Datasheet tda8761 DATASHEETS (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA8761
9-bit analog-to-digital converter for digital video
Preliminary specification File under Integrated Circuits, IC02
Philips Semiconductors
1995 Mar 20
Page 2
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video

FEATURES

• 9-bit resolution
• Sampling rate up to 30 MHz
• DC sampling allowed
• One clock cycle conversion only
• High signal-to-noise ratio over a large analog input
frequency range (8.5 effective bits at 10 MHz full-scale input at f
• No missing codes guaranteed
• In range (IR) 3-state TTL output
• TTL compatible digital inputs and outputs
• Low-level AC clock input signal allowed
• External reference voltage regulator
• Power dissipation only 360 mW (typical)
• Low analog input capacitance, no buffer amplifier
required
• No sample-and-hold circuit required.
= 30 MHz)
clk
TDA8761

APPLICATIONS

Analog-to-digital conversion for:
• Video data digitizing
• Digital Video Broadcasting (DVB)
• Cable TV.

GENERAL DESCRIPTION

The TDA8761 is a 9-bit analog-to-digital converter (ADC) for professional video and digital video set box applications. It converts the analog input signal into 9-bit binary-coded digital words at a maximum sampling rate of 30 MHz. Its linearity performance ensures the required conversion accuracy in case of 256QAM demodulator concept and for all symbol frequencies. All digital inputs and outputs are TTL compatible, although a low-level sine wave clock input signal is allowed.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V V V I
CCA
I
CCD
I
CCO
CCA CCD CCO
analog supply voltage 4.75 5.0 5.25 V digital supply voltage 4.75 5.0 5.25 V output stages supply voltage 4.4 5.0 5.25 V analog supply current − 30 tbf mA digital supply current − 22 tbf mA output stages supply current − 22 tbf mA
AINL AC integral non-linearity note 1; full scale input sine wave −±0.75 tbf LSB
note 1; 50% full scale input sine wave −±0.5 tbf LSB
ADNL AC differential non-linearity note 1; full scale input sine wave −±0.5 tbf LSB
note 1; 50% full scale input sine wave −±0.3 tbf LSB
f
clk(max)
P
tot
maximum clock frequency 30 −−MHz total power dissipation − 360 tbf mW
Note
= 11 MHz and f
1. f
i
= 30 MHz; fi= 8 MHz and f
clk
= 20 MHz.
clk

ORDERING INFORMATION

TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA8761M SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
1995 Mar 20 2
Page 3
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video

BLOCK DIAGRAM

handbook, full pagewidth
analog
voltage input
V
RT
V
V
RM
V
CCA
3
CLOCK DRIVER
9
I
8
7
ANALOG -TO - DIGITAL
CONVERTER
CLK
1
V
CCD
11
TDA8761
TTL OUTPUTSLATCHES
CE 10
2
25
D8
D7
24
D6
23
D5
22
D4
21 20 D3
19
D2
18
D1
17 D0
TDA8761
TC
MSB
data outputs
LSB
V
6
RB
4 AGND1
analog grounds digital ground
5 AGND2
12 DGND
IN RANGE LATCH
Fig.1 Block diagram.
TTL OUTPUT
14 OGND1
output grounds
27 OGND2
13
28 26
MGC355
V
CCO1
V
CCO2
IR output
1995 Mar 20 3
Page 4
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video

