Datasheet TDA8771AH-C1-R2, TDA8771AH-C1-R1, TDA8771AH-C1 Datasheet (Philips)

Page 1
DATA SH EET
Product specification File under Integrated Circuits, IC02
1996 Jan 25
INTEGRATED CIRCUITS
TDA8771A
Triple 8-bit video Digital-to-Analog Converter (DAC)
Page 2
1996 Jan 25 2
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
FEATURES
8-bit resolution
Sampling rate up to 35 MHz
Internal reference voltage regulator
No deglitching circuit required
Large output voltage range
1kΩ output load
Power dissipation only 200 mW
Single 5 V power supply
44-pin QFP package.
APPLICATIONS
General purpose high-speed digital-to-analog conversion
Digital TV
Graphic display
Desktop video processing.
GENERAL DESCRIPTION
The TDA8771A is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz.
The DACs are based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source.
The device is fabricated in a 5 V, CMOS process that ensures high functionality with low power dissipation.
QUICK REFERENCE DATA
Note
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DDA
analog supply voltage 4.5 5.0 5.5 V
V
DDD
digital supply voltage 4.5 5.0 5.5 V
I
DDA
analog supply current RL=1kΩ; note 1 10 33 45 mA
I
DDD
digital supply current f
clk
= 35 MHz 720mA
INL integral non-linearity f
clk
= 35 MHz; ramp input −±0.5 ±1 LSB
DNL differential non-linearity f
clk
= 35 MHz; ramp input −±0.25 ±0.5 LSB
f
clk(max)
maximum clock frequency 35 −−MHz
P
tot
total power dissipation RL=1kΩ; f
clk
= 35 MHz; note 1 45 200 360 mW
TYPE
NUMBER
P ACKAGE
NAME DESCRIPTION VERSION
TDA8771AH QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 × 10 × 1.75 mm
SOT307-2
Page 3
1996 Jan 25 3
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MBH039
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
31
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
30,29 26,25
4
24 to 21
4
BANDGAP
REFERENCE
16 to 13
4
20 to 17
4
5 to 3
4
12 to 9
4
8
34, 37, 38,41 33
36
2,42 6,28
40
44
1
clock input
7,2732,35,39,43
V
DDA DDD
V
reference
current input
RED
analog output
GREEN
analog output
BLUE
analog output
V
SSA SSD
V
reference voltage
decoupling input
not
connected
BLUE
digital inputs
(bits B4 to B7)
BLUE
digital inputs
(bits B0 to B3)
GREEN
digital inputs
(bits G4 to G7)
GREEN
digital inputs
(bits G0 to G3)
RED
digital inputs
(bits R4 to R7)
RED
digital inputs
(bits R0 to R3)
TDA8771A
(I )
REF
(V )
REF
Page 4
1996 Jan 25 4
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
PINNING
SYMBOL PIN DESCRIPTION
I
REF
1 reference current input for output buffers
V
SSA1
2 analog supply ground 1 R7 3 RED digital input data; bit 7 (MSB) R6 4 RED digital input data; bit 6 R5 5 RED digital input data; bit 5 V
SSD1
6 digital supply ground 1 V
DDD1
7 digital supply voltage 1 R4 8 RED digital input data; bit 4 R3 9 RED digital input data; bit 3 R2 10 RED digital input data; bit 2 R1 11 RED digital input data; bit 1 R0 12 RED digital input data; bit 0 (LSB) G7 13 GREEN digital input data; bit 7 (MSB) G6 14 GREEN digital input data; bit 6 G5 15 GREEN digital input data; bit 5 G4 16 GREEN digital input data; bit 4 G3 17 GREEN digital input data; bit 3 G2 18 GREEN digital input data; bit 2 G1 19 GREEN digital input data; bit 1 G0 20 GREEN digital input data; bit 0 (LSB) B7 21 BLUE digital input data; bit 7 (MSB) B6 22 BLUE digital input data; bit 6 B5 23 BLUE digital input data; bit 5 B4 24 BLUE digital input data; bit 4 B3 25 BLUE digital input data; bit 3 B2 26 BLUE digital input data; bit 2 V
DDD2
27 digital supply voltage 2
V
SSD2
28 digital supply ground 2 B1 29 BLUE digital input data; bit 1 B0 30 BLUE digital input data; bit 0 (LSB) CLK 31 clock input V
DDA1
32 analog supply voltage 1 V
REF
33 decoupling input for reference voltage n.c. 34 not connected V
DDA2
35 analog supply voltage 2 OUTB 36 BLUE analog output n.c. 37 not connected n.c. 38 not connected V
DDA3
39 analog supply voltage 3 OUTG 40 GREEN analog output
Page 5
1996 Jan 25 5
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
n.c. 41 not connected V
SSA2
42 analog supply ground 2 V
DDA4
43 analog supply voltage 4 OUTR 44 RED analog output
SYMBOL PIN DESCRIPTION
Fig.2 Pin configuration.
handbook, full pagewidth
1 2 3 4 5 6 7 8
9 10 11
33 32 31 30 29 28 27 26 25 24 23
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
index corner
TDA8771A
I
REF
V
SSA1
R7 R6 R5
R4 R3 R2 R1
B6
R0
G7
G6
G5
G4G3G2G1G0
B7
V
SSD2
V
REF
CLK
V
DDA1
V
DDD2 B2 B3 B4
V
DDA2
V
DDA4
V
DDA3
OUTR
n.c.
