Datasheet TDA8793HL Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8793

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

Product specification
Supersedes data of 1999 Oct 06
File under Integrated Circuits, IC02

2000 Nov 20

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

FEATURES

• 8-bit low-power ADC: 180 mW (typical value)

• 2.7 to 3.6 V operation

• Track-and-hold circuit

• In track-and-hold mode: sampling rate from

70 to 100 Msps

• In non track-and-hold mode: sampling rate from
1 sps to 100 Msps

• CMOS/TTL compatible digital inputs and outputs

• Internal reference voltages

• Adjustable full-scale range possibility with external

reference

• Power-down mode: 5 mW.

APPLICATIONS

• Radio communications

• Digital data storage read channels

• Medical imaging

• Digital instrumentation.

TDA8793

GENERAL DESCRIPTION

The TDA8793 is an 8-bit low-power Analog-to-Digital
Converter (ADC) which includes a track-and-hold circuit
and internal references. The device converts an analog
input signal, up to 100 MHz, into 8-bit binary codes at a
maximum sample rate of 100 Msps. All digital inputs and
outputs are CMOS/TTL compatible. A sine wave clock
input signal can also be used.

The Power-down mode enables the device power
consumption to be reduced to 5 mW.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
V
V
I

CCA

CCA
CCD
CCO

analog supply voltage 2.7 3.0 3.6 V
digital supply voltage 2.7 3.0 3.6 V
output stages supply voltage 2.7 3.0 3.6 V
analog supply current operating 32 40 48 mA

standby 0 2 100 µA

I

CCD

digital supply current operating 12 16 24 mA

standby 0 0.66 1.1 mA

I

CCO

INL integral non-linearity ramp input; f

DNL differential non-linearity ramp input; f

f

CLK(max)

P

tot

output stages supply current ramp input − 4 6.5 mA

V

CCA=VCCD

V

CCA=VCCD

CLK

=3V

CLK

=3V

= 2 MHz;

= 2 MHz;

−±0.85 ±1.70 LSB

−±0.25 ±0.80 LSB

maximum clock input frequency 100 −−MHz
total power dissipation VCC=3V − 180 − mW

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8793HL LQFP32 plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm SOT401-1

2000 Nov 20 2

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

BLOCK DIAGRAM

handbook, full pagewidth

INP
INN

REFOUT

REFIN

4
3

5
2

TEN

12

TRACK-AND-

HOLD

V

CCA

TDA8793

V

7

V

CCD

CCO2

10

ADC

CLOCK DRIVER

V

22

LATCHES

CCO1

20

CMOS

OUTPUTS

26

D7

25

D6

24

D5

23

D4

18

D3

17

D2

16

D1

15

D0

11

CLK

SDN

STDBY

32

8

REFERENCE

VOLTAGES

31

DEC

TDA8793

6

AGND

9

DGND

Fig.1 Block diagram.

21

OGND119OGND2

MGR016

2000 Nov 20 3

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
REFIN 2 reference input for ADC
INN 3 negative input
INP 4 positive input
REFOUT 5 reference output for AC coupling of

input
AGND 6 analog ground
V

CCA

STDBY 8 standby mode input
DGND 9 digital ground
V

CCD

CLK 11 clock input
TEN 12 track enable input (active LOW)
n.c. 13 not connected
n.c. 14 not connected
D0 15 data output bit 0 (LSB)
D1 16 data output bit 1

7 analog supply voltage

10 digital supply voltage

TDA8793

SYMBOL PIN DESCRIPTION

D2 17 data output bit 2
D3 18 data output bit 3
OGND1 19 output ground 1
V

CCO1

OGND2 21 output ground 2
V

CCO2

D4 23 data output bit 4
D5 24 data output bit 5
D6 25 data output bit 6
D7 26 data output bit 7 (MSB)
n.c. 27 not connected
n.c. 28 not connected
n.c. 29 not connected
n.c. 30 not connected
DEC 31 decoupling
SDN 32 stabilized decoupling node output

20 output supply voltage 1

22 output supply voltage 2

handbook, full pagewidth

n.c.

REFIN

INN
INP

1
2
3
4

SDN
32

DEC
31

n.c.
30

n.c.