PINNING

SYMBOL PIN DESCRIPTION
CLK 1 clock input TC 2 two’s complement input (active LOW) V
CCA
AGND1 4 analog ground 1 AGND2 5 analog ground 2 V
RB
V
RM
V
I
V
RT
CE 10 chip enable input (TTL level input,
V
CCD
DGND 12 digital ground V
CCO1
OGND1 14 output ground 1 n.c. 15 not connected n.c. 16 not connected D0 17 data output; bit 0 (LSB) D1 18 data output; bit 1 D2 19 data output; bit 2 D3 20 data output; bit 3 D4 21 data output; bit 4 D5 22 data output; bit 5 D6 23 data output; bit 6 D7 24 data output; bit 7 D8 25 data output; bit 8 (MSB) IR 26 in range data output OGND2 27 output ground 2 V
CCO2
3 analog supply voltage (+5 V)
6 reference voltage BOTTOM input 7 reference voltage MIDDLE 8 analog input voltage 9 reference voltage TOP input
active LOW)
11 digital supply voltage (+5 V)
13 supply voltage for output stages 1
(+5 V)
28 supply voltage for output stages 2
(+5 V)
handbook, halfpage
1
CLK
2
TC
V
3
CCA
V
RB
V
RM
V
RT CE
V
CCD
DGND
CCO1
4 5 6 7
I
8
9 10 11 12 13
TDA8761
MGC356
V
AGND1 AGND2
V
OGND1
Fig.2 Pin configuration.
TDA8761
V
28
CCO2
27
OGND2 IR
26 25
D8
24
D7
23
D6
22
D5 D4
21 20
D3 D2
19 18
D1
17
D0
16
n.c.
1514
n.c.
1995 Mar 20 4
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Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V ∆V
V V
I
O
T T T
CCA CCD CCO
CC
I i(p-p)
stg amb j
analog supply voltage note 1 −0.3 +7.0 V digital supply voltage note 1 −0.3 +7.0 V output stages supply voltage note 1 −0.3 +7.0 V supply voltage differences between
V V V
CCA CCO CCA
and V
and V
and V
CCD
CCD
CCO
−1.0 +1.0 V
−1.0 +1.0 V
−1.0 +1.0 V
input voltage referenced to AGND −0.3 +7.0 V AC input voltage for switching
referenced to DGND − V
CCD
V
(peak-to-peak value) output current − 10 mA storage temperature −55 +150 °C operating ambient temperature 0 +70 °C junction temperature − +150 °C
Note
1. The supply voltages V between V
CCA
, V
CCD
CCA
and V
and V
CCD
is between −1 and +1 V.
CCO
may have any value between −0.3 V and +7.0 V provided the difference
CCO
, V

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 110 K/W
1995 Mar 20 5
Page 6
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video

