Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA8776A
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
Product specification
Supersedes data of 1995 May 11
File under Integrated Circuits, IC02
1996 Jun 04
Page 2
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
TDA8776A
Converter (DAC)
FEATURES
• 10-bit resolution
• Conversion rate up to 1000 MHz
• 10K/100K ECL input levels
• Internal reference voltage generator
• No deglitching circuit required
• Internal input register
• Power dissipation only 925 mW (typical)
• Internal 50 Ω output load (connected to the analog
ground)
• Very few external components required.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
V
V
EEA
EED
EEI
analog supply voltage −5.46 −5.20 −4.94 V
digital supply voltage −5.46 −5.20 −4.94 V
input stages digital supply
note 1 −5.46 −5.20 −4.94 V
voltage
I
EEA
I
EED
I
EEI
analog supply current note 1 − 108 145 mA
digital supply current note 1 − 60 85 mA
input stages digital supply
note 1 − 10 15 mA
current
V
OUT
− V
OUT
full-scale analog output voltage
notes 1 and 2; ZL=50Ω 1.7 2.0 2.5 V
(peak-to-peak value)
INL DC integral non-linearity note 3 −±0.3 ±0.5 LSB
DNL DC differential non-linearity note 3 −±0.2 ±0.45 LSB
f
clk(max)
t
S1
P
tot
maximum clock frequency 1000 −−MHz
settling time (differential) 10% to 90% full scale; Fig.9 − 0.5 − ns
total power dissipation − 925 − mW
APPLICATIONS
High-speed digital-to-analog conversion for:
• High resolution video and graphics
• Direct digital synthesis (DDS)
• Telecommunication
• High-speed modems.
GENERAL DESCRIPTION
The TDA8776A is a 10-bit Digital-to-Analog Converter
(DAC) for high resolution video and other high frequency
applications. It converts the digital input signal into an
analog output voltage at a maximum conversion rate of
1000 Msps. No external reference voltage is required and
all digital inputs are 10K/100K-ECL compatible.
Notes
1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and
2. The analog output voltages (V
OUT
and V
) are negative with respect to AGND (see Table 1). The external output
OUT
CLK is LOW.
resistance between AGND and each of these outputs is typically 50 Ω.
3. A warm-up time is necessary to reach optimal performances.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
TDA8776AK PLCC28 plastic leaded chip carrier; 28 leads SOT261-2
1996 Jun 04 2
Page 3
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
BLOCK DIAGRAM
D9 D8 D7 D6 D5 D4 D3 D2
22 21 20 19 18 17 16 15 14 13 12
ECL BUFFERS
COLUMN DECODER
ROW
DECODER
TDA8776A
D1 D0 IGND
DELAY
R-2R DIVIDER
TDA8776A
25
V
EEI
28
DGND2
10
AGND2
11
V
EED3
24
V
EEA
25 34 9 86 7 27
DGND1
AGND1
V
EED1VEED2
V
OUT2
V
OUT1VOUT1VOUT2
Fig.1 Block diagram.
26
MBE581
CLK CLK
1996 Jun 04 3
Page 4
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
PINNING
SYMBOL PIN DESCRIPTION
n.c. 1 not connected
DGND1 2 digital ground 1
V
EED1
V
EED2
AGND1 5 analog ground 1
V
OUT1
V
OUT2
V
OUT1
V
OUT2
AGND2 10 analog ground 2
V
EED3
IGND 12 input ground for ECL input buffers
D0 13 data input; bit 0 (LSB)
D1 14 data input; bit 1
3 digital supply voltage 1 (−5.2 V)
4 digital supply voltage 2 (−5.2 V)
6 analog voltage output 1
7 analog voltage output 2
8 complementary analog voltage
output 1
9 complementary analog voltage
output 2
11 digital supply voltage 3 (−5.2 V)
TDA8776A
SYMBOL PIN DESCRIPTION
D2 15 data input; bit 2
D3 16 data input; bit 3
D4 17 data input; bit 4
D5 18 data input; bit 5
D6 19 data input; bit 6
D7 20 data input; bit 7
D8 21 data input; bit 8
D9 22 data input; bit 9 (MSB)
n.c. 23 not connected
V
EEA
V
EEI
CLK 26 complementary clock input
CLK 27 clock input
DGND2 28 digital ground 2
24 analog supply voltage (−5.2 V)
25 input supply voltage for ECL input
buffers (−5.2 V)
AGND1
V
OUT1
V
OUT2
V
OUT1
V
OUT2
AGND2
V
EED3
EED2VEED1
V
4
3
2
5
6
7
8
9
10
11
12
IGND
TDA8776A
13
14
D0
Fig.2 Pin configuration.
n.c.
