9-bit analog-to-digital converter for
digital video
Preliminary specification
File under Integrated Circuits, IC02
Philips Semiconductors
1995 Mar 20
Page 2
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
FEATURES
• 9-bit resolution
• Sampling rate up to 30 MHz
• DC sampling allowed
• One clock cycle conversion only
• High signal-to-noise ratio over a large analog input
frequency range (8.5 effective bits at 10 MHz full-scale
input at f
• No missing codes guaranteed
• In range (IR) 3-state TTL output
• TTL compatible digital inputs and outputs
• Low-level AC clock input signal allowed
• External reference voltage regulator
• Power dissipation only 360 mW (typical)
• Low analog input capacitance, no buffer amplifier
required
• No sample-and-hold circuit required.
= 30 MHz)
clk
TDA8761
APPLICATIONS
Analog-to-digital conversion for:
• Video data digitizing
• Digital Video Broadcasting (DVB)
• Cable TV.
GENERAL DESCRIPTION
The TDA8761 is a 9-bit analog-to-digital converter (ADC)
for professional video and digital video set box
applications. It converts the analog input signal into 9-bit
binary-coded digital words at a maximum sampling rate of
30 MHz. Its linearity performance ensures the required
conversion accuracy in case of 256QAM demodulator
concept and for all symbol frequencies. All digital inputs
and outputs are TTL compatible, although a low-level sine
wave clock input signal is allowed.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
V
V
I
CCA
I
CCD
I
CCO
CCA
CCD
CCO
analog supply voltage4.755.05.25V
digital supply voltage4.755.05.25V
output stages supply voltage4.45.05.25V
analog supply current−30tbfmA
digital supply current−22tbfmA
output stages supply current−22tbfmA
AINLAC integral non-linearitynote 1; full scale input sine wave−±0.75tbfLSB
note 1; 50% full scale input sine wave−±0.5tbfLSB
ADNLAC differential non-linearitynote 1; full scale input sine wave−±0.5tbfLSB
note 1; 50% full scale input sine wave−±0.3tbfLSB
f
clk(max)
P
tot
maximum clock frequency30−−MHz
total power dissipation−360tbfmW
Note
= 11 MHz and f
1. f
i
= 30 MHz; fi= 8 MHz and f
clk
= 20 MHz.
clk
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
PACKAGE
TDA8761MSSOP28plastic shrink small outline package; 28 leads; body width 5.3 mmSOT341-1
1995 Mar 202
Page 3
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
BLOCK DIAGRAM
handbook, full pagewidth
analog
voltage input
V
RT
V
V
RM
V
CCA
3
CLOCK DRIVER
9
I
8
7
ANALOG -TO - DIGITAL
CONVERTER
CLK
1
V
CCD
11
TDA8761
TTL OUTPUTSLATCHES
CE
10
2
25
D8
D7
24
D6
23
D5
22
D4
21
20 D3
19
D2
18
D1
17 D0
TDA8761
TC
MSB
data outputs
LSB
V
6
RB
4
AGND1
analog groundsdigital ground
5
AGND2
12
DGND
IN RANGE LATCH
Fig.1 Block diagram.
TTL OUTPUT
14
OGND1
output grounds
27
OGND2
13
28
26
MGC355
V
CCO1
V
CCO2
IR
output
1995 Mar 203
Page 4
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
PINNING
SYMBOLPINDESCRIPTION
CLK1clock input
TC2two’s complement input (active LOW)
V
CCA
AGND14analog ground 1
AGND25analog ground 2
V
RB
V
RM
V
I
V
RT
CE10chip enable input (TTL level input,
V
CCD
DGND12digital ground
V
CCO1
OGND114output ground 1
n.c.15not connected
n.c.16not connected
D017data output; bit 0 (LSB)
D118data output; bit 1
D219data output; bit 2
D320data output; bit 3
D421data output; bit 4
D522data output; bit 5
D623data output; bit 6
D724data output; bit 7
D825data output; bit 8 (MSB)
IR26in range data output
OGND227output ground 2
V
CCO2
3analog supply voltage (+5 V)
6reference voltage BOTTOM input
7reference voltage MIDDLE
8analog input voltage
9reference voltage TOP input
active LOW)
11digital supply voltage (+5 V)
13supply voltage for output stages 1
(+5 V)
28supply voltage for output stages 2
(+5 V)
handbook, halfpage
1
CLK
2
TC
V
3
CCA
V
RB
V
RM
V
RT
CE
V
CCD
DGND
CCO1
4
5
6
7
I
8
9
10
11
12
13
TDA8761
MGC356
V
AGND1
AGND2
V
OGND1
Fig.2 Pin configuration.
TDA8761
V
28
CCO2
27
OGND2
IR
26
25
D8
24
D7
23
D6
22
D5
D4
21
20
D3
D2
19
18
D1
17
D0
16
n.c.
1514
n.c.
