Datasheet TDA8809T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8809T

Radial error signal processor for
compact disc players

Product specification
File under Integrated Circuits, IC01

November 1987

Philips Semiconductors Product specification

Radial error signal processor for

TDA8809T

compact disc players

GENERAL DESCRIPTION

The TDA8809T is a bipolar integrated circuit which provides control signals for the radial motor. These control signals
are generated from radial error signals received from a photo-diode signal processor (TDA8808), and velocity control
signals from the control processor.

Features

• Tracking error processor with automatic asymmetry control

• AGC circuity with automatic start-up and wobble generator

• Tracking control for fast forward/reverse scan, search, repeat and pause functions

• Radial polarity - 4 - tracks counting

• Possibility for car, home and portable applications.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

V
V
V
I

P

T

P

ex(+)
ext(−)
ext(+)

amb

− V

ext(−)

Supply voltage range 4,5 5,0 5,5 V
External voltage range

pin 12 V

P

10 12 V
pin 13 −5,5 −5,0 0 V
pin 12 to pin 13 4,5 − 12 V

Supply current − 5,3 − mA
Operating ambient temperature range −30 − +85 °C

PACKAGE OUTLINE

28-lead mini-pack; plastic (S028; SOT136A); SOT136-1; 1996 August 15.

November 1987 2

Philips Semiconductors Product specification

Radial error signal processor for compact
disc players

TDA8809T

November 1987 3

Fig.1 Block diagram.

Philips Semiconductors Product specification

Radial error signal processor for compact
disc players

PINNING

PIN MNEMONIC DESCRIPTION

1V
2C
3C
4R
5R

6

P
osc1
osc2
wob
osc

DIV4 Divide-by-4 input
7 REdig Digital output of sign (Re2 - Re1)
8B3
9B2
10 B1
11 B0
12 V
13 V

ext(+)
ext(−)

14 GND Negative supply connection
15 RADout Current output of amplified

16 REin Radial error input
17 RElag Voltage output of integrated

18 Lag Connection of integrator capacitor

19 Lead Lead output
20 V

ref

21 AGC Gain control input for radial error

22 R

DAC

23 offset in Offset control input for radial

24 offset out Offset control output for radial

25 C

26 C

LPF

HPF

27 Re1 Input for amplified currents from

28 Re2 Input for amplified currents from

Positive supply voltage
Frequency setting capacitors for

oscillator
Wobble generator input

Biassing resistor for oscillator
frequency and internal amplitude

Input control bits for off-, catch-,
play-status and DAC output
current

Positive external voltage input
Negative external voltage input

(also substrate connection)

(Re2 - Re1) input currents

(Re2 - Re1) input currents

for (Re1 - Re2) input currents

Internal reference voltage output

signal
Biassing resistor for current

output for track jumping (31⁄2 bits)

offset

offset
Low-pass filter for Re1 and Re2,

used for radial offset control
High-pass filter for Re1 and Re2,

used for radial offset control

photo-diodes D1 and D2

photo diodes D3 and D4

TDA8809T

Fig.2 Pinning diagram.

November 1987 4

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER MIN. MAX. UNIT

Supply voltage ranges (see Fig.3)

V

P

V

ext

V

ext(−)

V

O

V

O

I

RDAC

P

tot

T

stg

T

amb

T

j

pin 1 to pin 14 −0,3 13 V
pin 12 to pin 13 −0,3 13 V
pin 14 to pin 13 −0,3 13 V

Output voltage ranges

except RADout 0 V
RADout V
R

current range 50 250 µA

DAC

ext(−)

V

P
ext(+)

V
V

Total power dissipation see Fig.4
Storage temperature range −55 +150 °C
Operating ambient temperature range −30 +85 °C
Operating junction temperature − 150 °C

THERMAL RESISTANCE

From junction to ambient R

th j-a

= 140 K/W

Fig.3 Supply voltages;

(a) Home application (b) Car application. Fig.4 Power derating curve.

November 1987 5

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

CHARACTERISTICS

= +5 V; V V

V

P

I

(pin 5) = −50 µA; V

Rosc

= 25 °C; all voltages measured with respect to V

T

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

V

ext(+)

V

ext(−)

− V

V
I

P

ext(+)

ext(−)

Reference output (V
V

ref

 Output impedance − 25 −Ω

Z

O

Reference input (R
V

Rosc

I

Rosc

Reference input (R
V

RDAC

I

RDAC

Reference input (R
V

Rwob

I

Rwob

REdig output (REdig)
I

REdig

I

REdig

V

REdig

V

REdig

GND

= 0 V; V

RADout

ext(+)

= 0 V; V

= +5 V; V

offset in

ext(−)

= −5 V; I

= V

lead

(pin 22) = −75 µA; I

RDAC

= V

= V

lag

; unless otherwise specified.

