Datasheet TDA8786G-C2-S1, TDA8786G-C2, TDA8786G-C1-R5, TDA8786G-C1-S1, TDA8786G-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1997 May 20
File under Integrated Circuits, IC02

1997 Nov 17

INTEGRATED CIRCUITS

TDA8786; TDA8786A

10-bit analog-to-digital interface for
CCD cameras

1997 Nov 17 2

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

FEATURES

• Correlated Double Sampling (CDS), AGC, soft clipper,
pre-blanking, 10-bit ADC and reference regulator
included

• Fully programmable via a 3-wire serial interface

• Sampling frequency up to 18 MHz

• AGC gain from 3.5 to 33.5 dB (in 0.1 dB steps)

• Programmable soft clipper for white compression

(starting at 40% of the input signal)

• Standby mode available for each block for power saving
applications (19 mW)

• 6 dB fixed gain analog output for analog iris control

• 8-bit and 10-bit DAC included for analog settings

• Low power consumption of only 475 mW (typ.)

• 5 V operation and 2.5 to 5 V operation for the digital

outputs

• CDS control pulse: TDA8786 = HIGH;
TDA8786A = LOW

• TTL compatible inputs, TTL and CMOS compatible
outputs.

GENERAL DESCRIPTION

The TDA8786; TDA8786A is a 10-bit analog-to-digital
interface for CCD cameras. The device includes a
correlated double sampling circuit, AGC, a soft clipper
circuit and a low power 10-bit Analog-to-Digital Converter
(ADC) together with its reference voltage regulator.

The AGC and soft clipper circuits are controlled by on-chip
DACs via a serial interface.

A 10-bit DAC controls the ADC input clamp level.
A pre-blanking function is also included.
An additional DAC is provided for additional system

controls; its output voltage range is 1.4 V (p-p) which is
available at pin OFDOUT.

APPLICATIONS

• CCD camera systems.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

analog supply voltage 4.5 4.75 5.5 V

V

CCD

digital supply voltage 4.5 4.75 5.5 V

V

CCO

digital outputs supply voltage 2.5 2.6 5.5 V

I

CCA

analog supply current − 83 − mA

I

CCD

digital supply current − 16 − mA

I

CCO

digital outputs supply current f

CLK

= 18 MHz;

CL= 20 pF; ramp input

− 1 − mA

ADC

res

ADC resolution − 10 − bits

V

i(CDS)(p-p)

CDS input voltage (peak-to-peak value) − 400 1200 mV

G

CDS

CDS output amplifier gain − 6 − dB

f

CLK(max)

maximum clock frequency 18 −−MHz

AGC

dyn

AGC dynamic range − 30 − dB

N

tot(rms)

total noise from CDS input to ADC
output (RMS value)

gain = 3.5 dB − 0.5 − LSB

P

tot

total power consumption − 475 − mW

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8786G

LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2

TDA8786AG

1997 Nov 17 3

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGE361

SOFT

CLIPPER

OPTICAL

BLACK
CLAMP

TRACK-

AND-HOLD

TRACK-

AND-HOLD

TRACK-

AND-HOLD

TRACK-

AND-HOLD

TRACK-

AND-HOLD

CLAMP

ref2

ref1

CLAMP

CLAMP

8-BIT DAC

4-BIT DAC

10-BIT DAC

9-BIT DAC

+

6 dB

AGC

CLOCK

GENERATOR

10-BIT ADC

REGULATOR

SERIAL

INTERFACE

OUTPUTS

BUFFER

5

4

1

1

2

7

8

6

9
10

14

11

12

13 15 16 17 18

20

21

22

23

24

36

3

25

26

27

28

29

30

31

32

33

34

35

3738394041424344

454846

47

IN2

IN1 AGND3

V

CCA3

CDSP2 CDSP1 CLPCDS CLK

DGND2

V

CCD2

OE

V

CCO

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0
DGND1
OFDOUT

OGND

V

CCD1

STDBY

SEN

SCLK

SDATA

DEC1

V

RT

V

RB

V

CCA2

DACOUT

V

ref

CLPADC

AGND2

ADCIN

PBOUT

V

CCA1

PBIN

AGCOUT

PBK

CLPOPB

AGND1

19

STGE

AMPOUT

TDA8786

TDA8786A

1

1997 Nov 17 4

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

PINNING

SYMBOL PIN DESCRIPTION

CLPOPB 1 optical black clamp control pulse input (active HIGH for TDA8786, active LOW for TDA8786A)
PBK 2 pre-blanking control pulse input; if PBK is HIGH (LOW) the signal is replaced by the optical

black level for TDA8786 (TDA8786A)
OFDOUT 3 analog output of the additional 8-bit control DAC (controlled via the serial interface)
AMPOUT 4 CDS amplifier output (fixed gain = +6 dB)
AGND1 5 analog ground 1
V

