Datasheet TDA8822M-C1, TDA8822T-C1 Datasheet (Philips)

DATA SH EET

Preliminary specification
File under Integrated Circuits, IC02

1997 Jan 08

INTEGRATED CIRCUITS

TDA8822

Universal I

2

C-bus programmable

RF modulator

1997 Jan 08 2

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

FEATURES

• 5 V power supply

• Video amplifier with clamp and white clip circuits

• Programmable video modulation depth

• FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz)

• Programmable picture-to-sound ratio

• Programmable deviation of the sound subcarrier

• Input for modulated NICAM sound subcarrier or second

frequency modulated sound subcarrier

• Asymmetrical or symmetrical RF output buffer

• Symmetrical RF oscillator for UHF or VHF band

according to the application

• One I2C-bus programmable output port

• On-chip Phase-Locked Loop (PLL) frequency

synthesizer for the RF carrier

• On-chip PLL frequency synthesizer for the sound carrier

• On-chip power supply regulator

• On-chip I2C-bus and/or hardware controlled Test

Pattern Signal Generator (TPSG) with LED driver

• RF output switch-off during tuning.

APPLICATIONS

• Video recorders

• Cable converters

• Satellite receivers

• Set top boxes.

GENERAL DESCRIPTION

The TDA8822 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (B/G, I, D/K, M
and N standards).

Two PLL frequency-synthesizers set the picture carrier
frequency and the sound subcarrier frequency to the
required frequencies. These PLL frequency-synthesizers
are programmed via the I

2

C-bus.

The I2C-bus controls these features:

• Video modulation depth

• Sound subcarrier modulation deviation

• Picture-to-sound ratio.

This makes the IC suitable for multistandard applications
without any adjustment into the application.

Additional features are provided like an input for the
NICAM or second FM carrier, a test pattern signal
generator with a LED driver and a general purpose
output port.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8822T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
TDA8822M SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

1997 Jan 08 3

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

QUICK REFERENCE DATA

V

CCA=VCCD

=5V; T

amb

=25°C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2;
PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave;
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

analog supply voltage 4.5 5.0 5.5 V

V

CCD

digital supply voltage 4.5 5.0 5.5 V

I

CC(tot)

total supply current − 60 72 mA

m

d

modulation depth adjustment
range

typical value for MD setting between
0 and 7

72.5 − 90.0 %

P/S picture-to-sound ratio

adjustment range

typical value for PS setting between
0 and 7

−18 −−11 dB

V

RF

RF output voltage level
asymmetrical on a 75 Ω load

frequency between 45 and 860 MHz 77 80 83 dBµV

f

sc

sound subcarrier frequency 4.5 − 6.5 MHz

∆f

sc

sound subcarrier frequency
deviation range

for B/G, I, D/K, SC setting = 1, 2 or 3;
typical value for DEV setting between
0 and 7

20 − 45 kHz

for M, N, SC setting = 0; typical value
for DEV setting between 0 and 7

10 − 22.5 kHz

1997 Jan 08 4

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGE674

VIDEO

PHASE

DETECTOR

VIDEO

CHARGE

PUMP

VCO

CLIP

TPSG

SWITCH

ADDER

AUDIO

CHARGE

PUMP

AUDIO
PHASE

DETECTOR

PROG.

DIVIDER

14 BITS

PROG.

DIVIDER

I

2

C-BUS

RECEIVER

AND

LOGIC

f

div(audio)

f

div(video)

f

ref(video)

f

ref(audio)

REFERENCE

DIVIDER

CRYSTAL

OSCILLATOR

PRESCALER
DIVIDE-BY-8

RF

OSCILLATOR

MIXER

OUTPUT
BUFFER

VOLTAGE

REGULATOR

CLAMP

LOOP

AMP.

SND-IF

AMP.

AUDIO

AMP.

NICAM

AMP.

VIDEO

AMP.

in-lock flag

I2C-bus control

PS

setting

sound oscillator
ON/OFF

DEV
setting

MD setting

TPSG
ON/OFF

test test

frequency
setting

frequency
setting

RF oscillator

ON/OFF

test test

test

1819

RFA RFB

1

V

CCA

23

AGND

24

VIDEO

21

NICAM

22

AUDIO

3

PREEMPH

2

ACP

14

SCL

15

SDA

16

P0

17

TPSG

11 13

V

CCD

DGND

12

XTAL

9

VVT

8

10

7

6

5

4

VCP

RFOSCD

RFOSCC

OGND

RFOSCB

RFOSCA

20

RFGND

TDA8822

1997 Jan 08 5

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

PINNING

SYMBOL PIN DESCRIPTION

V

CCA

1 analog power supply
ACP 2 audio charge pump output
PREEMPH 3 audio pre-emphasis network
RFOSCA 4 RF oscillator A (collector) output
RFOSCB 5 RF oscillator B (base) input
OGND 6 RF oscillator ground
RFOSCC 7 RF oscillator C (base) input
RFOSCD 8 RF oscillator D (collector) output
VVT 9 video tuning voltage output
VCP 10 video charge pump output
V

