Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA8718
8-bit high-speed analog-to-digital
converter
Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02
Philips Semiconductors
June 1994
Page 2
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
FEATURES
• 8-bit resolution
• Sampling rate up to 600 MHz
• ECL (100K family) compatible for digital inputs and
outputs
• Overflow/Underflow output
GENERAL DESCRIPTION
The TDA8718 is an 8-bit analog-to-digital converter (ADC)
designed for professional applications. The device
converts the analog input signal into 8-bit binary coded
digital words at a sampling rate of 600 MHz. It has an
effective bandwidth capability up to 150 MHz full-scale
sine wave. All digital outputs are ECL compatible.
• 50 Ω load drive capability
• Low input capacitance (5 pF typ.).
APPLICATIONS
• High speed analog-to-digital conversion
• Industrial instrumentation
• Data communication
• RF communication.
QUICK REFERENCE DATA
Measured over full voltage and temperature ranges, unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
EEA
V
EED
I
ref
I
EEA
I
EED
I
EEO(L)
I
EEO(H)
analog supply voltage −4.2 −4.5 −4.8 V
digital supply voltage −4.2 −4.5 −4.8 V
resistive ladder current R = 48 Ω 30 45 60 mA
analog supply current 30 42 54 mA
digital supply current 100 120 150 mA
LOW level output supply current RL = 50 Ω 40 70 90 mA
HIGH level output supply current RL = 50 Ω 155 170 185 mA
ILE DC integral linearity error −±0.7 ±1.0 LSB
DLE DC differential linearity error −±0.3 ±0.5 LSB
EB effective bits f
f
clk(max)
P
tot
maximum clock frequency 600 −−MHz
total power dissipation − 990 1250 mW
= 4.43 MHz; I
i
f
= 100 MHz
clk
= 4.43 MHz; I
f
i
f
= 100 MHz
clk
= 45 mA;
ref
= 45 mA;
ref
− 7.5 − bits
− 6.5 − bits
ORDERING INFORMATION
TYPE NUMBER
PINS PIN POSITION MATERIAL CODE
TDA8718K 28 PLCC28 plastic SOT261-2
June 1994 2
PACKAGE
Page 3
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
BLOCK DIAGRAM
handbook, full pagewidth
reference
voltage middle
reference
voltage TOP
analog
voltage input
reference
voltage BOTTOM
analog negative
supply voltage
VRM2
V
RT
5
V
3
I
V
1
RB
V
EEA
28
8
Ω
RESISTOR
LADDER
32
Ω
ANALOG SIGNAL
PROCESSING
8
Ω
27
AGND
analog ground digital ground
CLK CLK
CLOCK DRIVER
&
24
DGND
clock inputs
INPUT
AND
OUTPUT
LATCHES
&
DIGITAL
DECODING
digital negative
supply voltage
V
EED
2389
ECL OUTPUTS
12
OGND1
TDA8718
11
V
BB
18
10
13
14
15
16
17 D2
19
20
21
MBB854 - 2
OGND2
6
OF
D7
D6
D5
D4
D3
D1
D0
UF
output
ground
overflow
output
MSB
data outputs
LSB
underflow
output
Fig.1 Block diagram.
June 1994 3
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
PINNING
SYMB
OL
V
RB
V
RM
V
I
PIN DESCRIPTION
1 reference voltage BOTTOM
2 reference voltage MIDDLE decoupling
3 analog input voltage
n.c. 4 not connected
V
RT
5 reference voltage TOP
OF 6 overflow digital output
n.c. 7 not connected
CLK 8 clock input
CLK 9 complementary clock input
D7 10 digital output; bit 7 (MSB)
V
BB
11 ECL reference voltage
OGND1 12 output ground 1 (0 V)
D6 13 digital output; bit 6
D5 14 digital output; bit 5
D4 15 digital output; bit 4
D3 16 digital output; bit 3
D2 17 digital output; bit 2
OGND2 18 output ground 2 (0 V)
D1 19 digital output; bit 1
D0 20 digital output; bit 0 (LSB)
UF 21 underflow digital output
n.c. 22 not connected
V
EED
23 digital supply voltage (−4.5 V)
DGND 24 digital ground
n.c. 25 not connected
n.c. 26 not connected
AGND 27 analog ground
V
EEA
28 analog supply voltage (−4.5 V)
handbook, halfpage
V
5
RT
6
OF
7
n.c.
8
CLK
9
CLK
10
D7
V
11
BB
n.c.
4
I
V
3
V
V
V
2
AGND
1
28
27
EEA
RM
RB
TDA8718
12
13
14
15
16
17
D6
OGND1
D5D4D3
D2
Fig.2 Pin configuration.
n.c.
26
18
MBB850 - 2
OGND2
25
n.c.
24
DGND
V
23
EED
n.c.