CCA1

6 analog supply voltage 1
AGCOUT 7 AGC and soft clipper amplifier signal output
PBIN 8 optical black clamp and pre-blanking block signal input (from AGCOUT via a capacitor)
PBOUT 9 optical black clamp and pre-blanking block signal output
ADCIN 10 ADC analog signal input (from PBOUT or AGCOUT via a capacitor)
CLPADC 11 clamp control input for ADC analog input signal clamp (active HIGH for TDA8786 and active

LOW for TDA8786A)

V

ref

12 ADC input clamp reference voltage (normally connected to pin VRB or DACOUT)
DACOUT 13 DAC output for ADC clamp level
AGND2 14 analog ground 2
V

CCA2

15 analog supply voltage 2
V

RB

16 ADC reference voltage (BOTTOM) code 0
V

RT

17 ADC reference voltage (TOP) code 1023
DEC1 18 decoupling 1 (decoupled to ground via a capacitor)
STGE 19 CDS offset storage
SDATA 20 serial data input for the 4 control DACs (9-bit DAC for AGC gain, 4-bit DAC for soft clipper;

additional 8-bit DAC for OFD output voltage; 10-bit DAC for ADC clamp level and the stand-by

mode per block; see Table 1)
SCLK 21 serial clock input for the control DACs and their serial interface; see Table 1
SEN 22 enable input for the serial interface shift register (active when SEN = logic 0); see Table 1
STDBY 23 stand-by control pin (active HIGH); all the output bits are logic 0 when stand-by is enabled
V

CCD1

24 digital supply voltage 1
DGND1 25 digital ground1
D0 26 ADC digital output 0 (LSB)
D1 27 ADC digital output 1
D2 28 ADC digital output 2
D3 29 ADC digital output 3
D4 30 ADC digital output 4
D5 31 ADC digital output 5
D6 32 ADC digital output 6
D7 33 ADC digital output 7
D8 34 ADC digital output 8
D9 35 ADC digital output 9 (MSB)
OGND 36 digital output ground

1997 Nov 17 5

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

V

CCO

37 digital output supply voltage
OE 38 output enable (LOW: digital outputs active; HIGH: digital outputs high impedance)
V

CCD2

39 digital supply voltage 2
DGND2 40 digital ground2
CLK 41 ADC clock input
CLPCDS 42 CDS clamp control input (active HIGH for TDA8786; active LOW for TDA8786A)
CDSP1 43 CDS control pulse input 1 (active HIGH for TDA8786; active LOW for TDA8786A)
CDSP2 44 CDS control pulse input 2 (active HIGH for TDA8786; active LOW for TDA8786A)
V

CCA3

45 analog supply voltage 3
IN1 46 input signal 1 from CCD (usually black channel)
IN2 47 input signal 2 from CCD (usually video channel)
AGND3 48 analog ground 3

SYMBOL PIN DESCRIPTION

Fig.2 Pin configuration.

1
2
3
4
5
6
7
8

9
10
11

36
35
34
33
32
31
30
29
28
27
26

13

14

15

16

17

18

19

20

21

22

23

48

47

46

45

44

43

42

41

40

39

38

12

24 37

25

TDA8786

TDA8786A

MGE360

OGND
D9
D8
D7

D5
D4
D3
D2
D1
D0
DGND1

CLPOPB

PBK
OFDOUT
AMPOUT

AGND1
V

CCA1

PBIN

PBOUT

CLPADC

V

ref

D6

IN2

IN1

V

CCA3

CDSP2

CDSP1

CLPCDS

DGND2

V

CCD2

OE

V

CCO

AGND3

CLK

AGCOUT

ADCIN

AGND2

V

CCA2

V

RB

V

RT

DEC1

STGE

SDATA

SEN

STDBY

V

CCD1

DACOUT

SCLK

1997 Nov 17 6

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. The supply voltages V

CCA

, V

CCD

and V

CCO

may have any value between −0.3 and +7.0 V provided that the supply

voltage difference ∆VCC remains as indicated.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CCA

analog supply voltage note 1 −0.3 +7.0 V

V

CCD

digital supply voltage note 1 −0.3 +7.0 V

V

CCO

output stages supply voltage note 1 −0.3 +7.0 V

∆V

CC

supply voltage difference

between V

CCA

and V

CCD

−1.0 +1.0 V

between V

CCA

and V

CCO

−1.0 +4.0 V

between V

CCD

and V

CCO

−1.0 +4.0 V

V

i

input voltage referenced to V

SSA

−0.3 +7.0 V

V

CLK(p-p)

