving the AGC pin
open-circuit, the gain control is disabled and no line loss
compensation is performed.

1999 Apr 08 13

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Base microphone channel (pins TXIN, GATX, TXOUT
and GNDTX) see Fig.7

The TEA1097 has an asymmetrical base microphone
input TXIN with an input resistance of 20 kΩ.
The DC biasing of the input is 0 V.

The output TXOUT is biased at two diodes voltage and has
a current capability equal to 20 µA (RMS). The gain of the
microphone amplifier (from pins TXIN to TXOUT) can be
adjusted from 0 to 31 dB to suit specific application
requirements.

The gain is proportional to the value of R

GATX

and equals

14.85 dB with R

GATX

= 30.1 kΩ. Without limitation from the
output, the microphone input stage can accommodate
signals up to 18 mV (RMS) at room temperature for 2% of
THD.

A capacitor can be connected in parallel with R

GATX

to

provide a 1st-order low-pass filter.

Fig.7 Base microphone channel.

The pin numbers given in parenthesis refer to the TEA1097H.

handbook, full pagewidth

MGL395

V I I V

C

MIC

V

BB

R

MIC

TXIN

GNDTX

TXOUT

GATX

29

(27)

30

(28)

28

(26)

31

(29)

R

GATX

C

GATX

1999 Apr 08 14

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Loudspeaker channel

Fig.8 Loudspeaker channel.

The pin numbers given in parenthesis refer to the TEA1097H.

handbook, full pagewidth

MGL394

DYNAMIC

LIMITER

VOLUME

CONTROL

I V

V I

DLC

LSAO

GALS

VOL

HFRX

14

(11)

16

(12)

11
(8)

7

(1)

27

(23)

V

BB

R

GALS

C

GALS

C

LSAO

C

DLC

R

VOL

to

logic

LOUDSPEAKER AMPLIFIER: PINS HFRX, GALS AND LSAO
The TEA1097 has an asymmetrical input for the

loudspeaker amplifier with an input resistance of 20 kΩ
between pins HFRX and GND. It is biased at two diodes
voltage. The input stage can accommodate signals up to
580 mV (RMS) at room temperature for 2% of THD.

The rail-to-rail output stage is designed to power a
loudspeaker down to 8 Ω connected as a single-ended
load (between pins LSAO and GND). When the circuit is
externally supplied, the maximum output power is equal to
280 mW (typ.) for 6 V applied to pin ESI.

The gain of the loudspeaker amplifier can be adjusted from
0 to 35 dB to suit specific application requirements.
The gain from HFRX to LSAO is proportional to the value
of R

GALS

and equals 28 dB with R

GALS

= 255 kΩ.

A capacitor connected in parallel with R

GALS

is

recommended and provides a first-order low-pass filter.

V

OLUME CONTROL (PIN VOL)

The loudspeaker amplifier gain can be adjusted with the
potentiometer R

VOL

. A linear potentiometer can be used to
obtain logarithmic control of the gain at the loudspeaker
amplifier. Each 1.9 kΩ increase of R

VOL

results in a gain

loss of 3 dB.

D

YNAMIC LIMITER (PIN DLC)

The dynamic limiter of the TEA1097 prevents clipping of
the loudspeaker output stage and protects the operation of
the circuit when the supply voltage at VBB falls below 2.7 V.

Hard clipping of the loudspeaker output stage is prevented
by rapidly reducing the gain when the output stage starts
to saturate. The time in which gain reduction is effected
(clipping attack time) is approximately a few milliseconds.
The circuit stays in the reduced gain mode until the peaks
of the loudspeaker signals no longer cause saturation.
The gain of the loudspeaker amplifier then returns to its
normal value within the clipping release time (typically
100 ms). Both attack and release times are proportional to
the value of the capacitor C

DLC

. The total harmonic
distortion of the loudspeaker output stage, in reduced gain
mode, stays below 1% up to 10 dB (min.) of input voltage
overdrive [providing V

HFRX

is below 580 mV (RMS)].

