Datasheet TDA8551T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8551

1 W BTL audio amplifier with digital
volume control

Product specification
Supersedes data of 1997 May 07
File under Integrated Circuits, IC01

1998 Feb 23

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

FEATURES

• One pin digital volume control

• Volume setting with UP/DOWN pulses

• Flexibility in use

• Few external components

• Low saturation voltage of output stage

• standby mode controlled by CMOS compatible levels

GENERAL DESCRIPTION

The TDA8551; TDA8551T is a one channel 1 W
Bridge-Tied Load (BTL) audio power amplifier capable of
delivering 1 W output power to an 8 Ω load at THD = 10%
using a 5 V power supply. The circuit contains a BTL
power amplifier, a digital volume control and standby/mute
logic. The TDA8551T comes in an 8 pin SO package and
the TDA8551 in a 8 pin DIP package.

• Low standby current

• No switch-on/switch-off plops

• High supply voltage ripple rejection

• Protected against electrostatic discharge

• Outputs short circuit safe to ground, V

P

and across the

APPLICATIONS

• Portable consumer products

• Personal computers

• Telephony.

load

• Thermally protected.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

q

I

stb

P

o

G

v

n

vol

THD total harmonic distortion P

supply voltage 2.7 5 5.5 V
quiescent current VP=5V − 610mA
standby current −−10 µA
output power THD = 10%; RL=8Ω; VP= 5 V 1 1.4 − W
voltage gain −60 − +20 dB
number of volume steps − 64 −

= 0.5 W − 0.15 − %

o

SVRR supply voltage ripple rejection 48 −−dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8551T SO8 plastic small outline package; 8leads; body width 3.9 mm SOT96-1
TDA8551 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Feb 23 2

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

BLOCK DIAGRAM

handbook, full pagewidth

UP/DOWN

SVR

1

4

IN

3

OPERATING

INTERFACE

downup

UP/DOWN
COUNTER

VOLUME

CONTROL

STANDBY/

MUTE/

27

MODE

V

P

15 kΩ

15 kΩ

GND

TDA8551

V

P

6

MASTER

20 kΩ

5 kΩ

R
R

SLAVE

MGK363

8

OUT+

5

OUT−

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

UP/DOWN 1 digital trinary input for volume

control

MODE 2 digital trinary input for mode

selection (standby , mute, operating)

SVR 3 half supply voltage, decoupling

ripple rejection
IN 4 audio input
OUT− 5 negative loudspeaker output

terminal
V

P

6 supply voltage
GND 7 ground
OUT+ 8 positive loudspeaker output

terminal

1998 Feb 23 3

handbook, halfpage

UP/DOWN

1
2

TDA8551

3

SVR

4

IN

MGK362

Fig.2 Pin configuration.

8
7
6
5

OUT+
GNDMODE
V

P

OUT−

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

FUNCTIONAL DESCRIPTION

The TDA8551; TDA8551T is a 1 W BTL audio power
amplifier capable of delivering 1 W output power to an 8 Ω
load at THD = 10% using a 5 V power supply. The gain of
the amplifier can be set by the digital volume control. In the
maximum volume setting the gain is 20 dB. Using the
MODE pin the device can be switched to the standby
condition, the mute condition and the normal operating
condition. The device is protected by an internal thermal
shutdown protection mechanism.

Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary CMOS output stage. The total
voltage loss for both output power MOS transistors is
within 1 V and with a 5 V supply and an 8 Ω loudspeaker
an output power of 1 W can be delivered. The total gain of
this power amplifier is internally fixed at 20 dB.

Volume control

The volume control operates as a digital controlled
attenuator between the audio input pin and the power
amplifier. In the maximum volume control setting the
attenuation is 0 dB and in the minimum volume control
setting the typical attenuation is 80 dB. The attenuation
can be set in 64 steps by the UP/DOWN pin.
This UP/DOWN pin is a trinary input:

• Floating UP/DOWN pin: volume remains unchanged

• Negative pulses: setting volume towards minimum

• Positive pulses: setting volume towards maximum.

Each pulse on the UP/DOWN pin results in a change in
gain of 80/64 = 1.25 dB (typical value). In the basic
application the UP/DOWN pin is switched to ground or V
by a double push-button. When the supply voltage is
initially connected, after a complete removal of the supply,
the initial state of the volume control is an attenuation of
40 dB (low volume), so the gain of the total amplifier is

−20 dB. After powering-up, some positive pulses have to
be applied to the UP/DOWN pin for turning up to listening
volume. When the device is switched with the MODE
select pin to the mute or the standby condition, the volume
control attenuation setting remains on its value, assumed
that the voltage on pin VP does not fall below the minimum
supply voltage. After switching the device back to the
operation mode, the previous volume setting is
maintained.

