Datasheet TDA8777 Datasheet (Philips)

Page 1

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Rev. 03 — 15 August 2005 Preliminary data sheet

1. General description

The TDA8777consistsofthreeseparate10-bitvideoDigital-to-AnalogConverters (DACs) with complementary outputs. They convert the digital input signals into analog current outputs at a maximum conversion rate of 330 MHz.

The DACs are based on current source architecture. A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by

the video DAC to be synchronized. The TDA8777 has a Power-down mode to reduce power consumption during inactive

periods. The TDA8777 is fabricated in a CMOS process that ensures high functionality with low

power dissipation.

2. Features

■ Triple 10-bit DAC

■ Sampling frequency up to 330 MHz

■ Internal voltage reference (1.21 V)

■ Complementary outputs

■ Direct drive of double terminated 75 Ω load into standard level

■ TTL compatible input

■ Sync and blank control inputs

■ Analog output current source

■ Power-down mode

■ 3.3 V power supply

■ LQFP48 package

3. Applications

■ PC video cards

■ High resolution image processing

■ Digital video systems

■ General purpose high-speed digital-to-analog conversion

Page 2

Philips Semiconductors

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

DDA

INL integral non-linearity −2 - +2 LSB DNL differential non-linearity −1 - +1 LSB f

CLK

tot

5. Ordering information

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

analog supply voltage 3.0 3.3 3.6 V analog supply current - 90 - mA

clock frequency

TDA8777HL/14/C1 - - 140 MHz TDA8777HL/24/C1 - - 240 MHz

TDA8777HL/33/C1 - - 330 MHz total power dissipation - 297 - mW current in Power-down mode - 20 - mA

Table 2: Ordering information

Type number Package Sampling

Name Description Version

TDA8777HL/14/C1 LQFP48 plastic low proﬁle quad ﬂat package; TDA8777HL/24/C1 240 MHz TDA8777HL/33/C1 330 MHz

48 leads; body 7 × 7 × 1.4 mm

SOT313-2 140 MHz

frequency

Preliminary data sheet Rev. 03 — 15 August 2005 2 of 18

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Philips Semiconductors

6. Block diagram

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

DDA3

DDA2

DDA1

red digital

inputs

(bits R9 to R0)

green digital

inputs

(bits G9 to G0)

blue digital

inputs

(bits B9 to B0)

48-39

10-1

23-14

30 29 13

POR

SSA2

TRIPLE MULTI-

PLEXER

SSA1

PSAVE

TDA8777

BLANKING

INSERT

24 12

DAC CONTROL MODULE

RSET

CURRENT/VOLTAGE REFERENCE V

+ I

ref

10-BIT DAC

+ I

ref

10-BIT DAC

+ I

ref

10-BIT DAC

BLANKCLK

COMP

SYNC

3537

ref

SYNC

INSERT

sync

VREF

OUTR

OUTG

OUTB

mle290

Fig 1. Block diagram

Preliminary data sheet Rev. 03 — 15 August 2005 3 of 18

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Philips Semiconductors

7. Pinning information

7.1 Pinning

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

R9 4847464544434241403938

G0 VREF

G1 COMP

G2 OUTR

G3 OUTR

G4 OUTG

G5 OUTG

G6 V

G7 V

G8 OUTB

G9 OUTB

BLANK V

SYNC V

1314151617181920212223

DDA1

B0 R8

TDA8777HL

B1 R7

B2 R6

B3 R5

B4 R4

B5 R3

B6 R2

B7 R1

B8 R0

PSAVE

RSET 37

CLK

36 35 34 33 32 31 30

DDA3

DDA2

28 27 26

SSA2

SSA1

001aad432

Fig 2. Pin conﬁguration

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

G0 1 green digital input data; bit 0 (LSB) G1 2 green digital input data; bit 1 G2 3 green digital input data; bit 2 G3 4 green digital input data; bit 3 G4 5 green digital input data; bit 4 G5 6 green digital input data; bit 5 G6 7 green digital input data; bit 6 G7 8 green digital input data; bit 7 G8 9 green digital input data; bit 8 G9 10 green digital input data; bit 9 (MSB) BLANK 11 composite blank control input (active LOW) SYNC 12 composite sync control input; for green channel only (active LOW) V

DDA1

B0 14 blue digital input data; bit 0 (LSB) B1 15 blue digital input data; bit 1 B2 16 blue digital input data; bit 2

13 analog supply voltage 1

Preliminary data sheet Rev. 03 — 15 August 2005 4 of 18

Page 5

Philips Semiconductors

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Table 3: Pin description

Symbol Pin Description

B3 17 blue digital input data; bit 3 B4 18 blue digital input data; bit 4 B5 19 blue digital input data; bit 5 B6 20 blue digital input data; bit 6 B7 21 blue digital input data; bit 7 B8 22 blue digital input data; bit 8 B9 23 blue digital input data; bit 9 (MSB) CLK 24 clock input V

