Datasheet tda8822 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8822

Universal I

2

C-bus programmable

RF modulator

Preliminary specification
File under Integrated Circuits, IC02

1997 Jan 08

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

FEATURES

• 5 V power supply

• Video amplifier with clamp and white clip circuits

• Programmable video modulation depth

• FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz)

• Programmable picture-to-sound ratio

• Programmable deviation of the sound subcarrier

• Input for modulated NICAM sound subcarrier or second

frequency modulated sound subcarrier

• Asymmetrical or symmetrical RF output buffer

• Symmetrical RF oscillator for UHF or VHF band

according to the application

• One I2C-bus programmable output port

• On-chip Phase-Locked Loop (PLL) frequency

synthesizer for the RF carrier

• On-chip PLL frequency synthesizer for the sound carrier

• On-chip power supply regulator

• On-chip I2C-bus and/or hardware controlled Test

Pattern Signal Generator (TPSG) with LED driver

• RF output switch-off during tuning.

APPLICATIONS

• Video recorders

• Cable converters

• Satellite receivers

• Set top boxes.

TDA8822

GENERAL DESCRIPTION

The TDA8822 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (B/G, I, D/K, M
and N standards).

Two PLL frequency-synthesizers set the picture carrier
frequency and the sound subcarrier frequency to the
required frequencies. These PLL frequency-synthesizers
are programmed via the I

The I2C-bus controls these features:

• Video modulation depth

• Sound subcarrier modulation deviation

• Picture-to-sound ratio.

This makes the IC suitable for multistandard applications
without any adjustment into the application.

Additional features are provided like an input for the
NICAM or second FM carrier, a test pattern signal
generator with a LED driver and a general purpose
output port.

2

C-bus.

ORDERING INFORMATION

TYPE

NUMBER

TDA8822T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
TDA8822M SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

1997 Jan 08 2

NAME DESCRIPTION VERSION

PACKAGE

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

QUICK REFERENCE DATA

V

CCA=VCCD

PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave;
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

V

CCD

I

CC(tot)

m

d

P/S picture-to-sound ratio

V

RF

f

sc

∆f

sc

=5V; T

=25°C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2;

amb

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
total supply current − 60 72 mA
modulation depth adjustment

range

adjustment range
RF output voltage level

typical value for MD setting between

72.5 − 90.0 %

0 and 7
typical value for PS setting between

−18 −−11 dB

0 and 7
frequency between 45 and 860 MHz 77 80 83 dBµV

asymmetrical on a 75 Ω load
sound subcarrier frequency 4.5 − 6.5 MHz
sound subcarrier frequency

deviation range

for B/G, I, D/K, SC setting = 1, 2 or 3;
typical value for DEV setting between

20 − 45 kHz

0 and 7
for M, N, SC setting = 0; typical value

10 − 22.5 kHz

for DEV setting between 0 and 7

1997 Jan 08 3

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

BLOCK DIAGRAM

handbook, full pagewidth

NICAM

VIDEO

24

CLAMP

TPSG

VIDEO

AMP.

MD setting

21

NICAM

AMP.

CLIP

AGND

23

SWITCH

TPSG
ON/OFF

V

CCA

1

VOLTAGE

REGULATOR

ADDER

RFA RFB

OUTPUT
BUFFER

MIXER

1819

TDA8822

20

RFGND

AUDIO

PREEMPH

ACP

SCL

SDA

P0

TPSG

SND-IF

22

AUDIO

AMP.

DEV
setting

3

test test

2

14
15

16
17

AUDIO

CHARGE

PUMP

2

I

C-BUS

RECEIVER

AND

LOGIC

VCO

AUDIO
PHASE

DETECTOR

I2C-bus control

f

div(audio)

f

div(video)

in-lock flag
f

ref(video)

f

ref(audio)

V

CCD

AMP.

setting

sound oscillator
ON/OFF

frequency
setting

11 13

DGND

PS

PROG.

DIVIDER

14 BITS

PROG.

DIVIDER

test test

VIDEO

PHASE

DETECTOR

REFERENCE

DIVIDER

frequency
setting

PRESCALER
DIVIDE-BY-8

CHARGE

TDA8822

RF oscillator

ON/OFF

VIDEO

PUMP

CRYSTAL

OSCILLATOR

RF

OSCILLATOR

test

LOOP

AMP.

10

12

MGE674

4
5
6
7
8

9

RFOSCA
RFOSCB
OGND
RFOSCC
RFOSCD
VCP

VVT

XTAL

Fig.1 Block diagram.

