Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA8716
8-bit high-speed analog-to-digital
converter
Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02
1996 Aug 26
Page 2
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital
converter
FEATURES
• 8-bit resolution
• Sampling rate up to 120 MHz
• ECL (10 K family) compatible digital inputs and outputs
• Overflow/Underflow output
• Low power dissipation
• Low input capacitance (13 pF typ.).
APPLICATIONS
• High speed analog-to-digital convertion
• Video signal digitizing
• Radar pulse analysis
• Transient signal analysis
• High energy physics research
• Medical systems
• Industrial instrumentation.
TDA8716
GENERAL DESCRIPTION
The TDA8716 is an 8-bit high-speed Analog-to-Digital
Converter (ADC) designed for HDTV and professional
applications. The device converts the analog input signal
into 8-bit binary coded digital words at a sampling rate of
120 MHz. All digital outputs are ECL compatible.
QUICK REFERENCE DATA
Measured over full voltage and temperature ranges, unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
V
I
EEA
I
EED
I
EEO
V
V
EEA
EED
RB
RT
analog supply voltage −5.45 −5.2 −4.95 V
digital supply voltage −5.45 −5.2 −4.95 V
analog supply current − 50 55 mA
digital supply current − 100 110 mA
output supply current RL = 2.2 kΩ−20 25 mA
reference voltage BOTTOM −−3.130 − V
reference voltage TOP −−1.870 − V
ILE DC integral linearity error see Fig.8 −±0.5 ±1 LSB
DLE DC differential linearity error see Fig.9 −±0.25 ±0.45 LSB
EB effective bit f
f
CLK
P
tot
maximum clock frequency 120 −−MHz
total power dissipation excluding load − 780 900 mW
= 20 MHz;
i
f
= 100 MHz
CLK
− 7 − bits
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
TDA8716 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
TDA8716T SO32L plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
1996 Aug 26 2
Page 3
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
BLOCK DIAGRAM
handbook, full pagewidth
reference top
reference middle
reference bottom
CLK input
CLKinput
voltage
voltage
voltage
analog input
8
10
9
6
1
CLOCK
BUFFER
2
LSB ANALOG
PROCESSING
folding and interpolation
SAMPLE LATCHES
DIGITAL PROCESSING
LSB BINARY
ENCODER
63
MSB ANALOG
PROCESSING
LATCHES
MSB BINARY
ENCODER
7
analog ground
11
5
analog negative
supply voltage
(– 5.2 V)
13
digital ground
24
digital negative
3
supply voltage
12
(– 5.2 V)
4
two's complement
output select
TDA8716
14 15 16 17 18 20 21 22 23
Fig.1 Block diagram; TDA8716.
1996 Aug 26 3
OUTPUT LATCHES
ECL BUFFERS
digital outputs
D0 to D7
IN range
MCD265 - 2
19
output ground
supply voltage
(0 V)
Page 4
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
PINNING TDA8716
SYMBOL PIN DESCRIPTION
CLK 1 complementary clock input
CLK 2 clock input
V
EED1
C
PLT2
V
EEA
V
RB
AGND1 7 analog ground 1
V
I
V
RM
V
RT
AGND2 11 analog ground 2
V
EED2
DGND1 13 digital ground 1
D0 14 digital output (LSB)
D1 15 digital output
D2 16 digital output
D3 17 digital output
D4 18 digital output
OGND 19 output ground supply voltage (0 V)
D5 20 digital output
D6 21 digital output
D7 22 digital output (MSB)
IR 23 IN range
DGND2 24 digital ground 2
3 digital negative supply voltage
(−5.2 V)
4 two's complement output select
(active HIGH)
5 analog negative supply voltage
(−5.2 V)
6 reference voltage BOTTOM
8 analog input
9 reference voltage MIDDLE
decoupling
10 reference voltage TOP
12 digital negative supply voltage
(−5.2 V)
handbook, halfpage
Fig.2 Pin configuration; TDA8716.
