Alignment-freemultistandardvision
and FM sound IF-PLL demodulator
Product specification
Supersedes data of 1999 Jul 21
File under Integrated Circuits, IC02
2000 Nov 22
Page 2
Philips SemiconductorsProduct specification
Alignment-free multistandardvisionand
FM sound IF-PLL demodulator
FEATURES
• 5 V supply voltage
• Gain controlled wide-band Vision Intermediate
Frequency (VIF) amplifier (AC-coupled)
• True synchronous demodulation with active carrier
regeneration (very linear demodulation, good
intermodulation figures, reduced harmonics and
excellent pulse response)
• Fully integrated VIF Voltage Controlled Oscillator
(VCO), alignment-free
• Digital acquisition help, VIF frequencies of 38.0, 38.9,
45.75 and 58.75 MHz
• 4 MHz reference frequency input [signal from
Phase-Locked Loop (PLL) tuning system] or operating
as crystal oscillator
• VIF Automatic Gain Control (AGC) detector for gain
control, operating as peak sync detector, fast reaction
time
TDA9880T
• Precise fullydigital Automatic Frequency Control (AFC)
detector with 4-bit digital-to-analog converter
• Fully integrated sound carrier trap for 4.5, 5.5,
6.0 and 6.5 MHz, controlled by reference signal
• Alignment-freeselectiveFM-PLL demodulator with high
linearity and low noise
• Digital frequency control, sound carrier frequencies
4.5, 5.5, 6.0 and 6.5 MHz
• Stabilizer circuit for ripple rejection and to achieve
constant output signals
• Electrostatic discharge (ESD) protection for all pins.
GENERAL DESCRIPTION
The TDA9880T is an integrated circuit for multistandard
vision IF signal processing and FM demodulation in TV
and VTR sets.
ORDERING INFORMATION
TYPE NUMBER
NAMEDESCRIPTIONVERSION
TDA9880TSO20plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
PACKAGE
2000 Nov 222
Page 3
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
I
P
V
i(sens)(VIF)(rms)
G
VIF(cr)
f
VIF
∆f
VIF
V
o(v)(p-p)
G
dif
ϕ
dif
B
v(−3dB)(trap)
α
SC1
S/N
W
PSRR
13
B
v(−1dB)
I
ch(max)(20)
I
dch(max)(20)
I
sink(14)
AFC
stps
I
o(source)(19)
I
o(sink)(19)
V
o(intc)(rms)
supply voltagenote 14.55.05.5V
supply current85100115mA
VIF input voltage sensitivity
−1 dB video at output−50100µV
(RMS value)
VIF gain control rangesee Fig.36569−dB
VIF frequenciessee Table 2−38.0−MHz
−38.9−MHz
−45.75−MHz
−58.75−MHz
VIF frequency window of digital
referenced to f
VIF
−±2.38−MHz
acquisition help
video output signal voltage
(peak-to-peak value)
sound carrier off; see Fig.91.72.02.3V
trap bypass mode;
0.951.101.25V
see Fig.9
differential gain
differential phase
−3 dB video bandwidth including
sound carrier trap
“NTC-7 Composite”
“NTC-7 Composite”
CL< 20 pF; RL>1kΩ;
AC load; note 2
f
= 4.5 MHz
trap
−25%
−24deg
3.954.05−MHz
(M/N standard)
f
= 5.5 MHz
trap
4.905.00−MHz
(B/G standard)
trap attenuation at first sound carrier M/N standard3036−dB
B/G standard3036−dB
weighted signal-to-noise ratio of
see Fig.5; note 35660−dB
video signal
power supply ripple rejection at
pin 13
−1 dB video bandwidthCL< 20 pF; RL>1kΩ;
f
= 70 Hz; video signal;
ripple
grey level; see Fig.8
2528−dB
56−MHz
AC load; trap bypass mode
AGC maximum charge current at
6810µA
pin 20
AGC maximum discharge current at
7.51012.5µA
pin 20
sink current of tuner AGC at pin 14maximum tuner gain
450600750µA
reduction; V14=1V;
see Fig.3
AFC steepness ∆I19/∆f0.851.051.25µA/kHz
AFC output source current at pin 19160200240µA
AFC output sink current at pin 19160200240µA
intercarrier output voltage
(RMS value)
V
i(SC)
-------------V
i(PC)
note 4
24 dB;–=
−49−mV
2000 Nov 223
Page 4
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
B
intc(−3dB)(ul)
V
o(AF)(8)(rms)
THD
8
B
AF(−3dB)
S/N
W(AF)
α
AM(sup)
PSRR
8
∆f
FM
f
ref(15)
V
ref(15)(rms)
upper limit −3 dB intercarrier
7.59.0−MHz
bandwidth
audio output signal voltage at pin 8
(RMS value)
25 kHz FM deviation;
75 µs de-emphasis
400500600mV
total harmonic distortion at pin 8−0.150.5%
−3 dB audio frequency bandwidthwithout de-emphasis;
100120−kHz
dependent on loop filter at
pin 4