1997 Jan 08 4

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

PINNING

SYMBOL PIN DESCRIPTION

V

CCA

ACP 2 audio charge pump output
PREEMPH 3 audio pre-emphasis network
RFOSCA 4 RF oscillator A (collector) output
RFOSCB 5 RF oscillator B (base) input
OGND 6 RF oscillator ground
RFOSCC 7 RF oscillator C (base) input
RFOSCD 8 RF oscillator D (collector) output
VVT 9 video tuning voltage output
VCP 10 video charge pump output
V

CCD

XTAL 12 crystal oscillator input
DGND 13 digital ground
SCL 14 serial clock (I
SDA 15 serial data (I
P0 16 general purpose output
TPSG 17 test pattern signal generator

RFB 18 RF output B
RFA 19 RF output A
RFGND 20 ground for the RF outputs
NICAM 21 NICAM input
AUDIO 22 audio input
AGND 23 analog ground
VIDEO 24 video input

1 analog power supply

11 digital power supply

2

C-bus) input

2

C-bus) input/output

input/output pin

handbook, halfpage

PREEMPH

RFOSCA
RFOSCB

RFOSCC
RFOSCD

V

1

CCA
ACP

2
3
4
5

OGND

6

TDA8822

7
8

VVT

9

VCP

10

V

11

CCD

XTAL

12

MGE673

Fig.2 Pin configuration.

TDA8822

VIDEO

24

AGND

23

AUDIO

22

NICAM

21

RFGND

20
19

RFA
RFB

18
17

TPSG
P0

16

SDA

15

SCL

14

DGND

13

1997 Jan 08 5

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

FUNCTIONAL DESCRIPTION

The TDA8822 is a programmable RF modulator which can
be divided into the following parts:

• Video part

• Audio part

• RF part.

Video part

The video part provides the following:

• The video part includes a clamping circuit which sets the
internal reference voltage to the bottom of the
synchronizing pulse. The modulation depth is adjusted
using 3 bits of the I
MD1 and MD0. These 3 bits make 8 different values for
the modulation depth possible (see Table 1).

• After the modulation depth is set, the signal is fed
through a clip control circuit that clips the video signal to
avoid that the modulation depth becomes higher than
100%.

• The video part also contains a TPSG. This TPSG
generates a pattern that helps to tune the TV set to the
programmed channel of the modulator. The pattern
consists of a sync pulse and two vertical white bars on
the screen (see Fig.3)

2

C-bus programming, called MD2,

TDA8822

The TPSG is activated in two ways:
– Forcing the pin TPSG to DGND in the application

(see Fig.8)

– Setting the TPSG bit to 1 via the I2C-bus, then the

TPSG pin acts as an output port, sinking current to
allow the indication of the use of the TPSG in the
application e.g. with an LED (see Fig.9).

Table 1 Modulation depth setting (typical values)

MD

SETTING

0 0 0 0 72.5
1 0 0 1 75.0
2 0 1 0 77.5
3 0 1 1 80.0
4 1 0 0 82.5
5 1 0 1 85.0
6 1 1 0 87.5
7 1 1 1 90.0

MD2 MD1 MD0

BIT

MODULATION

DEPTH (%)

handbook, full pagewidth

0 5 10 15 20 25 30 35 40 45 50 55 60 65 t (µs)

Fig.3 Test pattern signal.

1997 Jan 08 6

MGE675

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

Audio part

The audio part provides the following:

• The sound subcarrier is created in an integrated VCO.
The signal at the output of this VCO is fed to a stage that
adjusts the picture-to-sound ratio and to the audio
programmable divider.

• The frequency of the sound subcarrier is set by
programming the bits SC1 and SC0 of the I2C-bus (see
Table 2). These two bits set the dividing ratio of the
audio programmable divider to get the divided frequency
f

div(audio)

• The audio phase detector compares the
phase/frequency of the divided audio frequency f
and the reference frequency for the audio, f
drives the Charge Pump (CP) that charges or
discharges the audio loop filter connected between
pins ACP and AGND to get the VCO oscillating to the
programmed frequency.

.

div(audio)

ref(audio)

and

TDA8822

• f

ref(audio)

purpose output port during a special test mode.

• The frequency deviation of the sound subcarrier is set
using 3 bits DEV2, DEV1 and DEV0 of the I2C-bus
programming (see Table 3), when a signal of 1 kHz with
a level of 50 mV (p-p) is applied on the audio input pin.

• The difference between the picture carrier level and the
sound subcarrier level is adjusted using 3 bits PS2, PS1
and PS0 (see Table 4).

• The NICAM amplifier has a constant gain, and is
designed for adding a second sound subcarrier in the TV
channel. This subcarrier can be either a second FM
carrier for dual-sound/stereo system used in PAL B/G or
a modulated NICAM carrier. The level between the
picture carrier and the NICAM carrier (P/N) will depend
on the input level on the NICAM input.

and f

div(audio)

can be monitored on the general

Table 2 Sound subcarrier frequency setting

SC SETTING

BIT

SC1 SC0

0 0 0 4.5 M, N
1 0 1 5.5 B, G
2 1 0 6.0 I
3 1 1 6.5 D, K

Table 3 Sound subcarrier frequency deviation setting (typical values)

BIT

DEV SETTING

DEV2 DEV1 DEV0 B, G, I, D, K M, N

0 0 0 0 40.0 20.0 10.0
1 0 0 1 45.0 22.5 11.3
2 0 1 0 50.5 25.3 12.6
3 0 1 1 56.5 28.3 14.1
4 1 0 0 63.5 31.8 15.9
5 1 0 1 71.5 35.8 17.9
6 1 1 0 80.0 40.0 20.0
7 1 1 1 90.0 45.0 22.5