CHARACTERISTICS

V
CCA=V3
V27= 4.4 to 5.25 V; AGND and DGND shorted together; T V
CCA=VCCD=VCCO
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply
V
CCA
V
CCD
V
CCO
∆V
I
CCA
I
CCD
I
CCO
Inputs
to V4and V5= 4.75 to 5.25 V; V
=5V; V
analog supply voltage 4.75 5.0 5.25 V digital supply voltage 4.75 5.0 5.25 V output stages supply voltage 4.4 5.0 5.25 V
CC
supply voltage differences between
and V
V V V
CCA CCA CCD
and V and V
CCD CCO CCO
analog supply current − 30 tbf mA digital supply current − 22 tbf mA output stages supply current − 22 tbf mA
CCD=V11
= 1.5 V; CL= 15 pF and T
i(p-p)
to V12= 4.75 to 5.25 V; V
= 0 to +70 °C; typical values measured at
amb
=25°C; unless otherwise specified.
amb
CCO=V13
and V28to V14 and
−0.25 − +0.25 V
−0.4 − +0.4 V
−0.4 − +0.4 V
LOCK INPUT CLK (REFERENCED TO DGND); note 1
C V
IL
V
IH
I
IL
I
IH
Z
I
C
I
LOW level input voltage 0 − 0.8 V HIGH level input voltage 2.0 − V LOW level input current V HIGH level input current V input impedance f
input capacitance f INPUT CE (REFERENCED TO DGND); see Table 2 V
IL
V
IH
I
IL
I
IH
LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V
LOW level input current VIL= 0.4 V −400 −− µA
HIGH level input current VIH= 2.7 V −−20 µA VI(ANALOG INPUT VOLTAGE REFERENCED TO AGND) I
IL
I
IH
Z
I
C
I
LOW level input current VI= 1.3 V − 0 −µA
HIGH level input current VI= 3.8 V − 70 −µA
input impedance fi=10MHz − 5 − kΩ
input capacitance fi=10MHz − 8 − pF
CCD
= 0.4 V −10 +1 µA
clk
= 2.7 V −−20 µA
clk
=30MHz − 2 − kΩ
clk
=30MHz − 2 − pF
clk
CCD
V
V
1995 Mar 20 6
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Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Reference voltages for the resistor ladder; see Table 1
V
RB
V
RT
V
diff
I
ref
R
LAD
TC
RLAD
V
osB
V
osT
V
i(p-p)
Outputs
IGITAL OUTPUTS D8 TO D0 AND IR (REFERENCED TO OGND)
D V
OL
V
OH
I
OZ
Switching characteristics
reference voltage BOTTOM 1.2 1.3 − V
reference voltage TOP − 3.3 V
differential reference voltage
VRT− V
RB
1.8 2.0 3.0 V
− 0.8 V V
CCA
reference current − 30 − mA
resistor ladder − 85 −Ω
temperature coefficient of the resistor
ladder
− 1.86 − ppm
− 158 − mΩ/K
offset voltage BOTTOM note 2 − 250 − mV
offset voltage TOP note 2 − 250 − mV
analog input voltage
note 3 1.3 1.5 2.5 V
(peak-to-peak value)
LOW level output voltage IO= 1 mA 0 − 0.4 V
HIGH level output voltage IO= 0 mA 2.7 − V
= −0.4 mA 2.7 − V
I
O
= −1 mA 2.4 − V
I
O
output current in 3-state mode 0.4 V < VO<V
CCO
−20 − +20 µA
CCO CCO CCO
− 0.5 V
− 1.3 V
− 1.4 V
LOCK INPUT CLK; see Fig.3; note 1
C f
clk(max)
t
CPH
t
CPL
maximum clock frequency 30 −− MHz
clock pulse width HIGH 10 −− ns
clock pulse width LOW 10 −− ns
Analog signal processing
INEARITY
L AINL AC integral non-linearity note 5; full scale input
sine wave note 5; 50% full scale
input sine wave
ADNL AC differential non-linearity note 5; full scale input
sine wave note 5; 50% full scale
input sine wave
OFER offset error middle code;
= 1.3 V; VRT= 3.3 V
V
RB
GER gain error (from device to device) V
= 1.3 V;
RB
VRT= 3.3 V; note 4
−±0.75 tbf LSB
−±0.5 tbf LSB
−±0.5 tbf LSB
−±0.3 tbf LSB
−±1− LSB
−±0.1 − %
1995 Mar 20 7
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Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BANDWIDTH (f B analog bandwidth full-scale sine wave;
t
STLH
t
STHL
HARMONICS (f THD total harmonic distortion f SIGNAL-TO-NOISE RATIO; see Fig.7; note 8 S/N signal-to-noise ratio (full scale) without harmonics;
EFFECTIVE BITS; see Fig 6; note 8 EB effective bits f
TWO-TONE; note 9 TTIR two-tone intermodulation rejection f BIT ERROR RATE BER bit error rate f
DIFFERENTIAL GAIN; note 10 G
diff
DIFFERENTIAL PHASE; note 10
ϕ
diff
= 30 MHz)
clk
analog input settling time
LOW-to-HIGH
analog input settling time
HIGH-to-LOW
=30MHZ)
clk
differential gain f
differential phase f
− 40 − MHz
note 6 75% full-scale sine
− 55 − MHz
wave; note 6 small signal at
− 700 − MHz
mid-scale;
= ±10 LSB at
V
I