weighted signal-to-noise ratio of
audio signal
black picture5056−dB
white picture4551−dB
6 kHz sine wave
4046−dB
(black-to-white modulation)
sound carrier
3540−dB
subharmonics;
f = 2.25 MHz ±3 kHz
AM suppression of FM demodulator 75 µs de-emphasis;
4046−dB
AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation
power supply ripple rejection at pin 8 f
frequency window of digital
= 70 Hz; see Fig.81420−dB
ripple
−±225−kHz
acquisition help for FM demodulator
frequency of reference signal at
−4.0−MHz
pin 15
amplitude of referencesignal source
operation as input terminal80−400mV
at pin 15 (RMS value)
Notes
1. Values of video and sound parameters can be decreased at VP= 4.5 V.
2. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps
(see Figs 12 to 17); H (s) is the absolute value of transfer function.
3. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz
(M/N standard) or B = 5.0 MHz (B/G, I and D/K standard) weighted in accordance with
“CCIR 567”
.
4. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal
video signal with 1.1 V (p-p) as a reference:
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
FUNCTIONAL DESCRIPTION
Figure 1 shows the simplified block diagram of the
integrated circuit. The integrated circuit comprises the
following functional blocks:
1. VIF amplifier
2. Tuner-AGC and VIF-AGC
3. VIF-AGC detector
4. Frequency Phase-Locked Loop (FPLL) detector
5. VCO and Travelling Wave Divider (TWD)
6. Digital acquisition help and AFC
7. Video demodulator and amplifier
8. Sound carrier trap
9. Intercarrier mixer
10. FM demodulator and acquisition help
11. Audio amplifier
12. Internal voltage stabilizer.
VIF amplifier
The VIF amplifier consists of three AC-coupled differential
amplifier stages. Each differential stage comprises a
feedback network controlled by emitter degeneration.
Tuner-AGC and VIF-AGC
The AGC capacitor voltage is converted to an internal VIF
gaincontrol signal, and is fedto the tuner AGC togenerate
the tuner AGC output current at pin TAGC (open-collector
output). The tuner AGC takeover point can be adjusted
with R
filter in order to achieve the optimum IF input level.
VIF-AGC detector
The AGC detector generates the required VIF gain control
voltage for constant video output by charging or
discharging the AGC capacitor. Gain control is performed
by sync level detection. The newly developed AGC circuit
provides fast reaction time to cope with ‘aeroplane
fluttering’. The time constants for decreasing or increasing
gain are nearly equal.
. This allows the tuner to be matchedto the SAW
TOP
TDA9880T
After frequency lock-in the phase detector produces a DC
current proportional to the phase difference between the
VCO and the input signal. The DC current of either the
frequency detector or the phase detector is converted into
aDCvoltagevia the VIF-PLL filter, which controls the VCO
frequency.
VCO and Travelling Wave Divider (TWD)
The Resistor Capacitor (RC) VCO operates as an
integrated relaxation oscillator atdouble the picture carrier
frequency.The control voltage required totunethe VCO to
actually double the picture carrier frequency is generated
by the FPLL detector and fed via the loop filter to the VCO
control input terminal.
The oscillator signal is divided-by-two with a TWD which
generatestwo differential output signals witha 90 degrees
phase difference independent of the frequency.
Digital acquisition help and AFC
The integrated relaxation oscillator has a very wide
frequency range from approximately 30 to 70 MHz (after
the TWD). To prevent false locking of the FPLL and with
respect to the catching range of the frequency detector of
maximum ±2.5 MHz, the Digital Acquisition Help (DAH)
provides current into the loop filter until the VCO is in a
frequency window of ±2.3 MHz around the wanted VIF
frequency. In this case the analog operating FPLL willlock
the VCO to the VIF carrier and the acquisition help does
not provide any current to the loop filter.
