Datasheet tea1097 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA1097

Speech and loudspeaker amplifier
IC with auxiliary inputs/outputs and
analog multiplexer

Product specification
Supersedes data of 1998 Jun 11
File under Integrated Circuits, IC03

1999 Apr 08

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

FEATURES
Line interface

• Low DC line voltage

• Voltage regulator with adjustable DC voltage

• Symmetrical high-impedance inputs (70 kΩ) for

dynamic, magnetic or electric microphones

• Dual Tone Multi-Frequency (DTMF) input with
confidence tone on earphone and/or loudspeaker

• Receive amplifier for dynamic, magnetic or
piezo-electric earpieces (with externally adjustable gain)

• Automatic Gain Control (AGC) for true line loss
compensation.

Supplies

• Provides a strong 3.35 V regulated supply for
microcontroller or dialler

• Provides filtered power supply, optimized according to
line current and compatible with external voltage or
current sources

• Filtered 2 V power supply output for electret microphone

• Compatible with a ringer mode

• Power-Down (

Loudspeaker amplifier

• Single-ended rail-to-rail output

• Externally adjustable gain

• Dynamic limiter to prevent distortion

• Logarithmic volume control via linear potentiometer.

Auxiliary interfaces

• Asymmetrical high-impedance input for electret
microphone.

PD) logic input for power-down.

• General purpose auxiliary output for transmit and
receive

• Auxiliary transmit input with high signal level capability
dedicated to line transmission

• Auxiliary receive input with high signal level capability

• Integrated multiplexer for channels selection.

APPLICATIONS

• Telephone answering machines

• Telephones with digital handsfree

• Line powered telephone sets

• Cordless telephones

• Fax machines.

GENERAL DESCRIPTION

The TEA1097 is an analog bipolar circuit dedicated for
telephone applications. It includes a line interface, handset
microphone and earpiece amplifiers, base microphone
and loudspeaker amplifiers, some specific auxiliary
Inputs/Outputs (I/Os) and an analog multiplexer to enable
the right transmit and/or receive channels. The multiplexer
is controlled by a logic circuitry decoding four logic inputs
provided by a microcontroller. Twelve different application
modes have been defined and can be accessed by
selecting the right logic inputs.

This IC can be supplied by the line and/or by the mains if
available (in a cordless telephone or a telephone
answering machine for example). It provides a 3.35 V
supply for a microcontroller or dialler and a 2 V filtered
voltage supply for electret microphones. The IC is
designed to facilitate the use of the loudspeaker amplifier
during ringing phase.

TEA1097

ORDERING INFORMATION

TYPE

NUMBER

TEA1097TV VSO40 plastic very small outline package; 40 leads SOT158-1
TEA1097H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);

1999 Apr 08 2

NAME DESCRIPTION VERSION

body 10 × 10 × 1.75 mm

PACKAGE

SOT307-2

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

QUICK REFERENCE DATA

I

= 15 mA; R

line

AUXC = LOW;

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

line

V

SLPE

V

BB

V

DD

V

ESI(ext)

I

ESI(ext)

I

BB

I

BB(pd)

G

v(MIC-LN)

G

v(IR-RECO)

∆G

v(QR)

G

v(TXIN-TXOUT)

G

v(TXAUX-LN)

G

v(HFRX-LSAO)

∆G

v(trx)

SLPE

=20Ω; Z

= 600 Ω; f = 1 kHz; T

line

=25°C; AGC pin connected to LN;PD = HIGH; HFC = LOW;

amb

MUTT = HIGH; MUTR = HIGH; measured according to test circuits; unless otherwise specified.

line current operating range normal operation

TEA1097H 11 − 140 mA
TEA1097TV 11 − 130 mA

with reduced performance 1 − 11 mA

stabilized voltage between SLPE
and GND (V

ref

)

regulated supply voltage for
internal circuitry

regulated supply voltage on
pin V

DD

external voltage supply allowed on

I

= 15 mA 3.4 3.7 4.0 V

line

I

= 70 mA 5.7 6.1 6.5 V

line

I

= 15 mA 2.75 3.0 3.25 V

line

I

= 70 mA 4.9 5.3 5.7 V

line

VBB> 3.35 V + 0.25 V

3.1 3.35 3.6 V

(typ.)
otherwise − V

− 0.25 − V

BB

−− 6V

pin ESI
external current supply allowed on

−− 140 mA

pin ESI
current available on pin V

BB

speech mode − 11 − mA
handsfree mode;

− 9.5 − mA

HFC = HIGH

current consumption on VBB during

PD = LOW − 460 −µA

power-down phase
voltage gain from pin

V

= 5 mV (RMS) 43.3 44.3 45.3 dB

MIC

MIC+/MIC− to LN
voltage gain from pin IR

VIR= 15 mV (RMS) 28.7 29.7 30.7 dB

(referenced to LN) to RECO
gain voltage range between pins

−3 − +15 dB

RECO and QR
voltage gain from pin TXIN to

TXOUT
voltage gain from pin TXAUX to LN V

V

= 3 mV (RMS);

TXIN

R

= 30.1 kΩ; note 1

GATX

= 0.1 V (RMS);

TXAUX

13.15 14.85 16.55 dB

11.5 12.5 13.5 dB

note 1

voltage gain from pin HFRX to
LSAO

gain control range for transmit and
receive amplifiers affected by the
AGC; with respect to I

=15mA

line

V

= 20 mV (RMS);

HFRX

R

= 255 kΩ; note 1

GALS

I

= 70 mA; on

line

G

v(MIC-LN)

and G

v(IR-AUXO)

, G

v(IR-RECO)

25.5 28 30.5 dB

5.45 6.45 7.45 dB

Note

1. When the channel is enabled according to Table 1.

1999 Apr 08 3

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

BLOCK DIAGRAM

handbook, full pagewidth

REG SLPE
20

(16)18(14)

AGC

GND

TXAUX

DTMF

19 (15)

LN

22 (18)

17 (13)

5 (43)

34 (32)

STARTER

LINE CURRENT DETECTION
LOW VOLTAGE BEHAVIOUR

AGC

Tail currents for preamps

ATT.

SWITCH

TEA1097TV

SUPPLY

D6

MANAGEMENT

POWER-DOWN

CURRENT SOURCES

ANALOG

MULTIPLEXER

CONTROL

TEA1097

V

(10) 13

BB

(9) 12

ESI
V

(19) 23

DD

(20) 24

MICS

(38) 40

PD

HFC(37) 39
MUTT(39) 1
MUTR(40) 2
AUXC(41) 3

33 (31)

MIC+

32 (30)

MIC−

30 (28)

TXIN

STAB 25 (21)

GALS 14 (11)

16 (12)

LSAO

DLC 11 (8)

6 (44)

AUXO

37 (35)

RECO

36 (34)

GARX

35 (33)

QR

TAIL

CURRENTS

DYNAMIC

LIMITER

VOLUME

CONTROL

ATT.

(26) 28

(1) 7

(36) 38

(17) 21

(42) 4

MGL392

GATX(27) 29

TXOUT
GNDTX(29) 31

VOL(23) 27

HFRX

HFTX

IR

RAUX

The pin numbers given in parenthesis refer to the TEA1097H.

Fig.1 Block diagram.