CCD

11 digital power supply
XTAL 12 crystal oscillator input
DGND 13 digital ground
SCL 14 serial clock (I

2

C-bus) input

SDA 15 serial data (I

2

C-bus) input/output
P0 16 general purpose output
TPSG 17 test pattern signal generator

input/output pin
RFB 18 RF output B
RFA 19 RF output A
RFGND 20 ground for the RF outputs
NICAM 21 NICAM input
AUDIO 22 audio input
AGND 23 analog ground
VIDEO 24 video input

Fig.2 Pin configuration.

handbook, halfpage

V

CCA
ACP

PREEMPH

RFOSCA
RFOSCB

OGND
RFOSCC
RFOSCD

VVT

VCP

V

CCD

XTAL

VIDEO
AGND
AUDIO
NICAM

RFA
RFB

RFGND

TPSG
P0
SDA
SCL
DGND

1
2
3
4
5
6
7
8

9
10
11
12

24
23
22
21
20
19
18
17

16
15
14
13

TDA8822

MGE673

1997 Jan 08 6

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

FUNCTIONAL DESCRIPTION

The TDA8822 is a programmable RF modulator which can
be divided into the following parts:

• Video part

• Audio part

• RF part.

Video part

The video part provides the following:

• The video part includes a clamping circuit which sets the
internal reference voltage to the bottom of the
synchronizing pulse. The modulation depth is adjusted
using 3 bits of the I

2

C-bus programming, called MD2,
MD1 and MD0. These 3 bits make 8 different values for
the modulation depth possible (see Table 1).

• After the modulation depth is set, the signal is fed
through a clip control circuit that clips the video signal to
avoid that the modulation depth becomes higher than
100%.

• The video part also contains a TPSG. This TPSG
generates a pattern that helps to tune the TV set to the
programmed channel of the modulator. The pattern
consists of a sync pulse and two vertical white bars on
the screen (see Fig.3)

The TPSG is activated in two ways:
– Forcing the pin TPSG to DGND in the application

(see Fig.8)

– Setting the TPSG bit to 1 via the I2C-bus, then the

TPSG pin acts as an output port, sinking current to
allow the indication of the use of the TPSG in the
application e.g. with an LED (see Fig.9).

Table 1 Modulation depth setting (typical values)

MD

SETTING

BIT

MODULATION

DEPTH (%)

MD2 MD1 MD0

0 0 0 0 72.5
1 0 0 1 75.0
2 0 1 0 77.5
3 0 1 1 80.0
4 1 0 0 82.5
5 1 0 1 85.0
6 1 1 0 87.5
7 1 1 1 90.0

Fig.3 Test pattern signal.

handbook, full pagewidth

MGE675

0 5 10 15 20 25 30 35 40 45 50 55 60 65 t (µs)

1997 Jan 08 7

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Audio part

The audio part provides the following:

• The sound subcarrier is created in an integrated VCO.
The signal at the output of this VCO is fed to a stage that
adjusts the picture-to-sound ratio and to the audio
programmable divider.

• The frequency of the sound subcarrier is set by
programming the bits SC1 and SC0 of the I2C-bus (see
Table 2). These two bits set the dividing ratio of the
audio programmable divider to get the divided frequency
f

div(audio)

.

• The audio phase detector compares the
phase/frequency of the divided audio frequency f

div(audio)

and the reference frequency for the audio, f

ref(audio)

and
drives the Charge Pump (CP) that charges or
discharges the audio loop filter connected between
pins ACP and AGND to get the VCO oscillating to the
programmed frequency.

• f

ref(audio)

and f

div(audio)

can be monitored on the general

purpose output port during a special test mode.

• The frequency deviation of the sound subcarrier is set
using 3 bits DEV2, DEV1 and DEV0 of the I2C-bus
programming (see Table 3), when a signal of 1 kHz with
a level of 50 mV (p-p) is applied on the audio input pin.

• The difference between the picture carrier level and the
sound subcarrier level is adjusted using 3 bits PS2, PS1
and PS0 (see Table 4).

• The NICAM amplifier has a constant gain, and is
designed for adding a second sound subcarrier in the TV
channel. This subcarrier can be either a second FM
carrier for dual-sound/stereo system used in PAL B/G or
a modulated NICAM carrier. The level between the
picture carrier and the NICAM carrier (P/N) will depend
on the input level on the NICAM input.