22
21
UF
D0
20
19
D1
June 1994 4
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
EEA
V
EED
∆V
EE
V
I
∆V
clk(p-p)
I
O
T
stg
T
amb
T
j
analog supply voltage (pin 28) −7.0 +0.3 V
digital supply voltage (pin 23) −7.0 +0.3 V
supply voltage difference between V
and V
EED
EEA
input voltage (pin 3) referenced to AGND V
clock input voltage difference between
CLK and CLK pin 8 to pin 9
referenced to V
note 1
EED
;
−1.00 +1.0 V
EEA
0V
− 2.0 V
(peak-to-peak value)
output current for each digital output − 30 mA
storage temperature −55 +150 °C
operating ambient temperature 0 +70 °C
junction temperature − +150 °C
Note
1. The circuit has two clock inputs CLK and
CLK. Sampling takes place on the falling edge of the clock input signal;
CLK and CLK are two complementary signals.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-a
handbook, halfpage
R
∆
th j-a
(%)
0
10
20
30
40
thermal resistance from junction to ambient in free air 55 K/W
MBB851
50
Test conditions: PCB (2.24 ×2.24 ×0.062 inches).
LFPM = Linear Foot Per Minute.
Fig.3 Average effect of air flow on R
200 400 600 800
0 1000
airflow (LFPM)
.
th j-a
June 1994 5
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
CHARACTERISTICS
V
= −4.2 to −4.8 V; V
EEA
T
= 0 to +70 °C; typical values measured at V
amb
unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
EEA
V
EED
I
EEA
I
EED
I
EEO(L)
I
EEO(H)
analog supply voltage (pin 28) −4.2 −4.5 −4.8 V
digital supply voltage (pin 23) −4.2 −4.5 −4.8 V
analog supply current (pin 28) 30 42 54 mA
digital supply current (pin 23) 100 120 150 mA
LOW level output supply current RL = 50 Ω 40 70 90 mA
HIGH level output supply current RL = 50 Ω 155 170 185 mA
Reference voltages for the resistor ladder (see Table 1)
I
RT
V
V
R
TC
RB
RT
LAD
RLAD
reference current (pin 5) R = 48 Ω 30 45 60 mA
reference voltage BOTTOM (pin 1) − 48 Ω× IRT− V
reference voltage TOP (pin 5) − 0 − V
resistor ladder − 48 −Ω
temperature coefficient of the
resistor ladder
V
osB
V
osT
voltage offset BOTTOM note 1 − 8 Ω×IRT− mV
voltage offset TOP note 1 − 8 Ω×IRT− mV
Inputs
= −4.2 to −4.8 V; V
EED
EEA
to V
EEA
= −0.1 to +0.1 V; AGND and DGND shorted together;
EED
= −4.5 V, V
= −4.5 V and T
EED
= 25 °C;
amb
− 175 − MΩ/K
CLK
INPUT (PIN 8); CLK INPUT (PIN 9)
V
IL
V
IH
I
IL
I
IH
R
I
C
I
∆V
clk(p-p)
LOW level input voltage −−1.8 − V
HIGH level input voltage −−0.8 − V
LOW level input current V
HIGH level input current V
input resistance f
input capacitance f
clock input voltage difference
between CLK and CLK pin 8 to
pin 9 (peak-to-peak value)
ANALOG INPUT (PIN 3); NOTE 2
I
IL
I
IH
R
I
C
I
LOW level input current data output = 00 20 40 80 µA
HIGH level input current data output = FF 100 200 400 µA
input resistance − 10 − kΩ
input capacitance − 5 − pF
= −1.8 V − 0 −µA
clk
= −0.8 V − 120 −µA
clk
= 100 MHz − 1.5 − kΩ
clk
= 100 MHz − 3.5 − pF
clk
− 900 − mV
June 1994 6
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Outputs (RL = 50 Ω)
D
IGITAL 100K ECL OUTPUTS (D0 TO D7; OF; UF)
V
OL
V
OH
V
ECL
I
OL
I
OH
Switching characteristics
f
clk(max)
t
; t
r
f
Analog signal processing (f
LOW level output voltage Tamb = 25 °C −−1770 −1650 mV
HIGH level output voltage Tamb = 25 °C −1300 −1150 − mV
ECL reference voltage −1550 −1450 −1350 mV
LOW level output current 4 6 8 mA
HIGH level output current 10 20 25 mA
maximum clock frequency
600 −−MHz
(pins 8 and 9)
rise and fall times fi = 100 MHz −− 750 ps
= 500 MHz)
clk
H
ARMONICS (FULL SCALE)
h
1
h
2
h
3
fundamental harmonics fi = 100 MHz − 0 − dB
second harmonics fi = 100 MHz −−54 − dB
third harmonics fi = 100 MHz −−50 − dB
Transfer function
ILE DC integral linearity error −±0.7 ±1.0 LSB
DLE DC differential linearity error −±0.3 ±0.5 LSB
AILE AC integral linearity error note 3 −±0.9 ±1.5 LSB
EB effective bits f
BER bit error rate f
= 4.43 MHz, full scale;
i
I
= 45 mA; note 4;
ref
f
= 100 MHz; Fig.5
clk
= 100 MHz, full scale;
f
i
I
= 45 mA; note 4;
ref
f
= 500 MHz; Fig.6
clk
= 500 MHz;
clk
fi= 100 MHz;
− 7.5 − bits
− 6.5 − bits
− 10
−11
− times/
samples
Vi= ±8 LSB at code
128; 50% clock duty
cycle
Timing (f
t
ds
t
h
t
d
= 500 MHz; RL = 50 Ω; CL = 5 pF) note 5
clk
sampling delay −− 300 ps
output hold time 400 700 − ps
output delay time − 1300 1500 ps
June 1994 7
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
Notes to the “Characteristics”
