Datasheet tda8762 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8762

10-bit high-speed low-power
analog-to-digital converter

Product specification
Supersedes data of 1995 Feb 15
File under Integrated Circuits, IC02

1996 Mar 28

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

FEATURES

• 10-bit resolution

• Sampling rate up to 40 MHz

• DC sampling allowed

• One clock cycle conversion only

• High signal-to-noise ratio over a large analog input

frequency range (9.4 effective bits at 4.43 MHz full-scale
input at f

• No missing codes guaranteed

• In range (IR) TTL output

• TTL compatible digital inputs and outputs

• Low-level AC clock input signal allowed

• External reference voltage regulator

• Power dissipation only 380 mW (typical)

• Low analog input capacitance, no buffer amplifier

required

• No sample-and-hold circuit required.

= 40 MHz)

clk

TDA8762

APPLICATIONS

High-speed analog-to-digital conversion for:

• Video data digitizing

• Radar pulse analysis

• Transient signal analysis

• High energy physics research

•Σ∆ modulators

• Medical imaging.

GENERAL DESCRIPTION

The TDA8762 is a 10-bit high-speed analog-to-digital
converter (ADC) for professional video and other
applications. It converts the analog input signal into 10-bit
binary-coded digital words at a maximum sampling rate of
40 MHz. All digital inputs and outputs are TTL compatible,
although a low-level sine wave clock input signal is
allowed.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

V

CCD

V

CCO

I

CCA

I

CCD

I

CCO

INL integral non-linearity f

analog supply voltage 4.75 5.0 5.25 V
digital supply voltage 4.75 5.0 5.25 V
output stages supply voltage 4.4 5.0 5.25 V
analog supply current − 29 36 mA
digital supply current − 24 30 mA
output stages supply current − 23 30 mA

= 40 MHz;

clk

−±0.75 ±1.5 LSB

ramp input

DNL differential non-linearity f

= 40 MHz;

clk

−±0.3 ±0.7 LSB

ramp input

f

clk(max)

P

tot

maximum clock frequency 40 −−MHz
total power dissipation − 380 500 mW

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA8762M/4 SSOP28 plastic shrink small outline package;

PACKAGE

SAMPLING

FREQUENCY (MHz)

SOT341-1 40

28 leads; body width 5.3 mm

1996 Mar 28 2

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

BLOCK DIAGRAM

handbook, full pagewidth

analog

voltage input

V

RT

V

V

RM

V

RB

V

CCA

3

9

R

LAD

I

8

7

6

ANALOG -TO - DIGITAL

CONVERTER

CLK

1

CLOCK DRIVER

IN RANGE LATCH

V

CCD

11

TDA8762

OE
10

TTL OUTPUTSLATCHES

TTL OUTPUT

2

25

D9

D8

24

D7

23

D6

22

D5

21
20 D4

19

D3

18

D2
17 D1
16 D0

V

13

28

V

26

TDA8762

TC

MSB

data outputs

LSB

CCO1

CCO2

IR
output

4
AGND1

analog grounds digital ground

5
AGND2

12
DGND

Fig.1 Block diagram.

1996 Mar 28 3

14
OGND1

output grounds

27
OGND2

MGC035

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

PINNING

SYMBOL PIN DESCRIPTION

CLK 1 clock input
TC 2 two’s complement input (active LOW)
V

CCA

AGND1 4 analog ground 1
AGND2 5 analog ground 2
V

RB

V

RM

V

I

V

RT

OE 10 output enable input

V

CCD

DGND 12 digital ground
V

CCO1

OGND1 14 output ground 1
n.c. 15 not connected
D0 16 data output; bit 0 (LSB)
D1 17 data output; bit 1
D2 18 data output; bit 2
D3 19 data output; bit 3
D4 20 data output; bit 4
D5 21 data output; bit 5
D6 22 data output; bit 6
D7 23 data output; bit 7
D8 24 data output; bit 8
D9 25 data output; bit 9 (MSB)
IR 26 in range data output
OGND2 27 output ground 2
V