GND

Cosc1

= V

Cosc2

= V

(pin 4) = −8 µA;

Rwob

; V

ref

offset in

is connected to V

offset out

Supply voltage range 4,5 5,0 5,5 V
External voltage range (see

Fig.3)

pin 12 V

P

10 12 V
pin 13 −5,5 −5,0 0 V
pin 12 to pin 13 4,5 − 12 V

Supply current 4,0 5,3 6,6 mA

)

ref

Output voltage I

)

osc

Input voltage level I

≤ ±1 mA 2,25 2,45 2,65 V

Vref

= −50 µA 1,1 1,24 1,3 V

Rosc

Input current −−50 −µA

)

DAC

Input voltage level I

= −75 µA 1,1 1,23 1,3 V

RDAC

Input current −−75 −µA

)

wob

Input voltage level I

= −8 µA 150 165 180 mV

Rwob

Input current −−8−µA

Output source current note 1 (A) −−160 −50 µA
Output sink current note1 (B) 0,4 3,5 − mA
Output voltage HIGH I

REdig

= −50 µA;

2,4 −− V

note 1 (A)

Output voltage LOW I

REdig

= 400 µA;

0 0,13 0,4 V

note 1 (B)

;

November 1987 6

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Digital inputs

B0, B1, B2 and B3

V

IH

V

IL

I

IH

I

IL

Divide-by-4 input (
V

IH

V

IL

I

IH

I

IL

f

i

Radial error inputs (Re1; Re2)
V

, V

Re1

Re2

, I

I

Re1

Re2

, Z

Z

Re1

Re2

Gain control input (AGC)

I

AGC

I

lag

I

lag

| Input impedance −

|Z

AGC

I

AGC0

∆I

AGC

-------------------------------------­∆ IRe1I

–()

Re2

Input voltage HIGH note 2 2,0 − V

P

Input voltage LOW note 2 0 − 0,8 V
Input sink current HIGH 0 0,03 1,0 µA
Input source current LOW −3,0 −0,1 0 µA

DIV4)

Input voltage HIGH divide-by-1 2,0 − V

P

Input voltage LOW divide-by-4 0 − 0,8 V
Input sink current HIGH 0 5,0

(5)

Input source current LOW −10 −30 µA
Input frequency at Re1 and

− 10 50 kHz

Re2

Input voltage level I

Re1

= I

= −110 µAVP−1,81 VP− 1,71 VP− 1,61 V

Re2

Input current −−110 −µA

 Input impedance − 2,5 − kΩ

rad on; lag hold off

Offset current V

Lag current for I

minimum radial gain V
maximum radial gain V

Gain V

= 3,8 V;

AGC

I

= I

Re1
Re1

I

Re2

AGC
AGC

AGC

V

Cosc2

V

Cosc1

I

Re1

I

Re2

I

Re1

− I

AGC0

I

Re1

− I

AGC0

= 0 −0,2 0 0,2 µA

Re2

= −85 µA;
= −115 µA

= 0,6 V −2,5 −0,45 +1,5 µA
= 3,8 V −42 −30 −18 µA

(5)

− MΩ

= 3,8 V;

= V

+ 1,4 V;

ref

= V

;

ref

= −100 µA;
= −100 µA −−2−µA

- I

= 4 µA

Re2

then

- I

= −4 µA

Re2

0,7 0,9 1,1

V

V

µA

November 1987 7

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Gain control (continued)

Radial error trackcrossing rad off; V

I

AGC

I

AGC

Offset control (offset out)

Offset current rad on; I

I

offset out

Offset lag current for rad on; lag hold off;

minimum amplification Re1 V

I

lag

maximum amplification Re2 V
minimum amplification Re2 V

I

lag

I

lag

maximum amplification Re1 V

Offset lag current note 3 −70+7 µA

Transconductance factor

I

∆

offset out

------------------------------------- ­V

∆ I

offset in

-------------------------------------­V

range offset in

⋅

tot

I

Re2−IRe1

I

Re2+IRe1

I

Re2−IRe1

I

Re2+IRe1

I

= I

Re1

= 3,8 V;

V

AGC

I

= I

Re1

offset in

− 1,2 V −115 −100 −85 µA

ref
offset in

+ 1,2 V +85 +100 +115 µA

ref

rad off; V

= I

I

Re1

V

range offset in

0,6 V (int.);