1. Voltage offset BOTTOM (V
and the reference voltage BOTTOM (VRB) at T
reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at T
2. The analog input is not internally biased. It should be externally biased between VRT and VRB levels.
3. Full-scale sine wave; fi = 4.43 MHz; f
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
5. TDA8718 can only withstand one or two 100K ECL loads in order to work out timings at the maximum sampling
frequency. It is recommended to minimize the printed circuit-board load by implementing the load device as close as
possible to the TDA8718.
Table 1 Output coding and input voltage (typical values; referenced to AGND.
) is the difference between the analog input which produces data outputs equal to 00
osB
= 100 MHz.
clk
= 25 °C. Voltage offset TOP (V
amb
) is the difference between
osT
=25°C.
amb
STEP V
I
Underflow <−40 Ω×I
0 −40 Ω×I
RT
RT
O/UF
D5 D4 D3 D2 D1 D0
1000000
0000000
1 . 0000001
. . .. ....
. . .......
. . .......
254 . 0111110
BINARY OUTPUT BITS
255 −8 Ω×I
Overflow >−8Ω×I
handbook, full pagewidth
CLK
V
I
RT
RT
0111111
1111111
50 %
sample N
sample N + 1
sample N + 2
t
ds
DATA
OF/UF
DATA
N - 2
DATA
N - 1
Fig.4 Timing diagram.
June 1994 8
DATA
N
t
h
DATA
N + 1
50 %
MSA666
Page 9
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
amplitude
(dB)
100
120
0
20
40
60
80
0 6.27 12.5
Fig.5 Fast Fourier Transform (f
18.8
= 100 MHz; fi= 4.43 MHz).
clk
handbook, full pagewidth
Effective bits: 7.53; THD = −54.56dB.
Harmonic levels (dB): 2nd =−77.28; 3rd = −54.76; 4th = −71.43; 5th = −71.85; 6th = −105.50.
MBD879
43.925.1 31.3 37.6 50.2
f (MHz)
amplitude
(dB)
100
120
0
20
40
60
80
0 31.2 62.4
Fig.6 Fast Fourier Transform (f
93.5
= 500 MHz; fi= 100 MHz).
clk
handbook, full pagewidth
Effective bits: 6.60; THD = −48.60 dB.
Harmonic levels (dB): 2nd = −64.81; 3rd = −51.10; 4th = −65.05; 5th = −58.33; 6th = −54.07.
MBD880
218.0125.0 156.0 187.0 249.0
f (MHz)
June 1994 9
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
APPLICATION INFORMATION
V
handbook, full pagewidth
n.c.
V
V
I
RM
22
nF
V
RB
22
nF
EEA
AGND
22
nF
nF
22
n.c.
V
RT
OF
CLK
CLK
22 nF
n.c.
V
4321
5
6
7
8
9
D7
10
BB
11
12 13 14 15
OGND1
D6 D5 D4 D3 D2 OGND2
TDA8718
28
16
27 26
17 18
25
24
23
22
21
20
19
22 nF
D0
D1
MBB852 - 2
n.c.
n.c.
UF
DGND
V
EED
–2 V
Fig.7 Application diagram.
June 1994 10
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
PACKAGE OUTLINE
handbook, full pagewidth
seating plane
S
0.10 S
28
1
A
4
o
45
12.57
12.32
11.58
11.43
0.53
1.27
(24 x)
25
max
0.81
max
0.18 M
1.14
19
1826
12
R
0.64
10.92
9.91
2.16
max
11.58
11.43
12.57
12.32
Dimensions in mm.
1.22
1.07
5
11
0.51
max
Fig.8 Plastic leaded chip carrier, 28-leads; SOT261-2.
June 1994 11
(3x)
4.57
max
3.04
max
0.32
max
0.51 min
detail A
MBC654
Page 12
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
SOLDERING
Plastic leaded chip carriers
YWAVE
B
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
Y SOLDER PASTE REFLOW
B
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
R
IRON OR PULSE
-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between
270 and 320 °C. (Pulse-heated soldering is not
recommended for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
June 1994 12
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
NOTES
June 1994 13
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Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
NOTES
June 1994 14
Page 15
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8718
NOTES
June 1994 15
Page 16
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Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382.
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (662)398-0141, Fax. (662)398-3319.
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 2770, Fax. (0212)269 3094
United Kingdom: Philips Semiconductors Limited, P.O. Box 65,
Philips House, Torrington Place, LONDON, WC1E 7HD,
Tel. (071)436 41 44, Fax. (071)323 03 42
United States:INTEGRATED CIRCUITS:
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
SCD31 © Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/04/pp16 Date of release: June 1994
Document order number: 9397 734 40011
Philips Semiconductors
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