CCO2

3 analog supply voltage (+5 V)

6 reference voltage BOTTOM input
7 reference voltage MIDDLE
8 analog input voltage
9 reference voltage TOP input

(TTL level input, active LOW)

11 digital supply voltage (+5 V)

13 supply voltage for output stages 1

(+5 V)

28 supply voltage for output stages 2

(+5 V)

handbook, halfpage

1

CLK

2

TC

V

3

CCA

V

RB

V

RM

V

RT
OE

V

CCD

DGND

CCO1

4
5
6
7

I

8

9
10
11
12
13

TDA8762

MGC036

V

AGND1
AGND2

V

OGND1

Fig.2 Pin configuration.

TDA8762

V

28

CCO2

27

OGND2
IR

26
25

D9

24

D8

23

D7

22

D6
D5

21
20

D4
D3

19
18

D2

17

D1

16

D0

1514

n.c.

1996 Mar 28 4

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CCA

V

CCD

V

CCO

∆V

V

I

V

clk(p-p)

I

O

T

stg

T

amb

T

j

CC

analog supply voltage note 1 −0.3 +7.0 V
digital supply voltage note 1 −0.3 +7.0 V
output stages supply voltage note 1 −0.3 +7.0 V
supply voltage difference

V
V
V

CCA
CCA
CCD

− V

− V

− V

CCD
CCO
CCO

−1.0 +1.0 V

−1.0 +1.0 V

−1.0 +1.0 V

input voltage referenced to AGND −0.3 +7.0 V
AC input voltage for switching

referenced to DGND − V

CCD

(peak-to-peak value)
output current − 10 mA
storage temperature −55 +150 °C
operating ambient temperature 0 +70 °C
junction temperature − +150 °C

V

Note

1. The supply voltages V

CCA

CCD

and V

may have any value between −0.3 V and +7.0 V provided that the supply

CCO

, V

voltage differences ∆VCC are respected.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 110 K/W

1996 Mar 28 5

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

CHARACTERISTICS

V

CCA=V3

V27= 4.4 to 5.25 V; AGND and DGND shorted together; T
V

CCA=VCCD=VCCO

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply

V

CCA

V

CCD

V

CCO

∆V

I

CCA

I

CCD

I

CCO

Inputs

to V4and V5= 4.75 to 5.25 V; V

=5V; V

analog supply voltage 4.75 5.0 5.25 V
digital supply voltage 4.75 5.0 5.25 V
output stages supply voltage 4.4 5.0 5.25 V

CC

voltage difference

V

− V
V
V

CCA
CCA
CCD

− V

− V

CCD
CCO
CCO

analog supply current − 29 36 mA
digital supply current − 24 30 mA
output stages supply current CL= 15 pF; ramp input − 23 30 mA

CCD=V11

= 2.0 V; CL= 15 pF and T

I(p-p)

to V12= 4.75 to 5.25 V; V

= 0 to +70 °C; typical values measured at

amb

=25°C; unless otherwise specified.

amb

CCO=V13

and V28to V14 and

−0.25 − +0.25 V

−0.4 − +0.4 V

−0.4 − +0.4 V

LOCK INPUT CLK (REFERENCED TO DGND); note 1

C
V

IL

V

IH

I

IL

I

IH

Z

I

C

I

LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V
LOW level input current V
HIGH level input current V
input impedance f
input capacitance f

clk
clk

= 40 MHz − 2 − kΩ

clk

= 40 MHz − 2 − pF

clk

INPUTS OE AND TC (REFERENCED TO DGND); see Table 2
V

IL

V

IH

I

IL

I

IH

LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V
LOW level input current VIL= 0.4 V −400 −− µA

HIGH level input current VIH= 2.7 V −−20 µA
VI(ANALOG INPUT VOLTAGE REFERENCED TO AGND)
I

