Datasheet tdf5242t DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDF5242T

Brushless DC motor drive circuit

Preliminary specification
Supersedes data of 1997 Apr 23
File under Integrated Circuits, IC11

1997 Sep 12

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

FEATURES

• Full-wave commutation without position sensors

• Built-in start-up circuitry

• Six outputs that can drive three external transistor pairs:

APPLICATIONS

• High-power applications, for instance:
– high-end hard disk drives
– automotive applications.

– output current 0.2 A (typ.)
– low saturation voltage
– built-in current limiter

• Thermal protection

• Tacho output without extra sensor

• Transconductance amplifier for an external control

transistor

• Brake control input

• Direction control input.

GENERAL DESCRIPTION

The TDF5242T is a bipolar integrated circuit for driving
3-phase brushless DC motors in full-wave mode.
The device functions sensorless, thus saving 3 hall-effect
sensors, using the back-EMF (Electro Motive Force)
sensing technique to sense the rotor position. It includes
6 pre-drivers able to control external FETs (Field Effect
Transistors) or bipolar transistors. It offers brake and
direction control. It is ideally suited for high-power
applications such as high-end hard disk drives and
automotive applications.

QUICK REFERENCE DATA

Measured over full voltage and temperature range.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

V

VMOT

supply voltage note 1 4 − 18 V
input voltage to the output

3 − 18 V

driver stages

V

O

I

LIM

driver output voltage IO= 100 mA; lower transistor −−0.35 V

I

= 100 mA; upper transistor 1.05 −−V

O

current limiting V

= 14.5 V; RO=47Ω 150 200 250 mA

VMOT

Note

1. An unstabilized supply can be used.

ORDERING INFORMATION

TYPE

NUMBER

NUMBER DESCRIPTION VERSION

PACKAGE

TDF5242T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

1997 Sep 12 2

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

BLOCK DIAGRAM

handbook, full pagewidth

+AMP IN

−AMP IN

CAP-ST

CAP-DC
CAP-CD

TEST

CAP-TI

FG

19
20

16

15
14

8

18

10

THERMAL

PROTECTION

AMP OUT VMOT

START-UP

OSCILLATOR

ADAPTIVE

COMMUTATION

DELAY

TIMING

ROTATION

SPEED

AND

DETECTOR

OUTPUT

STAGE

21 6

TRANS-

CONDUCTANCE

AMPLIFIER

COMMUTATION

LOGIC

OUTPUT DRIVER STAGE

OUTPUT DRIVER

STAGE

OUTPUT DRIVER

STAGE

OUTPUT DRIVER

STAGE

OUTPUT DRIVER

STAGE

27

OUT-NA

28

OUT-PA

1

OUT-NB

2

OUT-PB

4

OUT-PC

DIRECTION

LOGIC

BRAKE

LOGIC

TDF5242T

12, 17, 25

n.c.

7

DIR BRAKE GND2 GND1 V

9113

Fig.1 Block diagram.

1997 Sep 12 3

EMF COMPARATORS

13

P

OUTPUT DRIVER

STAGE

22

23

24
26

MGG988

5

OUT-NC

COMP-A

COMP-B

COMP-C
MOT0

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

PINNING

SYMBOL PIN DESCRIPTION

OUT-NB 1 driver output B for driving the

n-channel power FET or power NPN

OUT-PB 2 driver output B for driving the

p-channel power FET or power PNP

GND1 3 ground (0 V) motor supply return for

output stages

OUT-PC 4 driver output C for driving the

p-channel power FET or power PNP

OUT-NC 5 driver output C for driving the

n-channel power FET or power NPN

VMOT 6 input voltage for the output driver

stages
DIR 7 direction input command
TEST 8 test input/output
BRAKE 9 brake input
FG 10 frequency generator: output of the

rotation speed detector stage
GND2 11 ground supply return for control

circuits
n.c. 12 not connected
V

P

13 supply voltage

CAP-CD 14 external capacitor connection for

adaptive communication delay timing
CAP-DC 15 external capacitor connection for

adaptive communication delay

timing copy
CAP-ST 16 external capacitor connection for

start-up oscillator
n.c. 17 not connected
CAP-TI 18 external capacitor connection for

timing
+AMP IN 19 non-inverting input of the

transconductance amplifier

−AMP IN 20 inverting input of the

transconductance amplifier
AMP OUT 21 transconductance amplifier output

(open collector)
COMP-A 22 comparator input corresponding to

output A

SYMBOL PIN DESCRIPTION

COMP-B 23 comparator input corresponding to

output B

COMP-C 24 comparator input corresponding to

output C
n.c. 25 not connected
MOT0 26 input from the star point of the motor

coils
OUT-NA 27 driver output A for driving the

n-channel power FET or power NPN
OUT-PA 28 driver output A for driving the

p-channel power FET or power PNP

handbook, halfpage

OUT-NB
OUT-PB

GND1
OUT-PC
OUT-NC

VMOT

DIR

TEST

BRAKE

FG

GND2

n.c.