Mode select pin

The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is between V
and VP− 0.5 V. At a mode select voltage level of less than

0.5 V the amplifier is fully operational. In the range
between 1 V and VP− 1.4 V the amplifier is in the mute
condition. The mute condition is useful for using it as a ‘fast
mute’; in this mode output signal is suppressed, while the
volume setting remains at its value. It is advised to keep
the device in the mute condition while the input capacitor
is being charged. This can be done by holding the MODE
pin at a level of 0.5VP, or by waiting approximately 100 ms
before giving the first volume-UP pulses.

P

P

1998 Feb 23 4

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

I

I

ORM

T

stg

T

amb

V

sc

P

tot

QUALITY SPECIFICATION

supply voltage −0.3 +5.5 V
input voltage −0.3 VP+ 0.3 V
repetitive peak output current − 1A
storage temperature −55 +150 °C
operating temperature −40 +85 °C
AC and DC short-circuit safe voltage − 5.5 V
maximum power dissipation SO8 − 0.8 W

DIP8 − 1.2 W

Quality according to
the

“Quality reference handbook”

“SNW-FQ-611 part E”

, order number 9397 750 00192.

, if this type is used as an audio amplifier. Quality specifications are listed in

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SO8 160 K/W
DIP8 100 K/W

1998 Feb 23 5

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

CHARACTERISTICS

V

=5V; T

P

test circuit of Fig.4.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DC characteristics

V

P

I

q

I

stb

V

O

V

OUT+

Mode select pin

V

MODE

I

MODE

α mute attenuation note 3 80 90 − dB

=25°C; RL=8Ω; V

amb

supply voltage 2.7 5 5.5 V
quiescent current RL= ∞; note 1 − 610 mA
standby current V
DC output voltage note 2 − 2.5 − V

− V

 differential output offset −−50 mV

OUT−

input voltage standby mode VP− 0.5 − V

input current 0 < V

= 0 V; total gain setting at +7 dB (unless otherwise specified); measured in

MODE

MODE=VP

mute mode 1 − V

−−10 µA

P
P

operating mode 0 − 0.5 V

MODE<VP

−−100 nA

V

− 1.4 V

Volume control

t

rep

V

th(UP)

V

float(max)

V

float(min

V

th(DOWN)

I

UP/DOWN

G

v(max)

) UP/DOWN pin floating low level 1.0 −− V

pulse repetition time 100 −− ns
UP/DOWN pin up threshold level 4.2 − V

P

V

UP/DOWN pin floating high level −−3.4 V

UP/DOWN pin down threshold level 0 − 0.6 V
input current UP/DOWN pin 0 < V
maximum voltage gain (including

UP/DOWN<VP

−−200 µA
19 20 21 dB

power amplifier)

G

v(min)

minimum voltage gain (including

−62 −60 −58 dB

power amplifier)

n

vol

∆G

v

Z

i

V

i(rms)(max)

number of volume steps − 64 −
voltage gain variation per step − 1.25 − dB
input impedance 14 20 − kΩ
maximum input voltage (RMS value) −−2.0 V

AC characteristics (f = 1 kHz)

P

o

output power THD = 10% 1 1.4 − W

THD = 0.5% 0.6 1.0 − W
THD total harmonic distortion P
V

n(o)

noise output voltage note 5 − 60 100 µV

= 0.5 W; note 4 − 0.15 0.5 %

o

SVRR supply voltage ripple rejection note 6 48 53 − dB
V

i(IN)(max)

maximum input voltage on pin IN THD = 1%;

−−2.0 V
Gv= −50 dB
to 0 dB

1998 Feb 23 6

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

Notes to the Characteristics

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.

2. The DC output voltage with respect to ground is approximately 0.5VP.

3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a bandwidth of 20 kHz.

4. Total gain setting at +20 dB.

5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input
source impedance R

6. Supply voltage ripple rejection is measured at the output, with a source impedance of R
The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive
supply rail.

source

=0Ω.

