Datasheet TDA8771H-C2-R1, TDA8775G-C1 Datasheet (Philips)

DATA SH EET

Preliminary specification
File under Integrated Circuits, IC02

1996 Aug 14

INTEGRATED CIRCUITS

TDA8775

Triple 10-bit video Digital-to-Analog
Converter (DAC)

1996 Aug 14 2

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

FEATURES

• 10-bit resolution

• Sampling rate up to:

– 50 MHz for normal mode; RL= 37.5 Ω
– 35 MHz for LOW power mode; RL= 150 Ω

• Internal current reference

• Current reference selector for:

– normal mode, RL= 37.5 Ω (typ.)
– low-power mode, RL= 150 Ω (typ.)

• No deglitching circuit required

•

SYNC and BLANK control inputs

• 0.66 V output voltage range on red and blue channels

• 1 V output voltage range on green channel

(including sync)

• BLANK control input on the 3 channels

• + 5 V power supply.

APPLICATIONS

• General purpose high-speed digital-to-analog
conversion

• Digital TV

• Graphic display

• Desktop video processing.

GENERAL DESCRIPTION

The TDA8775 consists of three 10-bit video
Digital-to-Analog Converters (DACs). They convert the
digital input signals into current outputs at a maximum
conversion rate of 50 MHz.

The DACs are based on current source architecture with
selectable current reference.

The devices are fabricated in a 5 V CMOS process that
ensures high functionality with low power dissipation.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DDA

analog supply voltage 4.5 5.0 5.5 V

V

DDD

digital supply voltage 4.5 5.0 5.5 V

I

DDA

analog supply current SLT = 1; RL= 37.5 Ω−67 tbf mA

SLT = 0; R

L

= 150 Ω−16 tbf mA

I

DDD

digital supply current SLT = 1; RL= 37.5 Ω−15 tbf mA

SLT = 0; R

L

= 150 Ω−10 tbf mA
INL DC integral non-linearity −±1±2 LSB
DNL DC differential non-linearity −±0.7 ±1.0 LSB
f

clk(max)

maximum clock frequency SLT = 1; RL= 37.5 Ω 50 −−MHz

SLT = 0; R

L

= 150 Ω 35 −−MHz
P

tot

total power dissipation SLT = 1; RL= 37.5 Ω;

f

clk

=50MHz

− 410 tbf mW

SLT = 0; R

L

= 150 Ω;

f

clk

=35MHz

− 130 tbf mW

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8775G LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2

1996 Aug 14 3

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGE965

6

6

10-7

6-1

24-21

20-15

35-32

31-26

14
13

48 39 12 36

42

40

43

47

44

46

25

11454138

6

4

4

4

CURRENT

SOURCE

MSB

DECODER

LSB

DECODER

CURRENT

REFERENCE

CURRENT

SOURCE

MSB

DECODER

LSB

DECODER

CURRENT

SOURCE

MSB

DECODER

LSB

DECODER

CONTROL

REGISTER

V

DDA1VDDA2VDDA3

V

DDD1

37

V

DDD2

OUTB

OUTG

OUTR

VSSA1

VSSA2

VSSA3

CLK

SLT reference current

decoupling input

(I

ref

)

V

SSD1VSSD2

red

digital inputs

(bits R0 to R3)

red

digital inputs

(bits R4 to R9)

green

digital inputs

(bits G0 to G3)

green

digital inputs

(bits G4 to G9)

blue

digital inputs

(bits B0 to B3)

blue

digital inputs

(bits B4 to B9)

BLANK

control input

SYNC

control input

TDA8775

1996 Aug 14 4

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

PINNING

SYMBOL PIN DESCRIPTION

R9 1 red digital input data; bit 9 (MSB)
R8 2 red digital input data; bit 8
R7 3 red digital input data; bit 7
R6 4 red digital input data; bit 6
R5 5 red digital input data; bit 5
R4 6 red digital input data; bit 4
R3 7 red digital input data; bit 3
R2 8 red digital input data; bit 2
R1 9 red digital input data; bit 1
R0 10 red digital input data; bit 0 (LSB)
V

