Datasheet tda8579 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8579

Dual common-mode rejection
differential line receiver

Product specification
Supersedes data of January 1994
File under Integrated Circuits, IC01

1995 Dec 15

Philips Semiconductors Product specification

Dual common-mode rejection

TDA8579

differential line receiver

FEATURES

• Excellent common-mode rejection, up to high
frequencies

• Elimination of source resistance dependency in the
common-mode rejection

• Few external components

• High supply voltage ripple rejection

• Low noise

• Low distortion

• All pins protected against electrostatic discharge

• AC and DC short-circuit safe to ground and V

CC

• Fast DC settling.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

G

v

supply voltage 5.0 8.5 18 V
supply current VCC= 8.5 V − 11 14 mA

voltage gain −0.5 0 +0.5 dB
SVRR supply voltage ripple rejection 55 60 − dB
V

no

Z

 input impedance 100 240 − kΩ

i

CMRR common-mode rejection ratio R

noise output voltage − 3.7 5.0 µV

s

GENERAL DESCRIPTION

The TDA8579 is a two channel differential amplifier with
0 dB gain and low distortion. The device has been
primarily developed for car radio applications where long
connections between signal sources and amplifiers (or
boosters) are necessary and where ground noise has to be
eliminated. The device is intended to be used to receive
line inputs in audio applications that require a high level of
common-mode rejection. The device is contained in an
8-pin small outline (SO) or dual in-line (DIP) package.

=0Ω−80 − dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8579 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TDA8579T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

1995 Dec 15 2

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

BLOCK DIAGRAM

V

CC

TDA8579

GND

8

7

V

CC

4

6

5

MBD230

INL

INR

1

2

IN

3

Fig.1 Block diagram.

OUTL

SVRR

OUTR

TDA8579

FUNCTIONAL DESCRIPTION

The TDA8579 contains two identical differential amplifiers
with a voltage gain of 0 dB. The device is intended to
receive line input signals for audio applications. The
TDA8579 has a very high level of common-mode rejection
and thus eliminates ground noise. The common-mode
rejection remains constant up to high frequencies (the
amplifier gain is fixed at 0 dB). The inputs have a high input
impedance. The output stage is a class AB stage with a
low output impedance. For a large common-mode
rejection, also at low frequencies, an electrolytic capacitor
connected to the negative input is advised. Because the
input impedance is relatively high, this results in a large
settling time of the DC input voltage. Therefore a
quick-charge circuit is included to charge the input
capacitor within 0.2 seconds.

All input and output pins are protected against high
electrostatic discharge conditions (4000 V, 150 pF, 150 Ω).

PINNING

SYMBOL PIN DESCRIPTION

INL+ 1 positive input left
IN− 2 common negative input
INR+ 3 positive input right
SVRR 4 half supply voltage
GND 5 ground
OUTR 6 output right
OUTL 7 output left
V

CC

8 supply voltage

INL

1

IN

2

INR

SVRR

TDA8579

3
4

MBD231

Fig.2 Pin configuration.

V

8

CC

OUTL

7

OUTR

6
5

GND

1995 Dec 15 3

Philips Semiconductors Product specification

Dual common-mode rejection

TDA8579

differential line receiver

LIMITING VALUES

in accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

I

ORM

V

sc

T

stg

T

amb

T

j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

supply voltage operating − 18 V
repetitive peak output current − 40 mA
AC and DC short-circuit safe voltage − 18 V
storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C
maximum junction temperature − +150 °C

thermal resistance from junction to ambient in free air

TDA8579 (DIP8) 110 K/W
TDA8579T (SO8) 160 K/W

1995 Dec 15 4

Philips Semiconductors Product specification

Dual common-mode rejection

TDA8579

differential line receiver

CHARACTERISTICS

V

= 8.5 V; T

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

V

O

t

set

G

v

α

cs

 channel unbalance −−0.5 dB

∆G

v

f

L

f

H

 input impedance 100 240 − kΩ

Z

i

Z

 output impedance −−10 Ω

o

V

i(max)

V

no

V

CM(rms)

CMRR common-mode rejection ratio R

SVRR supply voltage ripple rejection note 5 55 65 − dB

THD total harmonic distortion V

THD

max

=25°C; f = 1 kHz; measured in test circuit of Fig.3; unless otherwise specified.

amb

supply voltage 5.0 8.5 18 V
supply current − 11 14 mA
DC output voltage note 1 − 4.3 − V
DC input voltage settling time − 0.2 − s
voltage gain −0.5 0 +0.5 dB
channel separation Rs=5kΩ 70 80 − dB

low frequency roll-off −1 dB; note 2 20 −−Hz
high frequency roll-off −1dB 20 −−kHz

maximum input voltage THD = 1% − 2.0 − V
noise output voltage Rs=0Ω; note 3 − 3.7 5.0 µV
common-mode input voltage

−−1.0 V

(RMS value)

=5kΩ 66 70 − dB

s

R

=0Ω; note 4 − 80 − dB

s

note 6 − 60 − dB

=1V; − 0.02 − %

i

V

i

=1V;

−−0.1 %

f = 20 Hz to 20 kHz

total harmonic distortion at

Vi=1V; RL= 150 Ω− − 1%

maximum output current

Notes

1. The DC output voltage with respect to ground is approximately 0.5V

CC

.