When the supply voltage drops below an internal threshold
voltage of 2.7 V, the gain of the loudspeaker amplifier is
rapidly reduced (approximately 1 ms). When the supply
voltage exceeds 2.7 V, the gain of the loudspeaker
amplifier is increased again. By forcing a level lower than

0.2 V on pin DLC, the loudspeaker amplifier is muted.

1999 Apr 08 15

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Logic inputs
Table 1 Selection of transmit and receive channels for 12 different application modes

LOGIC INPUTS

FEATURES APPLICATION EXAMPLES

PD HFC MUTT MUTR AUXC

0 X X X 1 HFRX to LSAO ringer mode
0 X X X 0 flash, DC dialling
10000DTMF to LN; DTMF to RECO;

QR and MICS are active

DTMF dialling in handset

10010MICtoAUXO; RAUX to RECO;

QR and MICS are active

cordless intercom with
corded handset

10110MICtoLN; IR to RECO;

IR to AUXO; MIC to TXOUT ; QR and
MICS are active

handset conversation

10101TXAUX to LN and IR to AUXO conversation using auxiliary

I/O; cordless: digital

handsfree in mobile
11011RAUX to RECO and HFRX to LSAO listening on the loudspeaker
11001TXAUX to LN; IR to AUXO;

RAUX to RECO; HFRX to LSAO

answering machine: play and

record messages; listen the

recorded message on the

loudspeaker
11000DTMF to LN; DTMF to RECO;

HFRX to LSAO; QR and MICS are
active

DTMF dialling in handsfree

or group listening modes

11101TXAUX to LN; IR to AUXO;

IR to RECO and HFRX to LSAO

answering machine: play and

record messages while

listening in the loudspeaker
11010TXIN to TXOUT; HFTX to AUXO;

RAUX to RECO; HFRX to LSAO
and MICS is active

cordless intercom with base

11110TXIN to TXOUT; TXAUX to LN;

IR to RECO; IR to AUXO;
HFRX to LSAO; MICS is active

digital handsfree

conversation

11100MICtoLN; IR to RECO;

IR to AUXO; HFRX to LSAO;
MIC to TXOUT; QR and MICS are
active

handset conversation with

group-listening

1999 Apr 08 16

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); DC levels are referenced to GND.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

positive continuous line voltage −0.4 +12 V
repetitive line voltage during switch-on or line

interruption

−0.4 +13.2 V

V

ESI

positive continuous voltage on pin ESI −0.4 +6 V

I

i(ESI)

input current at pin ESI − 140 mA

V

n(max)

maximum voltage

on pins REG, SLPE, IR and AGC −0.4 V

LN

+ 0.4 V

on all other pins except V

DD

−0.4 VBB+ 0.4 V

I

line

maximum line current for

TEA1097H − 140 mA
TEA1097TV − 130 mA

P

tot

total power dissipation T

amb

=75°C
TEA1097TV − 400 mW
TEA1097H − 720 mW

T

stg

IC storage temperature −40 +125 °C

T

amb

operating ambient temperature −25 +75 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

TEA1097TV 115 K/W
TEA1097H 63 K/W

1999 Apr 08 17

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Fig.9 Safe operating area (TEA1097TV).

LINE T

amb

(°C) P

tot

(mW)

(1) 25 800
(2) 35 720
(3) 45 640
(4) 55 560
(5) 65 480
(6) 75 400

handbook, full pagewidth

160

0

3.5 9.5

(3)

11.5

I

line

(mA)

7.55.5

120

40

80

13.5

V

SLPE

(V)

FCA026

(5)

(6)

(2)

(4)

(1)

1999 Apr 08 18

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Fig.10 Safe operating area (TEA1097H).

LINE T

amb

(°C) P

tot

(mW)

(1) 35 1304
(2) 45 1158
(3) 55 1012
(4) 65 866
(5) 75 720

handbook, full pagewidth

160

0

3 911

I

line

(mA)

75

120

40

80

134 10 1286

V

SLPE

(V)

FCA025

(1)

(2)

(5)

(3)

(4)

1999 Apr 08 19

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

CHARACTERISTICS

I

line

= 15 mA; R

SLPE

=20Ω; Z

line

= 600 Ω; f = 1 kHz; T

amb

=25°C; AGC pin connected to LN; PD = HIGH; HFC = LOW;