CLK
CLK
V
EED1
C
PLT2
V
EEA
V
RB
AGND1
V
RM
V
RT
AGND2
V
EED2
1
2
3
4
5
6
TDA8716
7
V
8
I
9
10
11
12
MCD259
24
23
22
21
20
19
18
17
16
15
14
13
DGND2
IR
D7
D6
D5
OGND
D4
D3
D2
D1
D0
DGND1
1996 Aug 26 4
Page 5
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
PINNING TDA8716T
SYMBOL PIN DESCRIPTION
CLK 1 complementary clock input
CLK 2 clock input
V
EED1
n.c. 4 not connected
n.c. 5 not connected
C
PLT2
V
EEA
V
RB
AGND1 9 analog ground 1
V
I
V
RM
n.c. 12 not connected
n.c. 13 not connected
V
RT
AGND2 15 analog ground 2
V
EED2
DGND1 17 digital ground 1
D0 18 digital output (LSB)
D1 19 digital output
n.c. 20 not connected
n.c. 21 not connected
D2 22 digital output
D3 23 digital output
D4 24 digital output
OGND 25 output ground supply voltage (0 V)
D5 26 digital output
D6 27 digital output
n.c. 28 not connected
n.c. 29 not connected
D7 30 digital output (MSB)
IR 31 IN range
DGND2 32 digital ground 2
3 digital negative supply voltage
(−5.2 V)
6 two's complement output select
(active HIGH)
7 analog negative supply voltage
(−5.2 V)
8 reference voltage BOTTOM
10 analog input
11 reference voltage MIDDLE
decoupling
14 reference voltage TOP
16 digital negative supply voltage
(−5.2 V)
handbook, halfpage
Fig.3 Pin configuration; TDA8716T.
CLK
CLK
V
EED1
n.c.
n.c.
C
PLT2
V
EEA
V
RB
AGND1
V
V
RM
n.c.
n.c.
V
RT
AGND2
V
EED2
1
2
3
4
5
6
7
8
TDA8716T
9
10
I
11
12
13
14
15
16
MBC742 - 2
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
DGND2
IR
D7
n.c.
n.c.
D6
D5
OGND
D4
D3
D2
n.c.
n.c.
D1
D0
DGND1
1996 Aug 26 5
Page 6
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
EEA
V
EED1,VEED2
− V
V
EEA
V
− V
EEA
V
I
V
CLK; CLK(p-p)
I
O
T
stg
T
amb
T
j
EED1
EED2
analog supply voltage −7.0 +0.3 V
digital supply voltage −7.0 +0.3 V
;
supply voltage differences −1+1V
input voltage referenced to
V
EEA
0V
AGND
input voltage for differential clock drive
note 1 − 2.0 V
(peak-to-peak value)
output current (each output stage) − 10 mA
storage temperature −55 +150 °C
operating ambient temperature 0 +70 °C
junction temperature − +150 °C
Note
1. The circuit has two clock inputs: CLK and
CLK. Sampling takes place on the rising edge of the clock input signal:
CLK and CLK are two's complementary ECL signals.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
from junction to ambient in free air
SOT101 35 K/W
SOT287 (see Fig.4) 65 K/W
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
1996 Aug 26 6
Page 7
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
CHARACTERISTICS
V
= −4.95 to −5.45 V; V
EEA
T
= 0 to +70 °C; unless otherwise specified. (Typical values taken at V
amb
=25°C).