1999 Apr 08 4

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

PINNING

SYMBOL

MUTT 1 39 logic input (active LOW)
MUTR 2 40 logic input (active LOW)
AUXC 3 41 logic input
RAUX 4 42 auxiliary receive amplifier input
TXAUX 5 43 auxiliary transmit amplifier input
AUXO 6 44 auxiliary amplifier output
HFRX 7 1 receive input for loudspeaker amplifier
n.c. 8 to 10,

DLC 11 8 dynamic limiter capacitor for the loudspeaker amplifier
ESI 12 9 external supply input
V

BB

GALS 14 11 loudspeaker amplifier gain adjustment
LSAO 16 12 loudspeaker amplifier output
GND 17 13 ground reference
SLPE 18 14 line current sense
LN 19 15 positive line terminal
REG 20 16 line voltage regulator decoupling
IR 21 17 receive amplifier input
AGC 22 18 automatic gain control/line loss compensation
V

DD

MICS 24 20 microphone supply output
STAB 25 21 reference current adjustment
VOL 27 23 loudspeaker volume adjustment
TXOUT 28 26 base microphone amplifier output
GATX 29 27 base microphone amplifier gain adjustment
TXIN 30 28 base microphone amplifier input
GNDTX 31 29 ground reference for microphone amplifiers
MIC− 32 30 negative handset microphone amplifier input
MIC+ 33 31 positive handset microphone amplifier input
DTMF 34 32 dual tone multi-frequency input
QR 35 33 earpiece amplifier output
GARX 36 34 earpiece amplifier gain adjustment
RECO 37 35 receive amplifier output
HFTX 38 36 transmit input for auxiliary receive amplifier
HFC 39 37 logic input
PD 40 38 power-down input (active LOW)

VSO40 QFP44

15 and 26

PIN

2 to 7, 22,
24 and 25

13 10 stabilized supply for internal circuitry

23 19 3.35 V regulated voltage supply for microcontroller

not connected

DESCRIPTION

TEA1097

1999 Apr 08 5

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

handbook, halfpage

MUTT
MUTR
AUXC
RAUX

TXAUX

AUXO

HFRX

n.c.
n.c.
n.c.

DLC

ESI

V

BB

GALS

n.c.

LSAO

GND

SLPE

LN

REG

1
2
3
4
5
6
7
8
9

10

TEA1097TV

11
12
13
14
15
16
17
18
19
20

MGL393

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

PD
HFC
HFTX
RECO
GARX
QR
DTMF
MIC+
MIC−
GNDTX
TXIN
GATX
TXOUT
VOL
n.c.
STAB
MICS
V
AGC
IR

TEA1097

DD

Fig.2 Pin configuration (VSO40).

1999 Apr 08 6

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

handbook, full pagewidth

HFRX

n.c.
n.c.

n.c
n.c
n.c
n.c

DLC

ESI

V

BB

GALS

TXAUX
43

RAUX

42

AUXC
41

TEA1097H

AUXO

44

1
2
3
4
5
6
7
8

9
10
11

MUTR
40

MUTT
39

PD
38

HFC
37

HFTX
36

RECO
35

GARX
34

33
32
31
30
29
28
27
26
25
24
23

TEA1097

QR
DTMF
MIC+
MIC−
GNDTX
TXIN
GATX
TXOUT
n.c.
n.c.
VOL

12

13

14

15

LN

GND

SLPE

LSAO

Fig.3 Pin configuration (QFP44).

FUNCTIONAL DESCRIPTION

All data given in this chapter are typical values, except
when otherwise specified.

Supplies

L

INE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE,

REG

AND V

BB

)

The supply for the TEA1097 and its peripherals is obtained
from the line. The IC generates a stabilized reference
voltage (V

) between pins SLPE and GND. This

ref

reference voltage is equal to 3.7 V for line currents lower
than 18 mA. It than increases linearly with the line current
and reaches the value of 6.1 V for line currents higher than
45 mA. For line currents below 9 mA, the internal
reference voltage generating V

is automatically adjusted

ref

to a lower value. This is the so-called low voltage area and
the TEA1097 has limited performances in this area
(see Section “Low voltage behaviour”). This reference
voltage is temperature compensated.

21

16

REG

17

18

19

IR

DD

V

AGC

20

MICS

STAB

22
n.c

FCA019

The voltage between pins SLPE and REG is used by the
internal regulator to generate the stabilized reference
voltage and is decoupled by means of a capacitor between
pins LN and REG.

This capacitor converted into an equivalent inductance
realizes the set impedance conversion from its DC value

) to its AC value (done by an external impedance).

(R

SLPE

The IC regulates the line voltage at pin LN and it can be
calculated as follows:

V

I

V

=

LN

SLPEIline

refRSLPE

I×+

SLPE

Ix–=

where:

I

= line current

line

Ix= current consumed on pin LN (approximately a
few µA)

I

= current flowing through the R

SLPE

SLPE

resistor.

1999 Apr 08 7

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

The preferred value for R
will affect more than the DC characteristics; it also
influences the transmit gains to the line, the gain control
characteristic, the sidetone level and the maximum output
swing on the line.

As can be seen from Fig.4, the internal circuitry is supplied
by pin VBB, which is a strong supply point combined with
the line interface. The line current is flowing through the
R

resistor and is sunk by the VBB voltage stabilizer,

SLPE

becoming available for a loudspeaker amplifier or any
peripheral IC. Its voltage is equal to 3.0 V for line currents
lower than 18 mA. It than increases linearly with the line
current and reaches the value of 5.3 V for line currents
greater than 45 mA. It is temperature compensated.

handbook, full pagewidth

LN

is 20 Ω. Changing this value

SLPE

SLPE

R

SLPE

20 Ω

The aim of the current switch TR1 and TR2 is to reduce
distortion of large AC line signals. Current I
to VBB via TR1 when the voltage on SLPE is greater than
VBB+ 0.25 V. When the voltage on SLPE is lower than this
value, the current I

The reference voltage V
an external resistor between pins REG and SLPE.
For large line currents, this increase can slightly affect
some dynamic performances such as maximum signal
level on the line for 2% THD. The voltage on pin VBB is not
affected by this external resistor. See Fig.5 for the main
DC voltages.

TR1

is shunted to GND via TR2.

SLPE

can be increased by connecting

ref

TR2

GND

TEA1097

is supplied

SLPE

V

BB

REG

GND

C

REG

4.7 µF

TP1

D1

R3

R2

TN1

R1

from

preamp

J1

Fig.4 Line interface principle.

E1

TN2

J2

GND

E2

D1

MGM298

1999 Apr 08 8

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

handbook, full pagewidth

8

voltages

(V)

6

4

2

0

0 0.01

0.02 0.05

0.040.03

TEA1097

FCA049

LN

SLPE

V

BB

V

DD

MICS

(A)

0.070.06

I

line

Fig.5 Main DC voltages as a function of line current.

EXTERNAL SUPPLY (PINS ESI AND VBB)
The TEA1097 can be supplied by the line as well as by

external power sources (voltage or current sources) that
must be connected to pin ESI.

The IC will choose which supply to use according to the
voltage it can provide. A voltage supply on ESI is efficient
only if its value is greater than the working voltage of the
internal V

voltage stabilizer. Otherwise the IC continues

BB

to be line powered. The current consumed on this source
is at least equal to the internal consumption. It depends on
the voltage difference between the value forced on ESI
and the working voltage of the internal stabilizer.
The current required increases with the voltage difference
to manage. The excess current compared to the internal
consumption becomes then available for other purposes
such as supplying a loudspeaker amplifier. The voltage
source should not exceed 6 V. If the value of the external
voltage source can be lower than the working voltage of
the internal stabilizer, an external diode is required to avoid
reverse current flowing into the external power supply.