AUXC = LOW;

MUTT = HIGH; MUTR = HIGH; measured according to test circuits; DC levels are referenced to GND;

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

L

INE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND V

BB

)

V

SLPE

stabilized voltage between SLPE
and GND (V

ref

)

I

line

= 15 mA 3.4 3.7 4 V

I

line

= 70 mA 5.7 6.1 6.5 V

V

BB

regulated supply voltage for
internal circuitry

I

line

= 15 mA 2.75 3.0 3.25 V

I

line

= 70 mA 4.9 5.3 5.7 V

I

line

line current for voltage increase start current − 18 − mA

stop current − 45 − mA

∆V

SLPE(T)

stabilized voltage variation with
temperature referenced to 25 °C

T

amb

= −25 to +75 °C −±60 − mV

∆V

BB(T)

regulated voltage variation with
temperature referenced to 25 °C

T

amb

= −25 to +75 °C −±30 − mV

I

BB

current available on pin V

BB

speech mode − 11 − mA
digital handsfree mode;

HFC = HIGH

− 9.5 − mA

V

LN

line voltage I

line

=1mA − 1.55 − V

I

line

=4mA − 2.35 − V

I

line

= 15 mA 3.7 4.0 4.3 V

I

line

= 130 mA − 8.7 9.3 V
EXTERNAL SUPPLY (PIN ESI)
V

ESI

external voltage supply allowed
on pin ESI

−− 6V

voltage on pin ESI when
supplied by a current source

I

ESI

= 140 mA except in

power-down mode

− 6.6 − V

I

i(ESI)

input current on pin ESI V

ESI

= 3.5 V − 3.1 − mA

I

ESI(ext)

external current supply allowed
on pin ESI

−− 140 mA

1999 Apr 08 20

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

SUPPLY FOR PERIPHERALS (PIN VDD)
V

DD

regulated supply voltage on V

DDVBB

> 3.35 V + 0.25 V

(typ.)

3.1 3.35 3.6 V

otherwise − V

BB

− 0.25 − V

∆V

DD(T)

regulated voltage variation with
temperature referenced to 25 °C

T

amb

= −25 to +75 °C;
VBB> 3.35 V + 0.25 V
(typ.)

−±30 − mV

I

DD

current consumption on V

DD

in trickle mode;
I

line

= 0 mA;
VDD= 1.5 V;
VBBdischarging

− 15 150 nA

V

DD

> 3.35 V 60 100 −µA

I

DD(o)

current available for peripherals VDD= 3.35 V −− −3mA
SUPPLY FOR MICROPHONE (PIN MICS)
V

MICS

supply voltage for a microphone − 2 − V
I

MICS

current available on MICS −− −1mA
POWER-DOWN INPUT (PIN PD)
V

IL

LOW-level input voltage −0.4 − +0.3 V
V

IH

HIGH-level input voltage 1.8 − VBB+ 0.4 V
I

i(pd)

input current −−3 −6 µA
I

BB(pd)

current consumption on V

BB

during power-down phase

PD = LOW;
AUXC = LOW

− 460 −µA

RINGER MODE (PINS PD, AUXC, HFRX AND LSAO)
I

i(ESI)

input current on pin ESI PD = LOW;

AUXC = HIGH;
V

ESI

= 3.5 V

− 3.1 − mA

G

v(HFRX-LSAO)

voltage gain from pin HFRX to

LSAO

PD = LOW;
AUXC = HIGH;
V

ESI

= 3.5 V

V

HFRX

= 20 mV (RMS);

R

GALS

= 255 kΩ

− 28 − dB

Preamplifier inputs (pins MIC+, MIC−, IR, DTMF, TXIN, HFTX, HFRX, TXAUX and RAUX)
Z

i(MIC)

 input impedance

differential between
pins MIC+ and MIC−

− 70 − kΩ

single-ended between
pins MIC+/MIC− and GNDTX

− 35 − kΩ

Z

i(IR)

 input impedance between pins

IR and LN

− 20 − kΩ

Z

i(DTMF)

 input impedance between pins

DTMF and GND

− 20 − kΩ

Z

i(TXIN)

 input impedance between pins

TXIN and GNDTX

− 20 − kΩ

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 21

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Z

i(HFTX)

 input impedance between pins

HFTX and GND

− 20 − kΩ

Z

i(HFRX)

 input impedance between pins

HFRX and GND

− 20 − kΩ

Z

i(TXAUX)

 input impedance between pins

TXAUX and GND

− 20 − kΩ

Z

i(RAUX)

 input impedance between pins

RAUX and GND

− 20 − kΩ

TX amplifiers; see note 1
TX

HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC− AND LN)

