Datasheet tda8775 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8775

Triple 10-bit video Digital-to-Analog
Converter (DAC)

Preliminary specification
File under Integrated Circuits, IC02

1996 Aug 14

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

FEATURES

• 10-bit resolution

• Sampling rate up to:

– 50 MHz for normal mode; RL= 37.5 Ω
– 35 MHz for LOW power mode; RL= 150 Ω

• Internal current reference

• Current reference selector for:

– normal mode, RL= 37.5 Ω (typ.)
– low-power mode, RL= 150 Ω (typ.)

• No deglitching circuit required
SYNC and BLANK control inputs

•

• 0.66 V output voltage range on red and blue channels

• 1 V output voltage range on green channel

(including sync)

• BLANK control input on the 3 channels

• + 5 V power supply.

TDA8775

APPLICATIONS

• General purpose high-speed digital-to-analog
conversion

• Digital TV

• Graphic display

• Desktop video processing.

GENERAL DESCRIPTION

The TDA8775 consists of three 10-bit video
Digital-to-Analog Converters (DACs). They convert the
digital input signals into current outputs at a maximum
conversion rate of 50 MHz.

The DACs are based on current source architecture with
selectable current reference.

The devices are fabricated in a 5 V CMOS process that
ensures high functionality with low power dissipation.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
V
I

DDA

I

DDD

DDA
DDD

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current SLT = 1; RL= 37.5 Ω−67 tbf mA

SLT = 0; R

= 150 Ω−16 tbf mA

L

digital supply current SLT = 1; RL= 37.5 Ω−15 tbf mA

SLT = 0; R

= 150 Ω−10 tbf mA

L

INL DC integral non-linearity −±1±2 LSB
DNL DC differential non-linearity −±0.7 ±1.0 LSB
f

clk(max)

P

tot

maximum clock frequency SLT = 1; RL= 37.5 Ω 50 −−MHz

SLT = 0; R

total power dissipation SLT = 1; RL= 37.5 Ω;

f

=50MHz

clk

SLT = 0; R
f

=35MHz

clk

= 150 Ω 35 −−MHz

L

− 410 tbf mW

= 150 Ω;

L

− 130 tbf mW

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8775G LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2

1996 Aug 14 2

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

BLOCK DIAGRAM

V

handbook, full pagewidth

red

digital inputs

(bits R0 to R3)

red

digital inputs

(bits R4 to R9)

green

digital inputs

(bits G0 to G3)

DDA1VDDA2VDDA3

10-7

TDA8775

6-1

24-21

TDA8775

V

DDD1

4

LSB

DECODER

6

MSB

DECODER

CURRENT

SOURCE

4

V

DDD2

11454138

37

25

CLK

46

OUTR

green

digital inputs

(bits G4 to G9)

blue

digital inputs

(bits B0 to B3)

blue

digital inputs

(bits B4 to B9)

BLANK

control input

SYNC

control input

20-15

35-32

31-26

14
13

6

6

CONTROL

REGISTER

LSB

DECODER

MSB

DECODER

MSB

DECODER

48 39 12 36

SLT reference current

CURRENT

SOURCE

4

LSB

DECODER

CURRENT

SOURCE

CURRENT

REFERENCE

decoupling input

(I

)

ref

V

SSD1VSSD2

44

OUTG

47

VSSA3

43

VSSA2

40

VSSA1

42

OUTB

MGE965

Fig.1 Block diagram.

1996 Aug 14 3

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

PINNING

SYMBOL PIN DESCRIPTION

R9 1 red digital input data; bit 9 (MSB)
R8 2 red digital input data; bit 8
R7 3 red digital input data; bit 7
R6 4 red digital input data; bit 6
R5 5 red digital input data; bit 5
R4 6 red digital input data; bit 4
R3 7 red digital input data; bit 3
R2 8 red digital input data; bit 2
R1 9 red digital input data; bit 1
R0 10 red digital input data; bit 0 (LSB)
V