Table 2 Sound subcarrier frequency setting

Table 3 Sound subcarrier frequency deviation setting (typical values)

SC SETTING

BIT

SOUND SUBCARRIER

FREQUENCY (MHz)

STANDARD

SC1 SC0

0 0 0 4.5 M, N
1 0 1 5.5 B, G
2 1 0 6.0 I
3 1 1 6.5 D, K

DEV SETTING

BIT

DEVIATION

(%)

DEVIATION (kHz)

DEV2 DEV1 DEV0 B, G, I, D, K M, N

0 0 0 0 40.0 20.0 10.0
1 0 0 1 45.0 22.5 11.3
2 0 1 0 50.5 25.3 12.6
3 0 1 1 56.5 28.3 14.1
4 1 0 0 63.5 31.8 15.9
5 1 0 1 71.5 35.8 17.9
6 1 1 0 80.0 40.0 20.0
7 1 1 1 90.0 45.0 22.5

1997 Jan 08 8

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Table 4 Picture-to-sound ratio setting (typical values)

PS SETTING

BIT

P/S RATIO

(dB)

PS2 PS1 PS0

0 000 −11
1 001 −12
2 010 −13
3 011 −14
4 100 −15
5 101 −16
6 110 −17
7 111 −18

RF part

The RF part provides the following:

• The RF oscillator can produce any frequency used for
TV transmission, from 35 to 890 MHz. The frequency
range depends on the components used in the
application (see Table 11).

• The RF mixer combines the video signal, the sound
subcarrier and the carrier from the NICAM input to build
a baseband TV channel. This baseband signal is then
mixed with the RF oscillator signal to get the RF TV
channel.

• The two signals from the RF mixer are sent to the output
buffer. This output buffer can be used either as two
asymmetrical outputs or as one symmetrical output.

• The output buffer is switched-off while the PLL is not
in-lock, to avoid parasitic output signal during the tuning
of the RF oscillator. The in-lock information is given by
the phase detector of the loop.

• The signal from the RF oscillator is fed to the PLL which
controls the picture carrier frequency. The RF signal is
first divided by 8 in the prescaler, and then divided in the
programmable 14-bits divider. The dividing ratio of this
divider is programmed via the I2C-bus. The minimum
frequency that can be synthesized is 16 MHz, and the
maximum frequency is 1023.9375 MHz.

• The divided frequency called f

div(video)

is compared to the

reference frequency called f

ref(video)

coming from the
crystal oscillator and divided in the reference divider.
The crystal oscillator is intended to be used with a
crystal of 4 MHz.

• The comparison between f

ref(video)

and f

div(video)

is done
in the video phase detector. The resulting signal is fed
via the video charge pump to the loop amplifier,
including the tuning voltage drive (33 V) inside the IC.

• f

ref(video)

and f

div(video)

can also be monitored on the

output port during a special test mode.

• The I2C-bus receiver and control logic includes the
control of:

– Picture carrier frequency
– Sound subcarrier frequency
– Sound subcarrier frequency deviation
– Video modulation depth
– Picture-to-sound ratio
– TPSG on/off and LED drive control
– RF oscillator on/off
– Sound oscillator on/off
– General purpose output port on/off
– Test modes setting.

Software information

The transmission is made using 4 words in I

2

C-bus format.
First the address CA has to be sent, then at least two
consecutive words have to be sent, either the two words
F1 and F0, or the two words C1 and C0.

The two words C1 and F1 are differentiated inside the IC
by the first bit being logic 1 or logic 0 respectively.
The contents of the 4 bytes is shown in Table 5.

At the power-up of the TDA8822, the I2C-bus state is the
following:

• N13 to N0 are not fixed

• SC setting = 1: the sound carrier is fixed to 5.5 MHz

• MD is set to 4 (82.5%), PS is set to 1 (−12 dB) and DEV

is set to 2 (50.5%)

1997 Jan 08 9

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

• T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to
logic 1 and P0 is set to logic 0 to select the video high
impedance test mode because it is in this mode that the
RF oscillator starts in the best conditions.

The TPSG bit is used to switch on or off the TPSG using
the I2C-bus. It is also possible to switch the TPSG on in the
application, connecting the pin TPSG to DGND. This
pin TPSG has a double function and acts as an input or as
an output.

These are the two functions:

• Output: if the TPSG is set using the I2C-bus, the
pin TPSG is used as an output open collector NPN port.
This port can be used to indicate with an LED that the
TPSG is on. This is especially useful in systems using
an on-screen display. If the TV set is not tuned to the
right channel there is an alternate indication that the
TPSG is on (see Fig.9).

• Input: if the TPSG is set with an hardware switch in the
application, the TPSG pin is used as one of the inputs to
select the TPSG mode (see Fig.8).

Notice that if the TPSG bit is set to logic 1 while the RF0
bit is set to logic 0, the TPSG is turned off, and the sound
oscillator is off (see Table 8).

N13 to N0 are the 14 bits to set the video programmable
divider ratio and then to set the picture carrier frequency
following the formula: f

osc=fref(video)

× 8 × N,

where:

• f

ref(video)

is the frequency on pin XTAL divided by the
reference divider ratio. For example, with a 4 MHz
crystal connected to

pin XTAL,f

ref video()

4000000

512

----------------------- -

7812.5 Hz==

• N is the programmable divider ratio:
N=N

13

× 213+N12× 212+ ... + N1× 2+N

0

• f

osc

is the RF oscillator frequency.