T
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
EEA
V
EED1,VEED2
I
EEA
I
EED1,IEED2
I
EE
V
diff
analog supply voltage −5.45 −5.2 −4.95 V
digital supply voltage −5.45 −5.2 −4.95 V
analog supply current − 50 55 mA
digital supply current − 100 110 mA
output supply current RL= 2.2 kΩ−20 25 mA
supply voltage differential V
Reference voltages for the resistor ladder
V
V
V
V
V
V
RB
RT
ref
OB
OT
I(p-p)
reference voltage BOTTOM −3.5 −3.13 − V
reference voltage TOP −−1.87 −1.5 V
reference voltage differential VRT− V
voltage offset BOTTOM note 1 − 130 − mV
voltage offset TOP note 1 − 130 − mV
input voltage amplitude
(peak-to-peak value)
I
ref
R
TC
LAD
RL
reference current − 15 − mA
resistor ladder − 85 −Ω
temperature coefficient of the
resistor ladder
EED1
, V
= −4.95 to −5.45 V; AGND, DGND and OGND shorted together;
EED2
= −5.2 V; V
EEA
− V
RB
EED1
; V
EEA
− V
EEA
−0.5 0 +0.5 V
EED2
− 1.26 − V
EED1
0.95 1.0 1.5 V
− 0.18 −Ω/K
, V
EED2
= −5.2 V;
Inputs
CLK and
V
IL
V
IH
I
IL
I
IH
R
I
C
I
V
CLK(p-p)
CLK input
LOW level input voltage −1850 −1770 −1650 mV
HIGH level input voltage −960 −880 −810 mV
LOW level input current V
HIGH level input current V
= −1.77 V − 1 −µA
CLK
= −0.88 V − 10 −µA
CLK
input resistance − 20 − kΩ
input capacitance − 2 − pF
differential clock input
V
− V
CLK
CLK
(peak-to-peak value)
Analog input; note 2
I
IB
I
IT
R
I
C
I
input current BOTTOM VRB= −3.13 V − 0 −µA
input current TOP VRT= −1.87 V − 170 −µA
input resistance − 7 − kΩ
input capacitance − 13 20 pF
1996 Aug 26 7
− 900 − mV
Page 8
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Outputs (RL= 2.2 kΩ)
Digital 10K ECL outputs (D0 to D7; IR)
V
OL
V
OH
I
OL
I
OH
Timing (f
t
ds
t
HD
t
d
t
aj
Switching characteristics
f
; f
CLK
CLK
Analog signal processing (f
G
diff
φ
diff
Harmonics (full scale); f
f1 fundamental − 0 − dB
f2 even harmonics −−60 − dB
f3 odd harmonics −−50 − dB
LOW level output voltage −1850 −1770 −1600 mV
HIGH level output voltage −960 −880 −810 mV
LOW level output current − 1.8 4.0 mA
HIGH level output current − 2.0 4.0 mA
= 100 MHz; RL= 2.2 kΩ; see Fig.5)
CLK
sampling delay − 13ns
output hold time 4 −−ns
output delay time note 3
= 3.3 pF −−7.5 ns
C
L
= 7.5 pF −−9ns
C
L
aperture jitter − 15 − ps
maximum clock frequency 120 −−MHz
= 100 MHz)
CLK
differential gain note 4 − 0.3 − %
differential phase note 4 − 0.4 −°C
= 10 MHz; f
i
= 100 MHz
CLK
Transfer function
ILE DC integral linearity error −±0.5 ±1 LSB
DLE DC differential linearity error −±0.25 ±0.45 LSB
AILE AC integral linearity error note 4 −±1±1.5 LSB
EB effective bits Figs 13 and 14; note 5;
= 100 MHz
f
CLK
= 4.43 MHz see Fig.10 − 7.7 − bits
f
i
= 10 MHz see Fig.11 − 7.5 − bits
f
i
= 20 MHz see Fig.12 − 7.0 − bits
f
i
= 30 MHz − 6.5 − bits
f
i
BER bit error rate f
= 100 MHz;
CLK
fi= 10 MHz; Vi= ±8 LSB at
− 10
−11
− times/
samples
code 128; 50% clock duty
factor
1996 Aug 26 8
Page 9
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
Notes
1. Voltage offset BOTTOM (VOB) is the difference between the analog input which produces data outputs equal to 00
and the reference voltage BOTTOM (VRB), at T
reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at T
2. The analog input is not internally biased. It should be externally biased between VRB and VRT levels.
3. The TDA8716 can only withstand one or two 10K or 100K ECL loads in order to work-out timings at the maximum
sampling frequency. It is therefore recommended to minimize the printed-circuit board load by implementing the load
device as close as possible to the TDA8716.
4. Full-scale sinewave; fi= 4.43 MHz; f
CLK
, f
CLK
5. Effective bits are obtained via a Fast Fourier Transformer (FFT) treatment taking 4 K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to SNR: SNR = EB (dB) × 6.02 + 1.76.