29

TDA8793

AGND

V

CCA

5
6
7
8

9

DGND

10

CCD

V

11

CLK

12

TEN

REFOUT

STDBY

Fig.2 Pin configuration.

2000 Nov 20 4

n.c.
28

13
n.c.

n.c.

27

14
n.c.

D7
26

15
D0

D6
25

16

D1

24
23
22
21
20
19
18
17

MGR017

D5
D4

V

CCO2
OGND2
V

CCO1
OGND1

D3
D2

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

V
V
∆V

V

I

O

T
T

CCA
CCD
CCO

CC

n

stg
amb

analog supply voltage note 1 −0.3 +5.0 V
digital supply voltage note 1 −0.3 +5.0 V
output stages supply voltage note 1 −0.3 +5.0 V
supply voltage differences between

V
V
V

CCA
CCO
CCA

and V

and V

and V

CCD

CCD

CCO

−1.0 +1.0 V

−1.0 +1.0 V

−1.0 +1.0 V

voltage on pins

INP, INN, CLK,

TEN and STDBY note 2 −0.3 +4.5 V

REFIN −0.3 +4.5 V
output current − 10 mA
storage temperature −55 +150 °C
ambient temperature 0 70 °C

Notes

1. The supply voltages V

CCA

, V

CCD

, V

may have any value between −0.3 and +5.0 V provided that the supply

CCO

voltage differences ∆VCC are respected.

2. All voltages are typical values and are referenced to all ground pins connected together.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 94 K/W

2000 Nov 20 5

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

CHARACTERISTICS

V

CCA=V7

DGND and OGND shorted together; V
V

CCA

T

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CCA

V

CCD

V

CCO

I

CCA

I

CCD

I

CCO

Internal reference voltage output (pin SDN); note 1
V

ref

V

reg

TC temperature coefficient − 20 − ppm/K

I

L

Internal reference voltage output (pin REFOUT)

V

ref

V

reg

TC temperature coefficient − 20 − ppm/K

I

L

Clock input (pin CLK); note 2
V

IL

V

IH

I

IL

I

IH

Z

i

C

i

Standby input (pin STDBY); see Table 1
V

IL

V

IH

I

IL

I

IH

Track enable input (pin TEN); see Table 2

V

IL

V

IH

I

IL

I

IH

to V6= 2.7 to 3.6 V; V

to V

= −0.15 to +0.15 V; T

CCO

CCD=V10

amb

to V9= 2.7 to 3.6 V; V

CCA

to V

= −0.15 to +0.15 V; V

CCD

= 0 to 70 °C; typical values measured at V

=25°C; single-ended input; unless otherwise specified.

analog supply voltage 2.7 3.0 3.6 V
digital supply voltage 2.7 3.0 3.6 V
output stages supply voltage 2.7 3.0 3.6 V
analog supply current 32 40 48 mA
digital supply current 12 16 24 mA
output stages supply current ramp input − 4 6.5 mA

f

= 20 MHz − 8.7 12 mA

i

reference voltage 1.21 1.26 1.31 V
line regulation voltage 2.7 < V

CCA

load current −1 −−mA

reference voltage 1.76 1.84 1.92 V
line regulation voltage 2.7 < V

CCA

load current −1 −−mA

LOW-level input voltage 0 − 0.8 V
HIGH-level input voltage 2 − V
LOW-level input current V
HIGH-level input current V
input impedance f
input capacitance f

=0 −2 − +2 µA

CLK
CLK=VCCD

= 100 MHz − 32 − kΩ

CLK

= 100 MHz − 2 − pF

CLK

LOW-level input voltage 0 − 0.8 V
HIGH-level input voltage 2 − V
LOW-level input current V
HIGH-level input current V

=0 −5 −−µA

STDBY
STDBY=VCCD

LOW-level input voltage 0 − 0.8 V
HIGH-level input voltage 2 − V
LOW-level input current V
HIGH-level input current V

=0 −5 −−µA

TEN
TEN=VCCD

CCO=V20

to V19 and V22to V21= 2.7 to 3.6 V; AGND,

CCD

to V

= −0.15 to +0.15 V;