V

CAP-CD

P

1
2
3
4
5
6
7

TDA5242T

8

9
10
11
12
13

MGG987

28
27
26
25
24
23
22
21
20
19
18
17
16
1514

OUT-PA
OUT-NA
MOT0
n.c.
COMP-C
COMP-B
COMP-A
AMP OUT

−AMP IN
+AMP IN

CAP-TI
n.c.
CAP-ST
CAP-DC

Fig.2 Pin configuration.

1997 Sep 12 4

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

FUNCTIONAL DESCRIPTION
Introduction

Full-wave driving of a three phase motor requires three
push-pull output stages. In each of the six possible states
two outputs are active, one sourcing (H) and one sinking
(L). The third output presents a high impedance (Z) to the
motor, which enables measurement of the motor
back-EMF (Electro Motive Force) in the corresponding
motor coil by the EMF comparator at each output.
The commutation logic is responsible for control of the
output transistors and selection of the correct EMF
comparator. In Table 1, the six possible states of the
externally connected output transistors have been
depicted and the corresponding output levels on the NA,
PA, NB, PB, NC and PC outputs of the TDF5242T.

The zero-crossing in the motor EMF (detected by the
comparator selected by the commutation logic) is used to
calculate the correct moment for the next commutation,
that is, the change to the next output state. The delay is
calculated (depending on the motor loading) by the
adaptive commutation delay block.

The output stages are protected by a current limiting circuit
and by thermal protection.

The detected zero-crossings are used to provide speed
information. The information has been made available on
the FG output pin. This output provides an output signal
with a frequency equal to the commutation frequency.

The system will only function when the EMF voltage from
the motor is present. Therefore, a start oscillator is
provided that will generate commutation pulses when no
zero-crossings in the motor voltage are available.

A timing function is incorporated into the device for internal
timing and for timing of the reverse rotation detection.

The TDF5242T also contains an uncommitted
transconductance amplifier (OTA) that can be used as a
control amplifier. The output is capable of directly driving
an external power transistor.

The TDF5242T is designed for systems with low current
consumption. It uses I
the output transistors (patented).

Start-up and commutation control

The system has been designed in such a way that the
tolerances of the application components are not critical.
However, the approximate values of the following
components must still be determined:

• The start capacitor; this determines the frequency of the
start oscillator

• The two capacitors in the adaptive commutation delay
circuit; these are important in determining the optimum
moment for commutation, depending on the type and
loading of the motor

• The timing capacitor; this provides the system with its
timing signals.

2

L logic and adaptive base drive for

Table 1 Output states (note 1)

DIR STATE MOT1 OUT-NA OUT-PA MOT2 OUT-NB OUT-PB MOT3 OUT-NC OUT-PC

H1ZLHLHHHLL
H2HLLLHHZLH
H3HLLZLHLHH
H4ZLHHLLLHH
H5LHHHLLZLH
H6LHHZLHHLL

L1ZLHLHHHLL
L2LHHZLHHLL
L3LHHHLLZLH
L4ZLHHLLLHH
L5HLLZLHLHH
L6HLLLHHZLH

Note

1. H = HIGH state; L = LOW state; Z = high-impedance OFF-state.

1997 Sep 12 5

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

START CAPACITOR (CAP-ST)
This capacitor determines the frequency of the start

oscillator. It is charged and discharged, with a current of
2 µA, from 0.05 to 2.2 V and back to 0.05 V. The time to
complete one cycle is:

t

start

2.15 C×()s (with C in µF )=

(1)

The start oscillator is reset by a commutation pulse and is
only active when the system is in the start-up mode.
A pulse from the start oscillator will cause the outputs to
change to the next state. If the movement of the motor
generates enough EMF, the TDF5242T will run the motor.
If the amount of EMF generated is insufficient, then the
motor will move one step only and will oscillate in its new
position. The amplitude of the oscillation must decrease
sufficiently before the arrival of the next start pulse, to
prevent the pulse arriving during the wrong phase of the
oscillation. The start capacitor should be chosen to meet
this requirement.

