Datasheet TDA8763AM-5-C4, TDA8763AM-5-C3, TDA8763AM-4-C4, TDA8763AM-4-C3, TDA8763AM-4-C1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1997 Feb 07
File under Integrated Circuits, IC02

1999 Jan 06

INTEGRATED CIRCUITS

TDA8763A

10-bit high-speed low-power ADC

1999 Jan 06 2

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

FEATURES

• 10-bit resolution

• Sampling rate up to 50 MHz

• DC sampling allowed

• One clock cycle conversion only

• High signal-to-noise ratio over a large analog input

frequency range (9.4 effective bits at 4.43 MHz
full-scale input at f

clk

= 40 MHz)

• No missing codes guaranteed

• In-Range (IR) CMOS output

• Levels TTL and CMOS compatible digital inputs

• 3 to 5 V CMOS digital outputs

• Low-level AC clock input signal allowed

• External reference voltage regulator

• Power dissipation only 175 mW (typical)

• Low analog input capacitance, no buffer amplifier

required

• No sample-and-hold circuit required.

APPLICATIONS

High-speed analog-to-digital conversion for:

• Video data digitizing

• Radar pulse analysis

• Transient signal analysis

• High energy physics research

•Σ∆ modulators

• Medical imaging.

GENERAL DESCRIPTION

The TDA8763A is a 10-bit high-speed low-power
analog-to-digital converter (ADC) for professional video
and other applications. It converts the analog input signal
into 10-bit binary-coded digital words at a maximum
sampling rate of 50 MHz. All digital inputs and outputs are
TTL and CMOS compatible, although a low-level sine
wave clock input signal is allowed.

The device requires an external source to drive its
reference ladder. If the application requires that the
reference is driven via internal sources the
recommendation is to use the TDA8763.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

SAMPLING

FREQUENCY (MHz)

NAME DESCRIPTION VERSION

TDA8763AM/3 SSOP28

plastic shrink small outline package; 28 leads;
body width 5.3 mm

SOT341-1 30
TDA8763AM/4 SSOP28 SOT341-1 40
TDA8763AM/5 SSOP28 SOT341-1 50

1999 Jan 06 3

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

analog supply voltage 4.75 5.0 5.25 V

V

CCD

digital supply voltage 4.75 5.0 5.25 V

V

CCO

output stages supply voltage 3.0 3.3 5.25 V

I

CCA

analog supply current − 18 24 mA

I

CCD

digital supply current − 16 21 mA

I

CCO

output stages supply current f

clk

= 40 MHz; ramp input − 12mA

INL integral non-linearity f

clk

= 40 MHz; ramp input −±0.8 ±2.0 LSB

DNL differential non-linearity f

clk

= 40 MHz; ramp input −±0.5 ±0.9 LSB

f

clk(max)

maximum clock frequency

TDA8763AM/3 30 −−MHz
TDA8763AM/4 40 −−MHz
TDA8763AM/5 50 −−MHz

P

tot

total power dissipation f

clk

= 40 MHz; ramp input − 175 247 mW

1999 Jan 06 4

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

12
DGND2

6

8

R

LAD

7

9

V

RB

V

RM

V

RT

V

I

11

V

CCD2

3

26

V

CCA

21

22

23

24

20 D4

D5

D6

D7

D8

19
18

25

2

D3

D2
17 D1
16 D0

D9

IN-RANGE LATCH

CMOS

OUTPUTS

LATCHES

ANALOG -TO - DIGITAL

CONVERTER

CLOCK DRIVER

MBG913

CMOS OUTPUT

1

CLK

10

OE

TC

TDA8763A

13

V

CCO

4
AGND

analog ground digital ground digital ground

27
DGND1

14

OGND

output ground

analog

voltage input

data outputs

LSB

MSB

28

V

CCD1

IR
output

1999 Jan 06 5

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

PINNING

SYMBOL PIN DESCRIPTION

CLK 1 clock input
TC 2 twos complement input (active LOW)
V

CCA

3 analog supply voltage (+5 V)
AGND 4 analog ground
n.c. 5 not connected
V

RB

6 reference voltage BOTTOM input
V

RM

7 reference voltage MIDDLE input
V

I

8 analog input voltage
V

RT

9 reference voltage TOP input
OE 10 output enable input (CMOS level

input, active LOW)

