
Philips Semiconductors Product specification
True logarithmic amplifier TDA8780M
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
P
V
i
T
amb
T
stg
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
supply voltage −0.3 +6.0 V
input voltage all other pins referenced to ground −0.3 VP+ 0.3 V
operating ambient temperature −20 +75 °C
IC storage temperature −55 +150 °C
ESD in accordance with
“MIL STD 883C” -“Method 3015”
.
CHARACTERISTICS
V
=5V; T
P
=25°C; V
amb
= 2.5 V; Vinat fin= 10.7 MHz; Rg= 3.3 kΩ; output not loaded; unless otherwise specified.
ref
Signal values expressed as peak voltages mV (peak), µV (peak) or dBm (50 Ω).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
I
P
I
P(PD)
t
sw
supply voltage 4.5 5.0 5.5 V
supply current VP= 5.5 V; Vin=1V − 5.4 6.7 mA
= 5.0 V; Vin=1V − 4.9 6.2 mA
V
P
supply current in power-down output not loaded − 40 200 µA
R
=10kΩ−100 250 µA
L
switching time see Fig.6 − 70 −µs
Reference input (pin 8)
V
ref
R
ref
external reference voltage input 2.0 2.5 VP− 2.0 V
external reference resistance input − 40 − kΩ
Inputs (pins 1 and 20)
f
in
R
diff
input operating frequency note 1 1.0 10.7 15 MHz
differential small-signal input
Vin=10mV − 10 − kΩ
resistance
C
diff
V
in(min)
differential input capacitance − 2 − pF
input voltage level at start of
− 60 −µV
logarithmic characteristic
V
in(top)
input voltage level at top end of
− 300 − mV
logarithmic characteristic
V
in(max)
maximum input signal voltage input protection diodes not
− 1 − V
conducting
∆V
in
input voltage level spread across
over whole T
and VP range −±2.5 − dB
amb
logarithmic range
1995 Jul 25 6

Philips Semiconductors Product specification
True logarithmic amplifier TDA8780M
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
(order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1995 Jul 25 11

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SCD41 © Philips Electronics N.V. 1995
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413061/1500/02/pp16 Date of release: 1995 Jul 25
Document order number: 9397 750 00234