G

v(MIC-LN)

voltage gain from pin MIC+/MIC−

to LN

V

MIC

= 5 mV (RMS) 43.3 44.3 45.3 dB

∆G

v(f)

gain variation with frequency

referenced to 1 kHz

f = 300 to 3400 Hz −±0.25 − dB

∆G

v(T)

gain variation with temperature

referenced to 25 °C

T

amb

= −25 to +75 °C −±0.25 − dB

CMRR common mode rejection ratio − 80 − dB
THD total harmonic distortion at pinLNVLN = 1.4 V (RMS) −− 2%

I

line

= 4 mA;

VLN= 0.12 V (RMS)

−− 10 %

V

no(LN)

noise output voltage at pin LN;

pins MIC+/MIC− shorted

through 200 Ω

psophometrically
weighted (p53 curve)

−−77.5 − dBmp

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;
MUTR = LOW;
AUXC = LOW

60 80 − dB

DTMF AMPLIFIER (PINS DTMF, LN AND RECO)
G

v(DTMF-LN)

voltage gain from pin DTMF toLNV

DTMF

= 50 mV (RMS) 24.35 25.35 26.35 dB

∆G

v(f)

gain variation with frequency

referenced to 1 kHz

f = 300 to 3400 Hz −±0.25 − dB

∆G

v(T)

gain variation with temperature

referenced to 25 °C

T

amb

= −25 to +75 °C −±0.25 − dB

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = HIGH;
MUTR = HIGH;
AUXC = LOW

60 80 − dB

G

v(DTMF-RECO)

voltage gain from pin DTMF to

RECO

V

DTMF

= 50 mV (RMS) −−16.5 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 22

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

TX AUXILIARY AMPLIFIER USING TXAUX (PINS TXAUX AND LN)
G

v(TXAUX-LN)

voltage gain from pin TXAUX toLNV

TXAUX

= 0.1 V (RMS) 11.5 12.5 13.5 dB

∆G

v(f)

gain variation with frequency

referenced to 1 kHz

f = 300 to 3400 Hz −±0.25 − dB

∆G

v(T)

gain variation with temperature

referenced to 25 °C

T

amb

= −25 to +75 °C −±0.25 − dB

THD total harmonic distortion at LN V

LN

= 1.4 V (RMS) −− 2%

V

TXAUX(rms)

maximum input voltage at

TXAUX (RMS value)

I

line

= 70 mA; THD = 2% − 1.2 − V

V

no(LN)

noise output voltage at pin LN;

pin TXAUX shorted to GND

through 200 Ω in series with

10 µF

psophometrically
weighted (p53 curve)

−−80.5 − dBmp

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;
MUTR = LOW;
AUXC = LOW

60 80 − dB

MICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC− AND TXOUT)
G

v(MIC-TXOUT)

voltage gain from pin MIC+/MIC−

to TXOUT

V

MIC

= 2 mV (RMS) 48.3 49.8 51.3 dB

∆G

v(f)

gain variation with frequency

referenced to 1 kHz

f = 300 to 3400 Hz −±0.1 − dB

∆G

v(T)

gain variation with temperature

referenced to 25 °C

T

amb

= −25 to +75 °C −±0.35 − dB

RX amplifiers; see note 1
RX

AMPLIFIERS USING IR (PINS IR AND RECO)

G

v(IR-RECO)

voltage gain from pin IR

(referenced to LN) to RECO

VIR= 15 mV (RMS) 28.7 29.7 30.7 dB

∆G

v(f)

gain variation with frequency

referenced to 1 kHz

f = 300 to 3400 Hz −±0.25 − dB

∆G

v(T)

gain variation with temperature

referenced to 25 °C

T

amb

= −25 to +75 °C −±0.3 − dB

V

IR(rms)(max)

maximum input voltage on IR

(referenced to LN) (RMS value)