AC input voltage for switching
(peak-to peak-value)

referenced to V

SSD

− V

CCD

V

I

o

output current − 10 mA

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature −20 +75 °C

T

j

junction temperature − 150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 76 K/W

1997 Nov 17 7

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

CHARACTERISTICS

V

CCA=VCCD

= 4.75 V; V

CCO

= 2.6 V; f

CLK

= 18 MHz; T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CCA

analog supply voltage 4.5 4.75 5.5 V

V

CCD

digital supply voltage 4.5 4.75 5.5 V

V

CCO

digital outputs supply
voltage

2.5 2.6 5.5 V

I

CCA

analog supply current − 83 − mA

I

CCD

digital supply current − 16 − mA

I

CCO

digital outputs supply
current

CL= 20 pF on all data
outputs; ramp input

− 1 − mA

Digital inputs

C

LOCK INPUT: CLK (REFERENCED TO DGND)

V

IL

LOW-level input voltage 0 − 0.8 V

V

IH

HIGH-level input voltage 2.0 − V

CCD

V

I

IL

LOW-level input current V

CLK

= 0.8 V −1 − +1 µA

I

IH

HIGH-level input current V

CLK

= 2.0 V −−20 µA

Z

i

input impedance f

CLK

= 18 MHz − 2 − kΩ

C

i

input capacitance f

CLK

= 18 MHz − 2 − pF
INPUTS: CDSP1 AND CDSP2
V

IL

LOW-level input voltage 0 − 0.6 V

V

IH

HIGH-level input voltage 2.2 − V

CCD

V

I

IL

LOW-level input current VIL= 0.6 V −−100 −µA

I

IH

HIGH-level input current VIH= 2.2 V − 0 −µA
INPUTS: SEN, STDBY, CLPCDS, CLPOPB, PBK AND CLPADC
V

IL

LOW-level input voltage 0 − 0.6 V
V

IH

HIGH-level input voltage 2.2 − V

CCD

V

I

i

input current −2 − +2 µA
INPUTS: SEN, SDATA AND SCLK (see Fig.14)
t

su1

SEN set-up time compared

to SCLK rising edge

− 4 − ns

t

su2

SDATA set-up time

compared to SCLK rising

edge

− 4 − ns

t

su3

SEN set-up time compared

to SCLK falling edge

− 4 − ns

t

hd3

SEN hold time compared

to SCLK rising edge

− 4 − ns

t

hd4

SDATA hold time

compared to SCLK rising

edge

− 4 − ns

1997 Nov 17 8

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Correlated Double Sampling; CDS

V

i(CDS)(p-p)

CDS input amplitude

(peak-to-peak value)

− 400 1200 mV

I

STGE,IN1,IN2

input current pins 19, 46

and 47

−2 − +2 µA

t

CDS(min)

CDS control pulses

minimum active time

(HIGH for TDA8786,

LOW for TDA8786A)

f

i(CDS1,2)=fCLK(pix)

V

i(CDS)(p-p)

= 1200 mV
black-to-white transition in
one pixel (±1 LSB typ.)

12 −−ns

t

hd1

hold time IN1 compared to
control pulse CDSP1

see Fig.15 − 1 − ns

t

hd2

hold time of IN2 compared
to control pulse CDSP2

see Fig.15 −−0.5 − ns

Amplifier outputs

G

AMPOUT

output amplifier gain − 6 − dB

Z

AMPOUT

output amplifier
impedance

− 300 −Ω

V

AMPOUT(p-p)

output amplifier dynamic
voltage level
(peak-to-peak value)

− 2.4 − V

V

AMPOUT(bl)

output amplifier black
level voltage

− 1.1 − V

V

AGCOUT(p-p)

AGC output amplifier
dynamic voltage level
(peak-to-peak value)