SUPPLY FOR MICROCONTROLLERS (PIN V

V

DD

The voltage on V

supply point follows the voltage on V

DD

DD

)

BB

with a difference equal to 250 mV (typ.) and is internally
limited to 3.35 V. This voltage is temperature
compensated. This supply point can provide a current up
to 3 mA (typ.). Its internal consumption stays low (a few
10 nA) as long as VDD does not exceed 1.5 V (see Fig.6).

An external voltage can be connected on VDD with limited
extra consumption on VDD (typically 100 µA). This voltage
source should not be lower than 3.5 V and higher than 6 V.

VBB and VDD can supply external circuits in the limits of
currents provided either from the line or from pin ESI,
taking into account the internal current consumption.

In case of current source, the voltage on VBB and ESI
depends on the current available. It is internally limited to

6.6 V. The current source should not exceed 140 mA.

1999 Apr 08 9

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

8

10

handbook, full pagewidth

I

DD

(pA)

7

10

6

10

5

10

4

10

3

10

2

10

10

1.0

1.5 2.5 3.0

2.0

TEA1097

FCA050

VDD (V)

Fig.6 Current consumption on VDD.

SUPPLY FOR MICROPHONE (PINS MICS AND GNDTX)
The MICS output can be used as a supply for an electret

microphone. Its voltage is equal to 2 V; it can source
current up to 1 mA and has an output impedance equal to
200 Ω.

L

OW VOLTAGE BEHAVIOUR

For line currents below 9 mA, the reference voltage is
automatically adjusted to a lower value; the VBB voltage
follows the SLPE voltage with 250 mV difference.
The excess current available for other purposes than DC
biasing of the IC becomes small. In this low voltage area,
the IC has limited performances.

When the VBB voltage reaches 2.7 V, the VBB detector of
the receive dynamic limiter on pin LSAO acts continuously,
discharging the capacitor at pin DLC. In the DC condition,
the loudspeaker is automatically disabled below this
voltage.

When V

becomes lower than 2.5 V, the TEA1097 is

BB

forced in a low voltage mode whatever the levels on the
logic inputs are. It is a speech mode with reduced
performances only enabling the microphone channel
(between the MIC inputs and LN) and the earpiece
amplifier. These two channels are able to deliver signals
for line currents as small as 3 mA. The HFC input is tied to
GND sinking a current equal to 300 µA (typ.).

P

OWER-DOWN MODE (PINS PD AND AUXC)

To reduce current consumption during dialling or register
recall (flash), the TEA1097 is provided with a power-down

PD). When the voltage on pins PD and AUXC is

input (
LOW, the current consumption from VBB and VDD is
reduced to 460 µA (typ.). Therefore a capacitor of 470 µF
connected to pin VBB is sufficient to power the TEA1097
during pulse dialling or flash. The PD input has a pull-up
structure, while AUXC has a pull-down structure. In this
mode, the capacitor C

is internally disconnected.

REG

1999 Apr 08 10

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

RINGER MODE (PINS ESI, VBB, AUXC AND PD)
The TEA1097 is designed to be activated during the

ringing phase. The loudspeaker amplifier can be used for
the melody signal. The IC must be powered by an external
supply on pin ESI, while applying a HIGH level on the logic
input AUXC and a LOW level on the
HFRX input and the LSAO output are activated, in order to
limit the current consumption. Some dynamic limiting is
provided to prevent VBB from being discharged below

2.7 V.

Transmit channels (pins MIC+, MIC−, DTMF, TXAUX
and LN)

H

ANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC− AND

LN)
The TEA1097 has symmetrical microphone inputs.

The input impedance between MIC+ and MIC− is 70 kΩ
(typ.). The voltage gain between pins MIC+, MIC− and LN
is set to 44.3 dB. Without limitation from the output, the
microphone input stage can accommodate signals up to
18 mV (RMS) at room temperature for 2% of THD.
The microphone inputs are biased at one diode voltage.

Automatic gain control is provided for line loss
compensation.

DTMF

AMPLIFIER (PINS DTMF, LN AND RECO)

The TEA1097 has an asymmetrical DTMF input. The input
impedance between pin DTMF and GND is 20 kΩ (typ.).
The voltage gain between pins DTMF and LN is set to

25.35 dB. Without limitation from the output, the input
stage can accommodate signals up to 180 mV (RMS) at
room temperature for 2% of THD.

When the DTMF amplifier is enabled, dialling tones may
be sent on the line. These tones can be heard in the
earpiece or in the loudspeaker at a low level. This is called
the confidence tone. The voltage attenuation between pins
DTMF and RECO is typically equal to −16.5 dB.

The DC biasing of this input is 0 V.
The automatic gain control has no effect on these

channels.

PD input. Only the

A

UXILIARY TRANSMIT AMPLIFIER (PINS TXAUX AND LN)

The TEA1097 has an asymmetrical auxiliary input TXAUX.
The input impedance between pins TXAUX and GND is
20 kΩ (typ.). The voltage gain between pins TXAUX and
LN is set to 12.5 dB. Without limitation from the output, the
input stage can accommodate signals up to 1.2 V (RMS)
at room temperature for 2% of THD. The TXAUX input is
biased at two diodes voltage.

Automatic gain control is provided for line loss
compensation.

M

ICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC−

AND TXOUT)

The voltage gain between the microphone inputs MIC+,
MIC− and the output TXOUT is set to 49.8 dB. This
channel gives an image of the signal sent on the line while
speaking in the handset microphone. Using external
circuitry, this signal can be used for several purposes such
as sending dynamic limiting or anti-howling in a listening-in
application. The TXOUT output is biased at two diodes
voltage.

The automatic gain control has no effect on these
channels.

Receive channels (pins IR, RAUX, RECO, GARX and
QR)

RX

AMPLIFIER (PINS IR AND RECO)

The receive amplifier has one input IR which is referred to
the line. The input impedance between pins IR and LN is
20 kΩ (typ.) and the DC biasing between these pins is
equal to one diode voltage. The gain between pins IR
(referenced to LN) and RECO is typically equal to 29.7 dB.
Without limitation from the output, the input stage can
accommodate signals up to 50 mV (RMS) at room
temperature for 2% of THD.

This receive amplifier has a rail-to-rail output RECO, which
is designed for use with high-ohmic (real) loads (larger
than 5 kΩ). This output is biased at two diodes voltage.

Automatic gain control is provided for line loss
compensation.

TEA1097

1999 Apr 08 11

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

EARPIECE AMPLIFIER (PINS GARX AND QR)
The earpiece amplifier is an operational amplifier having

its output (QR) and its inverting input (GARX) available.
Its input signal comes, via a decoupling capacitor, from the
receive RECO output. It is used in combination with two
resistors to get the required gain or attenuation compared
to the receive gain. It can be chosen between −3 and
+15 dB.

Two external capacitors C
GARX and QR) and C

GARS

GARX and GND) ensure stability. The C

(connected between pins

GAR

(connected between pins

capacitor

GAR

provides a first-order low-pass filter. The cut-off frequency
corresponds to the time constant C
The relationship C

GARS

≥ 10 × C

× Re2.

GAR

must be fulfilled.

GAR

The earpiece amplifier has a rail-to-rail output QR, biased
at two diodes voltage. It is designed for use with low-ohmic
(real) loads (150 Ω) or capacitive loads (100 nF in series
with 100 Ω).