The oscillation frequency of the motor is given by:

f

osc

=

1

---------------------------------- ­K

I× p×

t

2π

---------------------- -

J

where:

= torque constant (Nm/A)

K

t

I = current (A)
p = number of magnetic pole-pairs
J = inertia J (kg.m2).

Example: J = 72 × 10−6kg.m2, K=25×10−3Nm/A,p=6
and I = 0.5 A; this gives f

= 5 Hz. If the damping is high,

osc

a start frequency of 2 Hz can be chosen or t = 500 ms,
thus, according to equation (1): C = 0.5/2.15 = 0.23 µF
(choose 220 nF).

A

DAPTIVE COMMUTATION DELAY (CAP-CD AND CAP-DC)

In this circuit the capacitor CAP-CD is charged during one
commutation period, with an interruption of the charging
current during the diode pulse. During the next
commutation period the capacitor is discharged at twice
the charging current. The charging current is 8.1 µA and
the discharging current 16.2 µA; the voltage range is from

0.9 to 2.2 V. The voltage must stay within this range at the
lowest commutation frequency of interest, f

f 1.3×

6–

×

6231

------------ ­f

C1

(C in nF)

8.1 10

C

==

--------------------------

C1

:

If the commutation frequency is lower, a constant
commutation delay after the zero-crossing is generated by
the discharge from 2.2 down to 0.9 V at 16.2 µA;
maximum delay = (0.076 × C) ms (with C in nF)

Example: nominal commutation frequency = 900 Hz and
the lowest usable frequency = 400 Hz; so:

CAP-CD

6231

------------ ­400

(choose 18 nF)

15.6==

The other capacitor, CAP-DC, is used to repeat the same
delay by charging and discharging with 15.5 µA. The same
value can be chosen as for CAP-CD. Figure 3 illustrates
typical voltage waveforms.

handbook, full pagewidth

voltage

on CAP-CD

(1)

(1) COM = commutation.
(2) ZCR = zero-crossing.

voltage

on CAP-DC

COMCOM

(2)

ZCRZCR

COM COM COM COM

ZCR ZCR ZCR ZCR

Fig.3 CAP-CD and CAP-DC typical voltage waveforms in normal running mode.

1997 Sep 12 6

V

= V

max

IH

V

IL

t

MGG993

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

THE TIMING CAPACITOR (CAP-TI)
Capacitor CAP-TI is used for timing the successive steps

within one commutation period; these steps include some
internal delays.

The most important function is the watchdog time in which
the motor EMF has to recover from a negative diode-pulse
back to a positive EMF voltage (or vice versa). A watchdog
timer is a guarding function that only becomes active when
the expected event does not occur within a predetermined
time.

The EMF usually recovers within a short time if the motor
is running normally (<<1 ms). However, if the motor is
motionless or rotating in the reverse direction, the time can
be longer (>>1 ms).

A watchdog time must be chosen such that it is long
enough for a motor without detectable EMF, however, it
must be short enough to detect reverse rotation. If the
watchdog time is made too long, then the motor may run in
the wrong direction (with little torque).

The capacitor is charged with a current of 57 µA from

0.2 to 0.3 V. Above this level, it is charged with a current of
5 µA up to 2.2 V only if the selected motor EMF remains in
the wrong polarity (watchdog function). At the end, or, if the
motor voltage becomes positive, the capacitor is
discharged with a current of 28 µA. The watchdog time is
the time taken to charge the capacitor, with a current of
5 µA, from 0.3 to 2.2 V.

To ensure that the internal delays are covered CAP-TI
must have a minimum value of 2 nF. For the watchdog
function a value for CAP-TI of 10 nF is recommended.

To ensure a good start-up and commutation, care must be
taken that no oscillations occur at the trailing edge of the
flyback pulse. Snubber networks at the outputs should be
critically damped.

Typical voltage waveforms are illustrated by Fig.4.

Miscellaneous functions

In addition to start-up and commutation control, the
TDF5242T provides the following functions:

• Generation of the tacho signal FG

• General purpose Operational Transconductance

Amplifier (OTA)

• Possibilities of motor control

• Direction function and brake function

• High current and temperature protection.