− 1800 − mV

V

AGCOUT

AGC output amplifier black
level voltage

− 1.1 − V

Z

AGCOUT

AGC output amplifier
output impedance

at 10 kHz − 5 −Ω

I

AGCOUT

AGC output static drive
current

static −−1mA

V

OPB(p-p)

optical black clamp and
blanking block output
dynamic voltage
(peak-to-peak value)

− 1.8 − V

V

OPB

optical black clamp and
blanking block output black
level voltage

− 1.4 − V

Z

OPB

optical black clamp and
blanking block output
impedance

at 10 kHz −−5Ω

I

OPB

OPB output current drive static −−1mA

I

PBIN

input current pin 8 −2 − +2 µA

G

AGC(min)

minimum gain of AGC
circuit

AGC DAC input code = 00
(9-bit control)

− 3.5 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Nov 17 9

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

G

AGC(max)

maximum gain of AGC
circuit

AGC DAC input
code = ≥319 (9-bit control)

− 33.5 − dB

V

AGCOUT

AGC output amplifier black
level voltage

− 1.1 − V

V

inflex(p-p)

voltage at soft clipper
inflexion point
(peak-to-peak value)

soft clipper 4-bit control
DAC input code = 00

− 40%
V

AGCOUT(p-p)

− V

soft clipper 4-bit control
DAC input code = 15

− 100%
V

AGCOUT(p-p)

− V

CR

sc

soft clipper compression
ratio

V

i(sc)<Vinflex

− 1.0 −

V

i(sc)>Vinflex

− 0.66 −

CLAMPS

g

mADC

ADC clamps
transconductance

at clamp level − 60 − mS

g

mPBK

PBK clamp
transconductance

at clamp level − 60 − mS

g

mCDS

CDS clamps
transconductance

at clamp level − 5.5 − mS

V

PBIN(clamp)

clamp voltage
at PBIN input

− 1.4 − V

Analog-to-Digital Converter; ADC

f

CLK(max)

maximum clock frequency 18 −−MHz

t

CPH

clock pulse width HIGH 15 −−ns

t

CPL

clock pulse width LOW 15 −−ns

SR

CLK

clock input slew rate
(rising and falling edge)

10 to 90% 0.5 −−V/ns

V

i(ADC)(p-p)

ADC input voltage level
(peak-to-peak value)

− 1.8 − V

V

RB

ADC reference voltage
output code 0

− 1.4 − V

V

RT

ADC reference voltage
output code 1023

− 3.2 − V

I

ADCIN

input current pin 10 −2 − +2 µA

ILE integral linearity error f

CLK

= 18 MHz; ramp input −±1.0 ±2.0 LSB

DLE differential linearity error f

CLK

= 18 MHz; ramp input −±0.4 ±0.75 LSB

t

d(s)

sampling delay time −−5ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Nov 17 10

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Total chain timing (CDS + ADC + SOFT CLIPPER + PRE BLANKING + ADC)

t

d

time delay between
CDSP1 and CLK

50% at rising edges of
CLK and CDSP1:
transition full-scale code 0
to code 1023;
V

i(CDS)(p-p)

= 1200 mV

− 40 − ns

N

(rms)

noise (RMS value) gain = 3.5 dB − 0.5 − LSB

Digital-to-Analog Converters (OFDOUT DAC)

V

OFDOUT(p-p)

additional 8-bit control
DAC (OFD) output voltage
(peak-to-peak value)

− 1.4 − V

V

OFDOUT(0)

DC output voltage for
code 0

− 2.0 − V

V

OFDOUT(255)

DC output voltage for
code 255

− 3.4 − V

Z

OFDOUT

additional 8-bit control
DAC (OFD) output
impedance

− 2000 −Ω

I

OFDOUT

OFD output current drive static −−50 µA
ADC clamp control DAC (see Fig.5)
V

DACOUT(p-p)

ADC clamp 10-bit control

DAC output voltage

(peak-to-peak value)

− 0.9 − V

V

DACOUT

DC output voltage code 0 − 1.4 − V

code 1023 − 2.3 − V

Z

DACOUT

ADC clamp control DAC

output impedance

−−250 Ω

I

DACOUT

DAC output current drive static −−50 µA
OFE

LOOP

maximum offset error of

DAC + ADC clamp loop

code 0 −± 5 − LSB
code 1023 −±5−LSB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Nov 17 11

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Digital outputs (f

CLK

= 18 MHz; CL=20pF)