SOUND SUBCARRIER

FREQUENCY (MHz)

DEVIATION

(%)

STANDARD

DEVIATION (kHz)

1997 Jan 08 7

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

Table 4 Picture-to-sound ratio setting (typical values)

PS SETTING

PS2 PS1 PS0

0 000 −11
1 001 −12
2 010 −13
3 011 −14
4 100 −15
5 101 −16
6 110 −17
7 111 −18

RF part

The RF part provides the following:

• The RF oscillator can produce any frequency used for
TV transmission, from 35 to 890 MHz. The frequency
range depends on the components used in the
application (see Table 11).

• The RF mixer combines the video signal, the sound
subcarrier and the carrier from the NICAM input to build
a baseband TV channel. This baseband signal is then
mixed with the RF oscillator signal to get the RF TV
channel.

• The two signals from the RF mixer are sent to the output
buffer. This output buffer can be used either as two
asymmetrical outputs or as one symmetrical output.

• The output buffer is switched-off while the PLL is not
in-lock, to avoid parasitic output signal during the tuning
of the RF oscillator. The in-lock information is given by
the phase detector of the loop.

• The signal from the RF oscillator is fed to the PLL which
controls the picture carrier frequency. The RF signal is
first divided by 8 in the prescaler, and then divided in the
programmable 14-bits divider. The dividing ratio of this
divider is programmed via the I2C-bus. The minimum
frequency that can be synthesized is 16 MHz, and the
maximum frequency is 1023.9375 MHz.

• The divided frequency called f
reference frequency called f

div(video)

ref(video)

is compared to the

coming from the
crystal oscillator and divided in the reference divider.
The crystal oscillator is intended to be used with a
crystal of 4 MHz.

• The comparison between f

ref(video)

and f

div(video)

in the video phase detector. The resulting signal is fed
via the video charge pump to the loop amplifier,
including the tuning voltage drive (33 V) inside the IC.

BIT

is done

TDA8822

P/S RATIO

(dB)

• f

ref(video)

and f

div(video)

output port during a special test mode.

• The I2C-bus receiver and control logic includes the
control of:

– Picture carrier frequency
– Sound subcarrier frequency
– Sound subcarrier frequency deviation
– Video modulation depth
– Picture-to-sound ratio
– TPSG on/off and LED drive control
– RF oscillator on/off
– Sound oscillator on/off
– General purpose output port on/off
– Test modes setting.

Software information

The transmission is made using 4 words in I
First the address CA has to be sent, then at least two
consecutive words have to be sent, either the two words
F1 and F0, or the two words C1 and C0.

The two words C1 and F1 are differentiated inside the IC
by the first bit being logic 1 or logic 0 respectively.
The contents of the 4 bytes is shown in Table 5.

At the power-up of the TDA8822, the I2C-bus state is the
following:

• N13 to N0 are not fixed

• SC setting = 1: the sound carrier is fixed to 5.5 MHz

• MD is set to 4 (82.5%), PS is set to 1 (−12 dB) and DEV

is set to 2 (50.5%)

can also be monitored on the

2

C-bus format.

1997 Jan 08 8

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

• T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to
logic 1 and P0 is set to logic 0 to select the video high
impedance test mode because it is in this mode that the
RF oscillator starts in the best conditions.

The TPSG bit is used to switch on or off the TPSG using
the I2C-bus. It is also possible to switch the TPSG on in the
application, connecting the pin TPSG to DGND. This
pin TPSG has a double function and acts as an input or as
an output.

These are the two functions:

• Output: if the TPSG is set using the I2C-bus, the
pin TPSG is used as an output open collector NPN port.
This port can be used to indicate with an LED that the
TPSG is on. This is especially useful in systems using
an on-screen display. If the TV set is not tuned to the
right channel there is an alternate indication that the
TPSG is on (see Fig.9).

• Input: if the TPSG is set with an hardware switch in the
application, the TPSG pin is used as one of the inputs to
select the TPSG mode (see Fig.8).

Notice that if the TPSG bit is set to logic 1 while the RF0
bit is set to logic 0, the TPSG is turned off, and the sound
oscillator is off (see Table 8).

N13 to N0 are the 14 bits to set the video programmable
divider ratio and then to set the picture carrier frequency
following the formula: f

where:

• f

ref(video)

reference divider ratio. For example, with a 4 MHz
crystal connected to

pin XTAL,f

is the frequency on pin XTAL divided by the

ref video()

osc=fref(video)

4000000

----------------------- ­512

× 8 × N,

7812.5 Hz==

TDA8822

• N is the programmable divider ratio:
N=N

• f

osc

DEV2, DEV1 and DEV0 are the bits to set the sound
subcarrier frequency deviation (see Table 3).

PS2, PS1 and PS0 are the bits to set the picture-to-sound
ratio (see Table 4).