=0Ω at the input.

source

handbook, full pagewidth

t

V

P

V

th(UP)

V

float(max)

V

UP/DOWN

V

float(min)

V

th(DOWN)

0

The rise time (tr) and the width of the pulse (tw) are not critical.

r

t

t

rep

w

increasing volume

floating

decreasing volume

t

Fig.3 Timing UP/DOWN pin.

t

r

t

rep

t

w

MGK365

1998 Feb 23 7

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

volume
control

mute

V

P

V

UP

DOWN

P

standby

operating

V

2.2 kΩ

i

R1

330 nF

C5

100 nF

UP/DOWN

C1

4

IN

1

VOLUME

CONTROL

V

TDA8551

15 kΩ

SVR

3

C2

100

µF

STANDBY/

MUTE/

OPERATING

27
MODE

15 kΩ

Fig.4 Test and application circuit.

C4

220

µF

MGM560

VP = 5 V

OUT+

OUT−

C3

100

nF

8 Ω

V

P

6

MASTER

8

P

20 kΩ

5 kΩ

R
R

5

SLAVE

GND

Reduction of the value of capacitor C2 results in a
decrease of the SVRR performance at low frequencies
(see Fig.9).

The UP/DOWN pin can be driven by a 3-state logic output
stage (microcontroller) without extra external components.
If the UP/DOWN pin is driven by push-buttons, then it is
advised to have an RC filter between the buttons and the
UP/DOWN pin. Advised values for the RC filter are 2.2 kΩ
and 100 nF.

The volume control circuit responds to the trailing edge of
the pulse on the volume pin; connecting to VP results in a
one step (1.25 dB) higher gain; connecting to ground
results in a one step lower gain.

To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.

1998 Feb 23 8

The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test methods are not standardized
yet. In addition, the thermal performance of packages for a
specific application may be different than presented here,
because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz. copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

When a practical PCB layout is used with wider copper
tracks and some extra copper added both to the IC pin
connections and underneath the IC, the thermal resistance
from junction to ambient can be reduced. Without these
measures R

= 160 K/W for the SO8 package; see

th j-a

Chapter “Thermal characteristics”. The power dissipation
can be calculated as follows:

T

amb

P

=

-------------­R

th j-a

For a maximum ambient temperature of 50 °C, V
and R

=8Ω this results in a worst case sine wave

L

=5V

P

dissipation of 0.63 W.
Figures 5 to 15 represent test results obtained while using

the test circuit given in Fig.4. The following test conditions
apply: T

=25°C; VP= 5 V; f = 1 kHz; RL=8Ω;

amb

Gv= 20 dB; audio bandwidth from 22 Hz to 22 kHz
(except for Figs 8 and 9); unless otherwise specified.

10

handbook, halfpage

I

P

(mA)

8

6

4

2

0

0246

MGM554

VP (V)

10

handbook, halfpage

THD

(%)

1

−1

10

−2

10

−2

10

(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.

Fig.5 Supply current as a function of supply

voltage.

MGM551

(1)

(2)

(3)

−1

10

110

P

(W)

o

10

handbook, halfpage

THD

(%)

1

−1

10

−2

10

−2

10

f = 1 kHz.
(1) Gv= 0 dB.
(2) Gv= 7 dB.
(3) Gv=20dB.

(1)

(2)
(3)

−1

10

110

MGM552

P

(W)

o

Fig.6 Total harmonic distortion as a function of

output power at different frequencies.

1998 Feb 23 9

Fig.7 Total harmonic distortion as a function of

output power at different gains.

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

10

handbook, halfpage

MGM550

THD

(%)

1

(1)

−1

10

10

Po= 0.1 W.
(1) Gv= 0 dB.

(2)
(3)

−2

10 10

2

3

10

4

10

f (Hz)

(2) Gv= 7 dB.
(3) Gv=20dB.

Fig.8 Total harmonic distortion as a function of

frequency at different gains.

handbook, halfpage

0

MGM549

SVRR

(dB)

(1)

−20

(2)

(3)

−40

V
R

ripple
source

−60

= 100 mV.

5

10

(1) C2 = 10 µF; Gv=20dB.
(2) C2 = 10 µF; Gv= 7 dB.

(4)

(5)
(6)

10 10

=0Ω.

2

3

10

4

10

f (Hz)

5

10

(3) C2 = 100 µF; Gv= 20 dB.
(4) C2 = 10 µF; Gv= −10 dB.
(5) C2 = 100 µF; Gv= 7 dB.
(6) C2 = 100 µF; Gv= −10 dB.

Fig.9 Supply voltage ripple rejection as a function

of frequency.

2.4

handbook, halfpage

V

i

(V)

2.0

MGM559

1.6

1.2

0.8

0.4

0

−60 0−20 20

−40

Gv (dB)

THD = 1 %.