V

OH

HIGH-level output voltage IOH= −1mA V

CCO

− 0.5 − V

CCO

V

V

OL

LOW-level output voltage IOL= 1 mA 0 − 0.5 V
I

OZ

output current in 3-state

mode

0.5 V < Vo< V

CCO

−20 − +20 µA

t

o(h)

output hold time 5 −−ns
t

o(d)

output delay Ci= 20 pF; V

CCO

= 4.75 V − 12 15 ns

C

i

= 20 pF; V

CCO

= 3.15 V − 17 20 ns

C

i

= 20 pF; V

CCO

= 2.7 V − 21 24 ns

Serial interface

f

SCLK(max)

maximum frequency of

serial interface

5 −−MHz

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Fig.3 AGC gain as a function of DAC input code.

handbook, halfpage

MGE365

G

AGC

(dB)

33.5

3.5
0 319

511

AGC control DAC input code

1997 Nov 17 12

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

handbook, full pagewidth

MGE364

AGCOUT

100%

40%

40%

control DAC

input code = 15

control DAC

input code = 00

100% 130%

soft clipper input

0

(1)

(2)

0

Fig.4 Soft clipper output voltage as a function of soft clipper input voltage.

(1)

(2)

V

o

V

i

------

1=

V

o

V

i

------

0.66=

Fig.5 DAC voltage output as a function of DAC input code.

handbook, halfpage

MGE366

0

ADC CLAMP DAC

voltage

output

(V)

2.3

1.4
1023

ADC CLAMP control DAC input code

handbook, halfpage

MGD599

0

OFD DAC

voltage

output

(V)

3.4

2.0
255

OFD control DAC input code

1997 Nov 17 13

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.6 CCD high band control signal timing (TDA8786).

handbook, full pagewidth

MGE370

>12 ns

>12 ns

CDSP1

CDSP2

8 × f

SC

= 2f

CLK

Fig.7 CCD normal band control signal timing (TDA8786).

handbook, full pagewidth

MGE369

>12 ns

>12 ns

CDSP1

CDSP2

8 × f

SC

= 3f

CLK

1997 Nov 17 14

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.8 CCD high band control signal timing (TDA8786A).

handbook, full pagewidth

MGE371

>12 ns

>12 ns

CDSP1

CDSP2

8 × f

SC

= 2f

CLK

Fig.9 CCD normal band control signal timing (TDA8786A).

handbook, full pagewidth

MGE372

8 × f

SC

= 3f

CLK

CDSP1

CDSP2

>12 ns

>12 ns

1997 Nov 17 15

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.10 Typical PBK clamp current.

handbook, halfpage

MBK058

450

0

−450

I

PBIN

(µA)

V

PBIN

(V)

30 mV

1.4

Fig.11 Typical clamp currents for pins IN1, IN2 and

STGE.

handbook, halfpage

MBK057

350

0

−350

I

(µA)

V (V)

200 mV

2.85

Fig.12 Typical ADC clamp current.

handbook, halfpage

MBK059

450

slope = 1 kΩ

0

−450

I

ADCIN

(µA)

V

ADCIN

(V)

500 mV

30 mV

V

ref

ADC clamping

When pin CLPADC is HIGH (TDA8786) (LOW for
TDA8786A), the ADC input is clamped to voltage level V

ref

.

V

ref

should normally be connected to VRB (ADC reference
voltage code 0) or to DACOUT (10-bit DAC output).
The DAC is controlled via the serial interface, its output
covers the lower half of the ADC input range.

1997 Nov 17 16

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.13 Serial interface block diagram.

handbook, full pagewidth

OFD

LATCHES

AGC GAIN
LATCHES

SOFT CLIP

LATCHES

PARTIAL

STANDBY

CLAMP

REFERENCE

LATCHES

LATCH

SELECTION

D0
LSB MSB

SDATA

SCLK

SEN

8-bit DAC 10-bit DAC

MGD526

AGC control soft clip

control

standby

control

D1 D2 D3 D4 D510D6

SHIFT REGISTER

D7 D8 D9 A0 A1 A2

8
(D7 to D0)

9
(D8 to D0)

4
(D3 to D0)

4
(D3 to D0)

10
(D9 to D0)

Fig.14 Loading sequence of control DACs input data via the serial interface.

tsu= 4ns (min.); t

hd3=thd4

= 4ns (min.).

handbook, full pagewidth

MGE373

A2SDATA

SCLK

SEN

A1 A0 D9 D7 D6 D5 D4 D3

MSB LSB

D2 D1 D0

t

hd3

t

su3

t

su1

t

hd4

t

su2

D8

1997 Nov 17 17

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Table 1 Serial interface programming (see note 1)

Note

1. At the end of each programming sequence (usually during the video vertical blanking), the soft clipper register must
be reloaded (for example if the soft clipper is not used, code 15 must be entered in the soft clipper register at the end
of each TDA8786(A) programming sequence).