DDD1

11 digital supply voltage 1

V

SSD1

12 digital supply ground 1
SYNC 13 composite sync control input; for green channel only (active LOW)
BLANK 14 composite blank control input (active LOW)
G9 15 green digital input data; bit 9 (MSB)
G8 16 green digital input data; bit 8
G7 17 green digital input data; bit 7
G6 18 green digital input data; bit 6
G5 19 green digital input data; bit 5
G4 20 green digital input data; bit 4
G3 21 green digital input data; bit 3
G2 22 green digital input data; bit 2
G1 23 green digital input data; bit 1
G0 24 green digital input data; bit 0 (LSB)
CLK 25 clock input
B9 26 blue digital input data; bit 9 (MSB)
B8 27 blue digital input data; bit 8
B7 28 blue digital input data; bit 7
B6 29 blue digital input data; bit 6
B5 30 blue digital input data; bit 5
B4 31 blue digital input data; bit 4
B3 32 blue digital input data; bit 3
B2 33 blue digital input data; bit 2
B1 34 blue digital input data; bit 1
B0 35 blue digital input data; bit 0 (LSB)
V

SSD2

36 digital supply ground 2
V

DDD2

37 digital supply voltage 2
V

DDA1

38 analog supply voltage 1
I

ref

39 decoupling pin for reference current
V

SSA1

40 analog supply ground 1

1996 Aug 14 5

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

V

DDA2

41 analog supply voltage 2
OUTB 42 blue analog output
V

SSA2

43 analog supply ground 2
OUTG 44 green analog output
V

DDA3

45 analog supply voltage 3
OUTR 46 red analog output
V

SSA3

47 analog supply ground 3
SLT 48 mode selection; normal mode, R

L

= 37.5 Ω (active HIGH); low power mode,

RL= 150 Ω (active LOW)

SYMBOL PIN DESCRIPTION

Fig.2 Pin configuration.

handbook, full pagewidth

1
2
3
4
5
6
7
8

9
10
11

36
35
34
33
32
31
30
29
28
27
26

13

14

15

16

17

18

19

20

21

22

23

48

47

46

45

44

43

42

41

40

39

38

12

24 37

25

TDA8775

MGE964

V

SSD2

B0
B1
B2

B4
B5
B6
B7
B8
B9
CLK

R9
R8
R7
R6
R5
R4

R2
R1

V

DDD1

V

SSD1

B3

V

SSA3

OUTR

V

DDA3

OUTG

V

SSA2

OUTB

V

SSA1

I

ref

V

DDA1

V

DDD2

SLT

V

DDA2

R3

R0

G9

G8

G7

G6

G5

G4

G2

G1

G0

G3

BLANK

SYNC

1996 Aug 14 6

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

CHARACTERISTICS

TDA8775 operating at 50 MHz; SLT = 1 and R

L

= 37.5 Ω.

V

DDA=VDDD

= 4.5 to 5.5 V; V

SSA

and V

SSD

shorted together; V

DDA

− V

DDD

= −0.5 to +0.5 V; T

amb

= 0 to +70 °C; typical

values measured at V

DDA=VDDD

= 5 V and T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDA

analog supply voltage −0.5 +6.5 V

V

DDD

digital supply voltage −0.5 +6.5 V

∆V

DD

supply voltage difference between V

DDA

and V

DDD

−1.0 +1.0 V

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature 0 70 °C

T

j

junction temperature − 125 °C

SYMBOL PARAMETER VALUE (TYP.) UNIT

R

th j-a

thermal resistance from junction to ambient in free air 72 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V

DDA

analog supply voltage 4.5 5.0 5.5 V

V

DDD

digital supply voltage 4.5 5.0 5.5 V

I

DDA

analog supply current SLT = 1; RL= 37.5 Ω−67 tbf mA

SLT = 0; R

L

= 150 Ω−16 tbf mA

I

DDD

digital supply current SLT = 1; RL= 37.5 Ω−15 tbf mA

SLT = 0; R

L

= 150 Ω−10 tbf mA

Inputs

C

LOCK INPUT (PIN 25)