When the amplifier is turned off, the signal present on the
earpiece is equal to the ratio between the load on QR and
Re1+R

e2

AUXILIARY RECEIVE AMPLIFIER (PINS RAUX AND RECO)
The auxiliary receive amplifier has an asymmetrical input

RAUX; it uses the RECO output. Its input impedance
between pins RAUX and GND is typically equal to 20 kΩ.
The voltage gain between pins RAUX and RECO is equal
to−2.4 dB. Without any limitation from the output, the input
stage can accommodate signals up to 0.95 V (RMS) at
room temperature for 2% of THD.

This auxiliary amplifier has a rail-to-rail output RECO,
which is designed for use with high ohmic (real) loads
(larger than 5 kΩ). This output is biased at two diodes
voltage.

The automatic gain control has no effect on this channel.

UXILIARY AMPLIFIERS USING THE MICROPHONE INPUTS

A
(PINS MIC+, MIC− AND AUXO)

The auxiliary transmit amplifier using the microphone
MIC+ and MIC− inputs has a gain of 25.5 dB referenced to
AUXO. Without limitation from the output, the input stage
can accommodate signals up to 16 mV (RMS) at room
temperature for 2% of THD.

The automatic gain control has no effect on this channel.

UXILIARY AMPLIFIERS USING HFTX (PINS HFTX AND

A
AUXO)

The auxiliary transmit amplifier using the HFTX input has
a gain of 15.2 dB referenced to AUXO.

The automatic gain control has no effect on this channel.

RX

AMPLIFIER USING IR (PINS IR AND AUXO)

The auxiliary receive amplifier uses pin IR as input.
The input is referenced to pin LN and the DC biasing
between these two pins is one diode voltage. The voltage
gain between the input IR (referenced to LN) and the
output AUXO is typically equal to 32.8 dB, which
compensates typically the attenuation provided by the
anti-sidetone network.

Automatic gain control is provided for line loss
compensation.

Automatic gain control (pin AGC)

The TEA1097 performs automatic line loss compensation,
which fits well with the true line attenuation. The automatic
gain control varies the gain of some transmit and receive
amplifiers in accordance with the DC line current.
The control range is 6.45 dB for G
G

v(IR-AUXO)

approximately to a line length of 5.5 km for a 0.5 mm
twisted-pair copper cable.

and 6.8 dB for G

v(MIC-LN)

v(TXAUX-LN)

TEA1097

, G

v(IR-RECO)

, which corresponds

and

Auxiliary amplifiers using AUXO (pins MIC+, MIC−,
HFTX, IR and AUXO)

The TEA1097 has an auxiliary output AUXO, biased at two
diodes voltage. This output stage is a rail-to-rail one,
designed for use with high-ohmic (real) loads (larger than
5kΩ). The AUXO output amplifier is used in three different
channels, two transmit channels and one receive channel.

1999 Apr 08 12

To enable this gain control, the pin AGC must be shorted
to pin LN. The start current for compensation corresponds
to a line current equal to typically 23 mA and the stop
current to 57 mA. The start current can be increased by
connecting an external resistor between pins AGC and LN.
It can be increased to 40 mA (using a resistor typically
equal to 80 kΩ). The start and stop current will be
maintained in a ratio equal to 2.5. By leaving the AGC pin
open-circuit, the gain control is disabled and no line loss
compensation is performed.

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

Base microphone channel (pins TXIN, GATX, TXOUT
and GNDTX) see Fig.7

The TEA1097 has an asymmetrical base microphone
input TXIN with an input resistance of 20 kΩ.
The DC biasing of the input is 0 V.

The output TXOUT is biased at two diodes voltage and has
a current capability equal to 20 µA (RMS). The gain of the
microphone amplifier (from pins TXIN to TXOUT) can be
adjusted from 0 to 31 dB to suit specific application
requirements.

handbook, full pagewidth

V

BB

R

MIC

C

MIC

30

(28)

TXIN

V I I V

The gain is proportional to the value of R

14.85 dB with R
output, the microphone input stage can accommodate
signals up to 18 mV (RMS) at room temperature for 2% of
THD.

A capacitor can be connected in parallel with R
provide a 1st-order low-pass filter.

GATX

TXOUT

TEA1097

GATX

= 30.1 kΩ. Without limitation from the

GATX

R

GATX

29

(27)

C

GATX

28

(26)

and equals

to

GATX

The pin numbers given in parenthesis refer to the TEA1097H.

Fig.7 Base microphone channel.

GNDTX

MGL395

31

(29)

1999 Apr 08 13

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

Loudspeaker channel

handbook, full pagewidth

R

GALS

C

GALS

C

LSAO

C

DLC

The pin numbers given in parenthesis refer to the TEA1097H.

14

(11)

16

(12)

11
(8)

GALS

LSAO

DLC

DYNAMIC

LIMITER

V

BB

V I

to

logic

I V

VOLUME

CONTROL

HFRX

VOL

MGL394

7

(1)

27

(23)

R

TEA1097

VOL

Fig.8 Loudspeaker channel.

LOUDSPEAKER AMPLIFIER: PINS HFRX, GALS AND LSAO
The TEA1097 has an asymmetrical input for the

loudspeaker amplifier with an input resistance of 20 kΩ
between pins HFRX and GND. It is biased at two diodes
voltage. The input stage can accommodate signals up to
580 mV (RMS) at room temperature for 2% of THD.

The rail-to-rail output stage is designed to power a
loudspeaker down to 8 Ω connected as a single-ended
load (between pins LSAO and GND). When the circuit is
externally supplied, the maximum output power is equal to
280 mW (typ.) for 6 V applied to pin ESI.

The gain of the loudspeaker amplifier can be adjusted from
0 to 35 dB to suit specific application requirements.
The gain from HFRX to LSAO is proportional to the value
of R

and equals 28 dB with R

GALS

A capacitor connected in parallel with R

GALS

= 255 kΩ.

is

GALS

recommended and provides a first-order low-pass filter.

V

OLUME CONTROL (PIN VOL)

The loudspeaker amplifier gain can be adjusted with the
potentiometer R

. A linear potentiometer can be used to

VOL

obtain logarithmic control of the gain at the loudspeaker
amplifier. Each 1.9 kΩ increase of R

results in a gain

VOL

loss of 3 dB.

YNAMIC LIMITER (PIN DLC)

D
The dynamic limiter of the TEA1097 prevents clipping of

the loudspeaker output stage and protects the operation of
the circuit when the supply voltage at VBB falls below 2.7 V.

Hard clipping of the loudspeaker output stage is prevented
by rapidly reducing the gain when the output stage starts
to saturate. The time in which gain reduction is effected
(clipping attack time) is approximately a few milliseconds.
The circuit stays in the reduced gain mode until the peaks
of the loudspeaker signals no longer cause saturation.
The gain of the loudspeaker amplifier then returns to its
normal value within the clipping release time (typically
100 ms). Both attack and release times are proportional to
the value of the capacitor C

. The total harmonic

DLC

distortion of the loudspeaker output stage, in reduced gain
mode, stays below 1% up to 10 dB (min.) of input voltage
overdrive [providing V

is below 580 mV (RMS)].