IL

I

IH

Z

I

C

I

LOW level input current VI= 1.3 V − 0 −µA

HIGH level input current VI= 3.8 V − 70 −µA

input impedance fi= 4.43 MHz − 5 − kΩ

input capacitance fi= 4.43 MHz − 8 − pF

CCD

V
= 0.4 V −10 +1 µA
= 2.7 V −−20 µA

CCD

V

1996 Mar 28 6

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Reference voltages for the resistor ladder; see Table 1

V

RB

V

RT

V

diff

I

ref

R

LAD

TC

RLAD

V

osB

V

osT

V

I(p-p)

Outputs

D

IGITAL OUTPUTS D9 TO D0 AND IR (REFERENCED TO OGND)

V

OL

V

OH

I

OZ

Switching characteristics

reference voltage BOTTOM 1.2 1.3 − V
reference voltage TOP − 3.8 V
differential reference voltage

VRT− V

RB

1.8 2.5 3.0 V

CCA

− 0.8 V V

reference current − 28 − mA
resistor ladder − 90 −Ω
temperature coefficient of the resistor

ladder

− 1860 − ppm

− 167 − mΩ/K

offset voltage BOTTOM note 2 − 220 − mV
offset voltage TOP note 2 − 220 − mV
analog input voltage

note 3 1.5 2.06 2.5 V

(peak-to-peak value)

LOW level output voltage IO= 1 mA 0 − 0.4 V
HIGH level output voltage IO= 0 mA 2.7 − V

I

= −0.4 mA 2.7 − V

O

I

= −1 mA 2.4 − V

O

output current in 3-state mode 0.4 V < VO<V

CCO

−20 − +20 µA

CCO
CCO
CCO

− 0.5 V

− 1.3 V

− 1.4 V

LOCK INPUT CLK; see Fig.4; note 1

C
f

clk(max)

t

CPH

t

CPL

maximum clock frequency 40 −− MHz
clock pulse width HIGH 8 −− ns
clock pulse width LOW 8 −− ns

Analog signal processing

INEARITY

L
INL integral non-linearity f

= 40 MHz;

clk

ramp input

DNL differential non-linearity f

= 40 MHz;

clk

ramp input

OFER offset error middle code;

= 1.3 V; VRT= 3.8 V

V

RB

GER gain error (from device to device) V

= 1.3 V;

RB

VRT= 3.8 V; note 4

−±0.75 ±1.5 LSB

−±0.3 ±0.7 LSB

−±1− LSB

−±0.1 − %

1996 Mar 28 7

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

BANDWIDTH (f
B analog bandwidth full-scale sine wave;

t

STLH

t

STHL

HARMONICS (f
h

1

h

all

THD total harmonic distortion f
SIGNAL-TO-NOISE RATIO; see Fig.8; note 7
S/N signal-to-noise ratio (full scale) without harmonics;

EFFECTIVE BITS; see Figs 7, 8 and 9; note 7
EB effective bits f

TWO-TONE; note 8
TTIR two-tone intermodulation rejection f
BIT ERROR RATE
BER bit error rate f

= 40 MHz)

clk

− 40 − MHz

note 5
75% full-scale sine

− 55 − MHz

wave; note 5
small signal at

− 700 − MHz
mid-scale;
V

= ±10 LSB at

I

code 512; note 5

analog input settling time
LOW-to-HIGH

analog input settling time
HIGH-to-LOW

=40MHZ)

clk

full-scale square wave;
Fig.6; note 6

full-scale square wave;
Fig.6; note 6

− 2.0 3 ns

− 2.5 3.5 ns

fundamental harmonics (full scale) fi= 4.43 MHz −−0dB
harmonics (full scale); all components fi= 4.43 MHz

second harmonics −−70 −62 dB
third harmonics −−75 −67 dB

= 4.43 MHz −−70 − dB

i

57 59 − dB

= 40 MHz;

f

clk

fi= 4.43 MHz

= 40 MHz

clk

= 4.43 MHz − 9.4 − bits

f

i

f

= 7.5 MHz − 9.3 − bits

i

f

= 10 MHz − 9.0 − bits

i

f

= 15 MHz − 8.7 − bits

i

= 40 MHz −−70 − dB

clk

= 40 MHz;

clk

fi= 4.43 MHz;