DDD1

V

SSD1

SYNC 13 composite sync control input; for green channel only (active LOW)
BLANK 14 composite blank control input (active LOW)
G9 15 green digital input data; bit 9 (MSB)
G8 16 green digital input data; bit 8
G7 17 green digital input data; bit 7
G6 18 green digital input data; bit 6
G5 19 green digital input data; bit 5
G4 20 green digital input data; bit 4
G3 21 green digital input data; bit 3
G2 22 green digital input data; bit 2
G1 23 green digital input data; bit 1
G0 24 green digital input data; bit 0 (LSB)
CLK 25 clock input
B9 26 blue digital input data; bit 9 (MSB)
B8 27 blue digital input data; bit 8
B7 28 blue digital input data; bit 7
B6 29 blue digital input data; bit 6
B5 30 blue digital input data; bit 5
B4 31 blue digital input data; bit 4
B3 32 blue digital input data; bit 3
B2 33 blue digital input data; bit 2
B1 34 blue digital input data; bit 1
B0 35 blue digital input data; bit 0 (LSB)
V

SSD2

V

DDD2

V

DDA1

I

ref

V

SSA1

11 digital supply voltage 1
12 digital supply ground 1

36 digital supply ground 2
37 digital supply voltage 2
38 analog supply voltage 1
39 decoupling pin for reference current
40 analog supply ground 1

TDA8775

1996 Aug 14 4

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

SYMBOL PIN DESCRIPTION

V

DDA2

OUTB 42 blue analog output
V

SSA2

OUTG 44 green analog output
V

DDA3

OUTR 46 red analog output
V

SSA3

SLT 48 mode selection; normal mode, R

41 analog supply voltage 2

43 analog supply ground 2

45 analog supply voltage 3

47 analog supply ground 3

RL= 150 Ω (active LOW)

= 37.5 Ω (active HIGH); low power mode,

L

TDA8775

handbook, full pagewidth

V

DDD1

V

SSD1

R9
R8
R7
R6
R5
R4
R3
R2
R1
R0

SSA2

43

18
G6

OUTB
42

19

G5

DDA2

V

41

20

G4

V

40

21

V
47

14

BLANK

46

15

G9

V
45

16

G8

OUTG

V

44

TDA8775

17

G7

SLT
48

1
2
3
4
5
6
7
8

9
10
11
12

13

SYNC

DDA3

SSA3

OUTR

SSA1

G3

I

ref

39

22
G2

DDA1

V

38

23

G1

DDD2

V

24 37
G0

36
35
34
33
32
31
30
29
28
27
26
25

MGE964

V

SSD2

B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
CLK

Fig.2 Pin configuration.

1996 Aug 14 5

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog

TDA8775

Converter (DAC)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDA

V

DDD

∆V

DD

T

stg

T

amb

T

j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE (TYP.) UNIT

R

th j-a

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

analog supply voltage −0.5 +6.5 V
digital supply voltage −0.5 +6.5 V
supply voltage difference between V

DDA

and V

DDD

−1.0 +1.0 V
storage temperature −55 +150 °C
operating ambient temperature 0 70 °C
junction temperature − 125 °C

thermal resistance from junction to ambient in free air 72 K/W

CHARACTERISTICS

TDA8775 operating at 50 MHz; SLT = 1 and R
V

DDA=VDDD

values measured at V

= 4.5 to 5.5 V; V

DDA=VDDD

and V

SSA

= 5 V and T

SSD

= 37.5 Ω.

L

shorted together; V

=25°C; unless otherwise specified.

amb

DDA

− V

DDD

= −0.5 to +0.5 V; T

= 0 to +70 °C; typical

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V
V
I

DDA

I

DDD

DDA
DDD

analog supply voltage 4.5 5.0 5.5 V
digital supply voltage 4.5 5.0 5.5 V
analog supply current SLT = 1; RL= 37.5 Ω−67 tbf mA

SLT = 0; R

= 150 Ω−16 tbf mA

L

digital supply current SLT = 1; RL= 37.5 Ω−15 tbf mA

SLT = 0; R

= 150 Ω−10 tbf mA

L

Inputs

LOCK INPUT (PIN 25)