= I

I

tot

Re1

= 3,8 V

AGC

= −12 µA;
= −200 µA −303 µA
= −48 µA;
= −200 µA39 49 59 µA

= 0;

CHPF

= −110 µA −0,1 0 0,1 µA

Re2

= −110 µA

Re2

=

=

= 3,8 V;

AGC

= −100 µA;

Re2

=

+ I

Re2

0,17 0,21 0,25

rad off; V
I

= I

Re1

V

range offset in

0,6 V (int.);

= I

I

∆

I

offset out

------------------------------------- -

V

∆ I

offset in

--------------------------------------

V

range offset in

Z

 Input impedance −

offset in

⋅

tot

tot

November 1987 8

AGC

= −100 µA;

Re2

Re1 +IRe2

= V

=

GND

−0,1 0 0,1

(5)

− MΩ

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

High-pass filter (C

V

CHPF

V

∆

CHPF

------------------------------------- -

--------------------------------------

Z

–()∆

I

Re1IRe2

∆

V

CHPF

I

+()∆

Re1IRe2

 Input impedance − 8 − kΩ

CHPF

Low-pass filter (C
V

CLPF

 Input impedance − 8 − kΩ

Z

CLPF

RElag output

V

RElag

V

RElag

I

RElag

I

RElag

 Output impedance f = < 10 kHz −−50 Ω

Z

RElag

V

RElag offset

V

RElag

----------------­V

lag

)

HPF

Voltage level at I

CHPF

= 0 I

= I

Re1

Re2

I

= 0 VP−0,82 VP−0,72 VP−0,62 V

CLPF

Transresistance

from Re1, Re2 to C

)

LPF

Voltage level at I

CLPF

HPF

= 0 I

Output voltage range I

I

+ I

Re1

Re2

= I

Re1

Re2

= −200 µA;

RElag

V

= 4,25 V VP−1,1 −− V

lag

= 200 µA;

I

RElag

V

= 0,9 V −−1,1 V

lag

Maximum source

current output V

= 4,1 V −6,0 −3,5 −1,0 mA

lag

Maximum sink

current output V

Offset (V

RElag−Vref

) lag short-circuit on;

= 0,9 V 2,5 4,1 5,5 mA

lag

lag hold on −10 − 10 mV

Transfer lag → RElag f = < 10 kHz;

lag short-circuit off;
lag hold on −5% 1 5%

= 0;

= −200 µA

−200

(5)

6,2 8,8 11,5 kΩ

= 0 4,7 − V

200 Ω

P

V

Slew rate
RElag output amplifier lag short-circuit off;

SR lag hold on − 0,4 − V/µs

November 1987 9

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Lag push-pull current output, voltage input (pin 18)

note 4

Output voltage I

V

lag

V

lag

| Output impedance −

|Z

lag

Switch lag short-circuit

∆V

------------- ­∆V

lag
lag

|Z

lag sc

Impedance

|

Radial error input (REin)

|Z

| Input impedance rad on − 0 − kΩ

REin

= −20 µA;

lag

V
I

lag

V

offset in

= 20 µA;

= V

offset

= V

−1,2 V VP−1,5 −− V

ref

+ 1,2 V −−1,5 V

ref

(5)

− MΩ

lag short-circuit on;
lag hold on;
I

= ± 100 µA − 0,4 1 kΩ

lag

November 1987 10

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

RADout push-pull current output

Output voltage rad on

= 180 µA;

I

REin

I

V

RADout

V

RADout

= −50 µAV

RADout

= −180 µA;

I

REin

I

= 50 µA −−V

RADout

Current gain rad on;

= ± 100 µA −10% 1 10%

I

I

RADout

------------------ ­I

REin

REin

SR Slew rate − 0,4 − V/µs
|Z

| Output impedance −

RADout

Ratio of output

current to reference

= 0;

REin

= −75 µA;

I

RDAC

see also Table 1

I

RADout

------------------ ­I

RDAC

current I

−1,5 −− V

ext(+)

+1,5 V

ext(−)

(5)

− MΩ

−5% −0,5 +15%

−8% −2 +12%

−0,02 0 0,02

−0,02 0 0,02

−14% 0,5 +6%

−12% 2 +8%

−0,1 0 0,1

−0,1 0 0,1

−5% −0,5 +15%

−5% −0,375 +15%

−5% −0,25 +15%

−4% −0,125 +16%

−14% +0,5 +6%

− 13% +0,375 +7%

− 13% +0,25 +7%

− 13% +0,125 +7%

November 1987 11

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

= 3,8 V

Lead output

Output voltage I

V

lead

V

lead

I

lead offset

Offset current I
Current gain I

∆I

lead

--------------------------- -

∆

I

–()