1995 Mar 204
Page 5
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
V
V
∆V
V
V
I
O
T
T
T
CCA
CCD
CCO
CC
I
i(p-p)
stg
amb
j
analog supply voltagenote 1−0.3+7.0V
digital supply voltagenote 1−0.3+7.0V
output stages supply voltagenote 1−0.3+7.0V
supply voltage differences between
V
V
V
CCA
CCO
CCA
and V
and V
and V
CCD
CCD
CCO
−1.0+1.0V
−1.0+1.0V
−1.0+1.0V
input voltagereferenced to AGND−0.3+7.0V
AC input voltage for switching
may have any value between −0.3 V and +7.0 V provided the difference
CCO
, V
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-a
thermal resistance from junction to ambient in free air110K/W
1995 Mar 205
Page 6
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
CHARACTERISTICS
V
CCA=V3
V27= 4.4 to 5.25 V; AGND and DGND shorted together; T
V
CCA=VCCD=VCCO
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply
V
CCA
V
CCD
V
CCO
∆V
I
CCA
I
CCD
I
CCO
Inputs
to V4and V5= 4.75 to 5.25 V; V
=5V; V
analog supply voltage4.755.05.25V
digital supply voltage4.755.05.25V
output stages supply voltage4.45.05.25V
CC
supply voltage differences between
and V
V
V
V
CCA
CCA
CCD
and V
and V
CCD
CCO
CCO
analog supply current−30tbfmA
digital supply current−22tbfmA
output stages supply current−22tbfmA
CCD=V11
= 1.5 V; CL= 15 pF and T
i(p-p)
to V12= 4.75 to 5.25 V; V
= 0 to +70 °C; typical values measured at
amb
=25°C; unless otherwise specified.
amb
CCO=V13
and V28to V14 and
−0.25−+0.25V
−0.4−+0.4V
−0.4−+0.4V
LOCK INPUT CLK (REFERENCED TO DGND); note 1
C
V
IL
V
IH
I
IL
I
IH
Z
I
C
I
LOW level input voltage0−0.8V
HIGH level input voltage2.0−V
LOW level input currentV
HIGH level input currentV
input impedancef
input capacitancef
INPUT CE (REFERENCED TO DGND); see Table 2
V
IL
V
IH
I
IL
I
IH
LOW level input voltage0−0.8V
HIGH level input voltage2.0−V
LOW level input currentVIL= 0.4 V−400−−µA
HIGH level input currentVIH= 2.7 V−−20µA
VI(ANALOG INPUT VOLTAGE REFERENCED TO AGND)
I
IL
I
IH
Z
I
C
I
LOW level input currentVI= 1.3 V−0−µA
HIGH level input currentVI= 3.8 V−70−µA
input impedancefi=10MHz−5−kΩ
input capacitancefi=10MHz−8−pF
CCD
= 0.4 V−10 +1µA
clk
= 2.7 V−−20µA
clk
=30MHz−2−kΩ
clk
=30MHz−2−pF
clk
CCD
V
V
1995 Mar 206
Page 7
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Reference voltages for the resistor ladder; see Table 1
V
RB
V
RT
V
diff
I
ref
R
LAD
TC
RLAD
V
osB
V
osT
V
i(p-p)
Outputs
IGITAL OUTPUTS D8 TO D0 AND IR (REFERENCED TO OGND)
D
V
OL
V
OH
I
OZ
Switching characteristics
reference voltage BOTTOM1.21.3−V
reference voltage TOP−3.3V
differential reference voltage
VRT− V
RB
1.82.03.0V
− 0.8 V V
CCA
reference current−30−mA
resistor ladder−85−Ω
temperature coefficient of the resistor
ladder
−1.86−ppm
−158−mΩ/K
offset voltage BOTTOMnote 2−250−mV
offset voltage TOPnote 2−250−mV
analog input voltage
note 31.31.52.5V
(peak-to-peak value)
LOW level output voltageIO= 1 mA0−0.4V
HIGH level output voltageIO= 0 mA2.7−V
= −0.4 mA2.7−V
I
O
= −1 mA2.4−V
I
O
output current in 3-state mode0.4 V < VO<V
CCO
−20−+20µA
CCO
CCO
CCO
− 0.5V
− 1.3V
− 1.4V
LOCK INPUT CLK; see Fig.3; note 1
C
f
clk(max)
t
CPH
t
CPL
maximum clock frequency30−−MHz
clock pulse width HIGH10−−ns
clock pulse width LOW10−−ns
Analog signal processing
INEARITY
L
AINLAC integral non-linearitynote 5; full scale input
sine wave
note 5; 50% full scale
input sine wave
ADNLAC differential non-linearitynote 5; full scale input
sine wave
note 5; 50% full scale
input sine wave
OFERoffset errormiddle code;
= 1.3 V; VRT= 3.3 V
V
RB
GERgain error (from device to device)V
= 1.3 V;
RB
VRT= 3.3 V; note 4
−±0.75tbfLSB
−±0.5tbfLSB
−±0.5tbfLSB
−±0.3tbfLSB
−±1−LSB
−±0.1−%
1995 Mar 207
Page 8
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
BANDWIDTH (f
Banalog bandwidthfull-scale sine wave;
t
STLH
t
STHL
HARMONICS (f
THDtotal harmonic distortionf
SIGNAL-TO-NOISE RATIO; see Fig.7; note 8
S/Nsignal-to-noise ratio (full scale)without harmonics;
EFFECTIVE BITS; see Fig 6; note 8
EBeffective bitsf
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
3-state output delay times; see Fig.4
t
dZH
t
dZL
t
dHZ
t
dLZ
Notes
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 0.5 ns.