V

CCD2

11 digital supply voltage 2 (+5 V)
DGND2 12 digital ground 2
V

CCO

13 supply voltage for output stages

(3 to 5 V)
OGND 14 output ground
n.c. 15 not connected
D0 16 data output; bit 0 (LSB)
D1 17 data output; bit 1
D2 18 data output; bit 2
D3 19 data output; bit 3
D4 20 data output; bit 4
D5 21 data output; bit 5
D6 22 data output; bit 6
D7 23 data output; bit 7
D8 24 data output; bit 8
D9 25 data output; bit 9 (MSB)
IR 26 in range data output
DGND1 27 digital ground 1
V

CCD1

28 digital supply voltage 1 (+5 V)

Fig.2 Pin configuration.

andbook, halfpage

handbook, halfpage

1
2
3
4
5
6
7
8

9
10
11
12
13

28
27
26
25
24
23
22
21
20
19
18
17
16
1514

CLK

TC

CCA

AGND

n.c.

RB

RM

I

RT

OE

CCD2

DGND2

CCO

OGND

CCD1
DGND1
IR

D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
n.c.

V

V

V

V

V

V

V

V

TDA8763A

MBG914

1999 Jan 06 6

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. The supply voltages V

CCA

, V

CCD

and V

CCO

may have any value between −0.3 V and +7.0 V provided that the supply

voltage differences ∆VCC are respected.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CCA

analog supply voltage note 1 −0.3 +7.0 V

V

CCD

digital supply voltage note 1 −0.3 +7.0 V

V

CCO

output stages supply voltage note 1 −0.3 +7.0 V

∆V

CC

supply voltage difference

V

CCA

− V

CCD

−1.0 +1.0 V

V

CCA

− V

CCO

−1.0 +4.0 V

V

CCD

− V

CCO

−1.0 +4.0 V

V

I

input voltage referenced to AGND −0.3 +7.0 V

V

i(sw)(p-p)

AC input voltage for switching (peak-to-peak value) referenced to DGND − V

CCD

V

I

O

output current − 10 mA

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature −40 +85 °C

T

j

junction temperature − 150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 110 K/W

1999 Jan 06 7

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

CHARACTERISTICS

V

CCA=V3

to V4= 4.75 to 5.25 V; V

CCD=V11

to V12and V28to V27= 4.75 to 5.25 V; V

CCO=V13

to V14= 3.0 to 5.25 V;

AGND and DGND shorted together; T

amb

=0to+70°C; typical values measured at V

CCA=VCCD

= 5 V and

V

CCO

= 3.3 V; V

i(p-p)

= 2.0 V; CL= 15 pF and T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CCA

analog supply voltage 4.75 5.0 5.25 V

V

CCD1

digital supply voltage 1 4.75 5.0 5.25 V

V

CCD2

digital supply voltage 2 4.75 5.0 5.25 V

V

CCO

output stages supply voltage 3.0 3.3 5.25 V

∆V

CC

supply voltage difference

V

CCA

− V

CCD

−0.20 − +0.20 V

V

CCA

− V

CCO

−0.20 − +2.25 V

V

CCD

− V

CCO

−0.20 − +2.25 V

I

CCA

analog supply current − 18 24 mA

I

CCD

digital supply current − 16 21 mA

I

CCO

output stages supply current f

clk

= 40 MHz; ramp input − 12 mA

Inputs

C

LOCK INPUT CLK (REFERENCED TO DGND); note 1

V

IL

LOW-level input voltage 0 − 0.8 V

V

IH

HIGH-level input voltage 2.0 − V

CCD

V

I

IL

LOW-level input current V

clk

= 0.8 V −10+1µA

I

IH

HIGH-level input current V

clk

= 2.0 V − 210 µA

Z

i

input impedance f

clk

= 40 MHz − 2 − kΩ

C

i

input capacitance − 2 − pF
INPUTS OE AND TC (REFERENCED TO DGND); see Table 2
V

IL

LOW-level input voltage 0 − 0.8 V
V

IH

HIGH-level input voltage 2.0 − V

CCD

V

I

IL

LOW-level input current VIL= 0.8 V −1 −− µA
I

IH

HIGH-level input current VIH= 2.0 V −−1µA
V

I

(ANALOG INPUT VOLTAGE REFERENCED TO AGND)

I

IL

LOW-level input current VI=VRB= 1.3 V − 0 −µA
I

IH

HIGH-level input current VI=VRT= 3.67 V − 35 −µA
Z

i

input impedance fi= 4.43 MHz − 8 − kΩ
C

i

input capacitance − 5 − pF
Reference voltages for the resistor ladder see Table 1
V