DEV2, DEV1 and DEV0 are the bits to set the sound
subcarrier frequency deviation (see Table 3).

PS2, PS1 and PS0 are the bits to set the picture-to-sound
ratio (see Table 4).

MD2, MD1 and MD0 are the bits to set the modulation
depth (see Table 1).

SC1 and SC0 are the bits to set the sound subcarrier
frequency according to Table 2.

RF0 is a bit that controls the RF oscillator on/off. In normal
mode, it should be set to logic 1. If the modulator is not
used and may create some interferences with other
signals in the application, it should be set to logic 0
(see Table 6).

Notice that if the bit RF0 is logic 0 while the bit TPSG is
logic 1, then the RF oscillator is still running, but the sound
oscillator is off, and the TPSG is also off (see Table 8).

The bit P0 controls the output port P0, which is an open
collector NPN port, able to drive up to 10 mA
(see Table 7).

T0 is a bit used for test purposes. If this bit is set to logic 0,
the IC operates in normal configuration. If it is set to
logic 1, then the use of bits TPSG, RF0 and P0 is changed
to select 1 of the 8 test modes as explained in Table 9.

Table 5 Contents of programming words

BYTE

MSB LSB

ACKNOWLEDGE BIT

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Address byte CA 11001010 ACK
F1: frequency

byte 1

0 TPSG N13 N12 N11 N10 N9 N8 ACK

F0: frequency
byte 0

N7 N6 N5 N4 N3 N2 N1 N0 ACK

C1: control byte 1 1 DEV2 DEV1 DEV0 PS2 PS1 PS0 0 ACK
C0: control byte 0 MD2 MD1 MD0 SC1 SC0 RF0 P0 T0 ACK

1997 Jan 08 10

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Table 6 RF oscillator on/off setting (see note 1)

Note

1. This table is valid only if bit TPSG is set to logic 0.

Table 7 Output port programming

Table 8 Overview of the normal modes

Note

1. X means logic 0 or logic 1, don’t care.

STATE OF RF0 ACTION ON RF OSCILLATOR

0 stopped; no RF carrier
1 operating; normal use

STATE OF P0 PORT STATE

VOLTAGE ON PORT

(with a pull-up resistor to V

CCD

)

0 high impedance close to V

CCD

1 sinking current close to 0 V

T0 RF0 TPSG P0 PIN TPSG MODE

010X

(1)

input: open RF on; TPSG off

010X

(1)

input: to DGND RF on; TPSG on

011X

(1)

output: sinking current RF on; TPSG on

000X

(1)

input: open or to DGND RF off

001X

(1)

input: open RF on; TPSG off; sound oscillator off

001X

(1)

input: to DGND RF on; TPSG on; sound oscillator off

0X

(1)

X

(1)

0X

(1)

Port P0 off (high impedance)

0X

(1)

X

(1)

1X

(1)

Port P0 on (sinking current)

1997 Jan 08 11

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Table 9 Overview of the test modes

Notes

1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have
any effect, and that the output port does not sink any current.

2. In ‘f

ref(audio)

on P0’ mode, the reference frequency of the audio PLL is available on the port P0.

3. In ‘f

div(audio)

on P0’ mode, is available on the port P0 (f

div(audio)

is the frequency from the sound oscillator

divided by the dividing ratio of the audio programmable divider).

4. In ‘f

ref(video)

on P0’ mode, the reference frequency of the video PLL is available on the port P0.

5. In ‘f

div(video)

on P0’ mode, is available on the port P0 (f

div(video)

is the frequency of the RF oscillator divided

by the dividing ratio of the video programmable divider).

6. In ‘both CP sinking or sourcing current’ modes, the charge pump of the audio PLL and the one of the video PLL are
sinking or sourcing their nominal current.

7. The ‘video charge pump off’ mode allows to measure the leakage current on the video PLL charge pump.

8. The ‘audio charge pump off’ mode allows to measure the leakage current on the audio PLL charge pump.

9. In the ‘video high-impedance’ mode, it is possible to inject an external tuning voltage for the RF carrier setting.
In this mode, the video PLL is off.

10. In the ‘baseband signal on RF outputs’ mode, the RF oscillator is off, and it is possible to measure the baseband
video and audio subcarrier signals on the RF output pins.

11. During the ‘balance test’ mode the picture carrier is over-modulated allowing the measurement of the residual carrier.