I

line

= 70 mA; THD = 2% − 50 − mV

V

RECO(rms)(max)

maximum output voltage on pin

RECO (RMS value)

THD = 2% 0.75 0.9 − V

V

no(RECO)(rms)

noise output voltage at pin

RECO; pin IR is an open-circuit

(RMS value)

psophometrically
weighted (p53 curve)

−−88 − dBVp

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;
MUTR = LOW;
AUXC = LOW

60 80 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 23

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

RX EARPIECE AMPLIFIER (PINS GARX AND QR)
∆G

v(RECO-QR)

gain voltage range between pins

RECO and QR

−3 − +15 dB

V

QR(rms)(max)

maximum output voltage on pin

QR (RMS value)

sine wave drive;
RL= 150 Ω; THD < 2%

0.75 0.9 − V

V

no(QR)(rms)

noise output voltage at pin QR;

pin IR is an open-circuit

(RMS value)

G

v(QR)

= 0 dB;
psophometrically
weighted (p53 curve)

−−88 − dBVp

RX AMPLIFIER USING RAUX (PINS RAUX AND RECO)
G

v(RAUX-RECO)

voltage gain from pin RAUX to
RECO

V

RAUX

= 0.4 V (RMS) −3.7 −2.4 −1.1 dB

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

f = 300 to 3400 Hz −±0.25 − dB

∆G

v(T)

gain variation with temperature
referenced to 25 °C

T

amb

= −25 to +75 °C −±0.25 − dB

V

RAUX(rms)(max)

maximum input voltage on RAUX
(RMS value)

THD=2% − 0.95 − V

V

no(RECO)(rms)

noise output voltage at pin
RECO; pin RAUX shorted to
GND through 200 Ω in series
with 10 µF (RMS value)

psophometrically
weighted (p53 curve)

−−100 − dBVp

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;
MUTR = LOW;
AUXC = LOW

60 80 − dB

Auxiliary amplifiers using AUXO; see note 1
TX

AUXILIARY AMPLIFIER USING MIC+ AND MIC− (PINS MIC+, MIC− AND AUXO)

G

v(MIC-AUXO)

voltage gain from pin MIC+/MIC−
to AUXO

V

MIC

= 10 mV (RMS) 24.2 25.5 26.8 dB

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

f = 300 to 3400 Hz −±0.1 − dB

∆G

v(T)

gain variation with temperature
referenced to 25 °C

T

amb

= −25 to +75 °C −±0.3 − dB

V

MIC(rms)

maximum input voltage on
MIC+/MIC− (RMS value)

THD=2% − 16 − mV

V

no(AUXO)(rms)

noise output voltage at pin
AUXO; pins MIC+/MIC− shorted
to GNDTX through 200 Ω in
series with 10 µF (RMS value)

psophometrically
weighted (p53 curve)

−−91 − dBVp

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 24

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

TX AUXILIARY AMPLIFIER USING HFTX (PINS HFTX AND AUXO)
G

v(HFTX-AUXO)

voltage gain from pin HFTX to
AUXO

V

HFTX

= 100 mV (RMS) 14.2 15.2 16.2 dB

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

f = 300 to 3400 Hz −±0.1 − dB

∆G

v(T)

gain variation with temperature
referenced to 25 °C

T

amb

= −25 to +75 °C −±0.1 − dB

V

AUXO(rms)

maximum output voltage on pin
AUXO (RMS value)

THD = 2% 0.8 0.9 − V

V

no(AUXO)(rms)

noise output voltage at pin
AUXO; pin HFTX shorted to
GND through 200 Ω in series
with 10 µF (RMS value)

psophometrically
weighted (p53 curve)

−−91.5 − dBVp

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;
MUTR = HIGH;
AUXC = LOW

60 80 − dB

RX AMPLIFIER USING IR (PINS IR AND AUXO)
G

v(IR-AUXO)

voltage gain from pin IR
(referenced to LN) to AUXO

VIR= 3 mV (RMS) 31.6 32.8 34 dB

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

f = 300 to 3400 Hz −±0.1 − dB

∆G

v(T)

gain variation with temperature
referenced to 25 °C

T

amb

= −25 to +75 °C −±0.3 − dB

V

AUXO(rms)

maximum output voltage on
AUXO (RMS value)