− 10

−13

− times/

sample
VI= ±16 LSB at
code 512

1996 Mar 28 8

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

D

IFFERENTIAL GAIN; note 9

G

diff

differential gain f

DIFFERENTIAL PHASE; note 9

ϕ

diff

Timing (f

t

ds

t

h

t

d

C

L

differential phase f

= 40 MHz; CL= 15 pF); see Fig.4; note 10

clk

sampling delay time −−2ns
output hold time 5 −− ns
output delay time − 10 14 ns

digital output load − 15 40 pF
3-state output delay times; see Fig.5
t

dZH

t

dZL

t

dHZ

t

dLZ

enable HIGH − 45 50 ns

enable LOW − 25 35 ns

disable HIGH − 12 15 ns

disable LOW − 12 15 ns

Notes

1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 0.5 ns.

2. Analog input voltages producing code 0 up to and including code 1023:
a) V

(voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and

osB

the reference voltage BOTTOM (VRB) at T

b) V

(voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which

osT

produces data outputs equal to code 1023 at T

3. In order to ensure the optimum linearity performance of such converter architecture the lower and upper extremities
of the converter reference resistor ladder (corresponding to output codes 0 and 1023 respectively) are connected to
pins VRB and VRT via offset resistors ROB and ROT as shown in Fig.3.

= 40 MHz;

clk

PAL modulated ramp

= 40 MHz;

clk

PAL modulated ramp

=25°C.

amb

=25°C.

amb

− 0.5 − %

− 0.5 − deg

V

–

a) The current flowing into the resistor ladder is IL= and the full-scale input range at the converter,

to cover code 0 to code 1023, is . .

b) Since R

----------------------------------------­R

, ROB and ROT have similar behaviour with respect to process and temperature variation, the ratio

L

R

L

++

OBRLROT

will be kept reasonably constant from part to part. Consequently variation of the output codes

RLIL×

V

I

at a given input voltage depends mainly on the difference V

RTVRB

-----------------------------------------­R

++

OBRLROT

R

-----------------------------------------­R

L

++

OBRLROT

− VRB and its variation with temperature and supply

RT

V

–()0.824 VRTVRB–()×=×==

RTVRB

voltage. When several ADCs are connected in parallel and fed with the same reference source, the matching
between each of them is then optimized.

V

–()2V–

4. .

GER

1023V0

-----------------------------------------------­2V

100×=

1996 Mar 28 9

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

5. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.
No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.

6. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.

7. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.

8. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two
input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.

9. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a
digital-to-analog converter.

10. Output data acquisition: the output data is available after the maximum delay time of td.

handbook, halfpage

V

RT

R

OT

code 1023

R

L

V

RM

R

LAD

V

RB

I

L

R

OB

MGD281

code 0

Fig.3 Explanation of note 3.

1996 Mar 28 10

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

Table 1 Output coding and input voltage (typical values; referenced to AGND, VRB= 1.3 V, VRT= 3.8 V)

STEP V

I(p-p)

IR

D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

U/F <1.52 0 00000000001000000000
0 1.52 1 00000000001000000000
1 . 100000000011000000001

. . .....................

. . .....................

1022 . 111111111100111111110
1023 3.58 1 11111111110111111111
O/F >3.58 0 11111111110111111111

Table 2 Mode selection

TC OE D9 TO D0 IR

X 1 high impedance high impedance
0 0 active; two’s complement active
1 0 active; binary active

BINARY OUTPUT BITS TWO’S COMPLEMENT OUTPUT BITS

handbook, full pagewidth

CLK

V

l

DATA
D0 to D9

t

sample N

DATA

N - 2

t

CPL

CPH

sample N + 1

t

ds

DATA

N - 1

Fig.4 Timing diagram.