MD2, MD1 and MD0 are the bits to set the modulation
depth (see Table 1).

SC1 and SC0 are the bits to set the sound subcarrier
frequency according to Table 2.

RF0 is a bit that controls the RF oscillator on/off. In normal
mode, it should be set to logic 1. If the modulator is not
used and may create some interferences with other
signals in the application, it should be set to logic 0
(see Table 6).

Notice that if the bit RF0 is logic 0 while the bit TPSG is
logic 1, then the RF oscillator is still running, but the sound
oscillator is off, and the TPSG is also off (see Table 8).

The bit P0 controls the output port P0, which is an open
collector NPN port, able to drive up to 10 mA
(see Table 7).

T0 is a bit used for test purposes. If this bit is set to logic 0,
the IC operates in normal configuration. If it is set to
logic 1, then the use of bits TPSG, RF0 and P0 is changed
to select 1 of the 8 test modes as explained in Table 9.

× 213+N12× 212+ ... + N1× 2+N

13

is the RF oscillator frequency.

0

Table 5 Contents of programming words

BYTE

Address byte CA 11001010 ACK
F1: frequency

byte 1
F0: frequency

byte 0
C1: control byte 1 1 DEV2 DEV1 DEV0 PS2 PS1 PS0 0 ACK
C0: control byte 0 MD2 MD1 MD0 SC1 SC0 RF0 P0 T0 ACK

1997 Jan 08 9

MSB LSB

ACKNOWLEDGE BIT

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

0 TPSG N13 N12 N11 N10 N9 N8 ACK

N7 N6 N5 N4 N3 N2 N1 N0 ACK

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

Table 6 RF oscillator on/off setting (see note 1)

STATE OF RF0 ACTION ON RF OSCILLATOR

0 stopped; no RF carrier
1 operating; normal use

Note

1. This table is valid only if bit TPSG is set to logic 0.

Table 7 Output port programming

STATE OF P0 PORT STATE

0 high impedance close to V
1 sinking current close to 0 V

Table 8 Overview of the normal modes

T0 RF0 TPSG P0 PIN TPSG MODE

(1)

010X
010X
011X
000X
001X
001X
0X
0X

(1)
(1)

(1)

X

(1)

X

input: open RF on; TPSG off

(1)

input: to DGND RF on; TPSG on

(1)

output: sinking current RF on; TPSG on

(1)

input: open or to DGND RF off

(1)

input: open RF on; TPSG off; sound oscillator off

(1)

input: to DGND RF on; TPSG on; sound oscillator off
0X
1X

(1)
(1)

Port P0 off (high impedance)
Port P0 on (sinking current)

VOLTAGE ON PORT

(with a pull-up resistor to V

CCD

TDA8822

)

CCD

Note

1. X means logic 0 or logic 1, don’t care.

1997 Jan 08 10

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

Table 9 Overview of the test modes

T0 RF0 TPSG P0 PIN

1000 X f
1001 X f
1010 X f
1011 X f
1100 X video charge pump off; note 7
1101 X audio charge pump off and balance test; notes 8 and 11
1110 X video high impedance test; note 9
1111 X baseband signal on RF outputs; note 10

Notes

1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have
any effect, and that the output port does not sink any current.

2. In ‘f

3. In ‘f

ref(audio)

div(audio)

on P0’ mode, the reference frequency of the audio PLL is available on the port P0.

f

on P0’ mode, is available on the port P0 (f

div audio()

------------------------- -

divided by the dividing ratio of the audio programmable divider).

4. In ‘f

5. In ‘f

on P0’ mode, the reference frequency of the video PLL is available on the port P0.

ref(video)

f

on P0’ mode, is available on the port P0 (f

div(video)

div video()

-------------------------

by the dividing ratio of the video programmable divider).

6. In ‘both CP sinking or sourcing current’ modes, the charge pump of the audio PLL and the one of the video PLL are
sinking or sourcing their nominal current.

7. The ‘video charge pump off’ mode allows to measure the leakage current on the video PLL charge pump.

8. The ‘audio charge pump off’ mode allows to measure the leakage current on the audio PLL charge pump.

9. In the ‘video high-impedance’ mode, it is possible to inject an external tuning voltage for the RF carrier setting.
In this mode, the video PLL is off.

10. In the ‘baseband signal on RF outputs’ mode, the RF oscillator is off, and it is possible to measure the baseband
video and audio subcarrier signals on the RF output pins.

11. During the ‘balance test’ mode the picture carrier is over-modulated allowing the measurement of the residual carrier.

(1)

2

2

TPSG TEST MODES

ref(audio)
div(audio)
ref(video)
div(video)

on P0; both CP sinking current; notes 2 and 6

on P0; note 3
on P0; both CP sourcing current; notes 4 and 6
on P0; note 5

div(audio)

div(video)

is the frequency from the sound oscillator

is the frequency of the RF oscillator divided

1997 Jan 08 11

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

Example of programming

We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard
(sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of −12 dB, a modulation depth of 82.5%
and a deviation set to 50.5% in normal mode, without TPSG, output port on.