T0 RF0 TPSG P0 PIN

(1)

TPSG TEST MODES

1000 X f

ref(audio)

on P0; both CP sinking current; notes 2 and 6

1001 X f

div(audio)

on P0; note 3

1010 X f

ref(video)

on P0; both CP sourcing current; notes 4 and 6

1011 X f

div(video)

on P0; note 5
1100 X video charge pump off; note 7
1101 X audio charge pump off and balance test; notes 8 and 11
1110 X video high impedance test; note 9
1111 X baseband signal on RF outputs; note 10

f

div audio()

2

------------------------- -

f

div video()

2

-------------------------

1997 Jan 08 12

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Example of programming

We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard
(sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of −12 dB, a modulation depth of 82.5%
and a deviation set to 50.5% in normal mode, without TPSG, output port on.

These are the values of the bits that must be programmed:

• The video dividing ratio will be

• TPSG bit will be set to logic 0

• DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0

• PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1

• MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0

• SC1 will be set to logic 0 and SC0 to logic 1

• P0 will be set to logic 1

• RF0 will be set to logic 1

• T0 will be set to logic 0.

The protocol to the TDA8822 is illustrated in Table 10.

Table 10 Example of programming for the TDA8822.

BYTE

MSB LSB

ACKNOWLEDGE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Address byte CA 11001010 ACK
F1: frequency

byte 1

00011101 ACK

F0: frequency
byte 0

01110100 ACK

C1: control byte 1 10100010 ACK
C0: Control byte 0 10001110 ACK

N

f

osc

f

ref

8×

-----------------

471250000

7812.5 8×

------------------------------

7540 01110101110100== ==

1997 Jan 08 13

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in
accordance with the

“UZW-B0/FQ-A302”

specification equivalent to the

“MIL-STD-883C category B”

(2000 V). The IC

withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification

“UZW-B0/FQ-B302”

, issue date November 6th, 1990,(0 Ω, 200 pF, 200 V).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER MIN. MAX. UNIT

V

CCA

analog supply voltage −0.3 +7.0 V

V

CCD

digital supply voltage −0.3 +7.0 V

V

CC

operating supply voltage 4.5 5.5 V

V

max

maximum voltage on all pins except SCL, SDA and VVT −0.3 V

CC

V

V

BUS(max)

maximum voltage on SCL and SDA pins −0.3 +7.0 V

V

VVT(max)

maximum voltage on VVT pin −0.3 +35.0 V

T

stg

storage temperature −40 +125 °C

T

amb

operating ambient temperature −20 +85 °C

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SO24; SOT137-1 74 K/W
SSOP24; SOT340-1 120 K/W

1997 Jan 08 14

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

CHARACTERISTICS

V

CCA=VCCD

=5V; T

amb

=25°C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2;
PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave;
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

P

power supply current analog and digital parts − 60 72 mA

Video characteristics

I

VIDEO

video input current − 0.5 2.0 µA

z

VIDEO

video input impedance 30 −− kΩ

m

d

modulation depth part-to-part variation;

MD setting = 4

77.5 82.5 87.5 %

m

d(clip)

modulation depth during clipping
condition

video input level lower
than 1 V (p-p)

−−99 %

m

d(TPSG)

modulation depth when TPSG modeonpart to part variation,

MD setting = 4

72.5 82.5 92.5 %

m

d(APL)

variation of the modulation depth with
change of APL between 10 and 90%

reference for APL = 50% −2 0 +2 %

S/N video signal-to-noise ratio note 1 48 52 − dB
G

diff

differential gain note 2 − 36 %

ϕ

diff

differential phase note 2 − 3 6 deg
V/S video-to-sync ratio input signal: V/S=7:3 6.9:3.1 7:3 7.1:2.9
f

video

frequency response for the video

signal

note 3 −1 − +1 dB

Audio characteristics

Z

AUDIO

audio input impedance without any resistor

between AUDIO and
AGND

30 −− kΩ

∆f

m

modulation deviation SC setting = 1, 2 or 3;

DEV setting = 2

20 25 30 kHz

SC setting = 0;
DEV setting = 2

10 12.5 15 kHz

∆f

m(max)

maximum modulation deviation V

AUDIO

= 500 mV (p-p);

note 4

180 250 − kHz

THD total harmonic distortion 50 mV (p-p) sine wave at

1 kHz on AUDIO pin

− 0.4 1.0 %

S/N audio signal-to-noise ratio note 5 44 47 − dB
f

AUDIO

frequency response of the audio signal note 6 −1 − +1 dB
∆f

sc(acc)

sound subcarrier accuracy note 7 −1 0 +1 kHz
P/S picture-to-sound ratio no audio signal; no video

signal; PS setting = 1

−15 −12 −9dB

1997 Jan 08 15

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

NICAM characteristics

Z

NICAM

NICAM input impedance 10 −− kΩ
P/N level between picture carrier and

NICAM carrier

NICAM input
level = 150 mV (p-p);
no video signal

−23 −20 −17 dB

f

NICAM

frequency response of the NICAM

input

for frequencies between 5
and 8 MHz; reference for

6.5 MHz

−1 − +1 dB

BER bit error rate note 11 − 10

−6

−

EHD eye-height degradation note 11 − 4 − %

Channel characteristics

f

RF

RF frequency range with application VHF 1 47 − 88 MHz

with application VHF 3 174 − 230 MHz
with application UHF 470 − 860 MHz

f

RF(acc)

picture carrier accuracy note 7 −75 − +75 kHz
V

RF

output level on RF outputs during sync.