DGND1
DGND2
1
28
15
16
D1D2D3
CLK
27
17
D4
CLK
26
18
D5
25
24
23
22
21
20
19
MBE582
V
V
n.c.
D9
D8
D7
D6
EEI
EEA
1996 Jun 04 4
Page 5
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
TDA8776A
Converter (DAC)
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
EEA
V
EED
V
EEI
V
− V
EEA
EED
AGND − DGND ground voltage differential −0.1 +0.1 V
V
I
I
OUT/IOUT
T
stg
T
amb
T
j
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
analog supply voltage −7.0 ±0.3 V
digital supply voltage −7.0 ±0.3 V
input stages digital supply voltage −7.0 ±0.3 V
supply voltage differential −0.5 +0.5 V
input voltage V
EEI
±0.3 V
total output current ZL=50Ω−5 +50 mA
storage temperature −55 +150 °C
operating ambient temperature 0 70 °C
junction temperature − 150 °C
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 55 (typ.) K/W
1996 Jun 04 5
Page 6
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
TDA8776A
Converter (DAC)
CHARACTERISTICS
V
EEA=V24
V
EEI=V25
shorted together; V
V
EEA=VEED
Supply
V
EEA
V
EED
V
EEI
I
EEA
I
EED
I
EEI
AGND − DGND ground voltage differential −0.1 − +0.1 V
Inputs
D
IGITAL INPUTS (D9 TO D0) AND CLOCK INPUTS (CLK AND CLK)
V
IL
V
IH
I
IL
I
IH
f
clk(max)
Outputs (referenced to AGND); notes 1 and 2
V
OUT
Z
O
Transfer function
INL DC integral non-linearity note 3 −±0.3 ±0.5 LSB
DNL DC differential non-linearity note 3 −±0.2 ±0.45 LSB
to V5and V10= −5.46 to −4.94 V; V
to V12= −5.46 to −4.94 V; V
− V
OUT
= −5.2 V and T
= 2 V (p-p); ZL=50Ω; unless otherwise specified (typical values measured at
OUT
=25°C).
amb
EED
and V
EED=V3,V4
shorted together; T
EEI
and V11to V2and V28= −5.46 to −4.94 V;
=0to+70°C; AGND, DGND and IGND
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
analog supply voltage −5.46 −5.20 −4.94 V
digital supply voltage −5.46 −5.20 −4.94 V
input stages digital supply voltage note 1 −5.46 −5.20 −4.94 V
analog supply current note 1 − 108 145 mA
digital supply current note 1 − 60 85 mA
input stages digital supply current note 1 − 10 15 mA
LOW level input voltage −1.9 −1.8 −1.6 V
HIGH level input voltage −1.2 −0.9 −0.8 V
LOW level input current VI= −1.8 V −−10 µA
HIGH level input current VI= −0.9 V −−20 µA
maximum clock frequency 1000 −−MHz
− V
OUT(p-p)
full-scale analog output voltage
ZL=50Ω 1.7 2.0 2.5 V
(peak-to-peak value)
output impedance − 50 −Ω
Spurious free dynamic range (f
= 1000 MHz); V
clk
EEA=VEED
SFDR spurious free dynamic range
= 10 MHz −65 −69 − dB
f
OUT
f
= 50 MHz −−60 − dB
OUT
f
= 100 MHz −52 −57 − dB
OUT
= 200 MHz −−46 − dB
f
OUT
1996 Jun 04 6
= 5.2 V; T
=25°C; note 4; see Fig.3
amb
Page 7
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
TDA8776A
Converter (DAC)
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Switching characteristics (f
t
SU;DAT
t
HD;DAT
t
PD
t
S1
t
S2
t
d
data set-up time − 400 500 ps
data hold time 100 150 − ps
propagation delay time − 0.8 0.9 ns
settling time 10% to 90% full scale − 0.5 − ns
settling time change to ±1 LSB − 2.0 − ns
input to 50% output delay time − 1.4 1.5 ns
Output transients; glitches (f
E
g
differential glitch energy from code transition 511 to 512 − 12pV.s
Notes
1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW.
2. The analog output voltages (V
resistance between AGND and each of these outputs is typically 50 Ω.
3. Due to on-chip regulator behaviour a warm-up time is necessary to reach optimal performances; a typical time is
1 minute.