RB

reference voltage BOTTOM 1.2 1.3 2.45 V
V

RT

reference voltage TOP 3.2 3.67 V

CCA

− 0.8 V

V

diff

differential reference voltage

VRT− V

RB

2.0 2.37 3.0 V

I

ref

reference current VRT− VRB= 2.37 V − 9.7 − mA

1999 Jan 06 8

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

R

lad

resistor ladder − 245 −Ω
TC

Rlad

temperature coefficient of the

resistor ladder

− 1860 − ppm

− 456 − mΩ/K

V

offset(B)

offset voltage BOTTOM VRT− VRB= 2.37 V; note 2 − 175 − mV
V

offset(T)

offset voltage TOP VRT− VRB= 2.37 V; note 2 − 175 − mV
V

i(p-p)

analog input voltage

(peak-to-peak value)

note 3 1.70 2.02 2.55 V

Outputs

D

IGITAL OUTPUTS D9 TO D0 AND IR (REFERENCED TO OGND)

V

OL

LOW-level output voltage IOL= 1 mA 0 − 0.5 V
V

OH

HIGH-level output voltage IOH= −1mA V

CCO

− 0.5 − V

CCO

V

I

OZ

output current in 3-state mode 0.5 V < Vo<V

CCO

−20 − +20 µA

Switching characteristics

C

LOCK INPUT CLK; see Fig.4; note 1

f

clk(max)

maximum clock frequency

TDA8763AM/3 30 −− MHz
TDA8763AM/4 40 −− MHz
TDA8763AM/5 50 −− MHz

t

CPH

clock pulse width HIGH full effective bandwidth 8.5 −− ns
t

CPL

clock pulse width LOW full effective bandwidth 5.5 −− ns

Analog signal processing

L

INEARITY

INL integral non-linearity f

clk

= 40 MHz; ramp input −±0.8 ±2.0 LSB

DNL differential non-linearity f

clk

= 40 MHz; ramp input −±0.5 ±0.9 LSB

E

offset

offset error middle code; VRB= 1.3 V;

VRT= 3.67 V

−±1−LSB

E

G

gain error (from device to

device) using external

reference voltage

VRB= 1.3 V; VRT= 3.67 V;
note 4

−±0.1 − %

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jan 06 9

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

BANDWIDTH (f

clk

= 40 MHz)

B analog bandwidth full-scale sine wave;

note 5

− 15 − MHz

75% full-scale sine wave;
note 5

− 20 − MHz

small signal at mid-scale;
V

I

= ±10 LSB at code 512;

note 5

− 350 − MHz

t

stLH

analog input settling time

LOW-to-HIGH

full-scale square wave;
see Fig.6; note 6

− 1.5 3.0 ns

t

stHL

analog input settling time

HIGH-to-LOW

full-scale square wave;
see Fig.6; note 6

− 1.5 3.0 ns

HARMONICS (f

clk

=40MHZ); see Figs 7 and 8

H

fund(FS)

fundamental harmonics

(full-scale)

fi= 4.43 MHz −−0dB

H

all(FS)

harmonics (full-scale); all

components

fi= 4.43 MHz

second harmonics −−75 −65 dB
third harmonics −−72 −65 dB

THD total harmonic distortion f

i

= 4.43 MHz −−64 − dB
SIGNAL-TO-NOISE RATIO; see Figs 7 and 8; note 7
SNR

FS

signal-to-noise ratio (full-scale) without harmonics;

f

clk

= 40 MHz;

fi= 4.43 MHz

55 58 − dB

EFFECTIVE BITS; see Figs 7 and 8; note 7
EB effective bits TDA8763AM/3;

f

clk

= 30 MHz

f

i

= 4.43 MHz − 9.4 − bits

f

i

= 7.5 MHz − 9.1 − bits

TDA8763AM/4;
f

clk

= 40 MHz

f

i

= 4.43 MHz − 9.4 − bits

f

i

= 7.5 MHz − 9.0 − bits

f

i

= 10 MHz − 8.9 − bits

f

i

= 15 MHz − 8.1 − bits

TDA8763AM/5;
f

clk

= 50 MHz

f

i

= 4.43 MHz − 9.3 − bits

f

i

= 7.5 MHz − 8.9 − bits

f

i

= 10 MHz − 8.8 − bits

f

i

= 15 MHz − 8.0 − bits

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jan 06 10

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

Notes

1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 0.5 ns.

2. Analog input voltages producing code 0 up to and including code 1023:
a) V

offset(B)

(voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00

and the reference voltage BOTTOM (VRB) at T

amb

=25°C.

b) V

offset(T)

(voltage offset TOP) is the difference between reference voltage TOP (VRT) and the analog input which

produces data outputs equal to code 1023 at T

amb

=25°C.