The principle of the digital acquisition help is as follows:
the VCO is connected to a downcounter, which is preset
depending on the required VIF frequency. The counting
time, as well as the counter control, is derived from a
4 MHz reference signal. This signal can be supplied from
the internal 4 MHz crystal oscillator or from the 4 MHz
reference oscillator of an external tuning system.
The counting result after a counting cycle corresponds to
the actual VCO frequency.
The digital AFC is also derived from the counting result
after a counting cycle by digital-to-analog converting the
last four bits of the counter.
Frequency Phase-Locked Loop (FPLL) detector
The VIF amplifier output signal is fed into a Frequency
Detector(FD) and into a PhaseDetector (PD) via a limiting
amplifier. During acquisition the frequency detector
produces a DC current proportional to the frequency
difference between the input and the VCO signal.
2000 Nov 227
Video demodulator and amplifier
The video demodulator is realized by a multiplier which is
designedforlowdistortionandlargebandwidth.Thevision
IF input signal is multiplied with the ‘in phase’ signal of the
travelling wave divider output.
Page 8
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
The demodulator output signal is fed via an integrated
low-pass filter for attenuation of the carrier harmonics to
the video amplifier. The video amplifier is realized by an
operational amplifier with internal feedback and high
bandwidth. A low-pass filter is integrated to achieve an
attenuation of the carrier harmonics. The video signal of
1.1 V (p-p) for nominal vision IF modulation is fed
internally to the integrated sound carrier trap as well as to
the VIF-AGC detector. The second stage of the video
amplifier converts and amplifies the differential output
signal from the sound carrier trap to the single-ended
CVBS output signal at pin 13 with a 2 V (p-p) amplitude.
Noise clipping is provided. Furthermore the trap can be
bypassed by the implemented input switch of the second
amplifier stage, forced by connecting pin 12 to ground.
Sound carrier trap
The sound carrier trap consists of a reference filter, a
phase detector and the sound trap itself.
A sound carrier reference signal is fed into the reference
low-pass filter and is shifted by a nominal 90 degrees.
The phasedetectorcomparestheoriginalreferencesignal
with the signal shiftedby the reference filter and produces,
at the external capacitor CTR, a DC voltage by charging or
discharging the capacitor with a current proportional to the
phase difference between both signals, respectively to the
frequency error of the integrated filters. The DC voltage is
converted to currents which control the frequency position
of the reference filter and the sound trap.
The sound trap itselfis constructed of three separate traps
to realize sufficient suppression of the first and second
sound carrier. The right frequency position of the different
standards is set by the sound carrier reference signal.
Intercarrier mixer
The intercarrier mixer is realized by a multiplier, operating
inquadraturemodeforsuppressionoflowfrequencyvideo
signals. The VIF amplifier output signal is fed to the
intercarrier mixer and converted to an intercarrier
frequency by the regenerated 90 degree picture carrier
from the VCO. The mixer output signal is fed via a
band-pass filter and amplifier for attenuation of the high
frequency video signal components and carrier harmonics
to the output pin 11. The intercarrier signal is fed also to
the integrated FM demodulator.
TDA9880T
FM demodulator and acquisition help
The FM demodulator is realized as a narrow-band PLL
with external loop filter, which provides the necessary
selectivity. To achieve good selectivity, a linear phase
detector and constant input level are required. The
intercarrier signal from the intercarrier mixer is fed via a
gain controlled amplifier to the phase detector and it’s
output signal controls (via the loop filter) the integrated
relaxation oscillator. The possible frequency range is from
4 to 7 MHz. As a result of locking the oscillator frequency
tracks with the FM modulation of the input signal;
therefore,theoscillator control voltage is superimposed by
the AF voltage. In this way the FM-PLL operates as an
FM demodulator. The AF voltage is present at the loop
filter and is fed via a buffer with 0 dB gain to the audio
amplifier.
The digital acquisition help operates in the same way as
described in Section “Digital acquisition help and AFC”.