OUTG
V
SSA2
MBH040
V
SSD1
V
DDD1
B1
B0
B5
n.c.
n.c.
n.c.
OUTB
Page 6
1996 Jan 25 6
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
THERMAL CHARACTERISTICS
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits.
SYMBOL PARAMETER MIN. MAX. UNIT
V
DDA
analog supply voltage 0.5 +6.5 V
V
DDD
digital supply voltage 0.5 +6.5 V
V
DD
supply voltage difference between V
DDA
and V
DDD
1.0 +1.0 V
T
stg
storage temperature 55 +150 °C
T
amb
operating ambient temperature 0 +70 °C
T
j
junction temperature +125 °C
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 75 K/W
Page 7
1996 Jan 25 7
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
CHARACTERISTICS
V
DDA=VDDD
= 4.5 to 5.5 V; V
SSA
and V
SSD
shorted together; V
DDA
V
DDD
= 0.5 to +0.5 V; T
amb
= 0 to 70 °C;
typical values measured at V
DDA=VDDD
= 5 V and T
amb
=25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
DDA
analog supply voltage 4.5 5.0 5.5 V
V
DDD
digital supply voltage 4.5 5.0 5.5 V
I
DDA
analog supply current RL=1kΩ; note 1 10 33 45 mA
I
DDD
digital supply current f
clk
= 35 MHz 720mA
Inputs
C
LOCK INPUT (PIN 31)
V
IL
LOW level input voltage 0 1.2 V
V
IH
HIGH level input voltage 2.0 V
DDD
V R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21) V
IL
LOW level input voltage 0 1.2 V
V
IH
HIGH level input voltage 2.0 V
DDD
V
I
REF
REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS (PIN 1)
I
I
input current 0.6 0.7 mA Timing; see Fig.3 f
clk(max)
maximum clock frequency 35 −−MHz t
CPH
clock pulse width HIGH 8 −−ns t
CPL
clock pulse width LOW 8 −−ns t
r
clock rise time −−5ns t
f
clock fall time −−6ns t
SU;DAT
input data set-up time 4 −−ns t
HD;DAT
input data hold time 4 −−ns
Voltage reference (pin 33, referenced to V
SSA
)
V
REF
output reference voltage 1.180 1.242 1.305 V
Outputs
OUTB, OUTR, OUTG
ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO V
SSA
) FOR 1kΩLOAD; see Table 1
FSR full-scale output voltage range 2.80 2.95 3.10 V V
os
offset of analog voltage output 0.25 V V
Omax
maximum output voltage data inputs = logic 1;
note 2
2.95 3.20 3.45 V
V
Omin
minimum output voltage data inputs = logic 0;
note 2
0.05 0.25 0.45 V
THD total harmonic distortion f
i
= 4.43 MHz;
f
clk
= 35 MHz
−−44 dB
Z
L
output load impedance 0.9 1.0 1.1 k
Page 8
1996 Jan 25 8
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
Notes
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
2. VO is directly proportional to V
REF
.
Table 1 Input coding and DAC output voltages (typical values)
Transfer function (f
clk
= 35 MHz)
INL integral non-linearity ramp input 0.5 ±1 LSB DNL differential non-linearity ramp input 0.25 ±0.5 LSB
α
ct
crosstalk DAC to DAC 50 −−dB
DAC to DAC matching 1.0 2.0 % Switching characteristics (for 1 k output load); see Fig.4 t
d
input to 50% output delay time full-scale change 12 ns t
s1
settling time 10% to 90% of
full-scale change
15 ns
t
s2
settling time to ±1 LSB 50 ns
Output transients (glitches)
V
g
area for 1 LSB change 1 LSBns
BINARY INPUT DATA
(SYNC = BLANK = 0)
CODE
DAC OUTPUT VOLTAGES (V)
OUTB, OUTR, OUTG
R
L
=1k
0000 0000 0 0.262 0000 0001 1 0.273
.... .... . .
1000 0000 128 1.731
.... .... . .
1111 1110 254 3.188 1111 1111 255 3.200
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 9
1996 Jan 25 9
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
TIMING
Fig.3 Input timing.
handbook, full pagewidth
HD; DAT
t
data input
clock input
MBB656 - 1
SU; DAT
t
CPL
t
CPH
t
V
IH
V
IL
V
IL
50 %
50 %
stable
Fig.4 Switching timing.
handbook, full pagewidth
MBB662 - 3
clock input
code 1023
code 0
input code (example of a full-scale input data transition)
10 %
50 %
90 %
1 LSB
1 LSB
t
d
s1
t
s2
t
V
o
(1)
714 mV
(code 1023)
54 mV
(code 0)
50 %
Page 10
1996 Jan 25 10
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
INTERNAL CIRCUITRY
Fig.5 Internal circuitry.