pulse, loaded with 75 Ω

between 45 and 860 MHz 77 80 83 dBµV

V

RF(flat)

flatness of the RF output level across

each band

reference is centre of
each band

−202 dB

Z

o(RF)

RF output impedance single ended − 75 −Ω
SPU

o

spurious outside channel note 8 −−−40 dBc
SPU

2PC

RF second harmonic level on asymmetrical output at

low end of UHF band

−−−10 dBc

SPU

2SC

sound carrier second harmonic level −−65 −60 dBc
SPU

3SC

sound carrier third harmonic level −−65 −60 dBc
SPU

fref

reference frequency spurious measured with Philips

application board

−−−40 dBc

CHR

BEAT

chroma beat note 9 −−−63 dBc
NIC

BEAT

NICAM beat note 10 −−−63 dBc

Video charge pump output and video tuning amplifier: VCP and VVT

I

VCP

output current − 50 −µA
I

VCP(lk)

off-state leakage current −10 − 10 nA
V

VVT(min)

minimum tuning voltage on pin VVT 27 kΩ resistor between

pin VVT and +33 V

−−0.2 V

I

VVT(lk)

leakage current on pin VVT 27 kΩ resistor between

pin VVT and +33 V; high
impedance test mode

−−10 µA

Audio charge pump output: ACP

I

ACP

output current − 3 −µA
I

ACP(lk)

off-state leakage current −10 − 10 nA
V

ACP

tuning voltage range for the audio PLL,

on pin ACP

1.5 − 4.5 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Jan 08 16

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Notes

1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white;
see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted.

2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3
times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth
is adjusted using the I2C-bus to MD setting = 4 (82.5% typical modulation depth).

3. Measured with a spectrum analyser with ‘peak hold’ function, applying a 500 mV (p-p) sine wave at the video input
of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz.

4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz.

5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2,
using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver
has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO.

XTAL characteristics

|Z

XTAL

| XTAL input impedance absolute value;

with a 4 MHz crystal

600 1200 −Ω

Output Port characteristics

V

PORT

low voltage port on; I

PORT

=10mA − 150 400 mV

I

PORT(lk)

off-state leakage current port off; V

CCD

= 5.5 V −−10 µA

I

PORT(sink)

sinking current in the port port on 10 −− mA

TPSG pin characteristics

V

TPSG(on)

voltage on pin TPSG to switch the
TPSG on

0 − 1.5 V

V

TPSG(off)

voltage on pin TPSG to switch the
TPSG off

3.0 − V

CCD

V

I

TPSGL

LOW input current in pin TPSG TPSG to DGND −100 −− µA

I

TPSGH

HIGH input current in pin TPSG TPSG to V

CCD

−−100 µA

I

TPSG(sink)

output sinking current in pin TPSG TPSG set on using

I2C-bus

10 −− mA

V

TPSG(sink)

voltage on pin TPSG used as output TPSG set on using

I2C-bus

− 150 400 mV

I

2

C-bus receiver characteristics, pins SCL and SDA

f

SCL

frequency on SCL line −−100 kHz

V

IH

HIGH level input voltage 3 − 5.5 V

V

IL

LOW level input voltage 0 − 1.5 V

I

IH

HIGH level input current VIH=5V; V

CCD

=0or5V −−10 µA

I

IL

LOW level input current VIL=0V; V

CCD

=0or5V −10 −− µA

V

SDA(ack)

acknowledge output voltage on SDA during acknowledge

pulse; IIL=3mA

−−0.4 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Jan 08 17

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz.

7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the
value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of
the crystal.

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator
frequency and the sound oscillator frequency (fRF+2fs, 2fRF+fs, etc.). This measurement includes the spurious at
the1⁄4fRF,1⁄2fRF and3⁄4f

RF.

9. Chroma beat
a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K.

b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 920 kHz.

10. NICAM beat
a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement

is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 350 kHz or 5.15 MHz.

b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is

the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 552 kHz or 5.448 MHz.

11. NICAM eye height and Bit Error Rate measurement conditions:
a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an

attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is
set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input.

b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is

set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye
height and bit error rate are done on the 728D.