THD = 2% 0.8 0.9 − V

V

no(AUXO)(rms)

noise output voltage at pin
AUXO; pin IR is an open-circuit
(RMS value)

psophometrically
weighted (p53 curve)

−−85 − dBVp

∆G

v(mute)

gain reduction if not activated HFC = HIGH;

MUTT = LOW;
MUTR = HIGH;
AUXC = HIGH

60 80 − dB

Automatic Gain Control (pin AGC)

∆G

v(trx)

gain control range for transmit
and receive amplifiers affected
by the AGC; with respect to
I

line

=15mA

I

line

= 70 mA; on

G

v(MIC-LN)

, G

v(IR-RECO)

and G

v(IR-AUXO)

5.45 6.45 7.45 dB

I

line

= 70 mA;

G

v(TXAUX-LN)

5.8 6.8 7.8 dB

I

start

highest line current for
maximum gain

− 23 − mA

I

stop

lowest line current for maximum
gain

− 57 − mA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 25

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Logic inputs (pins HFC, AUXC, MUTT and MUTR)

V

IL

LOW-level input voltage −0.4 − +0.3 V

V

IH

HIGH-level input voltage 1.8 − VBB+ 0.4 V

I

i

input current

for pins HFC and AUXC − 36µA

for pins MUTT and MUTR −−2.5 −6 µA
Base microphone amplifier (pins TXIN, TXOUT and GATX); see note 1
G

v(TXIN-TXOUT)

voltage gain from pin TXIN to
TXOUT

V

TXIN

= 3 mV (RMS);

R

GATX

= 30.1 kΩ

13.15 14.85 16.55 dB

∆G

v

voltage gain adjustment with
R

GATX

−15 − +16 dB

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

f = 300 to 3400 Hz −±0.1 − dB

∆G

v(T)

gain variation with temperature
referenced to 25 °C

T

amb

= −25 to +75 °C −±0.15 − dB

V

no(TXOUT)(rms)

noise output voltage at pin
TXOUT; pin TXIN is shorted
through 200 Ω in series with
10 µF to GNDTX (RMS value)

psophometrically
weighted (p53 curve)

−−101 − dBVp

∆G

v(mute)

gain reduction if not activated HFC = HIGH;

MUTT = LOW;
MUTR = LOW;
AUXC = LOW

60 80 − dB

Loudspeaker amplifier (pins HFRX, LSAO, GALS and VOL); see note 1
G

v(HFRX-LSAO)

voltage gain from pin HFRX to
LSAO

V

HFRX

= 20 mV (RMS);

R

GALS

= 255 kΩ

25.5 28 30.5 dB

∆G

v

voltage gain adjustment with
R

GALS

−28 − +7 dB

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

f = 300 to 3400 Hz −±0.3 − dB

∆G

v(T)

gain variation with temperature
referenced to 25 °C

T

amb

= −25 to +75 °C −±0.3 − dB

∆G

v(vol)

voltage gain variation related to
∆R

VOL

= 1.9 kΩ

−−3 − dB

V

(HFRX)(rms)(max)

maximum input voltage at pin
HFRX (RMS value)

I

line

= 70 mA;

R

GALS

=33kΩ; for 2%

THD in the input stage

− 580 − mV

V

no(LSAO)(rms)

noise output voltage at pin
LSAO; pin HFRX is open-circuit
(RMS value)

psophometrically
weighted (p53 curve)

−−79 − dBVp

V

LSAO(rms)

output voltage (RMS value)
without external supply on pin
ESI

IBB= 0 mA; IDD=1mA

I

line

=18mA − 0.9 − V

I

line

=30mA − 1.2 − V

I

line

>50mA − 1.6 − V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 26

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Note

1. When the channel is enabled according to Table 1.

I

LSAO(max)

maximum output current at pin
LSAO (peak value)

external supply on ESI 150 300 − mA

Dynamic limiter (pins LSAO and DLC); see note 1
t

att

attack time when V

HFRX

jumps from

20 mV to 20 mV + 10 dB

−− 5ms

when V

BB

jumps below

V

BB(th)