T

HE OPERATIONAL TRANSCONDUCTANCE AMPLIFIER (OTA)

The OTA is an uncommitted amplifier with a high output
current (40 mA) that can be used as a control amplifier or
as a level converter in a Switched Mode Power Supply
(SMPS). The common mode input range includes ground
(GND) and rises to VP− 1.7 V. The high sink current
enables the OTA to drive a power transistor directly in an
analog control amplifier or in a SMPS driver.

Although the gain is not extremely high (0.3 S), care must
be taken with the stability of the circuit if the OTA is used
as a linear amplifier as no frequency compensation is
provided.

handbook, full pagewidth

V

MOT1

V

SWH

voltage

on CAP-TI

If the chosen value of CAP-TI is too small, oscillations can occur in certain positions of a blocked rotor. If the chosen value is too large, then it is possible
that the motor may run in the reverse direction (synchronously with little torque).

Fig.4 Typical CAP-TI and V

voltage waveforms in normal running mode.

MOT1

V

SWM

V

SWL

MGG994

1997 Sep 12 7

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

The convention for the inputs (inverting or not) is the same
as for a normal operational amplifier: with a resistor (as a
load) connected from the output (AMP OUT) to the positive
supply, a positive-going voltage is found when the
non-inverting input (+AMP IN) is positive with respect to
the inverting input (−AMP IN). Note that a ‘plus’ input
causes less current, and consequently a positive voltage.

OTOR CONTROL

M
DC motors can also be operated with analog control using

the OTA.
For the analog control an external transistor is required.

The OTA can supply the base current for this transistor
and act as a control amplifier (see Fig.8).

FG

SIGNAL

The FG (Frequency Generator) signal is generated in the
TDF5242T by using the zero-crossing of the motor EMF
from the three motor windings and the commutation signal.

Output FG switches from HIGH-to-LOW on all zero
crossings and from LOW-to-HIGH on all commutations.
Output FG can source typically 75 µA and sink more
than 3 mA.

Example: a 3-phase motor with 6 magnetic pole-pairs at
1500 rpm and with a full-wave drive has a commutation
frequency of 25 × 6 × 6 = 900 Hz, and generates a tacho
signal of 900 Hz.

IRECTION FUNCTION

D

• If the voltage on pin 7 is <2.3 V the motor is running in
one direction (depending on the motor connections)

• If pin 7 is floating or the voltage is >2.7 V the motor is
running in the other direction.

B

RAKE FUNCTION

• If the voltage on pin 9 (pin BRAKE) is <2.3 V the motor
brakes; in this condition the external outputs are driven
to a HIGH voltage level

• If pin 9 is floating or the voltage is >2.7 V the motor
runs normally.

ELIABILITY

R
The output stages are protected in two ways:

• Current limiting of the ‘lower’ output transistors.
The ‘upper’ output transistors use the same base
current as the conducting ‘lower’ transistor (+15%).
This means that the current to and from the output
stages is limited.

• Thermal protection of the six output transistors is
achieved in such a way that the transistors are switched
off when the junction temperature becomes too high.

1997 Sep 12 8

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

I

V

VMOT

V

O

V

I

T

stg

T

amb

P

tot

V

es

supply voltage 4 18 V
input voltage; all pins except

VI<18V −0.3 VP+ 0.5 V
VMOT, CAP-ST, CAP-TI, CAP-CD
and CAP-DC

VMOT input voltage 3 18 V
output voltage

FG GND V

P

V
AMP OUT − 18 V
OUT-NA, OUT-NB and OUT-NC − V

VMOT

− 0.9 V

OUT-PA, OUT-PB and OUT-PC 0.2 − V

input voltage CAP-ST, CAP-TI,

− 2.5 V

CAP-CD and CAP-DC
storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C
total power dissipation see Fig.5 −−
electrostatic handling see Chapter “Handling” − 500 V

handbook, halfpage

3

P

tot

(W)

2

1

0

−50 0 200

50 100 150

T

Fig.5 Power derating curve.

MGG989

amb

(°C)

HANDLING

Every pin withstands the ESD test according to

“MIL-STD-883C class 2”

. Method 3015 (HBM 1500 Ω,
100 pF) 3 pulses + and 3 pulses − on each pin referenced
to ground.

QUALITY SPECIFICATION

In accordance with
quality specification can be found in the

Reference Handbook”

“SNW-FQ-611-E”.

The number of the

”Quality

. The handbook can be ordered

using the code 9397 750 00192.