C
V

IL

V

IH

LOW level input voltage V

− 0.5 − 0.8 V

SSD

HIGH level input voltage 2.0 − V

DDD

+ 0.5 V
BLANK AND SYNC INPUTS (PINS 13 AND 14; ACTIVE LOW)
V

IL

V

IH

LOW level input voltage V
HIGH level input voltage 2.0 − V

− 0.5 − 0.8 V

SSD

DDD

+ 0.5 V
R, G AND B DIGITAL INPUTS (PINS 1 TO 10, 15 TO 24 AND 26 TO 35)
V

IL

V

IH

LOW level input voltage V
HIGH level input voltage 2.0 − V

− 0.5 − 0.8 V

SSD

DDD

+ 0.5 V

1996 Aug 14 6

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog

TDA8775

Converter (DAC)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Timing (CL= 25 pF); see Fig.4

f

clk(max)

t

CPH

t

CPL

t

r

t

f

t

SU;DAT

t

HD;DAT

Outputs

OUTB, OUTR
V

OUTmax

THD total harmonic distortion f

Z

L

maximum clock frequency SLT = 1; RL= 37.5 Ω 50 −− MHz

SLT = 0; R

= 150 Ω 35 −− MHz

L

clock pulse width HIGH 6 −− ns
clock pulse width LOW 6 −− ns
clock rise time −−4ns
clock fall time −−4ns
input data set-up time 4 −− ns
input data hold time 2.5 −− ns

AND OUTG ANALOG OUTPUTS (PINS 42, 46 AND 44, REFERENCED TO V

) FOR 37.5 Ω LOAD

SSA

maximum output voltage BLANK and SYNC active

R and B channels − 0.714 − V
G channel − 1.0 − V

= 4.43 MHz; SLT = 1;

i

f

= 50 MHz; RL= 37.5 Ω

clk

= 4.43 MHz; SLT = 0;

f

i

f

= 35 MHz; RL= 150 Ω

clk

−−52 − dB

−−50 − dB

output load impedance SLT = 1 tbf 37.5 tbf Ω

SLT = 0 tbf 150 tbf Ω

Transfer function

INL DC integral non-linearity −±1±2 LSB
DNL DC differential non-linearity −±0.7 ±1.0 LSB

α

ct

crosstalk DAC to DAC tbf −− dB

DAC to DAC matching − 1.0 tbf %
Switching characteristics; see Fig.5
t

d

input to 50% output delay

time

t

s1

settling time 10 to 90% full-scale change;

full-scale change;
SLT = 1; RL= 37.5 Ω

full-scale change;
SLT = 0; R

= 150 Ω

L

− tbf − ns

− tbf − ns

− 4 − ns

SLT = 1; RL= 37.5 Ω
10 to 90% full-scale change;

SLT = 0; R

t

s2

settling time to ±1 LSB; SLT = 1;

= 150 Ω

L

− 10 − ns

− tbf − ns

RL= 37.5 Ω
to ±1 LSB; SLT = 0;

= 150 Ω

R

L

− tbf − ns

Output transients (glitches)

V

g

area for 1 LSB change − tbf − LSB.ns

1996 Aug 14 7

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog

TDA8775

Converter (DAC)

Table 1 Input coding and DAC output currents (typical values)

DAC OUTPUT CURRENT

BINARY INPUT

(mA)

SLT = 1; RL= 37.5 Ω SLT = 0; RL= 150 Ω

SYNC BLANK DATA CODE

R, B

Channels

G Channel

0 0 XXH − 0000
1 0 XXH − 0 7.62 0 1.90
0 1 00H 0 1.44 1.44 0.36 0.36

−−−−−−

3FFH 1023 19.05 19.05 4.76 4.76

1 1 00H 0 1.44 9.05 0.36 2.26

−−−−−−

3FFH 1023 19.05 26.67 4.76 6.67

DAC OUTPUT CURRENT

(mA)

R, B

Channels

G Channel

handbook, full pagewidth

1 V660 mV

330 mV

REFERENCE

WHITE

REFERENCE

BLACK

BLANKING LEVEL

SYNC LEVEL

BLANK

SYNC

SYNC

PERIOD

GREY

SET-UP

LEVEL

(1)

(1)

SCALE

40 IRE UNITS

VIDEO PICTURE DATA

100 IRE

UNITS

MGD630

(1) Sync only on green channel.