CCO

CCA=VCCD=VCCO

= 3.0 V and

< 3.6 V − 1.25 4 mV

< 3.6 V − 1.5 5 mV

CCD

V

−−5µA

CCD

V

−−5µA

CCD

V

−−5µA

2000 Nov 20 6

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Analog inputs (pins INP and INN); input voltage referenced to AGND; V

V

∆V

i(p-p)

i(T)

input voltage range
(peak-to-peak value)

input voltage range variation with

Vi=V
T

amb

− V

INP

=25°C

INN

;

temperature

V

IO

Z

i

C

i

I

I

input offset voltage output code = 127 −30 − +30 mV
input impedance fi= 50 MHz − 90 − kΩ
input capacitance fi= 50 MHz − 2 − pF
input current VI=V

V

I=VREFOUT

REFOUT

− 0.5 V −1 −−µA
+ 0.5 V −−40 µA

Adjustable full-scale range

V

i(p-p)

input voltage range
(peak-to-peak value)

Vi=V
V

REFIN

T

amb

− V

INP

= 1.27 V;

=25°C; see Fig.3

INN

;

Reference input for ADC (pin REFIN); referenced to AGND; note 3
V

REFIN

I

REFIN

reference input voltage 1.25 1.27 1.35 V
reference input current − 0.9 1.1 mA

ADC data outputs (pins D0 to D7)

V

OL

V

OH

C

L

δV/δt slew rate 20% to 80%; C

LOW-level output voltage IO=1mA −−0.54 V

I

= 0.6 mA −−0.40 V

O

HIGH-level output voltage IO= −0.4 mA V
load capacitance −−10 pF

=10pF − 1.6 − V/ns

L

Analog signal processing; see Figs 4, 5, 6 and 7; note 3
INL integral non-linearity ramp input; f

V

CCA=VCCD

DNL differential non-linearity ramp input; f

V

CCA=VCCD

CLK

=3V

CLK

=3V

= 2 MHz;

= 2 MHz;

S/N signal-to-noise ratio (full-scale) without harmonics;

= 100 MHz:

f

CLK

= 20 MHz 43 48 − dB

f

i

f

= 50 MHz − 47 − dB

i

B −3 dB analog bandwidth track-and-hold active − 350 − MHz
THD total harmonic distortion f

H

fund(FS)

fundamental harmonics (full-scale) f

= 20 MHz −−53 − dB

i

f

= 50 MHz −−51 − dB

i

= 100 MHz:

CLK

f

= 20 MHz −−0dB

i

f

= 50 MHz −−0dB

i

= 1.27 V; see Table 3

REFIN

0.90 0.95 1.02 V

− 0.5 − mV/K

− 1 − V

− 0.5 − V

CCO

CCO

−±0.85 ±1.70 LSB

−±0.25 ±0.80 LSB

V

2000 Nov 20 7

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

H

D2(FS)

H

D3(FS)

SFDR spurious free dynamic range f

EB effective number of bits f

Data timing; f

f

CLK(min)

f

CLK(max)

t

W(CLKH)

t

W(CLKL)

t

r

t

f

t

ds

t

h

t

d

Notes

1. The reference output voltage (pin SDN) can be used to drive other analog circuits under the limits indicated.

2. In addition to a good layout of the digital and analog grounds, it is recommended that the rise and fall times of the
clock must be more than 0.75 ns.

3. It is possible with an external reference voltage connected to pin REFIN to adjust the ADC input range. The input
range variation will be fixed.

4. Effectivebitsare obtained viaaFast Fourier Transform (FFT)treatmenttaking 8000 acquisition pointsperequivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(Nyquist frequency). Conversion to signal-to-noise ratio: SINAD = 6.02 × EB + 1.76 dB.

second harmonic distortion
(full-scale) all components included

differential input;
f

= 100 MHz:

CLK

f

= 20 MHz −−63 − dB

i

f

= 50 MHz −−63 − dB

i

single-ended input;
f

= 100 MHz:

CLK

f

= 20 MHz −−57 − dB

i

= 50 MHz −−55 − dB

f

i

third harmonic distortion (full-scale)
all components included

differential input;
f

= 100 MHz:

CLK

f

= 20 MHz −−62 − dB

i

f

= 50 MHz −−55 − dB

i

single-ended input;
f

= 100 MHz:

CLK

= 20 MHz −−59 − dB

f

i

f

= 50 MHz −−55 − dB

i

= 100 MHz:

CLK

f

= 20 MHz − 56 − dB

i

f

= 50 MHz − 54 − dB

i

= 100 MHz; note 4:

CLK

f

= 20 MHz 7.0 7.4 − bits

i

f

= 50 MHz − 7.3 − bits

i

track-and-hold inactive − 7.4 − bits

= 100 MHz; CL=10pF;see Fig.8; note 2

CLK

minimum clock frequency track-and-hold active −−70 MHz
maximum clock frequency IO= 0.6 mA 100 −−MHz
clock pulse width HIGH 4 −−ns
clock pulse width LOW 4 −−ns
clock rise time 0.75 − 4ns
clock fall time 0.75 − 4ns
sampling delay −−1.5 ns
output hold time 3 −−ns
output delay time − 68ns

2000 Nov 20 8

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

Table 1 Standby selection

PIN STDBY POWER-DOWN MODE D0 TO D7 I

LOW inactive output operating 56 mA

HIGH active output logic state LOW 0.7 mA

Table 2 Track-and-hold selection

PIN

TEN TRACK-AND-HOLD

LOW active

HIGH inactive

Table 3 Output coding and input voltage (typical values; referenced to AGND; V

STEP V

Underflow <1.6 >2.1 0 0 0 00000

0 1.6 2.1 00000000

1 ... ... 00000001

... ... ... ... ... ... ... ... ... ... ...

127 1.85 1.85 ... ... ... ... ... ... ... ...

... ... ... ... ... ... ... ... ... ... ...

254 ... ... 11111110

255 2.1 1.6 11111111

Overflow >2.1 <1.6 1 1 1 11111

(V) V

INP

INN

(V)

D7 D6 D5 D4 D3 D2 D1 D0

OUTPUT CODING BITS

REFIN

= 1.27 V)

CCA+ICCD

2000 Nov 20 9

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

V

REFIN

FCE421

(V)

= 3.0 V,

1.4

handbook, halfpage

V

i(p-p)

(V)

1.2

1

0.8

0.6

1.15 1.25

Typical values measured at V

= 100 MHz, T

f

CLK

amb

1.35 1.45

CCA=VCCD=VCCO

=25°C and single-ended input.

67

handbook, halfpage

SFDR

S/N

(dB)

62

57

52

47

42

1.15 1.25

Typical values measured at V

= 100 MHz, T

f

CLK

amb

(1) SFDR.
(2) S/N.

(1)

(2)

1.35 1.45
V

REFIN

CCA=VCCD=VCCO

=25°C and single-ended input.

TDA8793

FCE423

(V)

= 3.0 V,

Fig.3 ADC input voltage range as a function of

reference input voltage.

55

handbook, halfpage

THD

S/N

(dB)

53

51

49

47

45

1

Typical values measured at V

= 100 MHz and T

f

CLK

(1) THD differential inputs.
(2) THD single-ended input.
(3) S/N.

CCA=VCCD=VCCO

=25°C.

amb

(3)

10

fi (MHz)

FCE419

= 3.0 V,

Fig.4 Spurious free dynamic range and noise as

a function of reference input voltage.

handbook, halfpage

(1)

(2)

2

10

8

EB

(bits)

7.5

7

6.5

6

5.5
110

Typical values measured at V

= 100 MHz and T

f

CLK

CCA=VCCD=VCCO

=25°C.

amb

fi (MHz)

(1) Differential inputs.
(2) Single-ended input.

FCE420

(1)

(2)

= 3.0 V,

2

10

Fig.5 Distortion and noise as a function of the

input frequency.

2000 Nov 20 10

Fig.6 Effectivenumber of bitsas a functionof the

input frequency.

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

V

REFIN

FCE422

(V)

= 3.0 V,

1.45

handbook, halfpage

8

EB

(bits)

7

6

5

1.15

Typical values measured at V

= 100 MHz, T

f

CLK

amb

1.25 1.35

CCA=VCCD=VCCO

=25°C and single-ended input.