Table 2 Standby selection

ADDRESS BITS

DATA BITS D9 to D0

A2 A1 A0

0 0 0 OFDOUT output control (D7 to D0).
0 0 1 Soft clipper control. Only the 4 LSBs (D3 to D0) are used. Bits D9 to D4 should be set to

logic 0.
0 1 0 AGC gain control (D8 to D0).
0 1 1 Partial standby controls for power consumption optimization. Only the 4 LSBs (D3 to D0)

are used. Bits D9 to D4 should be set to logic 0:

D0 = 1: CDS + AGC + soft clipper block in standby; I

CCA+ICCD

=48mA

D1 = 1: optical black clamp + blanking block in standby; I

CCA+ICCD

=92mA

D2 = 1: OFD DAC in standby; I

CCA+ICCD

=98mA

D3 = 1: 6 dB amplifier (output on AMPOUT pin) in standby; I

CCA+ICCD

= 98.5 mA.

1 0 0 Clamp reference DAC (D9 to D0).

STDBY D9 to D0 I

CCA+ICCD

1 LOW 4 mA (typ.)
0 active 99 mA (typ.)

1997 Nov 17 18

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.15 Pixel frequency timing diagram.

The hatched areas represent active video.

handbook, full pagewidth

MGE367

IN1 and IN2

CDSP1
(active HIGH)

CDSP2
(active HIGH)

DATA
OUTPUT
D0 to D7

CLK

PIXEL N − 4 PIXEL N − 3 PIXEL N − 2 PIXEL N − 1

PIXEL

N

PIXEL

N + 1

PIXEL

N + 2

PIXEL

N + 3

PIXEL

N + 4

PIXEL N

t

d (OUT)

sample N

t

h

t

d

t

hd2

t

hd1

Fig.16 Line frequency timing diagram.

handbook, full pagewidth

MGE368

CLPCDS
(active HIGH)

CLPADC
(active HIGH)

CLPOPB
(active HIGH)

PBK
(active HIGH)

PRE­BLANKING
OUTPUT

AGCOUT VIDEO OPTICAL BLACK HORIZONTAL FLYBACK DUMMY VIDEO

VIDEO BLACK LEVEL VIDEO

1997 Nov 17 19

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

APPLICATION INFORMATION

TDA8786 and SAA8110 can be used with Sharp CCDs. TDA8786A and SAA8110 can be used with Sony CCDs. Table 3
gives as an example some references of ICs which may be used with Philips TDA8786(A)/SAA8110. This overview is
not restrictive, both devices are compatible with other CCD/V-driver/PPG combinations including the more recent ones.

Table 3 Possible components for the application of Figs 17 and 18

Notes to the application diagram

1. In the configuration of Figs 17 and 18, the microcontroller reads and writes data from/to the DSP using the
SNERT-bus (UART mode 0). Optional external control is available via the I2C-bus.

2. Free I/O pins of the microcontroller can be used to control PGG, or for other purposes.

3. 83Cxxx processing is synchronized by VD interruption. Depending on VD polarity, it can be necessary to invert VD.

4. A customized 83Cxxx is available for this application. Please contact your nearest Philips sales office.

CCD TYPE

COMPONENT

TYPE

NTSC PAL

MEDIUM

RESOLUTION

HIGH

RESOLUTION

MEDIUM

RESOLUTION

HIGH

RESOLUTION

Sony CCDs CCD LZ2313H5 LZ2353A LZ2323H5 LZ2363

V-driver LR36683N
timing generator LZ95G55 LZ95G71 LZ95G55 LZ95G71

Sharp CCDs CCD ICX056AK ICX068AK ICX057AK ICXo69AK

V-driver CXD1250MN, CXD1267N
timing generator CXD1257AR CXD1265R CXD1257AR CXD1265R

1997 Nov 17 20

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.17 SAA8110G system configuration for camera application (continued in Fig.18).