=25°C. Voltage offset TOP (VOT) is the difference between
amb
amb
= 100 MHz.
=25°C.
percent
change
th j–a
0
)
–10
–20
–30
–40
–50
–60
0 200 400 600 800
handbook, full pagewidth
(R
SOL
air flow (LFPM)
MEA540
1000
Fig.4 Average effect of air flow on thermal resistance.
1996 Aug 26 9
Page 10
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
Table 1 Output coding (CPLT2 HIGH)
BINARY
STEP VI (TYP.)
OUTPUTS
D7 to D0
Underflow <−3 V 00000000 0
0 −3 V 00000000 1
1 . 00000001 1
. . ...... .
. . ...... .
. . ...... .
254 . 11111110 1
255 −2 V 11111111 1
Overflow >−2 V 11111111 0
IR
Table 2 Two's complement coding
C
PLT2
) non inverted
1 (V
IH
) inverted
0 (V
IL
D7 (MSB)
handbook, full pagewidth
CLK
ANALOG
INPUT
V
l
DATA
OUTPUT
D0 - D7
sample N
DATA
N - 1
t
d
sample N + 1
t
HD
DATA
N
Fig.5 Timing diagram.
sample N + 2
DATA
N + 1
MSA654
50 %
50 %
1996 Aug 26 10
Page 11
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
APPLICATION INFORMATION
Additional application information will be supplied upon request, please quote reference number FTV/AN 9109.
handbook, full pagewidth
V
(– 5.2 V)
EED1
C
PLT2
V (– 5.2 V)
EEA
V
(– 3.13 V)
RB
analog input
V (– 1.87 V)
RT
(– 5.2 V)
V
EED2
CLK
CLK
AGND1
AGND2
100 nF
100 nF
100 nF
DGND2
1
2
3
4
5
6
TDA8716
7
8
V
RM
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
IR
D7
D6
D5
D4
D3
D2
D1
D0
DGND1
OGND (0 V)
V
EED
MCD260 - 2
Typical value for resistors =2.2 kΩ.
Lower resistor values can be used down to 500 Ω to obtain higher sampling frequencies in the 150 MSPS range (limited by td and tHD timings). In this
configuration a DC shift of the ECL output levels V
VRB, VRT and VM are decoupled to AGND.
Analog, digital and output supplies should be separated and decoupled.
The external voltage regulator must be constructed in such a way that a good supply voltage ripple rejection is achieved with respect to the LSB value.
and VOH will occur.
OL
Fig.6 Application diagram; TDA8716.
1996 Aug 26 11
Page 12
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
handbook, halfpage
CLK; CLK
handbook, halfpage
DGND
V
CCD1
DGND
C
PLT2
13, 24
1, 2
3
13, 24
4
MCD261
handbook, halfpage
handbook, halfpage
AGND
AGND
V
V
RT
V
RM
CCA
7, 11
8
V
I
5
7, 11
10
9
x 80
MCD262 - 1
resistor
ladder
V
CCD2
12
handbook, halfpage
V
RB
MCD263
V
CCA
AGND
V
RT
V
RM
V
RB
V
CCA
7, 11
10
9
6
5
resistor
MCD264
ladder
Fig.7 Internal pin configuration diagram.
6
5
MCD264
1996 Aug 26 12
Page 13
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
handbook, full pagewidth
1.0
LSB
0.5
0
–0.5
–1.0
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256
MEA537
CODE
Fig.8 DC Integral Linearity Error (ILE).
handbook, full pagewidth
1.0
LSB
0.5
0
–0.5
–1.0
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256
Fig.9 DC Differential Linearity Error (DLE).
1996 Aug 26 13
MEA536
CODE
Page 14
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
amplitude
(dB)
–100
–120
0
–20
–40
–60
–80
0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 50.0
frequency (MHz)
MEA535
Effective bits: 7.74; Harmonic levels (in dB): 2nd = −69.34; 3rd = −58.85; 4th = −82.55; 5th = −68.16 and 6th = −63.01.
Fig.10 Fast fourier transformer (f
= 100 MHz; fi= 4.43 MHz).