Audio amplifier
The audio amplifier consists of two parts:
1. The AF preamplifier is an operational amplifier with
internal feedback, high gain and high common mode
rejection. The AF voltage from the PLL demodulator,
by principle a small output signal, is amplified by
30 dB. A DC operating point control circuit (pin 6)
decouples the AF amplifier from the DC voltage of the
PLL. The low-pass characteristic of the amplifier
reduces the harmonics of the intercarrier signal at the
sound output terminal. If required, a de-emphasis
network can be realized by the amplifier output
resistance and an external capacitor.
2. The AF output amplifier (10 dB) provides the required
output level by a rail-to-rail output stage. This amplifier
makes use of an input selector for switching to mute
state, automatically controlled by the mute switching
voltage from the digital acquisition help in order to
avoid lock-in noise. During normal operation the
automatic audio mute function is not active.
Application of a 2.2 kΩ resistor between the
intercarrier output (pin 11) and ground will activate the
automatic audio mute function.
Internal voltage stabilizer
The band gap circuit internally generates a voltage of
approximately 2.4 V, independent of the supply voltage
and the temperature. Avoltage regulator circuit, controlled
by this voltage, produces a constant voltage of 3.55 V
which is used as an internal reference voltage.
2000 Nov 228
Page 9
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
P
V
n
t
sc
T
stg
T
amb
V
es
Notes
1. Charge device model class A; machine model: discharging a 200 pF capacitor via a 0.75 µH inductance.
2. Charge device model class B; human body model: discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
supply voltageIP= 115 mA; T
=70°C; at
amb
−5.5V
maximum chip temperature of 125 °C
voltage at
pins 1 to 4, 6 to 10, 12 and 17 to 200V
P
V
pin 14013.2V
short-circuit time to ground or V
P
−10s
storage temperature−25+150°C
ambient temperature−20+70°C
electrostatic handling voltage for all
pins
note 1−250+250V
note 2−3000+3000V
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th(j-a)
thermal resistance from junction to ambientin free air85K/W
2000 Nov 229
Page 10
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
CHARACTERISTICS
VP=5V; T
PC/SC = 10 dB) is used for specification; V
1 : 1; DSB video modulation; 10% residual carrier; video signal in accordance with
taken in test circuit of Fig.18; unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply (pin 17)
V
P
I
P
P
tot
VIF amplifier (pins 1 and 2)
V
i(sens)(VIF)(rms)
V
i(max)(rms)
∆V
int
G
VIF(cr)
B
VIF(−3dB)(ll)
B
VIF(−3dB)(ul)
R
i(dif)
C
i(dif)
V
I
FPLL and true synchronous video demodulator; note 4
f
VCO(max)
f
VIF
∆f
VIF
t
acq
V
i(sens)(VIF)(rms)
SIGNAL AT PIN 18
I
o(source)(PD)(max)
=25°C; see Table 2 for input frequencies; M standard (fPC= 45.75 MHz; fSC= 41.25 MHz;
amb
i(VIF)(rms)
= 10 mV (sync level); IF input from 50 Ω via broadband transformer
“NTC-7 Composite”
supply voltagenote 14.555.5V
supply current85100115mA
total power dissipation−500633mW
VIF input voltage sensitivity
−1 dB video at output−50100µV
(RMS value)
maximum input signal voltage
(RMS value)
internal IF amplitudedifference
between picture and sound
1 dB video at output;
note 2
within AGC range;
∆f = 4.5 MHz
110−−mV
−0.71dB
carrier
VIF gain control rangesee Fig.36569−dB
lower limit −3 dB VIF
DC input voltage2.32.62.9V
input resistance2.53.03.5kΩ
resonance resistance of crystal operation as crystal
−−200Ω
oscillator
pull-up/down capacitancenote 26−−−pF
frequency of reference signal−4.0−MHz
tolerance of reference
note 15−−±0.1%
frequency
V
2000 Nov 2217
Page 18
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
ref(rms)
amplitude of reference signal
source (RMS value)
R
o(ref)
output resistance of reference
source
C
K
decoupling capacitance to
external reference source
Notes
1. Values of video and sound parameters can be decreased at VP= 4.5 V.
2. This parameter is tested with 110 mV to ensure maximum input level.
3. Thisparameter is not tested during production andisonly given as application information for designingthetelevision
receiver.