handbook, full pagewidth

P0 (optional, PPG setting)
P1 (optional, PPG settings)
CDAC

OUT

(optional, can be used for frequency tuning)
CLK1 (to ADC and DSP)
CLK2 (to DSP, CLK2 = 2 × CLK1)
CDSPULSE1
CDSPULSE2
CLAMPCDS (CLAMP CDS, OPB, ADC can be the same)
CLAMPOPB
CLAMPADC
PreBlank (optional)
HD (to DSP and µC)
VD (to DSP and µC)
FI (to DSP and µC)

P0
P1

CDAC

OUT

CLK1

CLK2
CDSPULSE1
CDSPULSE2

CLAMPCDS
CLAMPOPB
CLAMPADC

PreBlank

Horizontal Drive

Vertical Drive

Field Id

V4 V3 V2 V1 H1

VERTICAL DRIVER

(PPG)

H2

V4 V3 V2 V1 H1 H2

Electrical

Shutter

Reset
Pulse

OGND
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0

100

nF

1 nF

1nF1nF2.2

nF

200

nF

DGND1

36
35
34
33
32
31
30
29
28
27
26
25

CLPOPB

CLK1

100 nF

100 nF

100 nF

100 nF

100 nF

OEN (optional)
(from microcontroller)

100 nF

V

DDD

V

DDD

CLAMPCDS
CDSPULSE1
CDSPULSE2

PBK

CLAMPOPB
PreBlank

OFDOUT
AMPOUT

AMPOUT

AGND1

V

CCA1

AGCOUT

PBIN

PBOUT

ADCIN

CLPADC

V

ref

1
2
3
4
5
6
7
8
9
10
11
12

TDA8786G

or

TDA8786AG

ANALOG-TO-DIGITAL INTERFACE

AGND3

IN2

IN1

V

CCA3

V

CCD2

CDSP2

CDSP1

CLPCDS

DGND2

V

CCO

OE

CLK

DACOUT

AGND2

V

CCA2

V

RB

SEN

V

RT

DEC1

STGE

SCLK

V

CCD1

STBY

SDATA

13 14 15 16 2217 18 19 21 242320

48 47

220 nF

220 nF

CLAMPADC

(from PPG)

46 45 3944 43 42 40 373841

VERTICAL

DRIVER BUFFER

CCD

SMP_CLK
(from DSP)

V

DDD

V

DDA1

V

DDA1

V

DDA1

V

DDA1

−xxV +xxV
SWITCH MODE

POWER SUPPLIES

(optional)

CCDout

OFD level

(optional)

1 µF

A
B
C
D
E
F
G
H

I

J

K

L
M

5
6
7
8

2

VD (from PPG)

3
4
5

10 µF

4
3
2
1

SDA
SCL
PTC

V

DD

A2

100 nF

NC
WP

V

SS

6
7
8
9

4.7 µF

12 MHz

A0/SN

DA

SCL/SN

CL

HD (opt.)

FI

IN

A1/SN

RES

10
11

83C54/

83C654

(OM-XXX)

MICRO-

CONTROLLER

EPROM
PCF8598
PCF8594
PCF8582

13
14
15
16
17
18
19
20
21
22

18 pF

18 pF

V

DD

V

DDD

V

DDD

V

DDD

V

DDD

V

DDD

V

DDD

V

DDD

P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P0.4/AD4
P0.5/AD5

RESET_DSP
(to DSP)

P0.6/AD6
P0.7/AD7
EA
ALE
PSEN
P2.7/A15
P2.6/A14
P2.5/A13
P2.4/A12
P2.3/A11
P2.2/A10
P2.1/A9
P2.0/A8

44
43
42
41

OEN (optional)

(to ADC)

BC848C

40
39
38
37
36
35
33
32
31
30
29
28
27
26
25
24

P1.0
P1.1
P1.2
P1.3
P1.4

P1.5
P1.6/SCL
P1.7/SDA

RST
P3.0/RxD
P3.1/TxD

P3.2/INT0
P3.3/INT1

P3.4/T0
P3.5/T1

P3.6/WR

P3.7/RD

XTAL2
XTAL1

V

SS

5 V V

DDA1

5 V V

DDA2

5 V V

DDA3

V

DDD

4JB

3JB

2JB

1

+5 V

GND

SCL

SDA JB

10 kΩ

4.7kΩ4.7
kΩ

10 kΩ

MGK393

digital ground

analog ground

Shutter

Reset

1997 Nov 17 21

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

Fig.18 SAA8110G system configuration for camera application (continued from Fig.17).