V

IL

LOW level input voltage V

SSD

− 0.5 − 0.8 V

V

IH

HIGH level input voltage 2.0 − V

DDD

+ 0.5 V
BLANK AND SYNC INPUTS (PINS 13 AND 14; ACTIVE LOW)
V

IL

LOW level input voltage V

SSD

− 0.5 − 0.8 V

V

IH

HIGH level input voltage 2.0 − V

DDD

+ 0.5 V
R, G AND B DIGITAL INPUTS (PINS 1 TO 10, 15 TO 24 AND 26 TO 35)
V

IL

LOW level input voltage V

SSD

− 0.5 − 0.8 V

V

IH

HIGH level input voltage 2.0 − V

DDD

+ 0.5 V

1996 Aug 14 7

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

Timing (CL= 25 pF); see Fig.4
f

clk(max)

maximum clock frequency SLT = 1; RL= 37.5 Ω 50 −− MHz

SLT = 0; R

L

= 150 Ω 35 −− MHz

t

CPH

clock pulse width HIGH 6 −− ns

t

CPL

clock pulse width LOW 6 −− ns

t

r

clock rise time −−4ns

t

f

clock fall time −−4ns

t

SU;DAT

input data set-up time 4 −− ns

t

HD;DAT

input data hold time 2.5 −− ns

Outputs

OUTB, OUTR

AND OUTG ANALOG OUTPUTS (PINS 42, 46 AND 44, REFERENCED TO V

SSA

) FOR 37.5 Ω LOAD

V

OUTmax

maximum output voltage BLANK and SYNC active

R and B channels − 0.714 − V
G channel − 1.0 − V

THD total harmonic distortion f

i

= 4.43 MHz; SLT = 1;

f

clk

= 50 MHz; RL= 37.5 Ω

−−52 − dB

f

i

= 4.43 MHz; SLT = 0;

f

clk

= 35 MHz; RL= 150 Ω

−−50 − dB

Z

L

output load impedance SLT = 1 tbf 37.5 tbf Ω

SLT = 0 tbf 150 tbf Ω

Transfer function

INL DC integral non-linearity −±1±2 LSB
DNL DC differential non-linearity −±0.7 ±1.0 LSB

α

ct

crosstalk DAC to DAC tbf −− dB

DAC to DAC matching − 1.0 tbf %
Switching characteristics; see Fig.5
t

d

input to 50% output delay

time

full-scale change;
SLT = 1; RL= 37.5 Ω

− tbf − ns

full-scale change;
SLT = 0; R

L

= 150 Ω

− tbf − ns

t

s1

settling time 10 to 90% full-scale change;

SLT = 1; RL= 37.5 Ω

− 4 − ns

10 to 90% full-scale change;
SLT = 0; R

L

= 150 Ω

− 10 − ns

t

s2

settling time to ±1 LSB; SLT = 1;

RL= 37.5 Ω

− tbf − ns

to ±1 LSB; SLT = 0;
R

L

= 150 Ω

− tbf − ns

Output transients (glitches)

V

g

area for 1 LSB change − tbf − LSB.ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Aug 14 8

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

Table 1 Input coding and DAC output currents (typical values)

BINARY INPUT

DAC OUTPUT CURRENT

(mA)

DAC OUTPUT CURRENT

(mA)

SLT = 1; RL= 37.5 Ω SLT = 0; RL= 150 Ω

SYNC BLANK DATA CODE

R, B

Channels

G Channel

R, B

Channels

G Channel

0 0 XXH − 0000
1 0 XXH − 0 7.62 0 1.90
0 1 00H 0 1.44 1.44 0.36 0.36

−−−−−−

3FFH 1023 19.05 19.05 4.76 4.76

1 1 00H 0 1.44 9.05 0.36 2.26

−−−−−−

3FFH 1023 19.05 26.67 4.76 6.67

handbook, full pagewidth

BLANK

MGD630

1 V660 mV

330 mV

SYNC

PERIOD

GREY

SCALE

SET-UP

LEVEL

VIDEO PICTURE DATA

BLANKING LEVEL

REFERENCE

BLACK

REFERENCE

WHITE

SYNC

(1)

SYNC LEVEL

(1)

100 IRE

UNITS

40 IRE UNITS

Fig.3 Video signal diagram.