Re1IRe2

|Z

| Output impedance −

lead

Oscillator

(C

osc1

and C

connected

osc2

to 12 nF capacitors)

Amplitude oscillation

(peak-to-peak value)

V

osc1(p-p)

V

osc2(p-p)

f

osc

C

osc1

C

osc2

Operating frequency I
Output voltages

(peak-to-peak value)

0°injection

V

lead(p-p)

V

lag(p-p)

V

lag(p-p)

lead (pin19) R

(pin 18) R

C

lag

90°injection

offset out I

V

offset out(p-p)

45°injection

AGC R

V

AGC(p-p)

AGC

= −90 µA;

Re1

= −100 µA;

I

Re2

I

= −20 µAV

lead

= −100 µA;

I

Re1

I

= −90 µA;

Re2

I

= 20 µA −−1,5 V

lead

= I

Re1
Re1

I

Re2

= −100 µA −100 0 100 µA

Re2

= −120 µA;
= −100 µA −11,2 −9,9 −8,8

−1,5 −− V

P

(5)

− MΩ

1,05 1,25 1,45 V
1,05 1,25 1,45 V

= I

Re1

lead
lag

= −110 µA 690 740 790 Hz

Re2

= 10 kΩ 0,85 1,05 1,25 V

= 10 kΩ; rad on;
lag hold off 85 105 125 mV
rad on; lag hold on − 020 mV

= −100 µA;

CHPF

R

offset out

= 10 kΩ;

rad on 90 110 130 mV

= 10 kΩ

agc

V

offset in

= V

+ 1V;

ref

rad on 200 250 300 mV

November 1987 12

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

Notes to the characteristics

1. REdig output conditions:
(A) I

2. Input voltage HIGH indicates logic 1; Input voltage LOW indicates logic 0; see also Table 1.

3. DIV4 = HIGH; V
I

Re1

4. Output voltage conditions are:
rad on; lag short-circuit off; lag hold off; V
V

5. Value to be fixed.

Table 1 Truth table for DAC output current

FUNCTIONS DAC OUTPUT LOGICAL INPUTS INTERNAL SWITCHES

PUSH −1/2 0 0 0 0 off off on
(kick) −2 0 001offoffoff
OFF 0 0 0 1 0 off off on
OFF 0 0 0 1 1 on off off
PULL 1/2 0 1 0 0 off off on
(kick) 2 0 1 0 1 off off off
CATCH 0 0 1 1 0 off on on
PLAY 0 0 1 1 1 off on off
PUSH −1/2 1 0 0 0 on off on
PUSH −3/8 1 0 0 1 on off off
PUSH −1/4 1 0 1 0 on off on
PUSH −1/8 1 0 1 1 on off off
PULL 1/2 1 1 0 0 on off on
PULL 3/8 1 1 0 1 on off off
PULL 1/4 1 1 1 0 on off on
PULL 1/8 1 1 1 1 on off off

= I

offset

Re1

= V

> I

Re2

= −100 µA.

Re2

− 1,2 V.

ref

I

REout/IDAC

+ 5 µA; (B) I

adjusted for V

offset in

Re2

> I

+ 5 µA.

Re1

= 1,4 V; rad on; lag hold off; V

REdig

= 3,8 V; I

AGC

Re1

= I

Re2

= −100 µA;

AGC

B3 B2 B1 B0 lag

= 3,8 V;

s/c

rad lag

hold

Where:
0 = input voltage LOW; 1 = input voltage HIGH.

November 1987 13

Philips Semiconductors Product specification

Radial error signal processor for compact
disc players

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

15

TDA8809T

SOT136-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

18.1

7.6

17.7

7.4

0.71

0.30

0.69

0.29

14

w M

b

p

scale

eHELLpQ

1.27

0.050

10.65

10.00

0.42

0.39

1.4

0.055

Q

A

2

0.043

0.016

A

1.1

0.4

L

p

L

0.25 0.1

0.01

(A )

1

detail X

1.1

0.25

1.0

0.043

0.01

0.039

A

3

θ

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

o

8

o

0

OUTLINE
VERSION

SOT136-1

IEC JEDEC EIAJ

075E06 MS-013AE

REFERENCES

November 1987 14

EUROPEAN

PROJECTION

ISSUE DATE

91-08-13

95-01-24

Philips Semiconductors Product specification

Radial error signal processor for compact
disc players

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

TDA8809T

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

November 1987 15

Philips Semiconductors Product specification

Radial error signal processor for compact

TDA8809T

disc players

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

November 1987 16