T

WO-TONE; note 8

TTIR two-tone intermodulation

rejection

f

clk

= 40 MHz −−69 − dB

BIT ERROR RATE
BER bit error rate f

clk

= 50 MHz;
fi= 4.43 MHz;
VI= ±16 LSB at code 512

− 10

−13

− times/

sample

DIFFERENTIAL GAIN; note 9
G

diff

differential gain f

clk

= 40 MHz;
PAL modulated ramp

− 0.8 − %

DIFFERENTIAL PHASE; note 9

ϕ

diff

differential phase f

clk

= 40 MHz;
PAL modulated ramp

− 0.4 − deg

Timing (f

clk

= 40 MHz; CL= 15 pF); see Fig.4; note 10

t

ds

sampling delay time − 3 − ns

t

h

output hold time 4 −− ns

t

d

output delay time V

CCO

= 4.75 V − 10 13 ns

V

CCO

= 3.15 V − 12 15 ns

C

L

digital output load capacitance −−15 pF
3-state output delay times; see Fig.5
t

dZH

enable HIGH − 5.5 8.5 ns
t

dZL

enable LOW − 12 15 ns
t

dHZ

disable HIGH − 19 24 ns
t

dLZ

disable LOW − 12 15 ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Jan 06 11

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

3. In order to ensure the optimum linearity performance of such converter architecture the lower and upper extremities
of the converter reference resistor ladder (corresponding to output codes 0 and 1023 respectively) are connected to
pins V

RB

and VRT via offset resistors ROB and ROT as shown in Fig.3.

a) The current flowing into the resistor ladder is and the full-scale input range at the converter,

to cover code 0 to code 1023, is

b) Since R

L

, ROB and ROT have similar behaviour with respect to process and temperature variation, the ratio

will be kept reasonably constant from device to device. Consequently variation of the output

codes at a given input voltage depends mainly on the difference V

RT

− VRB and its variation with temperature and
supply voltage. When several ADCs are connected in parallel and fed with the same reference source, the
matching between each of them is then optimized.

4.

5. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.
No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.

6. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square wave signal) in order to sample the signal and obtain correct output data.

7. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: SINAD = ENOB × 6.02 + 1.76 dB.

8. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two
input signals have the same amplitude and the total amplitude of both signals provides full-scale to the converter.

9. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a
digital-to-analog converter.

10. Output data acquisition: the output data is available after the maximum delay time of t

d(max)

. For 50 MHz version it is

recommended to have the lowest possible output load.

I

L

VRTVRB–

R

OBRLROT

++

------------------------------------------

=

V

IRLIL

×

R

L

R

OBRLROT

++

------------------------------------------

== V(

RT

× VRB– )+ 0.˙852 V(

RTVRB

)–×=

RL

ROB RL ROT++

------------------------------------------------

E

G

V

1023V0

–()V

ip p–()

–

V

ip p–()

----------------------------------------------------------- -

100×=

Fig.3 Explanation of note 3.

handbook, halfpage

R

LAD

R

OT

V

RT

V

RM

V

RB

R

OB

code 1023

code 0

MGD281

I

L

R

L

1999 Jan 06 12

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

Table 1 Output coding and input voltage (typical values; referenced to AGND, VRB= 1.3 V, VRT= 3.67 V)

Table 2 Mode selection

STEP V

i(p-p)

IR

BINARY OUTPUT BITS TWO’S COMPLEMENT OUTPUT BITS

D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

U/F <1.475 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0000000

0 1.475 1 0 0 0 0 0 0 0 0 0 0 1 0 0 0000000
1 . 100000000011000000001

. . .....................

. . .....................

1022 . 111111111100111111110
1023 3.495 1 1 1 1 1 1 1 1 1 1 1 0 1 1 1111111

O/F >3.495 0 1 1 1 1 1 1 1 1 1 1 0 1 1 1111111

TC OE D9 to D0 IR

X 1 high impedance high impedance
0 0 active; twos complement active
1 0 active; binary active

Fig.4 Timing diagram.

handbook, full pagewidth

ds

t

sample N + 1

sample N

CLK

MBG916

sample N + 2

0 V

50%

V

CCO

0 V

50%

V

CCO

V

l

DATA
D0 to D9

t

d

t

h

CPH

t

CPL

t

DATA

N + 1

DATA

N

DATA

N - 1

DATA

N - 2

1999 Jan 06 13

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

Fig.5 Timing diagram and test conditions of 3-state output delay time.

fOE= 100kHz.

handbook, full pagewidth

MGD262

50%

50%

HIGH

LOW

dZH

t

dHZ

t

50%

HIGH

LOW

dZL

t

dLZ

t

10%

90%

output
data

V

CCD

output
data

3.3 kΩ

15 pF

S1

V

CCD

TDA8763A

OE

OE

TEST

dLZ

t

dZL

t

dHZ

t

dZH

S1

CCD

V

CCD

V

DGND
DGND

t

Fig.6 Analog input settling time diagram.