1997 Jan 08 18

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Fig.4 CCIR insertion line 17.

handbook, full pagewidth

010203040 50 60

64

70

MBE396

t (µs)

1 V

0.3 V

0 V

Fig.5 CCIR insertion line 330.

handbook, full pagewidth

010203040 50 60

64

70

MBE397

t (µs)

1 V

0.3 V

0 V

1997 Jan 08 19

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

INTERNAL PIN CONFIGURATION

Fig.6 Pin equivalent circuit for each pin.

handbook, full pagewidth

MGE681

V

CCA

AGND

ACP

V

CCD

DGND

V

CCA

regulated voltage

AGND

PREEMPH

regulated voltage

RFOSCA

RFOSCB

RFOSCC

OGND

RFOSCD

DGND

VVT

V

CCD

DGND

VCP

V

CCD

DGND

XTAL

V

CCA

AGND

VIDEO

regulator voltage

AGND

AUDIO

NICAM

V

CCA

AGND

V

CCA

RFA
RFB

RFGND

V

CCD

DGND

TPSG

V

CCD

DGND

P0

V

CCD

DGND

SCL

V

CCD

DGND

SDA

VOLTAGE

REGULATOR

regulated

voltage

1

2

3

4

5

6
7
8

9

10

12

11

13

14

15

16

17

18

19

20

21

22

23

24

V

CCA

V

CCD

DGND

AGND

1997 Jan 08 20

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

APPLICATION INFORMATION

Fig.7 Reference application.

(1) The components marked: C4, C5, C6, C7, C8, L1 and D1 must be chosen from Table 11 to get the desired frequency range.

handbook, full pagewidth

MGE678

C4

(1)

C5

(1)

C7

(1)

C8

(1)

C27

100 nF

C10

4.7
nF

(1)

C6

(1)

D1

R7 R8

22 kΩ 15 kΩ

C9

10 nF

R5
22 kΩ

R9
27 kΩ

R10
33
kΩ

L1

(1)

C2

2.2
µF

C1
100

nF

C25

10
nF

R2

4.7
kΩ

24

VIDEO23AGND22AUDIO21NICAM20RFGND19RFA18RFB17TPSG16P0

15

SDA

14

SCL

13

DGND

12

XTAL

11

V

CCD

10

VCP

9

VVT

8

RFOSCD

7

RFOSCC

6

OGND

5

RFOSCB

4

RFOSCA

3

PRE
EMPH

2

ACP

1

V

CCA

C26

68 nF

C11
10 nF

C12

18 pF

XTAL1
4 MHz

R26
82 Ω

R25
470 Ω

470 Ω

R24

100 nF

C24

R27

220 pF

C22

220 kΩ

R22

12

kΩ

R21
51 Ω

1 nF

C21

R14

270 Ω

R15

270 Ω

C19

100

pF

C18

100

pF

RFB

RFA

P0

R18
1 kΩ

VVT = 33 V

V

CC

= 5 V

VIDEO

AUDIO

NICAM

SDA

SCL

TDA8822

1997 Jan 08 21

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Application design

In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible
from the part of the RF outputs in order to avoid parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be
connected to the shielding box and to ground.

The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these
components, it is recommended to use the values indicated in Table 11.

Table 11 Components to be used for the RF oscillator

BAND

FREQUENCY

RANGE

VALUE FOR

C4, C5, C7, C8

VALUE

FOR C6

D1

L1: NUMBER

OF TURNS

L1:COIL

DIAMETER

L1: WIRE

DIAMETER

VHF1 47 to 130 MHz 5.6 pF 100pF BB132 14.5 3.0 mm 0.3 mm
VHF3 130 to 350 MHz 4.7 pF 150 pF BB133 4.5 3.0 mm 0.4 mm

UHF 470 to 860 MHz 1.8 pF 22 pF BB134 1.5 2.5 mm 0.5 mm

Video input (pin 24)

The video input level on the IC is of 500 mV (p-p). In most
of the cases, the available video signals are of 1 V (p-p)
with a source impedance of 75 Ω.

To handle this kind of signal, we use a resistive divider with
two 470 Ω resistors (R24 and R25 in Fig.7) to divide the
1 V (p-p) signal down to 500 mV (p-p). In order to get an
input impedance of 75 Ω, a resistor of 82 Ω is implemented
in parallel to the divider (R26 in Fig.7).

Audio pre-emphasis

The capacitor C22 connected in parallel with R27 is
defining the time constant for the pre-emphasis following
Table 12.

Table 12 Choice of the pre-emphasis constant

Note

1. This mode has to be considered if the pre-emphasis is
applied else-where on the path of the audio signal, or
if there is no need for pre-emphasis in specific
applications. Note also that the pre-emphasis can be
done by connecting a capacitor between pin
PREEMPH (pin 3) and ground. The value for this
capacitor is 10 nF for PAL and 15 nF for NTSC.

STANDARD

CAPACITOR

C22

TIME

CONSTANT

NTSC 330 pF 75 µs

PAL 220 pF 50 µs

special; note 1 no capacitor −

Audio input (pin 22)

The IC is sensitive to 45 mV (p-p) on pin AUDIO and the
DC voltage on this pin is close to 0 V.