4. Loop bandwidth BL = 70 kHz (damping factor d = 1.9; calculated with sync level within gain control range).
Calculation of the VIF-PLL filter can be done by use of the following formulae:
BL
d
1
K
------ -
3 dB–
2π
1
RKOKDC=
-- 2
, valid for d ≥ 1.2
R=
OKD
,
where:
rad
K
= VCO steepness or; KD= phase detector steepness;
O
--------
V
Hz
2π
------ -
V
R = loop resistor; C = loop capacitor; BL
5. V
i(VIF)(rms)
= 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video
modulation.
6. V
signal for nominal video signal.
i(VIF)
7. Broadband transformer at VIF input. The C/N ratio at VIF input is defined as the VIF input signal (sync level,
RMS value) related to a superimposed 4.2 MHz band-limited white noise signal (RMS value); white picture video
modulation.
8. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps
(see Figs 12 to 17); H (s) is the absolute value of transfer function.
9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13).
B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard).
10. The intermodulation figures are defined:
αd
0.92
αd
2.76
20
20
---------------------------------------
V
at 0.92 MHz
0
at 3.58 MHz
V
0
log=
---------------------------------------
V
at 2.76 MHz
0
3.6 dB+log=
; αd
2.76
at 3.58 MHz
V
0
11. Measurements taken with SAW filter M1963M (sound shelf: 20 dB); loop bandwidth BL = 70 kHz.
a) Modulation Vestigial Side-Band (VSB); sound carrier off; f
b) Sound carrier on; f
= 10 kHz to 10 MHz.
video
12. The sound carrier trap can be disabled by switching pin 12 to ground (<0.8 V). In this way the full composite video
spectrum appears at pin 13. The amplitude is 1.1 V (p-p).
13. Response time valid for a VIF input level range of 200 µVto70mV.
operation as input
80−400mV
terminal
−−4.7kΩ
operation as input
22100−pF
terminal
µA
--------
rad
= loop bandwidth for −3 dB; d = damping factor.
−3dB
; αd
value at 0.92 MHz referenced to black or white signal;
0.92
value at 2.76 MHz referenced to chrominance carrier.
> 0.5 MHz.
video
2000 Nov 2218
Page 19
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is
given in Fig.7. The AFC steepness can be changed by resistors R1 and R2.
15. The tolerance of the reference frequencydeterminestheaccuracy of the VIF AFC, FM demodulatorcentrefrequency
and maximum FM deviation.
16. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal
video signal with 1.1 V (p-p) as a reference:
V
iSC()
dB()6 dB 3 dB±+
--------------V
iPC()
V
o(intc)(rms)
1.1 V (p-p)
1
×10
---------- 22
where:
1
= correction term for RMS value,= sound-to-picture carrier ratio at VIF input(pins 1 and 2) in dB,
---------- 22
6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude
V
o(intc)(rms)
.
17. For normal operation no DC load at pin 11 is allowed, so the automatic audio mute function is not active.
By connecting a 2.2 kΩ resistor between pin 11 and ground the automatic audio mute function will be activated.
With this application also the series capacitor C
18. Calculation of the FM-PLL filter can be done approximately by use of the following formulae:
of the loop filter at pin 4 should be changed from 33 nF to 4.7 nF.
S
BL
fo1.55 ϑ2–()=
3 dB–
The formulae are only valid under the following conditions:
ϑ≤1 and C
>5C
S
P
where:
rad
K
= VCO steepness or; KD= phase detector steepness;
O
R
= loop resistor; CS= series capacitor; CP= parallel capacitor; fo= natural frequency of PLL;
S
BL
= loop bandwidth for −3 dB; ϑ = damping factor. For examples see Table 1.
−3dB
--------
V
Hz
2π
------ -
V
µA
--------
rad
19. For all S/N measurements the used vision IF modulator requires an incidental phase modulation for black-to-white
jump of less than 0.5 degrees.
20. Measurements taken with SAW filter M1963M (Siemens) for vision and sound IF (sound shelf: 20 dB).
Picture-to-sound carrier ratio of transmitter: PC/SC = 10 dB. Input level (at pins 1 and 2) V
i(VIF)(rms)
level), 25 kHz FM deviation for sound carrier, fAF= 400 Hz. Measurement in accordance with
= 10 mV (sync
“CCIR 468-4”
.
De-emphasis = 75 µs.