4. Devices with higher SFDR (min.) can be delivered on special request.
5. The worst case characteristics are obtained at the transition from input code 0 to 1023 and if an external load
impedance greater than 50 Ω is connected between V
The specified values have been measured directly on a 50 Ω load between V
impedance between V
6. The data set-up (t
SU;DAT
stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the
falling edge of the clock and still be recognized. The data hold time (t
falling edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time
indicates that the data may be released prior to the falling edge of the clock and still be recognized.
7. The definition of glitch energy and the measurement set-up are shown in Fig.10. The glitch energy is measured at
the input transition between code 511 to 512.
= 1000 MHz); notes 5 and 6; see Figs 8 and 9
clk
= 1000 MHz); note 7; see Fig.10
clk
and V
OUT
and AGND has been applied. All input data is latched at the falling edge of the clock.
OUT
) are negative with respect to AGND (see Table 1). The external output
OUT
OUT
or V
and AGND in parallel with the external 50 Ω load.
OUT
and AGND. No further load
OUT
) is the minimum period preceding the falling edge of the clock that the input data must be
) is the minimum period following the
HD;DAT
Table 1 Input coding and DAC output voltages (typical values; referenced to AGND regardless of the offset voltage)
DAC OUTPUT
CODE
BINARY INPUT DATA
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 V
VOLTAGES (V)
=50Ω
Z
L
OUT
V
OUT
0 0000000000 0 −1.0
1 0000000001−0.0010 −0.9990
. .......... . .
5121000000000−0.5 −0.5
. .......... . .
1022 1111111110−0.9990 −0.0010
1023 1111111111−1.0 0
1996 Jun 04 7
Page 8
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
80
handbook, full pagewidth
SFDR
(dB)
70
60
50
40
1
10
TDA8776A
MGD478
2
10
f (MHz)
3
10
Fig.3 Typical spurious free dynamic range (SFDR) as a function of output frequency.
20
DAC
handbook, full pagewidth
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0 100 200 300 400
f (MHz)
MGD475
500
Fig.4 Typical output spectrum; f
1996 Jun 04 8
= 1000 MHz; f
clk
OUT
= 10 MHz.
Page 9
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
20
handbook, full pagewidth
DAC
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0 100 200 300 400
TDA8776A
MGD474
f (MHz)
500
20
DAC
handbook, full pagewidth
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0 100 200 300 400
Fig.5 Typical output spectrum; f
= 1000 MHz; f
clk
OUT
= 50 MHz.
f (MHz)
MGD477
500
Fig.6 Typical output spectrum; f
1996 Jun 04 9
= 1000 MHz; f
clk
= 100 MHz.
OUT
Page 10
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
20
DAC
handbook, full pagewidth
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0 100 200 300 400
TDA8776A
MGD476
f (MHz)
500
Fig.7 Typical output spectrum; f
t
handbook, full pagewidth
input data
CLK
The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within tbf ns after the
falling edge of the clock (t
is negative; tbf ns). Data must be held at least tbf ns after the falling edge (t
SU;DAT
SU; DAT
stable
= 1000 MHz; f
clk
t
HD; DAT
= 200 MHz.
OUT
HD;DAT
MLD202
= tbfns).
0.9 V
1.35 V
1.8 V
0.9 V
1.35 V
1.8 V
Fig.8 Data set-up and hold times.
1996 Jun 04 10
Page 11
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
handbook, full pagewidth
CLK
input data
(example of a
full-scale input
transition)
code 0
1.35 V
0 V
(code 0)
V
OUT
TDA8776A
1.35 V
code 1023
1 LSB
10 %
t
d
t
S1
t
PD
t
S2
50 %
90 %
1.0 V
(code 1023)
1 LSB
MLD203
Fig.9 Switching characteristics.
1996 Jun 04 11
Page 12
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
HP80000
f
V
OUT
DATA
GENERATOR
V
OUT
clk /10
(2)
f
clk /10
(1)
f
clk
(3)
code 511
D9 MSB
D8
D7
D6
TDA8776A
D5
D4
D3
D2
D1
D0 (LSB)
PULSE
GENERATOR
(MASTER)
MODEL HP8133A
code 512
f
clk
time
V
V
OUT
OUT
1 LSB
clock
(3)
(1)
(2)
TEK 11801A
20 GHz
SAMPLING
SCOPE
TDA8776A
timing diagram
MBE583
The value of the glitch energy is the sum of the shaded areas measured in pV.s.
Fig.10 Glitch energy measurement.