HFRX

When the supply voltage drops below an internal threshold
voltage of 2.7 V, the gain of the loudspeaker amplifier is
rapidly reduced (approximately 1 ms). When the supply
voltage exceeds 2.7 V, the gain of the loudspeaker
amplifier is increased again. By forcing a level lower than

0.2 V on pin DLC, the loudspeaker amplifier is muted.

1999 Apr 08 14

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

Logic inputs
Table 1 Selection of transmit and receive channels for 12 different application modes

LOGIC INPUTS

PD HFC MUTT MUTR AUXC

0 X X X 1 HFRX to LSAO ringer mode
0 X X X 0 flash, DC dialling
10000DTMF to LN; DTMF to RECO;

QR and MICS are active

10010MICtoAUXO; RAUX to RECO;

QR and MICS are active

10110MICtoLN; IR to RECO;

IR to AUXO; MIC to TXOUT ; QR and
MICS are active

10101TXAUX to LN and IR to AUXO conversation using auxiliary

11011RAUX to RECO and HFRX to LSAO listening on the loudspeaker
11001TXAUX to LN; IR to AUXO;

RAUX to RECO; HFRX to LSAO

11000DTMF to LN; DTMF to RECO;

HFRX to LSAO; QR and MICS are
active

11101TXAUX to LN; IR to AUXO;

IR to RECO and HFRX to LSAO

11010TXIN to TXOUT; HFTX to AUXO;

RAUX to RECO; HFRX to LSAO
and MICS is active

11110TXIN to TXOUT; TXAUX to LN;

IR to RECO; IR to AUXO;
HFRX to LSAO; MICS is active

11100MICtoLN; IR to RECO;

IR to AUXO; HFRX to LSAO;
MIC to TXOUT; QR and MICS are
active

FEATURES APPLICATION EXAMPLES

DTMF dialling in handset

cordless intercom with
corded handset

handset conversation

I/O; cordless: digital
handsfree in mobile

answering machine: play and
record messages; listen the
recorded message on the
loudspeaker

DTMF dialling in handsfree
or group listening modes

answering machine: play and
record messages while
listening in the loudspeaker

cordless intercom with base

digital handsfree
conversation

handset conversation with
group-listening

1999 Apr 08 15

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); DC levels are referenced to GND.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

V

ESI

I

i(ESI)

V

n(max)

I

line

P

tot

T

stg

T

amb

positive continuous line voltage −0.4 +12 V
repetitive line voltage during switch-on or line

−0.4 +13.2 V

interruption
positive continuous voltage on pin ESI −0.4 +6 V
input current at pin ESI − 140 mA
maximum voltage

on pins REG, SLPE, IR and AGC −0.4 V
on all other pins except V

DD

−0.4 VBB+ 0.4 V

+ 0.4 V

LN

maximum line current for

TEA1097H − 140 mA
TEA1097TV − 130 mA

total power dissipation T

amb

=75°C
TEA1097TV − 400 mW
TEA1097H − 720 mW

IC storage temperature −40 +125 °C
operating ambient temperature −25 +75 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

TEA1097TV 115 K/W
TEA1097H 63 K/W

1999 Apr 08 16

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

160

handbook, full pagewidth

I

line

(mA)

120

80

40

0

3.5 9.5

(1)

(2)

(3)
(4)

(5)

(6)

7.55.5

11.5

TEA1097

FCA026

V

(V)

SLPE

13.5

LINE T

(1) 25 800
(2) 35 720
(3) 45 640
(4) 55 560
(5) 65 480
(6) 75 400

Fig.9 Safe operating area (TEA1097TV).

(°C) P

amb

(mW)

tot

1999 Apr 08 17

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

160

handbook, full pagewidth

I

line

(mA)

120

80

40

0

3 911

75

(1)

(2)

(3)

(4)

(5)

V

SLPE

TEA1097

FCA025

(V)

134 10 1286

LINE T

Fig.10 Safe operating area (TEA1097H).

(°C) P

amb

tot

(mW)

(1) 35 1304
(2) 45 1158
(3) 55 1012
(4) 65 866
(5) 75 720

1999 Apr 08 18

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

CHARACTERISTICS

I

= 15 mA; R

line

AUXC = LOW;
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

L

INE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND V

V

SLPE

V

BB

I

line

∆V

SLPE(T)

∆V

BB(T)

I

BB

V

LN

EXTERNAL SUPPLY (PIN ESI)
V

ESI

I

i(ESI)

I

ESI(ext)

SLPE

=20Ω; Z

= 600 Ω; f = 1 kHz; T

line

=25°C; AGC pin connected to LN; PD = HIGH; HFC = LOW;

amb

MUTT = HIGH; MUTR = HIGH; measured according to test circuits; DC levels are referenced to GND;

)

BB

stabilized voltage between SLPE
and GND (V

ref

)

regulated supply voltage for
internal circuitry

I

= 15 mA 3.4 3.7 4 V

line

= 70 mA 5.7 6.1 6.5 V

I

line

I

= 15 mA 2.75 3.0 3.25 V

line

I

= 70 mA 4.9 5.3 5.7 V

line

line current for voltage increase start current − 18 − mA

stop current − 45 − mA

stabilized voltage variation with

T

= −25 to +75 °C −±60 − mV

amb

temperature referenced to 25 °C
regulated voltage variation with

T

= −25 to +75 °C −±30 − mV

amb

temperature referenced to 25 °C
current available on pin V

BB

speech mode − 11 − mA
digital handsfree mode;

− 9.5 − mA

HFC = HIGH

line voltage I

external voltage supply allowed

=1mA − 1.55 − V

line

I

=4mA − 2.35 − V

line

I

= 15 mA 3.7 4.0 4.3 V

line

I

= 130 mA − 8.7 9.3 V

line

−− 6V

on pin ESI
voltage on pin ESI when

supplied by a current source
input current on pin ESI V
external current supply allowed

I

= 140 mA except in

ESI

− 6.6 − V

power-down mode

= 3.5 V − 3.1 − mA

ESI

−− 140 mA

on pin ESI

1999 Apr 08 19

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

SUPPLY FOR PERIPHERALS (PIN VDD)
V

∆V

DD

DD(T)

regulated supply voltage on V

regulated voltage variation with

DDVBB

temperature referenced to 25 °C

I

DD

I

DD(o)

current consumption on V

DD

current available for peripherals VDD= 3.35 V −− −3mA
SUPPLY FOR MICROPHONE (PIN MICS)
V

MICS

I

MICS

supply voltage for a microphone − 2 − V

current available on MICS −− −1mA
POWER-DOWN INPUT (PIN PD)
V

IL

V

IH

I

i(pd)

I

BB(pd)

LOW-level input voltage −0.4 − +0.3 V

HIGH-level input voltage 1.8 − VBB+ 0.4 V

input current −−3 −6 µA

current consumption on V

BB

during power-down phase
RINGER MODE (PINS PD, AUXC, HFRX AND LSAO)
I

i(ESI)

G

v(HFRX-LSAO)

input current on pin ESI PD = LOW;

voltage gain from pin HFRX to

LSAO

Preamplifier inputs (pins MIC+, MIC−, IR, DTMF, TXIN, HFTX, HFRX, TXAUX and RAUX)

 input impedance

Z

i(MIC)

differential between
pins MIC+ and MIC−

single-ended between
pins MIC+/MIC− and GNDTX

Z

 input impedance between pins

i(IR)

IR and LN

Z

 input impedance between pins

i(DTMF)

DTMF and GND

Z

 input impedance between pins

i(TXIN)

TXIN and GNDTX

> 3.35 V + 0.25 V

3.1 3.35 3.6 V

(typ.)
otherwise − V
T

= −25 to +75 °C;

amb

−±30 − mV

− 0.25 − V

BB

VBB> 3.35 V + 0.25 V
(typ.)

in trickle mode;
I

= 0 mA;

line

− 15 150 nA

VDD= 1.5 V;
VBBdischarging

> 3.35 V 60 100 −µA

V

DD

PD = LOW;

− 460 −µA

AUXC = LOW

− 3.1 − mA
AUXC = HIGH;
V

= 3.5 V

ESI

PD = LOW;