1/1 page = 296 mm (Datasheet)
27 mm
MBB658 - 1
V
DDD
V
SSD
GND
(a)
V
DDA
V
SSA
(b)
DACs resistor string
V
(c)
V
DDA
V
SSA
(d)
V
DD
V
DD
V
DD
V
DDA
V
DD
GND
DDA
125
(typ.)
(a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31. (b) V
REF
; pin 33.
(c) I
REF
; pin 1.
(d) OUTR, G, B; pins 44, 40 and 36.
Page 11
1996 Jan 25 11
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
APPLICATION INFORMATION
Fig.6 Application diagram.
Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on application. See Figs 7 and 9 for example of anti-aliasing filter.
handbook, full pagewidth
MBH041
V
REF
100 nF
V
SSA
V
DDA2
CLK
B0
B1
V
SSD2
R0 G7 G6 G5 G4 G3 G2 G1 G0 B7
V
DDD1
10 nF
5 V
V
SSD1
R4
R3
R2
R1
V
DDA3
10 nF
5 V
V
SSA2
1
k
n.c.
V
DDA4
10 nF
5 V
V
SSA1
R5
R6
R7
1
2
3
4
5
6
7
8
9
10
11
44 43 42 41 40 39 38 37 36 35 34
12 13 14 15 16 17 18 19 20 21 22
33
32
31
30
29
28
27
26
25
24
23
TDA8771A
1 k
V
SSA
OUTR
V
SSA
OUTG
V
SSA
OUTB
V
SSA
V
DDA1
10 nF
5 V
V
SSA
V
SSD
V
SSA
REF
I
n.c. n.c.
10 nF
5 V
V
SSA
1
k
n.c.
V
DDD2
10 nF
5 V
V
SSD
B2
B3
B4
B5
B6
V
SSA
6.8 k
Page 12
1996 Jan 25 12
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
Fig.7 Example of anti-aliasing filter for 2.4 V output swing.
handbook, full pagewidth
MBH042
56 pF 150 pF 56 pF
820
18 pF 18 pF
12 µH 12 µH
analog video output
(R,G or B)
2.4 V (p-p)
125
OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)
TDA8771A
analog ground
180
Fig.8 Frequency response for filter shown in Fig.7.
1/2 page (Datasheet)
22 mm
01020 40
0
40
120
160
80
MSA693
30
f (MHz)
α
(dB)
Characteristics of Fig.8
Order 5; adapted CHEBYSHEV
Ripple ρ≥0.7 dB
fat−3 dB = 6.2 MHz
f
NOTCH
= 10.8 MHz.
Page 13
1996 Jan 25 13
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
Fig.9 Example of anti-aliasing filter for 1.5 V output swing.
handbook, full pagewidth
MBH043
27 pF 68 pF 27 pF
500
6.8 pF 6.8 pF
27 µH 27 µH
analog video output
(R,G or B)
1.5 V (p-p)
125
OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36)
TDA8771A
analog ground
500
Fig.10 Frequency response for filter shown in Fig.9.
1/2 page (Datasheet)
22 mm
01020 40
0
40
120
160
80
MSA694
30
f (MHz)
i
α
(dB)
Characteristics of Fig.10
Order 5; adapted CHEBYSHEV
Ripple ρ≥0.25 dB
fat−3 dB = 5.6 MHz
f
NOTCH
= 11.7 MHz.
Page 14
1996 Jan 25 14
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
PACKAGE OUTLINE
UNIT A1A2A3b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
0.25
0.05
1.85
1.65
0.25
0.40
0.20
0.25
0.14
10.1
9.9
0.8 1.3
12.9
12.3
1.2
0.8
10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2
95-02-04 97-08-01
D
(1) (1)(1)
10.1
9.9
H
D
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
Z
D
A
Z
E
e
v M
A
X
1
44
34
33 23
22
12
y
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
pin 1 index
D
H
v M
B
b
p
b
p
w M
w M
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
A
max.
2.10
Page 15
1996 Jan 25 15
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all QFP packages.
The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our
“Quality
Reference Handbook”
(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves downstream and at the side corners.
Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Page 16
1996 Jan 25 16
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 17
1996 Jan 25 17
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
NOTES
Page 18
1996 Jan 25 18
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
NOTES
Page 19
1996 Jan 25 19
Philips Semiconductors Product specification
Triple 8-bit video Digital-to-Analog Converter (DAC)
TDA8771A
NOTES
Page 20
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Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5130, Fax. (03)3740 5077
Korea: Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040)2783749, Fax. (040)2788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel.380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825
SCDS47 © Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1100/01/pp20 Date of release: 1996 Jan 25 Document order number: 9397 750 00591
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