1996 Jun 04 12
Page 13
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
INTERNAL PIN CONFIGURATIONS
IGND
handbook, 4 columns
D0 to D9
V
EEI
TDA8776A
internal reference
MLD205
handbook, halfpage
AGND
V
OUT
V
OUT
V
EEA
MLD206
bit
n
switches and
current generators
Fig.11 D9 to D0.
DGND
50 Ω50 Ω
bit
n
lumns
V
CLK
EED
CLK
MLD207
Fig.12 Analog outputs.
1996 Jun 04 13
Fig.13 CLK and CLK.
Page 14
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
APPLICATION INFORMATION
handbook, full pagewidth
50 Ω digital
input matched
lines
1µF
10 nF
10 nF
10 nF
10 nF
V
TT
50 Ω
50 Ω
50 Ω
50 Ω
(1)
C
V
D6
D7
D8
D9
n.c.
EEA2
10
nF
50 Ω
18
19
20
21
22
23
24
50 Ω digital input matched lines
10
10
nF
nF
50 Ω
D5
50 Ω
D4
17
10
nF
50 Ω
D3
16
TDA8776A
TDA8776A
10
10
nF
nF
50 Ω
D2
15
50 Ω
D1
D0
14
13
12
IGND
11
10
9
8
7
6
V
EED3
AGND2
V
OUT2
V
OUT1
V
OUT2
V
OUT1
(1)
C
OUT
OUT
50 Ω analog
output matched
lines
VEE (−5.2 V)
22 µF
12
µH
1 µF
V
EEI
25
50 Ω
10
nF
26
50 Ω clock input
matched lines
CLK
50
10
nF
27
Ω
281234
22
µF
n.c.
1
µF
DGND1
LM337T
IN
CLK
DGND2
V
EED1
ADJ
C
OUT
75
Ω
(1)
V
EED2
AGND1
5
120
Ω
(1) C = 1 µF in parallel with 10 nF in parallel with 1 nF; all three mounted close to the supply pin of the DAC with 1 nF the nearest.
Fig.14 Application diagram.
1996 Jun 04 14
1
µF
VTT (−2 V)
22
µF
MGD480
Page 15
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
PACKAGE OUTLINE
PLCC28: plastic leaded chip carrier; 28 leads
e
y
25
26
28
1
pin 1 index
4
β
k
511
E
X
19
e
Z
D
D
H
D
TDA8776A
SOT261-2
e
E
A
Z
E
18
H
E
E
e
12
k
1
v M
A
A
A
1
A
4
B
v M
B
w M
detail X
b
p
b
1
(A )
3
L
p
0 5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
mm
inches
A
1
min. max. max. max. max.
4.57
0.51
4.19
0.180
0.020
0.165
A
0.25
0.01
A
4
3
3.05
0.12
b
0.53
0.33
0.021
0.013
b
p
1
0.81
0.66
0.032
0.026
(1)
D
11.58
11.43
0.456
0.450
(1)
E
eH
11.58
1.27
11.43
0.456
0.05
0.450
e
10.92
9.91
0.430
0.390
e
E
D
12.57
10.92
12.32
9.91
0.495
0.430
0.485
0.390
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT261-2
1996 Jun 04 15
H
E
D
12.57
12.32
0.495
0.485
k
1.22
1.07
0.048
0.042
k
0.51
0.020
1
0.057
0.040
L
p
1.44
1.02
EUROPEAN
PROJECTION
(1) (1)
Z
Z
E
D
ywv β
0.18 0.100.18
0.007 0.0040.007
2.16
0.085
2.16
0.085
o
45
ISSUE DATE
92-11-17
95-02-25
Page 16
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
SOLDERING PLCC
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
cases reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook2
(order code 9398 65290011).
Reflow soldering
Reflow soldering techniques are suitable for all PLCC
packages.
The choice of heating method may be influenced by larger
plastic packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our
Reference Manual”
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
(order code 9398 510 63011).
”
“Quality
TDA8776A
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration:
45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds at 270 to 320 °C
1996 Jun 04 16
Page 17
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
TDA8776A
Converter (DAC)
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 04 17
Page 18
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
NOTES
1996 Jun 04 18
Page 19
Philips Semiconductors Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
NOTES
1996 Jun 04 19
Page 20
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 805 4455, Fax. +61 2 805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 52 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 648 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 83749, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 926 5361, Fax. +7 095 564 8323
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970),
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996 SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 537021/1200/02/pp20 Date of release: 1996 Jun 04 Document order number: 9397 750 00888
Internet: http://www.semiconductors.philips.com/ps/
(1) ADDRESS CONTENT SOURCE April 2, 1998
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