SSA1

SSA2

OUTB 27 complementary blue current analog output OUTB 28 blue current analog output V

DDA2

DDA3

OUTG 31 complementary green current analog output OUTG 32 green current analog output OUTR 33 complementary red current analog output OUTR 34 red current analog output COMP 35 compliance voltage output VREF 36 voltage reference input RSET 37 full-scale current control resistor pin PSAVE 38 power-save control input (active LOW) R0 39 red digital input data; bit 0 (LSB) R1 40 red digital input data; bit 1 R2 41 red digital input data; bit 2 R3 42 red digital input data; bit 3 R4 43 red digital input data; bit 4 R5 44 red digital input data; bit 5 R6 45 red digital input data; bit 6 R7 46 red digital input data; bit 7 R8 47 red digital input data; bit 8 R9 48 red digital input data; bit 9 (MSB)

25 analog supply ground 1 26 analog supply ground 2

29 analog supply voltage 2 30 analog supply voltage 3

…continued

8. Functional description

This triple 10-bit video DAC is designed to convert digital input signals into analog output currents. All inputs (clock, data, blank and sync) must be TLL levels.

8.1 Voltage reference

The voltage referenceinputtopin VREF should be 1.21 V.For correct operation, a 100 nF capacitor should be connected between pin VREF and pin V

Preliminary data sheet Rev. 03 — 15 August 2005 5 of 18

DDA

Page 6

Philips Semiconductors

An external reference resistor must be connected between pin RSET and analog ground. This resistor sets the reference current which determines the analog output level, and is speciﬁed to be 560 Ω. This value allows a 1 V (p-p) output (video plus sync) into a 37.5 Ω load, such as a double-terminated 75 Ω coaxial cable.

8.2 Blanking and sync pulse insertion

The video signal (see Figure 3) is comprised of the following three parts:

• The video information: deﬁned by the 10 bits used to drive the DAC; nominal signal

amplitude = 700 mV (p-p)

• The sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a

video line and the start of the next video line; sync nominal amplitude = 300 mV; sync is added to the video signal output via the SYNC input (active LOW)

• The blanking period: allows interface-free detection of both sync and video, blanking

is allocated either side of the sync pulse; the blank level is equal to the video black level; blanking is added to the video signal output via the BLANK input (active LOW).

The values of SYNC and BLANK are latched on the rising edge of the clock signal. When no sync and no blank are applied, the DAC can be used continuously. This is the so-called generic mode.

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Because the signal delay in the DACis 1.5 times the clock period, the sync and blank are also delayed by 1.5 times the clock period.

Fig 3. Video signal sync pulse and blanking period

9. Limiting values

Table 4: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

DDA

stg

amb

0.7 V

0.3 V

analog supply voltage referred to V voltage on digital input pins referred to V storage temperature −55 +150 °C ambient temperature 0 70 °C junction temperature −40 +125 °C

blanking period

sync pulse

video information

SSA1 SSA2

mle291

−0.5 +6.5 V

−0.5 +5.5 V

Preliminary data sheet Rev. 03 — 15 August 2005 6 of 18

Page 7

Philips Semiconductors

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

10. Thermal characteristics

Table 5: Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

thermal resistance from junction to ambient in free air for SOT313-2 88 K/W

11. Characteristics

Table 6: Characteristics

Typical values measured at V

Symbol Parameter Conditions Min Typ Max Unit

Supplies

V I

DDA

P I

DDA

tot

analog supply voltage 3.0 3.3 3.6 V analog supply current - 90 - mA total power dissipation - 297 - mW current in Power-down mode - 20 - mA

Inputs

LOW-level input voltage - - 0.8 V HIGH-level input voltage 2.0 - - V LOW-level input current - - 80 µA HIGH-level input current - - 120 µA input capacitance - <tbd> -pF

Band gap reference

V I

DDA

V R

DDA

VREF RSET

analog supply voltage 3.0 3.3 3.6 V analog supply current - 2.7 - mA reference voltage input - 1.21 - V resistor for reference current - 560 - Ω

Digital-to-analog converter

RES ∆I

o(DAC)

DAC resolution - - 10 bits

DAC

DAC to DAC output current

matching INL integral non-linearity −2 - +2 LSB DNL differential non-linearity −1 - +1 LSB DAC

DAC to DAC crosstalk - <tbd> -dB

THD total harmonic distortion f

= 3.3 V; R

DDA

RSET

CLK

= 560Ω; T

=25°C; unless otherwise speciﬁed.