− 1 − ms

t

rel

release time when V

HFRX

jumps from

20 mV + 10 dB to 20 mV

− 100 − ms

THD total harmonic distortion at

V

HFRX

= 20 mV + 10 dB

t>t

att

− 0.1 2 %

V

BB(th)

VBB limiter threshold − 2.7 − V
Mute Loudspeaker (pin DLC); see note 1
V

DLC(th)

threshold voltage required on pin

DLC to obtain mute receive

condition

−0.4 − +0.2 V

I

DLC(th)

threshold current sourced by pin

DLC in mute receive condition

V

DLC

= 0.2 V − 100 −µA

∆G

vrx(mute)

voltage gain reduction in mute

receive condition

V

DLC

= 0.2 V 60 80 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Apr 08 27

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

auxiliary inputs/outputs and analog multiplexer

TEA1097

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TEST AND APPLICATION INFORMATION

o

k, full pagewidth

FCA001

C

IR

100 nF

C

emc

10 nF

i = 15 mA
J_line

C

imp

100 µF

C

REG

4.7 µF

C

VBB

470 µF

C

VDD

47 µF

Z

imp

620 Ω

V

IR

V

HFRX

R

SLPE
20 Ω

R

MIC

200 Ω

C

GATX

100 pF

C

RAUX

100 nF

V

RAUX

C

TXAUX

100 nF

C

DTMF

100 nF

R

GATX

30.1 kΩ

R

STAB

3.65
kΩ

R

VOL

0 to

22 kΩ

R

LSAO

8 Ω

PD

HFC

AUXC

MUTT

MUTR

AUXO

QR

GARX

RECO

HFRX

GALS

LSAO

40

(38)

39

(37)

3

(41)

1

(39)

2

(40)

6

(44)

35

(33)

36

(34)

37

(35)

7

(1)

14

(11)

16

(12)

GND

RAUX

TXAUX

DTMF

GATX

TXOUT

MIC−

MIC+

SLPE REG AGC LN ESI

V

BBVDD

IR

GNDTX STAB VOL DLC

17
(13)31(29)25(21)

27

(23)11(8)

21

(17)

18

(14)20(16)22(18)19(15)12(9)13(10)23(19)

24

(20)

33

(31)

32

(30)

29

(27)

28

(26)

34

(32)

C

HFTX

100 nF

HFTX

MICS

38

(36)

5

(43)

C

TXIN

100 nF

TXIN

30

(28)

4

(42)

TEA1097

from

controller

C

AUXO
10 µF

C

GAR

100 pF

C

GARS

1 nF

C

RXE

100 nF

C

HFRX

100 nF

C

GALS

150 pF

C

GALS

220 µF

C

DLC
470
nF

R

e2

100 kΩ

R

QR

150 Ω

R

e1

100 kΩ

R

AUXO

10 kΩ

R

GALS

255 kΩ

external

supply

D

ESI

Dz
V

d

10 V

C

exch

100 µF

Z

exch

600 Ω

C

MICS

4.7 µF

C

QR

4.7 µF

V

TXAUX

V

MIC

V

DTMF

V

TXIN

V

HFTX

Fig.11 Test circuit.

The pin numbers given in parenthesis refer to the TEA1097H.

1999 Apr 08 28

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

auxiliary inputs/outputs and analog multiplexer

TEA1097

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handbook, full pagewidth

MGL396

C

mich

33 nF

C

tx1

C

IR

100 nF

C

bal

220 nF

C

emc

10 nF

C

imp

22 µF

C

REG

4.7 µF
C

VBB

470 µF

C

VDD

47 µF

C

HFTX

100 nF

C

tx2

R

tx1

22 nF

15 kΩ

R

tx2

22 nF

15 kΩ

R

ast1

130 kΩ

R

ast2

3.92 kΩ

R

ast3

392 Ω

R

bal1

130 Ω

Z

imp

620 Ω

R

bal2

820 Ω

R

SLPE
20 Ω

R

tx3

8.2
kΩ

base

microphone

handset

microphone

C

micb

22 nF

C

RAUX

100 nF

C

TXAUX

100 nF

C

DTMF

100 nF

C

TXIN

100 nF

R

STAB

3.65
kΩ

R

bmics

2 kΩ

R

MICM
1 kΩ

R

MICP
1 kΩ

C

MICS

10 µF

R

GATX

30.1 kΩ

R

VOL

0 to

22 kΩ

PD

HFC

AUXC

MUTT

MUTR

AUXO

QR

GARX

RECO

HFRX

GALS

LSAO

40

(38)