These are the values of the bits that must be programmed:

f

• The video dividing ratio will be

• TPSG bit will be set to logic 0

• DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0

• PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1

• MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0

• SC1 will be set to logic 0 and SC0 to logic 1

• P0 will be set to logic 1

• RF0 will be set to logic 1

• T0 will be set to logic 0.

The protocol to the TDA8822 is illustrated in Table 10.

N

osc

----------------­f

ref

471250000

------------------------------

8×

7812.5 8×

7540 01110101110100== ==

Table 10 Example of programming for the TDA8822.

BYTE

Address byte CA 11001010 ACK
F1: frequency

byte 1
F0: frequency

byte 0
C1: control byte 1 10100010 ACK
C0: Control byte 0 10001110 ACK

MSB LSB

ACKNOWLEDGE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

00011101 ACK

01110100 ACK

1997 Jan 08 12

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CCA

V

CCD

V

CC

V

max

V

BUS(max)

V

VVT(max)

T

stg

T

amb

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in
accordance with the
withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification

“UZW-B0/FQ-B302”

analog supply voltage −0.3 +7.0 V
digital supply voltage −0.3 +7.0 V
operating supply voltage 4.5 5.5 V
maximum voltage on all pins except SCL, SDA and VVT −0.3 V

CC

V
maximum voltage on SCL and SDA pins −0.3 +7.0 V
maximum voltage on VVT pin −0.3 +35.0 V
storage temperature −40 +125 °C
operating ambient temperature −20 +85 °C

“UZW-B0/FQ-A302”

specification equivalent to the

“MIL-STD-883C category B”

(2000 V). The IC

, issue date November 6th, 1990,(0 Ω, 200 pF, 200 V).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SO24; SOT137-1 74 K/W
SSOP24; SOT340-1 120 K/W

1997 Jan 08 13

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

CHARACTERISTICS

V

CCA=VCCD

PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave;
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

P

Video characteristics

I

VIDEO

z

VIDEO

m

d

m

d(clip)

m

d(TPSG)

m

d(APL)

S/N video signal-to-noise ratio note 1 48 52 − dB
G

diff

ϕ

diff

V/S video-to-sync ratio input signal: V/S=7:3 6.9:3.1 7:3 7.1:2.9
f

video

=5V; T

=25°C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2;

amb

power supply current analog and digital parts − 60 72 mA

video input current − 0.5 2.0 µA
video input impedance 30 −− kΩ
modulation depth part-to-part variation;

77.5 82.5 87.5 %

MD setting = 4

modulation depth during clipping
condition

modulation depth when TPSG modeonpart to part variation,

video input level lower
than 1 V (p-p)

−−99 %

72.5 82.5 92.5 %

MD setting = 4

variation of the modulation depth with

reference for APL = 50% −2 0 +2 %

change of APL between 10 and 90%

differential gain note 2 − 36 %
differential phase note 2 − 3 6 deg

frequency response for the video

note 3 −1 − +1 dB

signal

Audio characteristics

Z

AUDIO

audio input impedance without any resistor

30 −− kΩ
between AUDIO and
AGND

∆f

m

modulation deviation SC setting = 1, 2 or 3;

20 25 30 kHz
DEV setting = 2

SC setting = 0;

10 12.5 15 kHz
DEV setting = 2

∆f

m(max)

maximum modulation deviation V

= 500 mV (p-p);

AUDIO

180 250 − kHz
note 4

THD total harmonic distortion 50 mV (p-p) sine wave at

− 0.4 1.0 %

1 kHz on AUDIO pin

S/N audio signal-to-noise ratio note 5 44 47 − dB
f

AUDIO

∆f

sc(acc)

P/S picture-to-sound ratio no audio signal; no video

frequency response of the audio signal note 6 −1 − +1 dB
sound subcarrier accuracy note 7 −1 0 +1 kHz

−15 −12 −9dB

signal; PS setting = 1

1997 Jan 08 14

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

NICAM characteristics

Z

NICAM

P/N level between picture carrier and

f

NICAM

BER bit error rate note 11 − 10

EHD eye-height degradation note 11 − 4 − %

Channel characteristics

f

RF

f

RF(acc)

V

RF

V

RF(flat)

Z

o(RF)

SPU

o

SPU

2PC

SPU

2SC

SPU

3SC

SPU

fref

CHR

BEAT

NIC

BEAT

Video charge pump output and video tuning amplifier: VCP and VVT

I

VCP

I

VCP(lk)

V

VVT(min)

I

VVT(lk)

NICAM input impedance 10 −− kΩ

NICAM carrier

NICAM input
level = 150 mV (p-p);

−23 −20 −17 dB

no video signal

frequency response of the NICAM
input

for frequencies between 5
and 8 MHz; reference for

−1 − +1 dB

6.5 MHz

−6

−

RF frequency range with application VHF 1 47 − 88 MHz

with application VHF 3 174 − 230 MHz
with application UHF 470 − 860 MHz

picture carrier accuracy note 7 −75 − +75 kHz
output level on RF outputs during sync.