(1) Sync only on green channel.

1996 Aug 14 9

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

TIMING

Fig.4 Input timing.

ndbook, full pagewidth

HD; DAT

t

data input

clock input

MBB656 - 1

SU; DAT

t

CPL

t

CPH

t

V

IH

V

IL

V

IL

50 %

50 %

stable

Fig.5 Switching timing.

handbook, full pagewidth

MBB662 - 3

clock input

code 1023

code 0

input code
(example of a
full-scale input
data transition)

10 %

50 %

90 %

1 LSB

1 LSB

t

d

s1

t

s2

t

V

o

(1)

714 mV

(code 1023)

54 mV

(code 0)

50 %

(1) Output level conditions, SYNC = 0; BLANK = 1.

1996 Aug 14 10

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

INTERNAL PIN CIRCUITRY

Fig.6 Internal circuitry.

(a) Digital inputs; pins 1 to 10, 13 to 25 and 26 to 35.
(b) I

ref

; pin 39.

(c) OUTR, OUTG and OUTB; pins 46, 44 and 42.

handbook, full pagewidth

MGE967

V

DDD

V

SSD

GND

V

DDA

V

DDA

V

SSA

V

SSA

bit

n

bit

n

(b) (c)(a)

1996 Aug 14 11

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

APPLICATION INFORMATION

Fig.7 Application diagram.

Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on the application.
(1) R = 37.5 Ω; SLT = 1.
(2) R = 150 Ω; SLT = 0.

handbook, full pagewidth

MGE966

1

(1)
(2)

2
3
4
5
6
7
8

9
10
11
12

13 14 15 16 17 18 19 20 21 22 23 24

25

26

27

28

29

30

31

32

33

34

35

36

3738394046 41424344454748

100 nF

100 nF

100 nF

22
nF

22
nF

R

+5 V

RR

red

input

green input

CLK

blue
input

+5 V

+5 V

+5 V

+5 V

TDA8775

R = 37.5 Ω or 150 Ω

1996 Aug 14 12

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

Fig.8 Example of reconstruction filter for 1 V output swing.

handbook, full pagewidth

MGE968

75 Ω

75 Ω

3.3 µH

2.7
µH

330 pF

27 pF

75

Ω

180

pF

R1

R2

R3

330 pF

video
output

video outputs

from TDA8775



Fig.9 Frequency response for filter shown in Fig.8.

handbook, full pagewidth

25

−40
05 20

MGE969

10 15

−30

−20

−10

0

att

(dB)

f (MHz)

(1)

(2)

(1) R2 = 75 Ω.
(2) R2 = 0 Ω.

1996 Aug 14 13

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

PACKAGE OUTLINE

UNIT

A

max.

A1A2A3b

p

cE

(1)

eH

E

LLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

1.60

0.20

0.05

1.45

1.35

0.25

0.27

0.17

0.18

0.12

7.1

6.9

0.5

9.15

8.85

0.69

0.59

0.95

0.55

7
0

o
o

0.12 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT313-2

93-06-15
94-12-19

D

(1) (1)(1)

7.1

6.9

H

D

9.15

8.85

E

Z

0.95

0.55

D

b

p

e

E

B

12

D

H

b

p

E

H

v M

B

D

Z

D

A

Z

E

e

v M

A

1

48

37

36

25

24

13

θ

A

1

A

L

p

Q

detail X

L

(A )

3

A

2

X

y

c

w M

w M

0 2.5 5 mm

scale

pin 1 index

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

SOT313-2

1996 Aug 14 14

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Aug 14 15

Philips Semiconductors Preliminary specification

Triple 10-bit video Digital-to-Analog
Converter (DAC)

TDA8775

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1996 SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 537021/50/01/pp16 Date of release: 1996 Aug 14 Document order number: 9397 75001021