amb

--4%

= 140 MHz

= 1 MHz - 60 - dB

OUT

= 2.2 MHz - 60 - dB

OUT

= 4.7 MHz - 60 - dB

OUT

= 12 MHz - 59 - dB

OUT

= 22 MHz - 58 - dB

OUT

= 39 MHz - 57 - dB

OUT

Preliminary data sheet Rev. 03 — 15 August 2005 7 of 18

Page 8

Philips Semiconductors

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Table 6: Characteristics

Typical values measured at V

…continued

= 3.3 V; R

DDA

RSET

= 560Ω; T

=25°C; unless otherwise speciﬁed.

amb

Symbol Parameter Conditions Min Typ Max Unit

THD total harmonic distortion f

SFDR spurious-free dynamic range to

Nyquist limit

= 240 MHz

CLK

= 1 MHz - 60 - dB

OUT

= 2.2 MHz - 60 - dB

OUT

= 4.7 MHz - 60 - dB

OUT

= 12 MHz - 60 - dB

OUT

= 22 MHz - 54 - dB

OUT

= 39 MHz - 51 - dB

OUT

= 330 MHz

CLK

= 1 MHz - 60 - dB

OUT

= 2.2 MHz - 60 - dB

OUT

= 4.7 MHz - 60 - dB

OUT

= 12 MHz - 60 - dB

OUT

= 22 MHz - 52 - dB

OUT

= 39 MHz - 43 - dB

OUT

= 140 MHz

CLK

= 1 MHz - 62 - dB

OUT

= 2.2 MHz - 62 - dB

OUT

= 4.7 MHz - 63 - dB

OUT

= 12 MHz - 63 - dB

OUT

= 22 MHz - 61 - dB

OUT

= 39 MHz - 61 - dB

OUT

= 240 MHz

CLK

= 1 MHz - 61 - dB

OUT

= 2.2 MHz - 61 - dB

OUT

= 4.7 MHz - 63 - dB

OUT

= 12 MHz - 56 - dB

OUT

= 22 MHz - 58 - dB

OUT

= 39 MHz - 52 - dB

OUT

= 330 MHz

CLK

= 1 MHz - 59 - dB

OUT

= 2.2 MHz - 59 - dB

OUT

= 4.7 MHz - 54 - dB

OUT

= 12 MHz - 53 - dB

OUT

= 22 MHz - 54 - dB

OUT

= 39 MHz - 47 - dB

OUT

Outputs

O(compl)

OUT

output voltage compliance 0 - 1.4 V

output impedance - <tbd> -kΩ

output capacitance - <tbd> -pF

Preliminary data sheet Rev. 03 — 15 August 2005 8 of 18

Page 9

Philips Semiconductors

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Table 6: Characteristics

Typical values measured at V

…continued

= 3.3 V; R

DDA

RSET

= 560Ω; T

=25°C; unless otherwise speciﬁed.

amb

Symbol Parameter Conditions Min Typ Max Unit

Timing

CLK

clock frequency

TDA8777HL/14/C1 - - 140 MHz TDA8777HL/24/C1 - - 240 MHz TDA8777HL/33/C1 - - 330 MHz

d(p)

su(i)

h(i)

d(o)

pipeline delay in clock cycles 2.5 2.5 2.5

input setup time see Figure 4 0.15 - - ns

input hold time see Figure 4 0--ns

output delay time see Figure 4 - 3.75 - ns

CLK

h(i)

Digital inputs

(R9 to R0, G9 to G0,

B9 to B0, SYNC,

BLANK)

su(i)

DATA

d(o)

Analog outputs (OUTB, OUTB,

OUTG, OUTG

OUTR, OUTR)

Output delay (t

) is measured from the 50 % point of the rising edge of CLK to the 50 % point of full-scale transition.

d(o)

Fig 4. Timing diagram digital inputs and analog outputs

001aaa892

Preliminary data sheet Rev. 03 — 15 August 2005 9 of 18

Page 10

Philips Semiconductors

12. Application information

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

THD (dB)

−20

−40

−60

−80

110

Sampling frequency = 140 MHz. Sampling frequency = 240 MHz.

Fig 5. THD as a function of f

THD (dB)

−20

001aad345

(MHz)

OUT

, typical values Fig 6. THD as a function of f

OUT

001aad348

THD (dB)

−20

−40

−60

−80

110

SFDR

(dB)

−20

OUT

, typical values

OUT

001aad347

(MHz)

001aad427

−40

−60

−80

110

(MHz)

OUT

−40

−60

−80

110

(MHz)

OUT

Sampling frequency = 330 MHz. Sampling frequency = 140 MHz.

Fig 7. THD as a function of f

, typical values Fig 8. SFDR as a function of f

OUT

, typical values

OUT

Preliminary data sheet Rev. 03 — 15 August 2005 10 of 18

Page 11

Philips Semiconductors

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

SFDR

(dB)

−20

−40

−60

−80

110

Sampling frequency = 240 MHz Sampling frequency = 330 MHz.