between 45 and 860 MHz 77 80 83 dBµV

pulse, loaded with 75 Ω
flatness of the RF output level across

each band

reference is centre of
each band

−202 dB

RF output impedance single ended − 75 −Ω
spurious outside channel note 8 −−−40 dBc
RF second harmonic level on asymmetrical output at

−−−10 dBc

low end of UHF band

sound carrier second harmonic level −−65 −60 dBc
sound carrier third harmonic level −−65 −60 dBc
reference frequency spurious measured with Philips

−−−40 dBc

application board

chroma beat note 9 −−−63 dBc
NICAM beat note 10 −−−63 dBc

output current − 50 −µA
off-state leakage current −10 − 10 nA
minimum tuning voltage on pin VVT 27 kΩ resistor between

−−0.2 V

pin VVT and +33 V

leakage current on pin VVT 27 kΩ resistor between

−−10 µA
pin VVT and +33 V; high
impedance test mode

Audio charge pump output: ACP

I

ACP

I

ACP(lk)

V

ACP

output current − 3 −µA
off-state leakage current −10 − 10 nA
tuning voltage range for the audio PLL,

on pin ACP

1997 Jan 08 15

1.5 − 4.5 V

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

XTAL characteristics

| XTAL input impedance absolute value;

|Z

XTAL

with a 4 MHz crystal

Output Port characteristics

V

PORT

I

PORT(lk)

I

PORT(sink)

low voltage port on; I
off-state leakage current port off; V
sinking current in the port port on 10 −− mA

TPSG pin characteristics

V

TPSG(on)

voltage on pin TPSG to switch the
TPSG on

V

TPSG(off)

voltage on pin TPSG to switch the
TPSG off

I

TPSGL

I

TPSGH

I

TPSG(sink)

LOW input current in pin TPSG TPSG to DGND −100 −− µA
HIGH input current in pin TPSG TPSG to V
output sinking current in pin TPSG TPSG set on using

I2C-bus

V

TPSG(sink)

voltage on pin TPSG used as output TPSG set on using

I2C-bus

2

C-bus receiver characteristics, pins SCL and SDA

I

f

SCL

V

IH

V

IL

I

IH

I

IL

V

SDA(ack)

frequency on SCL line −−100 kHz
HIGH level input voltage 3 − 5.5 V
LOW level input voltage 0 − 1.5 V
HIGH level input current VIH=5V; V
LOW level input current VIL=0V; V
acknowledge output voltage on SDA during acknowledge

pulse; IIL=3mA

=10mA − 150 400 mV

PORT

= 5.5 V −−10 µA

CCD

CCD

=0or5V −−10 µA

CCD

=0or5V −10 −− µA

CCD

600 1200 −Ω

0 − 1.5 V

3.0 − V

CCD

V

−−100 µA

10 −− mA

− 150 400 mV

−−0.4 V

Notes

1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white;
see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted.

2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3
times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth
is adjusted using the I2C-bus to MD setting = 4 (82.5% typical modulation depth).

3. Measured with a spectrum analyser with ‘peak hold’ function, applying a 500 mV (p-p) sine wave at the video input
of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz.

4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz.

5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2,
using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver
has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO.

1997 Jan 08 16

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz.

7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the
value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of
the crystal.

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator
frequency and the sound oscillator frequency (fRF+2fs, 2fRF+fs, etc.). This measurement includes the spurious at
the1⁄4fRF,1⁄2fRF and3⁄4f

9. Chroma beat
a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K.

b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 920 kHz.

10. NICAM beat
a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement

is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 350 kHz or 5.15 MHz.

b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is

the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 552 kHz or 5.448 MHz.

11. NICAM eye height and Bit Error Rate measurement conditions:
a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an

attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is
set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input.

b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is

set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye
height and bit error rate are done on the 728D.

RF.

1997 Jan 08 17

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

handbook, full pagewidth

1 V

0.3 V

0 V

010203040 50 60

t (µs)

TDA8822

MBE396

64

70

handbook, full pagewidth

1 V

0.3 V

0 V

Fig.4 CCIR insertion line 17.

010203040 50 60

t (µs)

MBE397

64

70

Fig.5 CCIR insertion line 330.

1997 Jan 08 18

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

1

V

CCA

2

ACP

V

CCD

DGND

regulated voltage

PREEMPH

3

V

CCA

AGND

V

CCA

AGND

regulated voltage

VOLTAGE

REGULATOR

regulated

voltage

V

CCA

V

CCA

AGND

regulator voltage

AGND

V

CCA

AGND

TDA8822

24

VIDEO

23

AGND

22

AUDIO

21

NICAM

20

RFGND

19

RFA

18

RFB

RFOSCA

RFOSCB

OGND
RFOSCC
RFOSCD

VVT

VCP

V

CCD

XTAL

4

5

6
7
8

9

DGND

V

CCD

10

11

12

V

CCD

DGND

DGND

V

CCD

DGND

V

DGND

V

CCD

DGND

CCD

V

DGND

CCD

MGE681

17

TPSG

16

P0

15

SDA

14

SCL

13

DGND

Fig.6 Pin equivalent circuit for each pin.