This pin needs to be grounded through a 12 kΩ resistor
(R22 in Fig.7). Care must then be taken if a coupling
capacitor needs to be implemented on the audio path to
connect it between the signal source and the input, with
the resistor of 12 kΩ still connected to the AUDIO pin.

NICAM input (pin 21)

The NICAM pin is sensitive to 150 mV (p-p) to reach a
level between picture carrier and NICAM carrier of typical

−20 dBc.
It is possible to put on this pin either a NICAM modulated

carrier for a NICAM application or a frequency modulated
carrier for the stereo system with a second FM carrier used
e.g. in Germany.

In a specific application where the main sound subcarrier
would be generated outside the IC, it is also possible to
inject the main sound carrier to this pin, with a level
depending on the wanted P/S. In this event, it is necessary
to stop the internal sound oscillator by setting RF0 to
logic 0 and TPSG to logic 1 (see Table 8).

1997 Jan 08 22

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

TPSG input/output (pin 17)

As already mentioned, this pin can be used either as an
input or as an output.

• As an input, it allows to turn on the TPSG, without

changing anything to the word the TDA8822 is
programmed through the I2C-bus.

In this mode, it is simply necessary to connect a switch
between the pin TPSG and DGND (see Fig.8). If the
switch is open, then the TPSG is selected
corresponding to the I2C-bus programming; if the switch
is closed, then the TPSG is on.

• As an output, it allows to indicate e.g. with an LED that

the TPSG has been programmed on using the I2C-bus.
In this mode, the pin acts as an open-collector output

port, it is possible to connect a LED to the 5 V power
supply with a series resistor to limit the current to about
10 mA (see Fig.9).

XTAL pin (pin 12)

This pin is connected to a 4 MHz crystal in series with a
capacitor. The value of this capacitor has to be as close as
possible to the load capacitance of the crystal.

It is also possible to drive the IC with an external 4 MHz
signal from a voltage source. A level of 50 mV(RMS)
insures stable operation. A capacitor of about 18 pF and a
resistor of 680 Ω needs to be placed in series with the
voltage source.

ACP pin (pin 2)

This pin is the charge pump output for the sound subcarrier
PLL as well as the input of the sound subcarrier VCO.

It is necessary to connect the loop filter between this pin
and ground. The loop filter indicated in Fig.7 gives a cut-off
frequency lower than 20 Hz.

If a cutoff frequency slightly higher than 20 Hz can be
accepted, it is possible to reduce the value of the 2.2 µF
capacitor (C2) to 220 nF. In this case C26 needs to be
changed from 68 nf to 22 nF and R3 needs to be changed
from 4.7 kΩ to 33 kΩ.

RF outputs (pins 18 and 19)

For inexpensive applications, it is possible to use the IC
with an asymmetrical output.

In an asymmetrical application, the unused output pin
must be loaded with a load as close as possible to the load
connected to the used pin.

A good improvement in performance is obtained using a
symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the two
outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced.

RF harmonics

This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.

It is possible to reduce the level of the second harmonic by
using a wide-band transformer at the output of the IC and
create a symmetrical application.

To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.

1997 Jan 08 23

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

Fig.8 Use of the pin TPSG as an input.

handbook, halfpage

MGE679

DGND

SCL

SDA

P0

TPSG

RFB

RFA

RFGND

C19

100 pF

C18

100 pF

R15

270 Ω

R14

270 Ω

RFB

RFA

SDA

SCL

13

14

15

16

17

18

19

20

P0

VCC = 5 V

R15

1 kΩ

S1

Fig.9 Use of the pin TPSG as an output.

handbook, halfpage

MGE680

DGND

SCL

SDA

P0

TPSG

RFB

RFA

RFGND

C19

100 pF

C18

100 pF

R15

270 Ω

R14

270 Ω

RFB

RFA

SDA

SCL

13

14

15

16

17

18

19

20

P0

VCC = 5 V

R15

1 kΩ

R17

330 Ω

1997 Jan 08 24

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

PACKAGE OUTLINES

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

15.6

15.2

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT137-1

X

12

24

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

c

L

v M

A

13

(A )

3

A

y

0.25

075E05 MS-013AD

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.61

0.60

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

e

1

0 5 10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

95-01-24
97-05-22

1997 Jan 08 25

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

UNIT A1A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

8.4

8.0

5.4

5.2

0.65 1.25

7.9

7.6

0.9

0.7

0.8

0.4

8
0

o
o

0.13 0.10.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT340-1 MO-150AG

93-09-08
95-02-04

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

112

24 13

0.25

y

pin 1 index

0 2.5 5 mm

scale

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

A

max.

2.0

1997 Jan 08 26

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

SO
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

SSOP
Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

METHOD (SO AND SSOP)
During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Jan 08 27

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TDA8822

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 537021/50/01/pp28 Date of release: 1997 Jan 08 Document order number: 9397 750 01601