1.4 V

sample N + 2

t

h

DATA

N

t

d

DATA

N + 1

MGC037

2.4 V

1.4 V

0.4 V

1996 Mar 28 11

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

V

handbook, full pagewidth

CCD

OE

output
data

output
data

LOW

t

dLZ

10 %

TDA8762

OE

HIGH

TDA8762

50 %

LOW

V

S1

CCD

t

dZH

50 %

TEST

t

dLZ

t

dZL

t

dHZ

t

dZH

S1

V

CCD

V

CCD

GND
GND

MGC038

t

dHZ

HIGH

t

dZL

50 %

3.3 kΩ

15 pF

90 %

fOE= 100 kHz.

Fig.5 Timing diagram and test conditions of 3-state output delay time.

1996 Mar 28 12

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

handbook, full pagewidth

code 1023

V

code 0

CLK

MGD345

I

50 %

2 ns

t

STLH

50 %

0.5 ns

2 ns

t

STHL

50 %

50 %

TDA8762

0.5 ns

Fig.6 Analog input settling-time diagram.

handbook, full pagewidth

0

A

(dB)

20

40

60

80

100

120

0 5 7.5 10 15 17.52.5 12.5

Effective bits: 9.46; THD = −71.19 dB;
Harmonic levels (dB): 2nd = −79.70; 3rd = −72.84; 4th = −81.54; 5th = −83.93; 6th = −86.47.

MLC947

20

f (MHz)

Fig.7 Fast Fourier Transform (f

1996 Mar 28 13

= 40 MHz; fi= 4.43 MHz).

clk

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

handbook, full pagewidth

0

A

(dB)

20

40

60

80

100

120

0 5 7.5 10 15 17.52.5 12.5

Effective bits: 9.11; THD = −63.18 dB;
Harmonic levels (dB): 2nd = −66.49; 3rd = −66.52; 4th = −85.15; 5th = −75.95; 6th = −83.47.

TDA8762

MLC948

f (MHz)

20

Fig.8 Fast Fourier Transform (f

handbook, full pagewidth

0

A

(dB)

20

40

60

80

100

120

0 5 7.5 10 15 17.52.5 12.5

Effective bits: 8.70; THD = −60.18 dB;
Harmonic levels (dB): 2nd = −62.24; 3rd = −70.44; 4th = −77.29; 5th = −65.99; 6th = −89.67.

= 40 MHz; fi= 10 MHz).

clk

f (MHz)

MLC949

20

Fig.9 Fast Fourier Transform (f

1996 Mar 28 14

= 40 MHz; fi= 15 MHz).

clk

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

INTERNAL PIN CONFIGURATIONS

V

handbook, halfpage

CCO2

MGC039

V

CCO1

D9 to D0

IR

OGND1

handbook, halfpage

V

CCA

V

I

AGND

TDA8762

MGC040 - 1

Fig.10 TTL data and in-range outputs.

handbook, halfpage

V

CCO1

OE

(TC)

OGND2

MGD344

Fig.11 Analog inputs.

V

CCA

V

RT

V

RM

V

RB

AGND

R

LAD

MBE565

Fig.12 OE (TC) input.

1996 Mar 28 15

Fig.13 VRB, VRM and VRT.

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

handbook, halfpage

V

CCD

CLK

DGND

V

(1.3 V)

ref

MGC042 - 1

TDA8762

Fig.14 CLK input.