− 28 − dB
AUXC = HIGH;
V

= 3.5 V

ESI

V

= 20 mV (RMS);

HFRX

R

= 255 kΩ

GALS

− 70 − kΩ

− 35 − kΩ

− 20 − kΩ

− 20 − kΩ

− 20 − kΩ

1999 Apr 08 20

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Z

Z

Z

Z

TX amplifiers; see note 1
TX

G

∆G

∆G

CMRR common mode rejection ratio − 80 − dB
THD total harmonic distortion at pinLNVLN = 1.4 V (RMS) −− 2%

V

∆G

DTMF AMPLIFIER (PINS DTMF, LN AND RECO)
G

 input impedance between pins

i(HFTX)

HFTX and GND

 input impedance between pins

i(HFRX)

HFRX and GND

 input impedance between pins

i(TXAUX)

TXAUX and GND

 input impedance between pins

i(RAUX)

RAUX and GND

HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC− AND LN)

v(MIC-LN)

voltage gain from pin MIC+/MIC−

V

MIC

to LN

v(f)

gain variation with frequency

f = 300 to 3400 Hz −±0.25 − dB

referenced to 1 kHz

v(T)

gain variation with temperature

T

amb

referenced to 25 °C

I

= 4 mA;

line

VLN= 0.12 V (RMS)

no(LN)

noise output voltage at pin LN;
pins MIC+/MIC− shorted

psophometrically
weighted (p53 curve)

through 200 Ω

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;
MUTR = LOW;
AUXC = LOW

v(DTMF-LN)

voltage gain from pin DTMF toLNV

DTMF

− 20 − kΩ

− 20 − kΩ

− 20 − kΩ

− 20 − kΩ

= 5 mV (RMS) 43.3 44.3 45.3 dB

= −25 to +75 °C −±0.25 − dB

−− 10 %

−−77.5 − dBmp

60 80 − dB

= 50 mV (RMS) 24.35 25.35 26.35 dB

∆G

v(f)

gain variation with frequency

f = 300 to 3400 Hz −±0.25 − dB

referenced to 1 kHz

∆G

v(T)

gain variation with temperature

T

= −25 to +75 °C −±0.25 − dB

amb

referenced to 25 °C

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = HIGH;
MUTR = HIGH;
AUXC = LOW

G

v(DTMF-RECO)

voltage gain from pin DTMF to

V

DTMF

RECO

1999 Apr 08 21

60 80 − dB

= 50 mV (RMS) −−16.5 − dB

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

TX AUXILIARY AMPLIFIER USING TXAUX (PINS TXAUX AND LN)
G

v(TXAUX-LN)

∆G

v(f)

voltage gain from pin TXAUX toLNV

gain variation with frequency

f = 300 to 3400 Hz −±0.25 − dB

referenced to 1 kHz

∆G

v(T)

gain variation with temperature

T

referenced to 25 °C
THD total harmonic distortion at LN V
V

TXAUX(rms)

maximum input voltage at

I

TXAUX (RMS value)
V

no(LN)

noise output voltage at pin LN;

pin TXAUX shorted to GND

psophometrically

weighted (p53 curve)
through 200 Ω in series with
10 µF

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;

MUTR = LOW;

AUXC = LOW

MICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC− AND TXOUT)
G

v(MIC-TXOUT)

voltage gain from pin MIC+/MIC−

V
to TXOUT

∆G

v(f)

gain variation with frequency

f = 300 to 3400 Hz −±0.1 − dB
referenced to 1 kHz

∆G

v(T)

gain variation with temperature

T
referenced to 25 °C

= 0.1 V (RMS) 11.5 12.5 13.5 dB

TXAUX

= −25 to +75 °C −±0.25 − dB

amb

= 1.4 V (RMS) −− 2%

LN

= 70 mA; THD = 2% − 1.2 − V

line

−−80.5 − dBmp

60 80 − dB

= 2 mV (RMS) 48.3 49.8 51.3 dB

MIC

= −25 to +75 °C −±0.35 − dB

amb

RX amplifiers; see note 1
RX

AMPLIFIERS USING IR (PINS IR AND RECO)

G

v(IR-RECO)

voltage gain from pin IR

VIR= 15 mV (RMS) 28.7 29.7 30.7 dB
(referenced to LN) to RECO

∆G

v(f)

gain variation with frequency

f = 300 to 3400 Hz −±0.25 − dB
referenced to 1 kHz

∆G

v(T)

gain variation with temperature

T

= −25 to +75 °C −±0.3 − dB

amb

referenced to 25 °C

V

IR(rms)(max)

maximum input voltage on IR

I

= 70 mA; THD = 2% − 50 − mV

line

(referenced to LN) (RMS value)

V

RECO(rms)(max)

maximum output voltage on pin

THD = 2% 0.75 0.9 − V
RECO (RMS value)

V

no(RECO)(rms)

noise output voltage at pin
RECO; pin IR is an open-circuit

psophometrically

weighted (p53 curve)
(RMS value)

∆G

v(mute)

gain reduction if not activated HFC = LOW;

MUTT = LOW;

MUTR = LOW;

AUXC = LOW

1999 Apr 08 22

−−88 − dBVp

60 80 − dB

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

RX EARPIECE AMPLIFIER (PINS GARX AND QR)
∆G

v(RECO-QR)

gain voltage range between pins
RECO and QR

V

QR(rms)(max)

maximum output voltage on pin
QR (RMS value)

V

no(QR)(rms)

noise output voltage at pin QR;
pin IR is an open-circuit
(RMS value)

RX AMPLIFIER USING RAUX (PINS RAUX AND RECO)
G

v(RAUX-RECO)

voltage gain from pin RAUX to
RECO

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

∆G

v(T)

gain variation with temperature
referenced to 25 °C

V

RAUX(rms)(max)

maximum input voltage on RAUX
(RMS value)

V

no(RECO)(rms)

noise output voltage at pin
RECO; pin RAUX shorted to
GND through 200 Ω in series
with 10 µF (RMS value)

∆G

v(mute)

gain reduction if not activated HFC = LOW;

sine wave drive;

RL= 150 Ω; THD < 2%

G

= 0 dB;

v(QR)

psophometrically

weighted (p53 curve)

V

= 0.4 V (RMS) −3.7 −2.4 −1.1 dB

RAUX

f = 300 to 3400 Hz −±0.25 − dB

T

= −25 to +75 °C −±0.25 − dB

amb

THD=2% − 0.95 − V

psophometrically

weighted (p53 curve)

MUTT = LOW;

MUTR = LOW;

AUXC = LOW

−3 − +15 dB

0.75 0.9 − V

−−88 − dBVp

−−100 − dBVp

60 80 − dB

Auxiliary amplifiers using AUXO; see note 1
TX

AUXILIARY AMPLIFIER USING MIC+ AND MIC− (PINS MIC+, MIC− AND AUXO)

G

v(MIC-AUXO)

voltage gain from pin MIC+/MIC−

V

= 10 mV (RMS) 24.2 25.5 26.8 dB

MIC

to AUXO

∆G

v(f)

gain variation with frequency

f = 300 to 3400 Hz −±0.1 − dB
referenced to 1 kHz

∆G

v(T)

gain variation with temperature

T

= −25 to +75 °C −±0.3 − dB

amb

referenced to 25 °C

V

MIC(rms)

maximum input voltage on

THD=2% − 16 − mV
MIC+/MIC− (RMS value)