TDA8793

Fig.7 Effective bits as a function of reference

input voltage.

handbook, full pagewidth

CLK

V

l

data

D0 to D7

t

W(CLKH)

sample N sample N + 1 sample N + 2

t

ds

DATA

N − 2

t

W(CLKL)

DATA
N − 1

t

h

DATA

N

t

d

DATA

N + 1

MGR018

Fig.8 Timing diagram.

2000 Nov 20 11

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

APPLICATION INFORMATION

handbook, full pagewidth

100 nF

10 nF

220 nF

input

50 Ω 50 Ω

100 nF

REFIN

INN
INP

REFOUT

TDA8793

100 nF

DEC

SND

31

32

2

3

TDA8793

4

5

MGR019

handbook, full pagewidth

Fig.9 Application diagram for single-ended input mode with internal reference.

EXTERNAL

input

220 nF

50 Ω 50 Ω

REFERENCE

100 nF

10 nF

100 nF

1.25 V

REFIN

INN
INP

REFOUT

2

3
4

5

100 nF

DEC

31

TDA8793

MGR020

Fig.10 Application diagram for single-ended input mode with external reference.

2000 Nov 20 12

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

handbook, full pagewidth

100 nF

220 nF

input 2

220 nF

input 1

50 Ω

50 Ω

100 nF

REFIN

INN

INP

REFOUT

TDA8793

100 nF

DEC

SND

32

2

3

4
5

31

TDA8793

MGR021

handbook, full pagewidth

Fig.11 Application diagram for differential input mode with internal reference.

100 nF

DEC

SND

input

100 nF

220 nF

1 : 1

100 Ω 100 Ω

100 nF

100 nF

REFIN

REFOUT

INN

INP

2

3

4

5

32

TDA8793

31

MGR022

Fig.12 Application diagram for differential input mode with internal reference and using a transformer.

2000 Nov 20 13

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

PACKAGE OUTLINE

LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm

c

y

X

24

25

17

Z

16

E

A

TDA8793

SOT401-1

e

pin 1 index

32

1

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

1.60

A

1A2A3bp

0.15

1.5

1.3

0.25

0.05

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

w M

b

p

D

H

D

cE

0.27

0.18

0.17

0.12

9

8

Z

D

B

0 2.5 5 mm

(1) (1)(1)

D

5.1

4.9

w M

b

p

v M

v M

scale

(1)

eH

H

5.1

4.9

0.5

7.15

6.85

D

E

A

B

H

E

E

7.15

6.85

A

LL

p

0.75

1.0

0.45

A

2

A

1

detail X

Z

D

0.2

0.12 0.1

0.95

0.55

(A )

3

L

p

L

Zywv θ

E

0.95

0.55

o

7

o

0

θ

OUTLINE
VERSION

SOT401-1 136E01 MS-026

IEC JEDEC EIAJ

REFERENCES

2000 Nov 20 14

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27
00-01-19

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

SOLDERING
Introduction to soldering surface mount packages

Thistext gives averybrief insight toacomplex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurface mount ICs,butit is notsuitableforfine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardby screen printing,stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

TDA8793

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wavewith high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leadsonfour sides, the footprintmust
be placedat a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the packagemust
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Nov 20 15

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wavesoldering is only suitable for SSOP andTSSOP packages with a pitch(e) equal to or larger than 0.65 mm;it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

2000 Nov 20 16

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps

TDA8793

Analog-to-Digital Converter (ADC)

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data willbe

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting valuesgiven arein
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atanyother conditionsabovethose given inthe
Characteristics sectionsof the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warranty thatsuchapplications will be
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto resultin personal injury. Philips
Semiconductorscustomersusing or sellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of anyofthese products, conveysnolicenceor title
under any patent, copyright, or mask work right to these
products,and makes norepresentations or warrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Nov 20 17

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

TDA8793

NOTES

2000 Nov 20 18

Philips Semiconductors Product specification

8-bit, low-power, 3 V, 100 Msps
Analog-to-Digital Converter (ADC)

TDA8793

NOTES

2000 Nov 20 19

Philips Semiconductors – a w orldwide compan y

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Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
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United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
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The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

70

Printed in The Netherlands 753504/03/pp20 Date of release: 2000 Nov 20 Document order number: 9397 750 07275