21. The PC/SC ratio is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC
ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values.
22. Measured with an FM deviation of 25 kHz, the typical AF output signal is 500 mV (RMS). By using Rx=20kΩ the
AF output signal is attenuated by 6 dB, so 250 mV (RMS). For handling an FM deviation of more than 55 kHz the
AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to
100 kHz an attenuation of 6 dB is recommended.
23. C
= 10 nF results in τ =50µs and C
DEEM
= 15 nF results in τ =75µs.
DEEM
2000 Nov 2219
Page 20
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
24. The lower limit of audio bandwidth depends on the value of the capacitor at pin 6. A value of C
f
AF(−3 dB)
≈ 20 Hz and C
= 220 nF leads to f
AFD
AF(−3 dB)
≈ 40 Hz.
25. The reference input pin 15 is able to operate as a 1-pin crystal oscillator as well as an input terminal with external
reference signal, e.g. from the tuning system.
26. The value of Cxdetermines the accuracy of the resonance frequency of the crystal. It depends on the type of crystal
used.
Table 1 Examples to note 18 of Chapter “Characteristics”
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, halfpage
V
20
(V)
4
3
2
1
3050110
(2)(3)(4)(1)
7090
V
i(VIF)
MHB158
(dB/µV)
(µA)
600
500
400
300
200
100
0
I
14
120
handbook, halfpage
V
i(VIF)
(dBµV)
100
90
80
70
60
024
TDA9880T
MHB159
12820416
R
TOP
(kΩ)
(1) VIF AGC voltage.
(2) I
; R
TOP
=22kΩ.
tuner
(3) I
(4) I
tuner
tuner
; R
; R
TOP
TOP
=12kΩ.
=0Ω.
Fig.3 Typical VIF and tuner AGC characteristic.
70
handbook, halfpage
S/N
(dB)
60
50
40
30
20
10
0
3050110
7090
V
i(VIF)
MHB160
(dB/µV)
Fig.5Typical signal-to-noise ratio as a function of
VIF input voltage.
Fig.4Typical tuner takeoverpoint as a function of
R
.
TOP
handbook, halfpage
13.2 dB
21 dB
SC CCPCSC CCPC
3.2 dB
13.2 dB
21 dB
BLUEYELLOW
SC = sound carrier, with respect to sync level.
CC = chrominance carrier, with respect to sync level.
PC = picture carrier, with respect to sync level.
The sound carrier levels are taking into account a sound shelf
attenuation of 20 dB (SAW filter M1963M).
Fig.6 Input signal conditions.
10 dB
MHA739
2000 Nov 2221
Page 22
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, full pagewidth
5
V
19
V
P
TDA9880T
R1
22 kΩ
I
19
19
R2
22 kΩ
MHB075
(V)
4
3
2
1
0
4348
lock range without SAW filter
444546
45.75
45.94
45.56
47
f (MHz)
TDA9880T
−200
I
19
(µA)
−100
0
100
200
handbook, full pagewidth
Fig.7 Measurement conditions and typical AFC characteristic.
VP = 5 V
VP = 5 V
TDA9880T
MHB076
(f
ripple
100 mV
= 70 Hz)
t
Fig.8 Ripple rejection condition.
2000 Nov 2222
Page 23
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, full pagewidth
2.6 V
1.5 V
3.57 V
3.35 V
1.95 V
1.35 V
2.72 V
1.83 V
Fig.9 Typical video signal levels on output pin 13 (sound carrier off).
trap bypass mode
normal mode
TDA9880T
zero carrier level
white level
black level
sync level
MHB163
10
handbook, full pagewidth
audio
0
S/N
(dB)
−10
−20
−30
−40
−50
−60
−70
49464340133710728222519313416
Conditions: 25 kHz FM deviation; 75 µs de-emphasis.
(1) Signal.
(2) Noise at H-picture.
(3) Noise at black picture.
MHB164
(1)
(2)
(3)
4
gain controlled operation of FM-PLL
PC/SC ratio at pins 1 and 2 (dB)
Fig.0 Audio S/N as a function of picture-to-sound carrier ratio.