2. Analog input voltages producing code 0 up to and including code 511:
a) V
b) V
3. Analog input voltage range can be derived from VRT− VRB difference. It is
6. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No
glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.
7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.
8. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
9. Intermodulation measured relative to either tone with analog input frequencies of 10.0 MHz and 10.10 MHz. The two
input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.
10. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a
digital-to-analog converter.
11. Output data acquisition: the output data is available after the maximum delay time of td.
1995 Mar 209
Page 10
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
Table 1 Output coding and input voltage (typical values; referenced to AGND, VRB= 1.3 V, VRT= 3.3 V)
9-bit analog-to-digital converter for
digital video
INTERNAL PIN CONFIGURATIONS
V
handbook, halfpage
V
CCO1
D8 to D0
O/UF
OGND1
CCO2
MGC361
handbook, halfpage
V
CCA
V
I
AGND
TDA8761
MGC040
dbook, halfpage
Fig.7 TTL data and in-range outputs.
V
CCO1
CE
(TC)
OGND2
MGC041
handbook, halfpage
Fig.8 Analog inputs.
V
CCA
V
RT
V
RM
V
RB
AGND
R
LAD
MEA050
Fig.9 CE (TC) 3-state input.
1995 Mar 2013
Fig.10 VRB, VRM and VRT.
Page 14
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
V
handbook, full pagewidth
CCD
CLK
DGND
MGC042
TDA8761
V
(1.3 V)
ref
Fig.11 CLK input.
1995 Mar 2014
Page 15
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
APPLICATION INFORMATION
handbook, halfpage
V
AGND1
AGND2
V
100 nF
AGND
100 nF
AGND
100 nF
AGND
V
V
V
CLK
TC
CCA
RB
RM
RT
CE
CCD
TDA8761
V
1
2
3
4
5
(1)
6
(1)
7
V
I
(1)
TDA8761
8
9
10
11
28
27
26
25
24
23
22
21
20
19
18
CCO2
OGND2
IR
D8
D7
D6
D5
D4
D3
D2
D1
DGND
12
V
CCO1
13
OGND1
14
The analog and digital supplies should be separated and decoupled.
The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. Eventually, the
reference ladder voltages can be derived from a well regulated V
For applications where the input signal must remain well centred around middle scale, VRM must be decoupled and connected to analog input signal
(pin 8) through a resistor. The values must be defined in accordance with the input signal frequency in order to avoid direct coupling into the ADC ladder
(e.g. R = 5 kΩ and C = 100 nF).
, VRM and VRT are decoupled to AGND.
(1) V
RB
(2) Pins 15 and 16 should be connected to DGND in order to prevent noise influence.
supply through a resistor bridge and a decoupled capacitor.
CCA
17
16
15
MGC362
D0
n.c.
n.c.
(2)
(2)
Fig.12 Application diagram.
1995 Mar 2015
Page 16
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
PACKAGE OUTLINE
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
c
y
Z
2815
TDA8761
SOT341-1
E
H
E
A
X
v M
A
pin 1 index
114
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNITA
mm
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
2.0
0.21
0.05
1
A2A
1.80
1.65
0.25
b
p
cD
0.20
0.09
3
0.38
0.25
p
02.55 mm
scale
(1)E(1)(1)
10.4
10.0
eHELLpQZywv θ
5.4
0.651.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
0.9
1.03
0.7
0.63
(A )
L
p
L
0.130.10.2
A
3
θ
1.1
0.7
o
8
o
0
OUTLINE
VERSION
SOT341-1 MO-150AH
IEC JEDEC EIAJ
REFERENCES
1995 Mar 2016
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
Page 17
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
SOLDERING
Plastic small outline packages
YWAVE
B
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
Y SOLDER PASTE REFLOW
B
TDA8761
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
R
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
-HEATED SOLDER TOOL)
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Mar 2017
Page 18
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
NOTES
1995 Mar 2018
Page 19
Philips SemiconductorsPreliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
NOTES
1995 Mar 2019
Page 20
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/01/pp20Date of release: 1995 Mar 20
Document order number:9397 750 00112
Philips Semiconductors
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