1997 Jan 08 19

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

APPLICATION INFORMATION

SCL

SDA

NICAM

AUDIO

VIDEO

470 Ω

R26
82 Ω

R21
51 Ω

R24

C21

1 nF

100 nF

R25
470 Ω

C22

220 pF

R27

220 kΩ

C24

VIDEO23AGND22AUDIO21NICAM20RFGND19RFA18RFB17TPSG16P0

24

R22

12

kΩ

R14

270 Ω

handbook, full pagewidth

R15

270 Ω

C18

C19

100

100

pF

pF

R18
1 kΩ

TDA8822

RFB

RFA

P0

DGND

SCL

SDA

15

14

13

TDA8822

8

7

6

5

4

3

2

1

RFOSCD

OGND

(1)

RFOSCC

C7

(1)

C6

(1)

R7 R8

22 kΩ 15 kΩ

C9

10 nF

C8

(1)

V

= 5 V

CC

VVT = 33 V

C25

CCA

C1
100

nF

R2

4.7
kΩ

10
nF

C2

2.2

EMPH

µF

C26

68 nF

C4

(1)

C5

(1)

L1

(1)

D1

R5
22 kΩ

RFOSCB

RFOSCA

PRE

ACP

V

(1) The components marked: C4, C5, C6, C7, C8, L1 and D1 must be chosen from Table 11 to get the desired frequency range.

9

VVT

C10

4.7
nF

R9
27 kΩ

10

VCP

C27

100 nF

R10
33
kΩ

12

11

XTAL

V

CCD

XTAL1
4 MHz

C12

18 pF

C11
10 nF

MGE678

Fig.7 Reference application.

1997 Jan 08 20

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

Application design

In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible
from the part of the RF outputs in order to avoid parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be
connected to the shielding box and to ground.

The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these
components, it is recommended to use the values indicated in Table 11.

Table 11 Components to be used for the RF oscillator

BAND

VHF1 47 to 130 MHz 5.6 pF 100pF BB132 14.5 3.0 mm 0.3 mm
VHF3 130 to 350 MHz 4.7 pF 150 pF BB133 4.5 3.0 mm 0.4 mm

UHF 470 to 860 MHz 1.8 pF 22 pF BB134 1.5 2.5 mm 0.5 mm

Video input (pin 24)

The video input level on the IC is of 500 mV (p-p). In most
of the cases, the available video signals are of 1 V (p-p)
with a source impedance of 75 Ω.

To handle this kind of signal, we use a resistive divider with
two 470 Ω resistors (R24 and R25 in Fig.7) to divide the
1 V (p-p) signal down to 500 mV (p-p). In order to get an
input impedance of 75 Ω, a resistor of 82 Ω is implemented
in parallel to the divider (R26 in Fig.7).

Audio pre-emphasis

The capacitor C22 connected in parallel with R27 is
defining the time constant for the pre-emphasis following
Table 12.

Table 12 Choice of the pre-emphasis constant

STANDARD

special; note 1 no capacitor −

Note

1. This mode has to be considered if the pre-emphasis is
applied else-where on the path of the audio signal, or
if there is no need for pre-emphasis in specific
applications. Note also that the pre-emphasis can be
done by connecting a capacitor between pin
PREEMPH (pin 3) and ground. The value for this
capacitor is 10 nF for PAL and 15 nF for NTSC.

FREQUENCY

RANGE

CAPACITOR

C22

NTSC 330 pF 75 µs

PAL 220 pF 50 µs

VALUE FOR

C4, C5, C7, C8

TIME

CONSTANT

VALUE

FOR C6

D1

Audio input (pin 22)

The IC is sensitive to 45 mV (p-p) on pin AUDIO and the
DC voltage on this pin is close to 0 V.

This pin needs to be grounded through a 12 kΩ resistor
(R22 in Fig.7). Care must then be taken if a coupling
capacitor needs to be implemented on the audio path to
connect it between the signal source and the input, with
the resistor of 12 kΩ still connected to the AUDIO pin.

NICAM input (pin 21)

The NICAM pin is sensitive to 150 mV (p-p) to reach a
level between picture carrier and NICAM carrier of typical

−20 dBc.
It is possible to put on this pin either a NICAM modulated

carrier for a NICAM application or a frequency modulated
carrier for the stereo system with a second FM carrier used
e.g. in Germany.

In a specific application where the main sound subcarrier
would be generated outside the IC, it is also possible to
inject the main sound carrier to this pin, with a level
depending on the wanted P/S. In this event, it is necessary
to stop the internal sound oscillator by setting RF0 to
logic 0 and TPSG to logic 1 (see Table 8).

L1: NUMBER

OF TURNS

L1:COIL

DIAMETER

L1: WIRE

DIAMETER

1997 Jan 08 21

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

TPSG input/output (pin 17)

As already mentioned, this pin can be used either as an
input or as an output.