39

(37)

3

(41)

1

(39)

2

(40)

6

(44)

35

(33)

36

(34)

37

(35)

7

(1)

14

(11)

16

(12)

GND

RAUX

TXAUX

DTMF

TXIN

GATX

TXOUT

HFTX

MIC−

MIC+

MICS

SLPE REG AGC LN ESI

VBBV

DD

IR

GNDTX STAB VOL DLC

17

(13)31(29)25(21)

27

(23)11(8)

21

(17)

18

(14)20(16)22(18)19(15)12(9)13(10)23(19)

24

(20)

33

(31)

32

(30)

38

(36)

28

(26)

29

(27)

30

(28)

34

(32)

5

(43)

4

(42)

TEA1097

from

controller

C

AUXO

100 nF

C

GAR

100 pF

C

GARS

1 nF

C

RXE

100 nF

C

GALS

150 pF

from digital

handsfree

to digital handsfree

from digital

answering machine

to digital
answering machine
or digital handsfree

from digital
answering machine
or digital handsfree

C

DLC

470

nF

R

e2

100 kΩ

R

e1

100 kΩ

R

GALS

255 kΩ

from MICS

external

supply

D

ESI

Dz
V

d

10 V

D2 D3

D1 D4

A

B

MICS

C

QR

4.7 µF

C

LSAO

220 µF

Fig.12 Basic application diagram.

The pin numbers given in parenthesis refer to the TEA1097H.

1999 Apr 08 29

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

PACKAGE OUTLINES

UNIT A

1

A2A

3

b

p

cD

(1)E(2)

Z

(1)

eHELLpQywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

0.3

0.1

2.45

2.25

0.25

0.42

0.30

0.22

0.14

15.6

15.2

7.6

7.5

0.762 2.25

12.3

11.8

1.15

1.05

0.6

0.3

7
0

o
o

0.1 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

1.7

1.5

SOT158-1

92-11-17
95-01-24

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

y

40

20

21

1

pin 1 index

0.012

0.004

0.096

0.089

0.017

0.012

0.0087

0.0055

0.61

0.60

0.30

0.29

0.03 0.089

0.48

0.46

0.045

0.041

0.024

0.012

0.004

0.2

0.008 0.004

0.067

0.059

0.010

0 5 10 mm

scale

VSO40: plastic very small outline package; 40 leads

SOT158-1

A

max.

2.70

0.11

1999 Apr 08 30

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

UNIT A1A2A3b

p

cE

(1)

eH

E

LL

p

Zywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.25

0.05

1.85

1.65

0.25

0.40

0.20

0.25

0.14

10.1

9.9

0.8 1.3

12.9

12.3

1.2

0.8

10

0

o

o

0.15 0.10.15

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.95

0.55

SOT307-2

95-02-04
97-08-01

D

(1) (1)(1)

10.1

9.9

H

D

12.9

12.3

E

Z

1.2

0.8

D

e

E

B

11

c

E

H

D

Z

D

A

Z

E

e

v M

A

X

1

44

34

33 23

22

12

y

θ

A

1

A

L

p

detail X

L

(A )

3

A

2

pin 1 index

D

H

v M

B

b

p

b

p

w M

w M

0 2.5 5 mm

scale

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

SOT307-2

A

max.

2.10

1999 Apr 08 31

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Apr 08 32

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Apr 08 33

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

NOTES

1999 Apr 08 34

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

NOTES

1999 Apr 08 35

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

TEA1097

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1999 SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Printed in The Netherlands 465002/750/03/pp36 Date of release: 1999 Apr 08 Document order number: 9397 750 05008