code 256; note 6 full-scale square wave;
− 2.0 tbf ns
Fig.5; note 7 full-scale square wave;
− 2.5 tbf ns
Fig.5; note 7
=10MHz −−64 − dB
i
53 55 − dB
f
= 30 MHz;
clk
fi=10MHz
= 30 MHz;
clk
− 8.5 − bits
fi=10MHz
=30MHz −−64 − dB
clk
= 30 MHz;
clk
− 10
−13
− times/
fi= 10 MHz; VI= ±16 LSB at code 256
= 30 MHz;
clk
− tbf − %
PAL modulated ramp
= 30 MHz;
clk
− tbf − deg
PAL modulated ramp
sample
Timing (f
t
ds
t
h
t
d
C
L
= 30 MHz; CL= 15 pF); see Fig.3; note 11
clk
sampling delay time −−2ns
output hold time 5 −− ns
output delay time − 10 14 ns
digital output load − 15 40 pF
1995 Mar 20 8
Page 9
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 3-state output delay times; see Fig.4
t
dZH
t
dZL
t
dHZ
t
dLZ
Notes
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less than 0.5 ns.
2. Analog input voltages producing code 0 up to and including code 511: a) V
b) V
3. Analog input voltage range can be derived from VRT− VRB difference. It is
enable HIGH − tbf tbf ns enable LOW − tbf tbf ns disable HIGH − tbf tbf ns disable LOW − tbf tbf ns
(voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and
osB
the reference voltage BOTTOM (VRB) at T
(voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which
osT
produces data outputs equal to code 511 at T
amb
=25°C.
=25°C.
amb
VRTVRB–()8×
------------------------------------------­9
V
–()1.5 V–
GER
4. = 11 MHz and f
5. f
i
511V0
---------------------------------------------------
1.5 V = 30 MHz; fi= 8 MHz and f
clk
100×=
= 20 MHz.
clk
6. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.
7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data.
8. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
9. Intermodulation measured relative to either tone with analog input frequencies of 10.0 MHz and 10.10 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.
10. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a digital-to-analog converter.
11. Output data acquisition: the output data is available after the maximum delay time of td.
1995 Mar 20 9
Page 10
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for
TDA8761
digital video
Table 1 Output coding and input voltage (typical values; referenced to AGND, VRB= 1.3 V, VRT= 3.3 V)
STEP V
I(p-p)
IR
D8 D7 D6 D5 D4 D3 D2 D1 D0 D8 D7 D6 D5 D4 D3 D2 D1 D0
U/F <1.55 0 0 00000000000000000
0 1.55 1 0 00000000000000000 1 . 1000000001000000001
. . ...................
. . ...................
510 . 1111111111111111110
511 3.05 1 1 11111111111111111
O/F >3.05 0 1 11111111111111111
Table 2 Mode selection
TC CE D8 TO D0 IR
X 1 high impedance high impedance
0 0 active; two’s complement active 1 0 active; binary active
BINARY OUTPUT BITS TWO’S COMPLEMENT OUTPUT BITS
handbook, full pagewidth
CLK
V
l
DATA D0 to D8
t
sample N
DATA
N - 2
CPH
t
CPL
sample N + 1
t
ds
DATA
N - 1
t
Fig.3 Timing diagram.
1.4 V
sample N + 2
t
h
DATA
N
d
DATA
N + 1
2.4 V
1.4 V
0.4 V
MGC357
1995 Mar 20 10
Page 11
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video
V
handbook, full pagewidth
CCD
CE
output data
output data
LOW
t
dLZ
10 %
TDA8761
HIGH
CE
t
dZL
50 %
15 pF
HIGH
3.3 kΩ
t
90 %
dHZ
LOW
V
S1
CCD
50 %
t
dZH
50 %
TEST
t
dLZ
t
dZL
t
dHZ
t
dZH
S1
V
CCD
V
CCD
GND GND
MGC358
TDA8761
fCE= 100kHz.
Fig.4 Timing diagram and test conditions of 3-state output delay time.
1995 Mar 20 11
Page 12
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video
t
handbook, full pagewidth
code 511
code 0
CLK
MGC359
V
I
STLH
50 %
2 ns
50 %
0.5 ns
2 ns
t
STHL
50 %
50 %
TDA8761
0.5 ns
Fig.5 Analog input settling-time diagram.
amplitude
(dB)
100
120
0
20
40
60
80
0 1.88 3.75
handbook, full pagewidth
Effective bits: 8.58; THD= −61.80 dB. Harmonic levels (dB): 2nd = −64.77; 3rd = −79.30; 4th = −71.90; 5th = −66.12; 6th = −82.29.
MGC360
9.375.63 7.50 11.3 13.1 15.0 f (MHz)
Fig.6 Fast Fourier Transform (f
1995 Mar 20 12
= 30 MHz; fi= 10 MHz).
clk
Page 13
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video