V

no(AUXO)(rms)

noise output voltage at pin
AUXO; pins MIC+/MIC− shorted

psophometrically

weighted (p53 curve)
to GNDTX through 200 Ω in
series with 10 µF (RMS value)

1999 Apr 08 23

−−91 − dBVp

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

TX AUXILIARY AMPLIFIER USING HFTX (PINS HFTX AND AUXO)
G

v(HFTX-AUXO)

voltage gain from pin HFTX to
AUXO

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

∆G

v(T)

gain variation with temperature
referenced to 25 °C

V

AUXO(rms)

maximum output voltage on pin
AUXO (RMS value)

V

no(AUXO)(rms)

noise output voltage at pin
AUXO; pin HFTX shorted to
GND through 200 Ω in series
with 10 µF (RMS value)

∆G

v(mute)

gain reduction if not activated HFC = LOW;

RX AMPLIFIER USING IR (PINS IR AND AUXO)
G

v(IR-AUXO)

voltage gain from pin IR
(referenced to LN) to AUXO

∆G

v(f)

gain variation with frequency
referenced to 1 kHz

∆G

v(T)

gain variation with temperature
referenced to 25 °C

V

AUXO(rms)

maximum output voltage on
AUXO (RMS value)

V

no(AUXO)(rms)

noise output voltage at pin
AUXO; pin IR is an open-circuit
(RMS value)

∆G

v(mute)

gain reduction if not activated HFC = HIGH;

V

= 100 mV (RMS) 14.2 15.2 16.2 dB

HFTX

f = 300 to 3400 Hz −±0.1 − dB

T

= −25 to +75 °C −±0.1 − dB

amb

THD = 2% 0.8 0.9 − V

psophometrically

−−91.5 − dBVp

weighted (p53 curve)

60 80 − dB
MUTT = LOW;
MUTR = HIGH;
AUXC = LOW

VIR= 3 mV (RMS) 31.6 32.8 34 dB

f = 300 to 3400 Hz −±0.1 − dB

T

= −25 to +75 °C −±0.3 − dB

amb

THD = 2% 0.8 0.9 − V

psophometrically

−−85 − dBVp

weighted (p53 curve)

60 80 − dB
MUTT = LOW;
MUTR = HIGH;
AUXC = HIGH

Automatic Gain Control (pin AGC)

∆G

I

start

v(trx)

gain control range for transmit
and receive amplifiers affected
by the AGC; with respect to
I

=15mA

line

highest line current for

I

= 70 mA; on

line

G

v(MIC-LN)

and G
I

= 70 mA;

line

G

v(TXAUX-LN)

maximum gain

I

stop

lowest line current for maximum
gain

1999 Apr 08 24

, G

v(IR-RECO)

v(IR-AUXO)

5.45 6.45 7.45 dB

5.8 6.8 7.8 dB

− 23 − mA

− 57 − mA

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Logic inputs (pins HFC, AUXC, MUTT and MUTR)

V

IL

V

IH

I

i

Base microphone amplifier (pins TXIN, TXOUT and GATX); see note 1
G

v(TXIN-TXOUT)

∆G

v

∆G

v(f)

∆G

v(T)

V

no(TXOUT)(rms)

∆G

v(mute)

LOW-level input voltage −0.4 − +0.3 V
HIGH-level input voltage 1.8 − VBB+ 0.4 V
input current

for pins HFC and AUXC − 36µA
for pins MUTT and MUTR −−2.5 −6 µA

voltage gain from pin TXIN to
TXOUT

voltage gain adjustment with
R

GATX

gain variation with frequency

V

= 3 mV (RMS);

TXIN

R

= 30.1 kΩ

GATX

13.15 14.85 16.55 dB

−15 − +16 dB

f = 300 to 3400 Hz −±0.1 − dB

referenced to 1 kHz
gain variation with temperature

T

= −25 to +75 °C −±0.15 − dB

amb

referenced to 25 °C
noise output voltage at pin

TXOUT; pin TXIN is shorted

psophometrically
weighted (p53 curve)

−−101 − dBVp

through 200 Ω in series with
10 µF to GNDTX (RMS value)

gain reduction if not activated HFC = HIGH;

60 80 − dB
MUTT = LOW;
MUTR = LOW;
AUXC = LOW

Loudspeaker amplifier (pins HFRX, LSAO, GALS and VOL); see note 1
G

v(HFRX-LSAO)

∆G

v

∆G

v(f)

voltage gain from pin HFRX to
LSAO

voltage gain adjustment with
R

GALS

gain variation with frequency

V

= 20 mV (RMS);

HFRX

R

= 255 kΩ

GALS

f = 300 to 3400 Hz −±0.3 − dB

referenced to 1 kHz

∆G

v(T)

gain variation with temperature

T

= −25 to +75 °C −±0.3 − dB

amb

referenced to 25 °C

∆G

v(vol)

V

(HFRX)(rms)(max)

voltage gain variation related to
∆R

= 1.9 kΩ

VOL

maximum input voltage at pin
HFRX (RMS value)

I

= 70 mA;

line

R

=33kΩ; for 2%

GALS

THD in the input stage

V

no(LSAO)(rms)

noise output voltage at pin
LSAO; pin HFRX is open-circuit

psophometrically
weighted (p53 curve)

(RMS value)

V

LSAO(rms)

output voltage (RMS value)
without external supply on pin
ESI

IBB= 0 mA; IDD=1mA

I

=18mA − 0.9 − V

line

=30mA − 1.2 − V

I

line

I

>50mA − 1.6 − V

line

25.5 28 30.5 dB

−28 − +7 dB

−−3 − dB

− 580 − mV

−−79 − dBVp

1999 Apr 08 25

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

LSAO(max)

Dynamic limiter (pins LSAO and DLC); see note 1
t

att

t

rel

THD total harmonic distortion at

V

BB(th)

Mute Loudspeaker (pin DLC); see note 1
V

DLC(th)

I

DLC(th)

∆G

vrx(mute)

maximum output current at pin

external supply on ESI 150 300 − mA

LSAO (peak value)

attack time when V

jumps from

HFRX

−− 5ms

20 mV to 20 mV + 10 dB
when V

V

BB(th)

release time when V

jumps below

BB

jumps from

HFRX

− 1 − ms

− 100 − ms

20 mV + 10 dB to 20 mV

V

= 20 mV + 10 dB

HFRX

t>t

att

− 0.1 2 %

VBB limiter threshold − 2.7 − V

threshold voltage required on pin

−0.4 − +0.2 V
DLC to obtain mute receive
condition

threshold current sourced by pin

V

= 0.2 V − 100 −µA

DLC

DLC in mute receive condition
voltage gain reduction in mute

V

= 0.2 V 60 80 − dB

DLC

receive condition

Note

1. When the channel is enabled according to Table 1.

1999 Apr 08 26

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1999 Apr 08 27

Z

exch

600 Ω

C

exch

100 µF

V

HFTX

i = 15 mA
J_line

Dz
V

d

10 V

V

TXIN

C

emc

10 nF

V

DTMF

Z

imp

620 Ω

C

imp

100 µF

V

C

GATX

100 pF

C

V

TXAUX

MIC

C

TXIN

100 nF

TXAUX

100 nF

C

MICS

4.7 µF

C

HFTX

100 nF

C

DTMF

100 nF

C

RAUX

100 nF

V

RAUX

V

IR

100 nF

C

IR

MICS

MIC+

R

MIC

200 Ω

MIC−

HFTX

TXOUT

R

GATX

30.1 kΩ
GATX

TXIN

DTMF

TXAUX

RAUX

R

20 Ω

SLPE REG AGC LN ESI

18

(14)20(16)22(18)19(15)12(9)13(10)