Fig.10 Input voltage as a function of voltage gain.

handbook, halfpage

1

V

o

MGM555

(V)

−1

10

−2

10

−3

10

−4

10

−5

10

(1) (2)

V

MODE

(1) VP=3V.
(2) VP=5V.

Fig.11 Output voltage as a function of mode select

input voltage at different supply voltages.

513240

1998 Feb 23 10

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

60

MGM553

n

vol

20

handbook, halfpage

G

v

(dB)

0

−20

−40

−60

−80

02040 80

Fig.12 Volume gain as a function of volume steps.

handbook, halfpage

3

P

o

(W)

2

1

0

0

THD = 10 %.
(1) RL=4Ω.
(2) RL=8Ω.

(1)

(2)

264

P
maximum available repetitive
peak output current of 1 A.

is limited by P

o(max)

VP (V)

Fig.13 Output power as a function of supply

voltage.

MGM558

tot

and a

1.5

handbook, halfpage

P

(W)

1

0.5

0

02 6

(1) RL=4Ω.
(2) RL=8Ω.
(3) RL=16Ω.

4

MGM556

(1)

(2)

(3)

VP (V)

Fig.14 Power dissipation as a function of supply

voltage.

1.5

handbook, halfpage

P

(W)

1

0.5

0

0 2.0

(1) VP= 5 V; RL=4Ω.
(2) VP= 5 V; RL=8Ω.
(3) VP= 3.3 V; RL=4Ω.

(1)

(2)

(3)

(4)

(5)

0.4 0.8 1.2 1.6

(4) VP= 5 V; RL=16Ω.
(5) VP= 3.3 V; RL=8Ω.

MGM557

Po (W)

Fig.15 Power dissipation as a function of output

power.

1998 Feb 23 11

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

handbook, full pagewidth

VOLUME

CONTROL

51.2

51.1

bottom viewtop view

+V

P

UPDOWN

GND

C4

S1 S2

C5

18

J1

stand-by operating

Dimensions in mm.

R1

C2

V

i

C1

TDA

8551

Fig.16 Layout of printed-circuit board.

1998 Feb 23 12

C3

OUT+

TDA8551

OUT−

AUDIO POWER
CIC NIJMEGEN

mute

MGM561

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

PACKAGE OUTLINES

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

pin 1 index

1

e

5

A

2

A

4

w M

b

p

SOT96-1

E

H

E

1

L

detail X

A

X

v M

A

Q

(A )

L

p

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

1.75

0.069

OUTLINE

VERSION

SOT96-1

A

1

0.25

0.10

0.010

0.004

A2A3b

1.45

0.25

1.25

0.057

0.01

0.049

IEC JEDEC EIAJ

076E03S MS-012AA

0.49

0.36

0.019

0.014

p

0.25

0.19

0.0100

0.0075

(1)E(2)

cD

5.0

4.8

0.20

0.19

REFERENCES

4.0

3.8

0.16

0.15

1.27

0.050

1998 Feb 23 13

eHELLpQZywv θ

1.05

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

0.25 0.10.25

0.010.010.041 0.004

EUROPEAN

PROJECTION

6.2

5.8

0.244

0.228

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

95-02-04
97-05-22

o

8

o

0

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

seating plane

A

L

Z

e

b

8

pin 1 index

1

w M

b

1

b

2

5

SOT97-1

M

E

A

2

A

c

(e )

1

M

H

E

1

4

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

mm

inches

max.

12

min.

max.

b

1.73

1.14

0.068

0.045

b

1

0.53

0.38

0.021

0.015

b

2

1.07

0.89

0.042

0.035

cD E e M

0.36

9.8

0.23

9.2

0.014

0.009

0.39

0.36

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT97-1

IEC JEDEC EIAJ

050G01 MO-001AN

REFERENCES

1998 Feb 23 14

(1) (1)

6.48

6.20

0.26

0.24

L

3.60

3.05

0.14

0.12

M

8.25

7.80

0.32

0.31

E

10.0

0.39

0.33

e

1

EUROPEAN

PROJECTION

H

8.3

w

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

(1)

Z

92-11-17
95-02-04

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1998 Feb 23 15

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Feb 23 16

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

NOTES

1998 Feb 23 17

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

NOTES

1998 Feb 23 18

Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

NOTES

1998 Feb 23 19

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 545102/25/02/pp20 Date of release: 1998 Feb 23 Document order number: 9397 750 03173