CLK
1996 Aug 26 14
Page 15
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
amplitude
(dB)
–20
–40
–60
–80
–100
–120
0
0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 50.0
frequency
(MHz)
MEA534
Effective bits: 7.57; Harmonic levels (in dB): 2nd = −82.07; 3rd = −61.90; 4th = −75.70; 5th = −65.61 and 6th = −72.50.
Fig.11 Fast fourier transformer (f
= 100 MHz; fi= 10 MHz).
CLK
1996 Aug 26 15
Page 16
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
0
amplitude
(dB)
–20
–40
–60
–80
–100
–120
0 6.43 12.9 19.3 25.7 32.2 38.6 45.0 51.5
Effective bits: 7.04; Harmonic levels (in dB): 2nd = −61.36; 3rd = −56.66; 4th = −61.97; 5th = −62.79 and 6th = −61.52.
Fig.12 Fast fourier transformer (f
= 100 MHz; fi= 20 MHz).
CLK
MEA533
frequency (MHz)
handbook, full pagewidth
8
effective
bits
7
6
5
4
5101520253035400
4.43 MHz
Fig.13 Typical effective bit as a function of input signal at f
1996 Aug 26 16
f (MHz)
= 100 MHz.
CLK
MEA539
i
Page 17
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
effective
bits
8
7.5
7
6.5
6.0
0 10 20 30 40 50 60 70 80 90 100 110 120
handbook, full pagewidth
Fig.14 Typical effective bits as a function of clock frequency at fi= 10 MHz.
MEA538
f (MHz)
clock
1996 Aug 26 17
Page 18
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
PACKAGE OUTLINES
DIP24: plastic dual in-line package; 24 leads (600 mil)
D
seating plane
L
Z
24
pin 1 index
e
b
SOT101-1
M
E
A
2
A
A
1
w M
b
1
13
E
c
(e )
1
M
H
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT101-1
1 2
min.
max.
0.066
0.051
IEC JEDEC EIAJ
051G02 MO-015AD
1.7
1.3
b
b
1
0.53
0.38
0.021
0.015
0.32
0.23
0.013
0.009
REFERENCES
cD E e M
32.0
31.4
1.26
1.24
1996 Aug 26 18
12
14.1
13.7
0.56
0.54
(1)(1)
e
L
3.9
15.80
3.4
15.24
EUROPEAN
PROJECTION
M
0.62
0.60
E
17.15
15.90
0.68
0.63
1
0.15
0.13
H
w
0.252.54 15.24
0.010.10 0.60
ISSUE DATE
92-11-17
95-01-23
Z
max.
2.25.1 0.51 4.0
0.0870.20 0.020 0.16
(1)
Page 19
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
SO32: plastic small outline package; 32 leads; body width 7.5 mm
D
y
Z
32
pin 1 index
1
e
17
16
w M
b
p
SOT287-1
E
c
H
E
A
2
A
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
A
max.
2.65
0.10
OUTLINE
VERSION
SOT287-1
A
1
0.3
0.1
0.012
0.004
A2A3b
2.45
0.25
2.25
0.096
0.01
0.086
IEC JEDEC EIAJ
0.49
0.36
0.02
0.01
p
0.27
0.18
0.011
0.007
(1)E(1)
cD
20.7
20.3
0.81
0.80
REFERENCES
7.6
7.4
0.30
0.29
1.27
0.050
1996 Aug 26 19
eHELLpQZywv θ
10.65
10.00
0.42
0.39
1.4
0.055
1.1
0.4
0.043
0.016
1.2
1.0
0.047
0.039
0.25 0.1
0.25
0.010.01
EUROPEAN
PROJECTION
0.004
(1)
0.95
0.55
0.037
0.022
ISSUE DATE
92-11-17
95-01-25
o
8
o
0
Page 20
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
OLDERING BY DIPPING OR BY WA VE
S
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
EPAIRING SOLDERED JOINTS
R
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Aug 26 20
Page 21
Philips Semiconductors Product specification
8-bit high-speed analog-to-digital converter TDA8716
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Aug 26 21
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