IR

21

(17)

24

(20)

33

(31)

32

(30)

38

(36)

28

(26)

29

(27)

30

(28)

34

(32)

5

(43)

4

(42)

17

(13)31(29)25(21)

GND

k, full pagewidth

external

supply

C

REG

SLPE

4.7 µF
D

ESI

TEA1097

27

(23)

GNDTX STAB VOL DLC

R

3.65
kΩ

STAB

R

VOL

0 to

22 kΩ

C

VBB

470 µF

V

BB

C

VDD

47 µF

V

DD

23

(19)

PD

40

(38)

HFC

39

(37)

AUXC

3

(41)

MUTT

1

(39)

MUTR

2

(40)

6

(44)

35

(33)

36

(34)

37

(35)

7

(1)

14

(11)

16

(12)

11

(8)

C

DLC
470
nF

AUXO

QR

GARX

RECO

HFRX

GALS

LSAO

C

R

100 kΩ

R

GALS

255 kΩ

10 µF

e1

AUXO

C

GAR

100 pF

C

HFRX

100 nF

controller

C

RXE

100 nF

C
150 pF

C

GALS

220 µF

R

from

R

10 kΩ

V

GALS

LSAO

8 Ω

FCA001

AUXO

C

GARS

1 nF

HFRX

R

e2

100 kΩ

R

QR

150 Ω

C

QR

4.7 µF

TEST AND APPLICATION INFORMATION

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

auxiliary inputs/outputs and analog multiplexer

TEA1097

The pin numbers given in parenthesis refer to the TEA1097H.

Fig.11 Test circuit.

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1999 Apr 08 28

handbook, full pagewidth

D2 D3

microphone

A

B

microphone

D1 D4

Dz
V

d

10 V

handset

base

Z

imp

620 Ω

C

emc

10 nF

C

imp

22 µF

MICS

R

MICP
1 kΩ

C

mich

33 nF

R

MICM
1 kΩ

to digital handsfree

from MICS

R

bmics

2 kΩ

C

from digital
answering machine
or digital handsfree

from digital

answering machine

C

22 nF

C

22 nF

micb

22 nF

tx2

tx1

R

bal2

820 Ω

R

bal1

130 Ω

R

ast2

3.92 kΩ

R

ast1

130 kΩ

C

R

15 kΩ

R

15 kΩ

C

TXIN

100 nF

C

TXAUX

100 nF

MICS

10 µF

tx2

tx1

C

HFTX

100 nF

R

GATX

30.1 kΩ

C

100 nF

C

100 nF

R

8.2
kΩ

DTMF

RAUX

C

IR

100 nF

tx3

TXOUT

TXAUX

R

ast3

392 Ω

MICS

MIC+

MIC−

HFTX

GATX

TXIN

DTMF

RAUX

C

bal

220 nF

IR

D

ESI

external

supply

R

C

SLPE

REG

20 Ω

4.7 µF

SLPE REG AGC LN ESI

18

(14)20(16)22(18)19(15)12(9)13(10)

21

(17)

24

(20)

33

(31)

32

(30)

TEA1097

38

(36)

28

(26)

29

(27)

30

(28)

34

(32)

5

(43)

4

17

(42)

(13)31(29)25(21)

GNDTX STAB VOL DLC

GND

R

STAB

3.65
kΩ

C

470 µF

V

27

(23)11(8)

R

VOL

0 to

22 kΩ

BB

VBB

C

VDD

47 µF

V

DD

23

(19)

40

PD

(38)

HFC

39

(37)

AUXC

3

(41)

MUTT

1

(39)

MUTR

2

(40)

C

AUXO

AUXO

6

(44)

100 nF

QR

35

(33)

GARX

36

(34)

37

(35)

14

(11)

16

(12)

C

DLC

470

nF

R

100 kΩ

RECO

HFRX

7

(1)

GALS

R

GALS

255 kΩ

LSAO

MGL396

C

GAR

100 pF

e1

from

controller

to digital
answering machine
or digital handsfree

R

e2

100 kΩ

C

GARS

1 nF

C

RXE

100 nF

from digital

handsfree

C

GALS

150 pF

C

C

QR

4.7 µF

LSAO

220 µF

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

auxiliary inputs/outputs and analog multiplexer

TEA1097

The pin numbers given in parenthesis refer to the TEA1097H.

Fig.12 Basic application diagram.

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

PACKAGE OUTLINES

VSO40: plastic very small outline package; 40 leads

D

c

y

Z

40

21

TEA1097

SOT158-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT A1A2A

mm

inches

Notes

1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

2.70

0.11

0.3

0.1

0.012

0.004

2.45

2.25

0.096

0.089

3

0.25

0.010

b

p

0.42

0.30

0.017

0.012

0.22

0.14

0.0087

0.0055

(1)E(2)

cD

15.6

15.2

0.61

0.60

20

b

p

scale

eHELLpQywv θ

7.6

0.762 2.25

7.5

0.30

0.03 0.089

0.29

w M

12.3

11.8

0.48

0.46

Q

A

2

A

1

1.7

1.5

0.067

0.059

detail X

1.15

0.2

1.05

0.045

0.008 0.004

0.041

L

p

L

0.1 0.1

0.004

(A )

A

3

θ

(1)

Z

0.6

0.3

0.024

0.012

o

7

o

0

OUTLINE

VERSION

SOT158-1

IEC JEDEC EIAJ

REFERENCES

1999 Apr 08 29

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-01-24

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

c

y

X

A

33 23

34

22

Z

E

TEA1097

SOT307-2

e

w M

b

p

pin 1 index

44

1

w M

b

0.25

p

D

H

D

cE

p

0.40

0.25

0.20

0.14

D

10.1

9.9

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.10

0.25

0.05

1.85

1.65

UNIT A1A2A3b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

12

11

Z

D

B

v M

0 2.5 5 mm

scale

(1)

(1) (1)(1)

eH

H

10.1

9.9

12.9

0.8 1.3

12.3

v M

D

H

E

A

B

E

12.9

12.3

E

LL

0.95

0.55

A

p

A

2

A

1

detail X

Z

D

0.15 0.10.15

1.2

0.8

(A )

3

L

p

L

Zywv θ

E

1.2

0.8

θ

o

10

o

0

OUTLINE

VERSION

SOT307-2

IEC JEDEC EIAJ

REFERENCES

1999 Apr 08 30

EUROPEAN

PROJECTION

ISSUE DATE

95-02-04
97-08-01

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

– smaller than 1.27 mm, the footprint longitudinal axis

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

TEA1097

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

must be parallel to the transport direction of the
printed-circuit board.

1999 Apr 08 31

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with

TEA1097

auxiliary inputs/outputs and analog multiplexer

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

(3)(4)
(5)

SOLDERING METHOD

(1)

suitable

suitable
suitable

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Apr 08 32

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

NOTES

TEA1097

1999 Apr 08 33

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

NOTES

TEA1097

1999 Apr 08 34

Philips Semiconductors Product specification

Speech and loudspeaker amplifier IC with
auxiliary inputs/outputs and analog multiplexer

NOTES

TEA1097

1999 Apr 08 35

Philips Semiconductors – a worldwide company

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Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
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Tel. [phone], Fax. [phone]
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Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

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TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

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Tel. [phone], Fax. [phone]

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Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

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Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1999 SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 465002/750/03/pp36 Date of release: 1999 Apr 08 Document order number: 9397 750 05008