1997 Sep 12 9

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

CHARACTERISTICS

V

= 14.5 V ±10%; T

P

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

P

V

VMOT

supply voltage note 1 4 − 18 V
supply current note 2 − 5.2 6.25 mA
input voltage to the output driver

stages

Thermal protection

T

SD

temperature at temperature sensor
causing shut-down

∆T decrease in temperature before

switch-on after shut-down

COMP-A, COMP-B, COMP-C and MOT0

V
I

I

V
∆V

I

CSW

CSW

input voltage −0.5 − V
input bias current 0.5V<VI<V
comparator switching level note 3 ±20 ±25 ±30 mV
variation in comparator switching

levels

V

hys

comparator input hysteresis T

OUT-NA, OUT-NB, OUT-NC, OUT-PA, OUT-PB and OUT-PC

V

V

∆V

O(n)

O(p)

OL

n-channel driver output voltage upper transistor;

p-channel driver output voltage upper transistor;

variation in saturation voltage
between lower transistors

∆V

OH

variation in saturation voltage
between upper transistors

I

LIM

current limiting lower transistor; RO=47Ω 150 180 250 mA

+AMP IN and −AMP IN

V

I

input voltage −0.3 − VP− 1.7 V
differential mode voltage without

‘latch-up’

I

b

C

I

V

offset

input bias current T
input capacitance T
input offset voltage −−10 mV

= −40 to +85 °C; unless otherwise specified.

amb

see Fig.1 3 − 18 V

=25°C − 75 −µV

amb

IO= −100 mA;
T

=25°C

amb

lower transistor;
I

= 10 mA; T

O

IO= −10 mA; T
lower transistor;

= 100 mA; T

I

O

IO= 100 mA; T

IO= −100 mA;
T

=25°C

amb

=25°C −−650 nA

amb

=25°C − 4 − pF

amb

130 140 150 °C

− T

− 1.5 V −10 − 0 µA

VMOT

− 30 − K

SD

−3 0 +3 mV

−1.05 −−V

−−0.35 V

=25°C

amb

−1.05 −−V

=25°C

amb

−−0.35 V

=25°C

amb

=25°C −−180 mV

amb

−−180 mV

−−±V

VMOT

P

V

V

1997 Sep 12 10

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

AMP OUT (open collector)

I

sink

V

sat

V

O

SR slew rate R
g

m(tr)

DIR

V

IL

V

IH

I

IL

I

IH

BRAKE

V

BM

I

I

FG (push-pull)

V

OL

V

OH

t

THL

f

FG

------------- ­f

comm

output sink current 40 −−mA
saturation voltage II=40mA − 1.5 2.1 V
output voltage −0.5 − +18 V

= 330 Ω; CL=50pF 40 −−mA/µs

L

transfer gain 0.3 −−S

LOW level input voltage (reverse
rotation)

HIGH level input voltage (normal
rotation)

LOW level input current (reverse
rotation)

HIGH level input current (normal
rotation)

brake-mode voltage enable brake mode;

reverse mode;
4V<VP<18V

normal mode;
4V<VP<18V

reverse mode;
T

=25°C

amb

normal mode;
T

=25°C

amb

−−2.3 V

2.7 −−V

−−20 −µA

− 0 −µA

−−2.3 V

4V<VP<18V
normal mode;

4V<V

<18V

P

input current brake mode; T

normal mode;

=25°C

T

amb

=25°C −−20 −30 µA

amb

2.7 −−V

− 020µA

LOW level output voltage IO= 1.6 mA −−0.4 V
HIGH level output voltage IO= −60 µA − VP− 0.3 − V
HIGH-to-LOW transition time T

amb

=25°C;

− 0.5 −µs

CL= 50 pF; RL=10kΩ

ratio of FG frequency and

=25°C − 1 −

T

amb

commutation frequency

CAP-ST

I

sink

I

source

V

SWL

V

SWH

output sink current 1.5 2.0 2.5 µA
output source current −2.5 −2.0 −1.5 µA
LOW level switching voltage T
HIGH level switching voltage T

=25°C − 0.20 − V

amb

=25°C − 2.20 − V

amb

1997 Sep 12 11

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

CAP-TI

I

sink

I

source

V

SWL

V

SWM

V

SWH

CAP-CD

I

sink

I

source

I

sink/Isource

V

IL

VIL∆

----------- ­T∆

V

IH

CAP-DC

I

sink

I

source

I

sink/Isource

V

IL

VIL∆

----------- ­T∆

V

IH

Notes

1. An unstabilized supply can be used.

2. V

VMOT=VP

3. Switching levels with respect to driver outputs OUT-NA, OUT-NB, OUT-NC, OUT-PA, OUT-PB and OUT-PC.

output sink current 20 28 38 µA
output source current 0.2V<V

0.3V<V
LOW level switching voltage T
MIDDLE level switching voltage T
HIGH level switching voltage T