Fig 9. SFDR as a function of f

BLANK

SYNC

11 12

001aad428

R6 45

R5 44

(MHz)

OUT

, typical values. Fig 10. SFDR as a function of f

OUT

TDA8777

SFDR

(dB)

−20

−40

−60

−80

110

560 Ω

PSAVE

R1 40

R0 39

RSET 3738

VREF

COMP

OUTR

OUTG

OUTB

DDA3

DDA2

SSA2

SSA1

0.1 µF

001aad429

(MHz)

OUT

, typical values

OUT

DDA

2423

CLK

001aaa890

DDA1

DDA

Fig 11. Application diagram

Preliminary data sheet Rev. 03 — 15 August 2005 11 of 18

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Philips Semiconductors

13. Package outline

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

pin 1 index

w M

SOT313-2

(A )

DIMENSIONS (mm are the original dimensions)

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT313-2 MS-026136E05

A1A2A3bpcE

max.

0.20

0.05

1.45

1.35

IEC JEDEC JEITA

1.6

0.25

w M

0.27

0.17

0 2.5 5 mm

(1)

(1) (1)(1)

7.1

0.18

0.12

7.1

6.9

REFERENCES

v M

scale

eHELL

9.15

0.5

8.85

detail X

Zywv θ

0.95

0.55

0.95

0.55

ISSUE DATE

00-01-19 03-02-25

o o

0.75

0.45

0.12 0.10.21

EUROPEAN

PROJECTION

9.15

8.85

Fig 12. Package outline SOT313-2 (LQFP48)

Preliminary data sheet Rev. 03 — 15 August 2005 12 of 18

Page 13

Philips Semiconductors

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our (document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch SMDs. In these situations reﬂow soldering is recommended.

14.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method.

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Data Handbook IC26; Integrated Circuit Packages

Typical reﬂow peak temperatures range from 215 °Cto270°C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

Preliminary data sheet Rev. 03 — 15 August 2005 13 of 18

Page 14

Philips Semiconductors

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most applications.

14.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

transport direction of the printed-circuit board.

When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C.

14.5 Package related soldering information

Table 7: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package

BGA, HTSSON..T SSOP..T

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO, VSSOP not recommended CWQCCN..L

[1] For more detailed information on the BGA packages refer to the

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

[1]

Soldering method Wave Reﬂow

[3]

, LBGA, LFBGA, SQFP,

, TFBGA, VFBGA, XSON

not suitable suitable

not suitable

[5]

, SO, SOJ suitable suitable

[8]

, PMFP

order a copy from your Philips Semiconductors sales ofﬁce.

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

Packages; Section: Packing Methods

account be processed throughmore than one soldering cycle or subjected to infrared reﬂow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package body peak temperature must be kept as low as possible.

[9]

, WQCCN..L

[8]

not suitable not suitable

[4]

[5] [6] [7]

(LF)BGA Application Note

Data Handbook IC26; Integrated Circuit

suitable

suitable suitable

(AN01026);

[2]

Preliminary data sheet Rev. 03 — 15 August 2005 14 of 18

Page 15

Philips Semiconductors

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm.

[7] Wavesoldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Preliminary data sheet Rev. 03 — 15 August 2005 15 of 18

Page 16

Philips Semiconductors

Triple 10-bit video DAC, up to 330 MHz sample frequency

TDA8777

15. Revision history

Table 8: Revision history

Document ID Release date Data sheet status Change notice Doc. number Supersedes

TDA8777_3 20050815 Preliminary data sheet - - TDA8777_2 Modiﬁcations:

TDA8777_2 20040517 Objective speciﬁcation - - TDA8777_1 TDA8777_1 20040108 Objective speciﬁcation - - -

• The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors.

• Status changed to Preliminary data sheet.

• Characteristics table revised, SPDR and THD data added, see Table 6.

• Figure 4 corrected.

• Figure 5 through to Figure 10 added.

Preliminary data sheet Rev. 03 — 15 August 2005 16 of 18

Page 17

Philips Semiconductors

16. Data sheet status

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

17. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2] [3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, andmakesno representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speciﬁed.

19. Trademarks

18. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors

Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: [email protected]

Preliminary data sheet Rev. 03 — 15 August 2005 17 of 18

Page 18

Philips Semiconductors

Triple 10-bit video DAC, up to 330 MHz sample frequency

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5

8.2 Blanking and sync pulse insertion . . . . . . . . . . 6

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Application information. . . . . . . . . . . . . . . . . . 10

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.2 Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 13

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 13

14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14

14.5 Package related soldering information . . . . . . 14

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16

16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 17

17 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

20 Contact information . . . . . . . . . . . . . . . . . . . . 17

TDA8777

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Published in The Netherlands

Date of release: 15 August 2005

Document number: TDA8777_3