Fig.3 Video signal diagram.

1996 Aug 14 8

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TIMING

ndbook, full pagewidth

data input

clock input

t

CPL

stable

t

HD; DAT

t

SU; DAT

Fig.4 Input timing.

t

CPH

MBB656 - 1

TDA8775

V

IH

50 %

V

IL

50 %

V

IL

handbook, full pagewidth

(1) Output level conditions, SYNC = 0; BLANK = 1.

clock input

input code
(example of a
full-scale input
data transition)

code 1023

50 %

714 mV

(code 1023)

(1)

V

o

code 0

1 LSB

10 %

t

d

t

s1

t

s2

50 %

90 %

1 LSB

MBB662 - 3

54 mV

(code 0)

Fig.5 Switching timing.

1996 Aug 14 9

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

INTERNAL PIN CIRCUITRY

handbook, full pagewidth

V

DDD

GND

V

SSD

(a) Digital inputs; pins 1 to 10, 13 to 25 and 26 to 35.
(b) I

; pin 39.

ref

(c) OUTR, OUTG and OUTB; pins 46, 44 and 42.

V

SSA

(b) (c)(a)

V

DDA

TDA8775

V

DDA

bit

n

V

SSA

bit

n

MGE967

Fig.6 Internal circuitry.

1996 Aug 14 10

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

APPLICATION INFORMATION

handbook, full pagewidth

R = 37.5 Ω or 150 Ω

+5 V

+5 V

red

input

100 nF

(1)
(2)

1

2
3
4
5
6
7
8

9
10
11
12

13 14 15 16 17 18 19 20 21 22 23 24

R

+5 V

100 nF

RR

TDA8775

22
nF

22
nF

+5 V

+5 V

3738394046 41424344454748

100 nF

36
35
34
33
32
31
30
29

28
27
26
25

TDA8775

blue
input

CLK

green input

Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on the application.
(1) R = 37.5 Ω; SLT = 1.
(2) R = 150 Ω; SLT = 0.

Fig.7 Application diagram.

1996 Aug 14 11

MGE966

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

handbook, full pagewidth

video outputs

from TDA8775

2.7
µH



75 Ω

R1

75

R2

180

Ω

pF

3.3 µH

27 pF

330 pF

330 pF

R3

TDA8775

video
output

75 Ω

MGE968

handbook, full pagewidth

att

(dB)

0

−10

−20

−30

−40

05 20

Fig.8 Example of reconstruction filter for 1 V output swing.

(1)

(2)

10 15

f (MHz)

MGE969

25

(1) R2 = 75 Ω.
(2) R2 = 0 Ω.

Fig.9 Frequency response for filter shown in Fig.8.

1996 Aug 14 12

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

PACKAGE OUTLINE

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

c

y

X

36

37

25

Z

24

E

A

TDA8775

SOT313-2

e

w M

pin 1 index

48

1

e

DIMENSIONS (mm are the original dimensions)

mm

A

A1A2A3b

max.

0.20

1.60

0.05

1.45

1.35

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

b

p

0.25

w M

D

H

D

p

0.27

0.17

12

Z

D

(1) (1)(1)

cE

D

0.18

7.1

0.12

6.9

b

p

13

v M

B

v M

0 2.5 5 mm

scale

(1)

eH

H

7.1

6.9

0.5

9.15

8.85

D

E

A

B

9.15

8.85

H

E

LLpQZywv θ

E

0.75

0.45

A

2

A

A

1

detail X

0.69

0.59

0.12 0.10.21.0

Q

(A )

3

θ

L

p

L

Z

E

D

0.95

0.55

o

7

o

0

0.95

0.55

OUTLINE
VERSION

SOT313-2

IEC JEDEC EIAJ

REFERENCES

1996 Aug 14 13

EUROPEAN

PROJECTION

ISSUE DATE

93-06-15
94-12-19

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

(order code 9398 652 90011).

TDA8775

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Aug 14 14

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog

TDA8775

Converter (DAC)

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Aug 14 15

Philips Semiconductors – a worldwide company

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20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/50/01/pp16 Date of release: 1996 Aug 14 Document order number: 9397 75001021