2000 Nov 2223
Page 24
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
(dBµV)
120
100
(1)
80
tuner gain
control range
handbook, full pagewidth
antenna input
SAW insertion
loss 14 dB
IF slip
6 dB
70 dB
VIF AGC
MHB079
TDA9880T
1
video 1.1 V (p-p)
−1
10
IF signals
RMS value
(V)
−2
10
(TOP)
−3
60
SAW insertion
loss 14 dB
40
40 dB
RF gain
20
10
VHF/UHF tunerVIF
tunerSAW filter
VIF amplifier, demodulator
and video
TDA9880T
10
0.66 × 10
−4
10
−5
10
0.66 × 10
−3
−5
(1) Depends on TOP.
Fig.11 Front-end level diagram.
2000 Nov 2224
Page 25
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, full pagewidth
10
H (s)
(dB)
0
−10
−20
−30
−40
22.533.544.55
TDA9880T
MHB166
minimum
requirements
f (MHz)
handbook, full pagewidth
Fig.12 Typical amplitude response for sound trap at M/N standard (including Korea).
400
group
delay
(ns)
300
200
100
0
−100
00.51.52312.53.54
MHB167
due to pre-correction
f (MHz)
ideal characteristic
in the transmitter
minimum
requirements
Remark: overall delay is not shown, here the maximum ripple is specified.
Fig.13 Typical group delay for sound trap at M/N standard.
2000 Nov 2225
Page 26
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, full pagewidth
10
H (s)
(dB)
0
−10
−20
−30
−40
44.555.566.57
TDA9880T
MHB168
minimum
requirements
f (MHz)
400
handbook, full pagewidth
group
delay
(ns)
300
200
100
0
−100
00.51.52312.53.544.55
Fig.14 Typical amplitude response for sound trap at B/G standard.
MHB169
ideal characteristic
due to pre-correction
in the transmitter
minimum
requirements
f (MHz)
Remark: Overall delay is not shown, here the maximum ripple is specified.
Fig.15 Typical group delay for sound trap at B/G standard.
2000 Nov 2226
Page 27
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, full pagewidth
10
H (s)
(dB)
0
−10
−20
−30
−40
44.555.566.57
TDA9880T
MHB170
minimum
requirements
f (MHz)
handbook, full pagewidth
Fig.16 Typical amplitude response for sound trap at I standard.
10
H (s)
(dB)
0
−10
−20
−30
−40
44.555.566.57
MHB171
f (MHz)
minimum
requirements
Fig.17 Typical amplitude response for sound trap at D/K standard.
2000 Nov 2227
Page 28
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2000 Nov 2228
TEST CIRCUIT
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
Philips SemiconductorsProduct specification
IF
input
AFC
output
1.5
22
kΩ
kΩ
C
VAGC
10 nF
VAGCAFCVPLL
20
22 kΩ
(1)
VIF-PLL
filter
100
R
nF
150 Ω
181914171615
C
220 nF
V
P
10 nF
V
P
GNDREF
4 MHz
(3)
C
x
f
ref
TAGC
output
CVBS
output
10
nF
TAGCCVBSTRSIO
C
TR
470
nF
bypass
131211
sound
intercarrier
output
3.3
MΩ
auto
mute
2.2
kΩ
TDA9880T
1372456
VIF1VIF2TOPFMPLL
1
: 1
22 kΩ
50
Ω
R
TOP
C
33 nF
R
2.7 kΩ
S
S
FM-PLL
filter
(2)
C
820
pF
P
DEEMAFDFAGCAUDS0S1
470 nF
C
100 nF
C
DEEM
15 nF
(4)
R
x
8910
FAGC
output
LM
H
logicaudio
LM
H
47
kΩ
47
kΩ
MHB162
(1) See note 4 of Chapter “Characteristics”.
(2) See notes 17 and 18 of Chapter “Characteristics”.
(3) See note 26 of Chapter “Characteristics”.
(4) See note 22 of Chapter “Characteristics”.
Fig.18 Test circuit.
TDA9880T
handbook, full pagewidth
Page 29
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
INTERNAL PIN CONFIGURATIONS
handbook, halfpage
+
1
1.1 kΩ5 kΩ
+
1.1 kΩ
2
2.65 V
3.55 V
MHB087
handbook, halfpage
3
TDA9880T
30 kΩ
+
1.9 V
20 kΩ
3.55 V
9 kΩ
MHB088
Fig.19 Pin 1 (VIF1) and pin 2 (VIF2).
handbook, halfpage
maximum 100 µA
+
4
maximum 100 µA
MHB089
andbook, halfpage
Fig.20 Pin 3 (TOP).