(1) Values depend on DSP output configuration.

handbook, full pagewidth

MGK394

1

3

5

7

9

11

13

15

17

19

2

4

6

8

10

SAA8110G

DIGITAL SIGNAL PROCESSOR

12

14

16

18

20

10 nF

100 nF

100

nF

100 nF

100 nF

100 nF

SMP_CLK (to power supply)

P0

digital ground

analog ground

P1

RESET_DSP

(from µC)

21

V

DDA2

V

DDA3

V

DDA3

V

DDA3

V

DDA3

22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

68 Ω

68 Ω

68 Ω

47 kΩ

150 kΩ

38 39 40

80 79

100 nF

A1/SN

RES

A0/SN

DA

SDA

optional

SCL/SN

CL

78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61

60

58

56

54

52

50

48

46

44

42

59

57

55

53

51

49

47

45

43

41

CVBS-RCA

CVBS

V, Red

U, Blue

C

Green

Y

SVHS

3

4

1
2
3
4
5

11
12
13
14
15

6

7

8
9

10

126

7

5

V

DDD(C1)

VSYNC

IN

VD

FI

IN

FI

CCD9

CCD7

CCD5

CCD3

CCD1

V

SSD(C2)

V

DDD

V

DDD

V

SSA(CD)

CLK1

CLK1

HSYNC

IN

HD

V

SSD(C1)

V

DDD

CCD8

CCD6

CCD4

CCD2

CCD0

SCLK

CDAC

RBIAS

V

DDA(CD)

SDATA

STROBE

SMP

P0

P1

SIS

V

DDD(C2)

RESET

T2T1T0

V

SSA(OB)

OUT3

V

DDA(O3)

OUT2

V

DDA(O2)

OUT1

V

DDA(O1)

CDAC

OUT

CDAC

OUT

UV1

100 nF

100

nF

UV7

LLC

HREF

FI

OUT

V

DDD(P1)

RBIAS

V

SSA(BG)

UV2
UV3

UV4
UV5
UV6

V

SSD(P1)

V

DDD(P2)

V

DDD

V

DDD

CREF/PXQ

VSYNC

OUT

CLK2

CLK2 (from PPG)

V

DDA(BG)

DECOUPL

100 nF

100 nF

100 nF

V

DDA(DC)

X

OUT

A0/SN

DA

V

DDD(C3)

Y0

Y2

Y4

Y6

X

IN

V

SSD(C4)

SCL/SN

CL

V

SSD(C3)

SDA

A1/SN

RES

V

SSD(P2)

Y1

Y3

Y5

Y7

UV0

V

DDD

V

DDD

V

DDD

26
24
22
20
18
16

DIGITAL OUTPUT CONNECTOR

14
12
10
8
6
4
2

25
23
21
19
17
15
13

11

9
7
5
3
1

L

(1)

L

(1)

L

(1)

L

(1)

L

(1)

L

(1)

L

(1)

L

(1)

L

(1)

A
B
C
D
E
F
G
H

I
J

K

L

M

1997 Nov 17 22

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

PACKAGE OUTLINE

UNIT

A

max.

A1A2A3b

p

cE

(1)

eH

E

LL

p

Zywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

1.60

0.20

0.05

1.45

1.35

0.25

0.27

0.17

0.18

0.12

7.1

6.9

0.5

9.15

8.85

0.95

0.55

7
0

o
o

0.12 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT313-2

94-12-19
97-08-01

D

(1) (1)(1)

7.1

6.9

H

D

9.15

8.85

E

Z

0.95

0.55

D

b

p

e

E

B

12

D

H

b

p

E

H

v M

B

D

Z

D

A

Z

E

e

v M

A

1

48

37

36

25

24

13

θ

A

1

A

L

p

detail X

L

(A )

3

A

2

X

y

c

w M

w M

0 2.5 5 mm

scale

pin 1 index

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

SOT313-2

1997 Nov 17 23

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.

Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

CAUTION

Wave soldering is NOT applicable for all LQFP
packages with a pitch (e) equal or less than 0.5 mm.

If wave soldering cannot be avoided, for LQFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Nov 17 24

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1997 Nov 17 25

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

NOTES

1997 Nov 17 26

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

NOTES

1997 Nov 17 27

Philips Semiconductors Product specification

10-bit analog-to-digital interface for
CCD cameras

TDA8786; TDA8786A

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA56
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 547047/1200/03/pp28 Date of release: 1997 Nov 17 Document order number: 9397 750 02926