1996 Mar 28 16

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

APPLICATION INFORMATION

Additional application information will be supplied upon request (please quote number

handbook, halfpage

100 nF

100 nF

AGND

100 nF

AGND

AGND

AGND1

AGND2

(1)

(3)(1)

(1)

V

V

CLK

CCA

V

V

RM

(4)

V

CCD

TC

RB

RT

OE

1

2

3

4

5

6

7

V

I

TDA8762

8

9

10

11

28

27

26

25

24

23

22

21

20

19

18

V

CCO2

OGND2

IR

D9

D8

D7

D6

D5

D4

D3

D2

“AN96025”

TDA8762

).

DGND

12

V

CCO1

13

OGND1

14

The analog and digital supplies should be separated and decoupled.
The external voltage reference generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value.

Eventually, the reference ladder voltages can be derived from a well regulated V
(1) VRB, VRM and VRT are decoupled to AGND.
(2) Pin 15 should be connected to DGND in order to prevent noise influence.
(3) When VRM is not used, pin 7 can be left open, avoiding the decoupling capacitor. In any case, this pin must not be grounded.
(4) When analog input signal is AC coupled, an input bias or a clamping level must be applied to VI input (pin 8).

supply through a resistor bridge and a decoupled capacitor.

CCA

MGC043

D1

17

D0

16

(2)

n.c.

15

Fig.15 Application diagram.

1996 Mar 28 17

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

PACKAGE OUTLINE

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

D

c

y

Z

28 15

TDA8762

SOT341-1

E

H

E

A

X

v M

A

pin 1 index

114

w M

b

e

DIMENSIONS (mm are the original dimensions)

UNIT A

mm

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

A

max.

2.0

1

0.21

0.05

A2A3b

1.80

0.25

1.65

0.38

0.25

p

cD

0.20

0.09

p

0 2.5 5 mm

scale

(1)E(1) (1)

10.4

10.0

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

Q

A

2

A

1

detail X

1.03

0.9

0.63

0.7

(A )

L

p

L

0.13 0.10.2

A

3

θ

1.1

0.7

o

8

o

0

OUTLINE
VERSION

SOT341-1 MO-150AH

IEC JEDEC EIAJ

REFERENCES

1996 Mar 28 18

EUROPEAN

PROJECTION

ISSUE DATE

93-09-08
95-02-04

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reflow soldering

Reflow soldering techniques are suitable for all SSOP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

(order code 9398 652 90011).

TDA8762

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Mar 28 19

Philips Semiconductors Product specification

10-bit high-speed low-power

TDA8762

analog-to-digital converter

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Mar 28 20

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

TDA8762

NOTES

1996 Mar 28 21

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

TDA8762

NOTES

1996 Mar 28 22

Philips Semiconductors Product specification

10-bit high-speed low-power
analog-to-digital converter

TDA8762

NOTES

1996 Mar 28 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211,

Volodarski Str. 6, 220050 MINSK,
Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:

Tel. [phone], Fax. [phone]

Chile: see South America
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300

COPENHAGEN S, Tel. [phone], Fax. [phone]

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]

France: 4 Rue du Port-aux-Vins, BP317,

92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]

Germany: P.O. Box 10 51 40, 20035 HAMBURG,

Tel. [phone], Fax. [phone]

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block,

Dr. Annie Besant Rd. Worli, BOMBAY 400 018
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS,

Piazza IV Novembre 3, 20124 MILANO,
Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO,

TEXAS 79905, Tel. [phone], Fax. [phone]

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC,
MAKATI, Metro MANILA,
Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220 - 5th floor, Suite 51,

CEP: 04552-903-SÃO PAULO-SP, Brazil,
P.O. Box 7383 (01064-970),
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-16485 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,

Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE,

2A Akademika Koroleva str., Office 165, 252148 KIEV,
Tel.[phone], Fax. [phone]

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax. [phone]

Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

Marketing & Sales Communications, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Fax. [phone]

SCDS48 © Philips Electronics N.V. 1996

All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.

Printed in The Netherlands

537021/1100/02/pp24 Date of release: 1996 Mar 28
Document order number: 9397 750 00767