INTERNAL PIN CONFIGURATIONS

V
handbook, halfpage
V
CCO1
D8 to D0
O/UF
OGND1
CCO2
MGC361
handbook, halfpage
V
CCA
V
I
AGND
TDA8761
MGC040
dbook, halfpage
Fig.7 TTL data and in-range outputs.
V
CCO1
CE
(TC)
OGND2
MGC041
handbook, halfpage
Fig.8 Analog inputs.
V
CCA
V
RT
V
RM
V
RB
AGND
R
LAD
MEA050
Fig.9 CE (TC) 3-state input.
1995 Mar 20 13
Fig.10 VRB, VRM and VRT.
Page 14
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video
V
handbook, full pagewidth
CCD
CLK
DGND
MGC042
TDA8761
V
(1.3 V)
ref
Fig.11 CLK input.
1995 Mar 20 14
Page 15
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video

APPLICATION INFORMATION

handbook, halfpage
V
AGND1
AGND2
V
100 nF
AGND
100 nF
AGND
100 nF
AGND
V
V
V
CLK
TC
CCA
RB
RM
RT
CE
CCD
TDA8761
V
1
2
3
4
5
(1)
6
(1)
7
V
I
(1)
TDA8761
8
9
10
11
28
27
26
25
24
23
22
21
20
19
18
CCO2
OGND2
IR
D8
D7
D6
D5
D4
D3
D2
D1
DGND
12
V
CCO1
13
OGND1
14
The analog and digital supplies should be separated and decoupled. The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. Eventually, the
reference ladder voltages can be derived from a well regulated V For applications where the input signal must remain well centred around middle scale, VRM must be decoupled and connected to analog input signal
(pin 8) through a resistor. The values must be defined in accordance with the input signal frequency in order to avoid direct coupling into the ADC ladder (e.g. R = 5 kΩ and C = 100 nF).
, VRM and VRT are decoupled to AGND.
(1) V
RB
(2) Pins 15 and 16 should be connected to DGND in order to prevent noise influence.
supply through a resistor bridge and a decoupled capacitor.
CCA
17
16
15
MGC362
D0
n.c.
n.c.
(2)
(2)
Fig.12 Application diagram.
1995 Mar 20 15
Page 16
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video

PACKAGE OUTLINE

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
c
y
Z
28 15
TDA8761

SOT341-1

E
H
E
A
X
v M
A
pin 1 index
114
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNIT A
mm
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
2.0
0.21
0.05
1
A2A
1.80
1.65
0.25
b
p
cD
0.20
0.09
3
0.38
0.25
p
0 2.5 5 mm
scale
(1)E(1) (1)
10.4
10.0
eHELLpQZywv θ
5.4
0.65 1.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
0.9
1.03
0.7
0.63
(A )
L
p
L
0.13 0.10.2
A
3
θ
1.1
0.7
o
8
o
0
OUTLINE
VERSION
SOT341-1 MO-150AH
IEC JEDEC EIAJ
REFERENCES
1995 Mar 20 16
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08 95-02-04
Page 17
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video
SOLDERING Plastic small outline packages
YWAVE
B During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications.
Y SOLDER PASTE REFLOW
B
TDA8761
Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C.
R
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
-HEATED SOLDER TOOL)
Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement.

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Mar 20 17
Page 18
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video
TDA8761
NOTES
1995 Mar 20 18
Page 19
Philips Semiconductors Preliminary specification
9-bit analog-to-digital converter for digital video
TDA8761
NOTES
1995 Mar 20 19
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Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Tel. (31)40 783 749, Fax. (31)40 788 399
Brazil: Rua do Rocio 220 - 5
CEP: 04552-903-SÃO PAULO-SP, Brazil. P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: Av. Santa Maria 0760, SANTIAGO,
Tel. (02)773 816, Fax. (02)777 6730
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. (032)88 2636, Fax. (031)57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (9)0-50261, Fax. (9)0-520971
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 63 23, 20043 HAMBURG,
Tel. (040)3296-0, Fax. (040)3296 213.
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg.,
24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)480 6960/480 6009
India: Philips INDIA Ltd, Shivsagar Estate, A Block ,
Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)7640 000, Fax. (01)7640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l.,
Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5028, Fax. (03)3740 0580
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB
Tel. (040)783749, Fax. (040)788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
th
floor, Suite 51,
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494.
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825
SCD39 © Philips Electronics N.V. 1995
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/01/pp20 Date of release: 1995 Mar 20 Document order number: 9397 750 00112
Philips Semiconductors
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