=25°C − 50 − mV

amb

=25°C − 0.30 − V

amb

=25°C − 2.20 − V

amb

< 0.3 V −64 −57 −50 µA

CAP-TI

< 2.2 V −6.5 −5.5 −4.5 µA

CAP-TI

output sink current 10.6 16.2 22 µA
output source current −5.3 −8.1 −11 µA
ratio of sink to source current 1.85 2.05 2.25
LOW level input voltage T
temperature coefficient of LOW

=25°C 825 850 875 mV

amb

−−1.4 − mV/K

level input voltage
HIGH level input voltage 2.3 − 2.5 V

output sink current 10.1 15.5 20.9 µA
output source current −20.9 −15.5 −10.1 µA
ratio of sink to source current 0.9 1.025 1.15
LOW level input voltage T
temperature coefficient of LOW

=25°C 825 850 875 mV

amb

−−1.4 − mV/K

level input voltage
HIGH level input voltage 2.3 − 2.5 V

; all other inputs at 0 V; all outputs at VP; IO= 0 mA.

1997 Sep 12 12

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

APPLICATION INFORMATION

handbook, full pagewidth

RY

(1)

RX

(1)

RY

(1)

RX

(1)

28 27 26 25 24 23 22 21 20 19 18 17 16 15

1234567891011121314

330 Ω

n.c.

kΩ

1

1

1

kΩ

kΩ

TDF5242T

10
nF

n.c.

n.c.

100

nF

18
nF

18
nF

FG

BRAKE

1 µF

V

MGG990

P

(1) RX = RY > 8 (VMOT − 1.5).

RY

(1)

RX

(1)

DIR

1 µF

VMOT

Fig.6 Application diagram without use of the Operational Transconductance Amplifier (OTA) with bipolar power

transistors.

1997 Sep 12 13

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

handbook, full pagewidth

330 Ω

28 27 26 25 24 23 22 21 20 19 18 17 16 15

1234567891011121314

n.c.

1 µF

kΩ

1

1

1

kΩ

kΩ

TDF5242T

DIR

VMOT

BRAKE

FG

10
nF

n.c.

n.c.

100

nF

1 µF

18
nF

18
nF

V

MGG991

P

Fig.7 Application diagram without use of the Operational Transconductance Amplifier (OTA) with MOSFETs.

1997 Sep 12 14

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

handbook, full pagewidth

from

DAC

FG to

micro-

controller

47 kΩ

220 nF

18 nF

18 nF

TEST

10 nF

20

16

15
14

8

18

10

+14 V

THERMAL

PROTECTION

BD434

680 Ω

47 nF

START-UP

OSCILLATOR

ADAPTIVE

COMMUTATION

DELAY

TIMING

ROTATION

SPEED

AND

DETECTOR

OUTPUT

STAGE

470 Ω

21

39 kΩ

120 Ω

10 kΩ

1 µF

47 nF

19 6

TDF5242T

COMMUTATION

LOGIC

OUT-PA

OUT-NA

OUT-PB

OUT-NB

OUT-PC

28

27

2

1

4

DIRECTION

LOGIC

+5 V

n.c.

GND1

11GND2

3

13

12, 17, 25

BRAKE

LOGIC

7

DIR BRAKE

Fig.8 Application of the TDF5242T as a scanner driver, with the use of the uncommitted on-chip OTA.

1997 Sep 12 15

OUT-NC

EMF COMPARATORS

9

5

22

23

24
26

MGG992

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

pin 1 index

1

e

15

14

w M

b

p

SOT136-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT136-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E06 MS-013AE

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

18.1

7.6

7.4

0.30

0.29

1.27

0.050

17.7

0.71

0.69

REFERENCES

1997 Sep 12 16

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Sep 12 17

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Sep 12 18

Philips Semiconductors Preliminary specification

Brushless DC motor drive circuit TDF5242T

NOTES

1997 Sep 12 19

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
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Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
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India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 297027/1200/02/pp20 Date of release: 1997 Sep 12 Document order number: 9397 750 02378