+
5
240 µA
5.0 kΩ
MHB090
Fig.21 Pin 4 (FMPLL).
2000 Nov 2229
Fig.22 Pin 5 (DEEM).
Page 30
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, halfpage
+
6
Fig.23 Pin 6 (AFD).
+
maximum 1.5 µA
maximum 1.5 µA
MHB091
handbook, halfpage
7
maximum 2.2 µA
+
maximum
2.2 µA
Fig.24 Pin 7 (FAGC).
TDA9880T
2 kΩ
1.5 V
MHB092
handbook, halfpage
8
handbook, halfpage
++
+
Fig.25 Pin 8 (AUD).
+
10
600 µA
27 kΩ
15 kΩ
10 pF
MHB093
handbook, halfpage
handbook, halfpage
+
9
Fig.26 Pin 9 (S0).
+
11
27 kΩ
3.55 V
MHB094
14.7 kΩ
3.55 V
MHB095
Fig.27 Pin 10 (S1).
2000 Nov 2230
1.2 mA
MHB096
Fig.28 Pin 11 (SIO).
Page 31
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, halfpage
+
12
maximum 9 µA
1 kΩ
maximum 13 µA
500 Ω
Fig.29 Pin 12 (TR).
maximum 150 µA
1.1 V
MHB165
handbook, halfpage
+
13
MHB098
Fig.30 Pin 13 (CVBS).
TDA9880T
+
7 kΩ10 kΩ
2.5 mA
handbook, halfpage
handbook, halfpage
14
maximum
600 µA
Fig.31 Pin 14 (TAGC).
16GND
MHB101
MHB099
handbook, halfpage
handbook, halfpage
+
3 kΩ
15
200 µA
Fig.32 Pin 15 (REF).
17
MHB100
+
MHB102
Fig.33 Pin 16 (GND).
2000 Nov 2231
Fig.34 Pin 17 (VP).
Page 32
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
handbook, halfpage
+
18
maximum
15 µA
maximum
5 µA
+
VCO
25 kΩ
MHB103
handbook, halfpage
TDA9880T
+
19
maximum 200 µA
1 kΩ
1 kΩ
MHB104
handbook, halfpage
20
Fig.35 Pin 18 (VPLL).
+
maximum 8 µA
maximum 10 µA
Fig.36 Pin 19 (AFC).
MHB105
Fig.37 Pin 20 (VAGC).
2000 Nov 2232
Page 33
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TDA9880T
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
1
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
0.49
0.36
p
cD
0.32
0.23
0.013
0.009
3
0.019
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1)(1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
0.055
A
1.4
1
detail X
1.1
1.1
1.0
0.4
0.043
0.043
0.039
0.016
(A )
L
p
L
0.25
0.01
A
3
θ
0.250.1
0.01
ywvθ
Z
0.9
0.4
8
0.004
0.035
0.016
0
o
o
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013
REFERENCES
2000 Nov 2233
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
Page 34
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
SOLDERING
Introduction to soldering surface mount packages
Thistextgivesa very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butit is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
TDA9880T
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Nov 2234
Page 35
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
TDA9880T
FM sound IF-PLL demodulator
Suitability of surface mount IC packages for wave and reflow soldering methods
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJsuitablesuitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Objective specificationDevelopmentThis data sheet contains the design target or goal specifications for
Preliminary specificationQualificationThis data sheet contains preliminary data, and supplementary data will be
Product specificationProductionThis data sheet contains final specifications. Philips Semiconductors
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditions above those giveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
PRODUCT
STATUS
DEFINITIONS
product development. Specification may change in any manner without
notice.
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected toresult in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyofthese products, conveys no licence or title
under any patent, copyright, or mask work right to these
products,andmakes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
(1)
2000 Nov 2236
Page 37
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
NOTES
TDA9880T
2000 Nov 2237
Page 38
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
NOTES
TDA9880T
2000 Nov 2238
Page 39
Philips SemiconductorsProduct specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
NOTES
TDA9880T
2000 Nov 2239
Page 40
Philips Semiconductors – a w orldwide compan y
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
70
Printed in The Netherlands753504/04/pp40 Date of release: 2000 Nov 22Document order number: 9397 750 07671
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