MBE566

50%

STLH

t

2 ns

code 0

code 1023

I

50%

0.5 ns

50%

2 ns

STHL

t

50%

0.5 ns

CLK

V

1999 Jan 06 14

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

Fig.7 Typical Fast Fourier Transform (f

clk

= 40 MHz; fi= 4.43 MHz).

Effective bits: 9.42; THD= −71.8 dB.

Harmonic levels (dB): 2nd = −83.19; 3rd = −78.09; 4th = −78.72; 5th = −78.33; 6th = −77.55.

handbook, full pagewidth

0

−120

−140

0 2.50 5.00

MGD862

−40

−80

12.57.50 10.0 15.0 17.5 20.0
f (MHz)

−100

−20

−60

amplitude

(dB)

Fig.8 Typical Fast Fourier Transform (f

clk

= 50 MHz; fi= 10 MHz).

Effective bits: 8.91; THD = −62.96 dB.
Harmonic levels (dB): 2nd = −71.38; 3rd = −71.54; 4th = −74.14; 5th = −65.15; 6th = −77.16.

handbook, full pagewidth

0

−120

−140

0 2.50 5.00

MGD863

−40

−80

12.57.50 10.0 15.0 17.5 25.020.0 22.5
f (MHz)

−100

−20

−60

amplitude

(dB)

1999 Jan 06 15

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

INTERNAL PIN CONFIGURATIONS

Fig.9 CMOS data and in range outputs.

handbook, halfpage

MBG915

V

CCO

OGND

D9 to D0

IR

Fig.10 Analog inputs.

handbook, halfpage

MGC040 - 1

AGND

V

CCA

V

I

Fig.11 OE and TC input.

handbook, halfpage

MBE557

V

CCO

OGND

OE
TC

Fig.12 VRB, VRM and VRT.

handbook, halfpage

R

MGD232

V

RB

V

RM

V

CCA

AGND

V

RT

LAD

1999 Jan 06 16

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

Fig.13 CLK input.

handbook, halfpage

1.5 V

V

CCD

DGND

CLK

MBE559 - 1

1999 Jan 06 17

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

APPLICATION INFORMATION

Fig.14 Application diagram.

The analog and digital supplies should be separated and well decoupled.
An application note is available and describes the design and the realization of a demonstration board that uses the version TDA8768AM with an

application environment.
(1) V

RB

, VRM and VRT are decoupled to AGND.
(2) Pin 15 may be connected to DGND in order to prevent noise influence.
(3) Decoupling capacitor for supplies; must be placed close to the device.

handbook, full pagewidth

28

27

26

25

24

23

22

21

20

19

18

17

TDA8763A

DGND1

V

CCO

D3

D4

D5

D6

D7

D8

D9

D2

D1

D0

V

CCD2

V

CCA

1

2

3

4

5

6

7

8

9

10

11

12

CLK

AGND

n.c.

n.c.

V

RB

V

RM

V

RT

MBG918

16

15

13

14

100 nF

100 nF

DGND2

OGND

IR

OE

TC

V

CCD1

AGND

AGND

100 nF

AGND

V

I

(1)

(1)

(1)

(2)

100 nF

(3)

100 nF

(3)

100 nF

(3)

100 nF

(3)

1999 Jan 06 18

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

PACKAGE OUTLINE

UNIT A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

10.4

10.0

5.4

5.2

0.65 1.25

7.9

7.6

0.9

0.7

1.1

0.7

8
0

o
o

0.13 0.10.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT341-1 MO-150AH

93-09-08
95-02-04

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

114

28 15

0.25

y

pin 1 index

0 2.5 5 mm

scale

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

SOT341-1

A

max.

2.0

1999 Jan 06 19

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Jan 06 20

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Jan 06 21

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

NOTES

1999 Jan 06 22

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

NOTES

1999 Jan 06 23

Philips Semiconductors Product specification

10-bit high-speed low-power ADC TDA8763A

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1999 SCA61
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Printed in The Netherlands 545004/750/03/pp24 Date of release: 1999 Jan 06 Document order number: 9397 750 04693