• As an input, it allows to turn on the TPSG, without

changing anything to the word the TDA8822 is
programmed through the I2C-bus.

In this mode, it is simply necessary to connect a switch
between the pin TPSG and DGND (see Fig.8). If the
switch is open, then the TPSG is selected
corresponding to the I2C-bus programming; if the switch
is closed, then the TPSG is on.

• As an output, it allows to indicate e.g. with an LED that

the TPSG has been programmed on using the I2C-bus.
In this mode, the pin acts as an open-collector output

port, it is possible to connect a LED to the 5 V power
supply with a series resistor to limit the current to about
10 mA (see Fig.9).

XTAL pin (pin 12)

This pin is connected to a 4 MHz crystal in series with a
capacitor. The value of this capacitor has to be as close as
possible to the load capacitance of the crystal.

It is also possible to drive the IC with an external 4 MHz
signal from a voltage source. A level of 50 mV(RMS)
insures stable operation. A capacitor of about 18 pF and a
resistor of 680 Ω needs to be placed in series with the
voltage source.

ACP pin (pin 2)

This pin is the charge pump output for the sound subcarrier
PLL as well as the input of the sound subcarrier VCO.

It is necessary to connect the loop filter between this pin
and ground. The loop filter indicated in Fig.7 gives a cut-off
frequency lower than 20 Hz.

TDA8822

If a cutoff frequency slightly higher than 20 Hz can be
accepted, it is possible to reduce the value of the 2.2 µF
capacitor (C2) to 220 nF. In this case C26 needs to be
changed from 68 nf to 22 nF and R3 needs to be changed
from 4.7 kΩ to 33 kΩ.

RF outputs (pins 18 and 19)

For inexpensive applications, it is possible to use the IC
with an asymmetrical output.

In an asymmetrical application, the unused output pin
must be loaded with a load as close as possible to the load
connected to the used pin.

A good improvement in performance is obtained using a
symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the two
outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced.

RF harmonics

This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.

It is possible to reduce the level of the second harmonic by
using a wide-band transformer at the output of the IC and
create a symmetrical application.

To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.

1997 Jan 08 22

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

handbook, halfpage

20

19

18

17

16

15

14

13

RFGND

RFA

RFB

TPSG

P0

SDA

SCL

DGND

C19

100 pF

C18

100 pF

R15

270 Ω

R14

270 Ω

RFA

RFB

SDA

SCL

R15

VCC = 5 V

1 kΩ

P0

S1

MGE679

handbook, halfpage

20

19

18

17

16

15

14

13

RFGND

RFA

RFB

TPSG

P0

SDA

SCL

DGND

C19

100 pF

C18

100 pF

R15

270 Ω

R14

270 Ω

RFA

RFB

SDA

SCL

R15

1 kΩ

R17

TDA8822

VCC = 5 V

330 Ω

P0

MGE680

Fig.8 Use of the pin TPSG as an input.

Fig.9 Use of the pin TPSG as an output.

1997 Jan 08 23

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

PACKAGE OUTLINES

SO24: plastic small outline package; 24 leads; body width 7.5 mm

D

c

y

Z

24

13

TDA8822

SOT137-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A1A2A

0.30

2.45

0.10

2.25

0.012

0.096

0.004

0.089

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

15.6

15.2

0.61

0.60

12

w M

b

p

scale

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.419

0.394

A

1.4

0.055

Q

2

A

1

detail X

1.1

1.1

0.4

0.043

0.016

1.0

0.043

0.039

0.25

0.01

L

p

L

(A )

0.25 0.1

0.01

A

3

θ

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

o

8

o

0

OUTLINE
VERSION

SOT137-1

IEC JEDEC EIAJ

075E05 MS-013AD

REFERENCES

1997 Jan 08 24

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

TDA8822

SOT340-1

E

H

E

A

X

v M

A

pin 1 index

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.0

0.21

0.05

1.80

1.65

0.25

b

3

p

0.38

0.25

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

0 2.5 5 mm

(1)E(1) (1)

cD

0.20

8.4

0.09

8.0

scale

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

Q

A

2

A

1

detail X

1.03

0.9

0.63

0.7

(A )

L

p

L

A

3

θ

0.13 0.10.2

0.8

0.4

o

8

o

0

OUTLINE

VERSION

SOT340-1 MO-150AG

IEC JEDEC EIAJ

REFERENCES

1997 Jan 08 25

EUROPEAN

PROJECTION

ISSUE DATE

93-09-08
95-02-04

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF
modulator

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

(order code 9398 652 90011).

TDA8822

SSOP
Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

METHOD (SO AND SSOP)
During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.
SO
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

1997 Jan 08 26

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

Philips Semiconductors Preliminary specification

Universal I2C-bus programmable RF

TDA8822

modulator

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1997 Jan 08 27

Philips Semiconductors – a worldwide company

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Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

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Slovenia: see Italy

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Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. [phone]

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/50/01/pp28 Date of release: 1997 Jan 08 Document order number: 9397 750 01601