2. The frequency response is externally fixed by the input coupling capacitors.

3. The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).

4. The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in accordance with the
test circuit (see Fig.3) while V

INL

and V

are short-circuited. Frequencies between 100 Hz and 100 kHz.

INR

5. The ripple rejection is measured at the output, with Rs=2kΩ, f = 1 kHz and a ripple amplitude of 2 V (p-p).

6. The ripple rejection is measured at the output, with Rs= 0 to 2 kΩ, f = 100 Hz to 20 kHz and a maximum ripple
amplitude of 2 V (p-p).

1995 Dec 15 5

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

220 nF

R

s

V

INL

5 k

Ω

22 µ

F

V

CM

V

INR

220 nF

R

s

Ω5 k

1

2

3

TDA8579

SVRR

TDA8579

8.5 V

R
10 k

MBD232

100 nF

L

Ω

R
10 k

OUTL

OUTR

L

Ω

8

V

5

CC

2.2 µ

47 µ

2.2 µ

F

F

F

7

4

6

10

THD

(%)

10

10

Fig.3 Test and application circuit.

1

2

3

10

2

10

3

10

4

10

f (Hz)

MBD215

5

10

Fig.4 Total harmonic distortion as a function of frequency; Vi= 1 V (RMS).

1995 Dec 15 6

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

0

CMR

(dB)

20

40

60

80

100

10

(1) Rs=5kΩ.
(2) Rs=2kΩ.
(3) Rs=0kΩ.

2

10

TDA8579

MBD216

(1)

(2)

(3)

3

10

4

10

f (Hz)

5

10

THD

(%)

10

10

10

Fig.5 Common-mode rejection ratio as a function of frequency; VCM= 1 V (RMS).

1

1

2

3

2

1010

3

10

V (mV)

i (rms)

MBD213

4

10

Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.

1995 Dec 15 7

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

40

CMR

(dB)

50

60

70

80

90

100 300 500 700 900

1100

V (mV)

CM (rms)

TDA8579

MBD214

1300

Fig.7 Common-mode rejection ratio as a function of common-mode input voltage; f = 1 kHz (Rs=0Ω).

0

CMR

(dB)

20

40

(1)

60

80

100

10

(1) C2 = 22 µF.
(2) C2 = 47 µF.
(3) C2 = 100 µF.

(2)
(3)

2

10

3

10

4

10

f (Hz)

MBD211

5

10

Fig.8 Common-mode rejection ratio as a function of frequency; VCM= 1 V (RMS).

1995 Dec 15 8

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

30

SVR
(dB)

40

50

60

70

10

2

10

TDA8579

MBD212

3

10

f (Hz)

4

10

Fig.9 Supply voltage ripple rejection as a function of frequency; V

= 2 V (p-p), Rs=2kΩ.

ripple

1995 Dec 15 9

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

seating plane

A

L

Z

e

b

8

1

w M

b

1

b

2

5

TDA8579

SOT97-1

M

E

A

2

A

c

(e )

1

M

H

pin 1 index

E

1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT97-1

12

min.

max.

050G01 MO-001AN

b

1.73

1.14

0.068

0.045

IEC JEDEC EIAJ

0.021

0.015

b

1

0.53

0.38

4

0 5 10 mm

scale

b

2

0.36

1.07

0.23

0.89

0.014

0.042

0.009

0.035

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

0.39

0.33

H

8.3

w

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

92-11-17
95-02-04

(1)

Z

1995 Dec 15 10

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

5

TDA8579

SOT96-1

E

H

E

A

X

v M

A

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

4

w M

b

p

0 2.5 5 mm

scale

(1)E(2)

cD

5.0

4.8

0.20

0.19

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

2

A

6.2

5.8

0.244

0.228

Q

3

A

θ

0.25 0.10.25

0.010.010.041 0.004

(1)

0.7

0.3

0.028

0.012

o

8

o

0

L

p

L

0.7

0.6

0.028

0.024

(A )

1

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE
VERSION

SOT96-1

IEC JEDEC EIAJ

076E03S MS-012AA

REFERENCES

1995 Dec 15 11

EUROPEAN

PROJECTION

ISSUE DATE

95-02-04
97-05-22

Philips Semiconductors Product specification

Dual common-mode rejection
differential line receiver

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TDA8579

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1995 Dec 15 12

Philips Semiconductors Product specification

Dual common-mode rejection

TDA8579

differential line receiver

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1995 Dec 15 13