Product specification
File under Integrated Circuits, IC01
March 1991
Page 2
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
GENERAL DESCRIPTION
The TDA8442 provides control of four analogue functions
and has one high-current and two switching outputs.
Control of the IC is performed via the two-line, bidirectional
I2C-bus.
Features
• Four analogue control outputs
• One high-current output port (npn open emitter)
• Two switching output ports (npn collector with internal
pull-up resistor)
2
• I
C-bus slave receiver
• Power-down reset.
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAXUNIT
Supply voltage (pin 9)V
Supply currentno outputs loadedI
Total power dissipationno outputs loadedP
Operating ambient
temperature range
TDA8442
PACKAGE OUTLINE
16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 23.
10.812.013.2V
8 1318mA
−−1W
−20−+70°C
T
P
P
tot
amb
Fig.1 Block diagram.
March 19912
Page 3
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
PINNING
PINSYMBOLDESCRIPTION
1DAC1analogue output 1
2DAC2analogue output 2
3DAC3analogue output 3
4SDAserial data line; I
5SCLserial clock line; I
6P2Port 2 npn collector output
Analogue control is facilitated by four 6-bit digital-to-analogue converters (DAC0 to DAC3).
The values of the output voltages from the DACs are set via the I
The high-current output port (P1) is suitable for switching between internal and external RGB signals.
It is an open npn emitter output capable of sourcing 14 mA (min.).
The two output ports (P2 and P2N) can be used for NTSC/PAL switching. These are npn collector outputs with internal
pull-up resistors of 10 kΩ (typ.). Both outputs are capable of sinking up to 2 mA with a voltage drop of less than 400 mV.
If one output is switched on (LOW), the other output is switched off, and vice versa.
Reset
The power-down-reset mode occurs whenever the positive supply voltage falls below 8.5 V (typ.) and resets all registers
to a defined state.
2
C-bus.
March 19913
Page 4
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
OPERATION
Write
2
The TDA8442 is controlled via the I
Programming of the TDA8442 is performed using the format shown in Fig.3.
Acknowledge (A) is generated by the TDA8442 only when a valid address is received and the device is not in the
power-down-reset mode (V
Control
> 8.5 V (typ.)).
P
C-bus (specifications for the I2C-bus will be supplied on request).
Fig.3 TDA8442 programming format.
TDA8442
Control is implemented by the instruction bytes POD (port output data) and DACX (digital-to-analogue converter control)
together with the corresponding data/control bytes (see Fig.4).
Fig.4 Control porgramming.
POD bit P1
If a logic 1 is programmed, the P1 output is switched on. If a logic 0 is programmed or after a power-down-reset, the P1
output is switched off (high-impedance state).
POD bit P2/P2N
If a logic 1 is programmed, the P2 output is switched off and the P2N output is switched on (LOW). If a logic 0 is
programmed or after a power-down-reset, the P2 output is switched on (LOW) and the P2N output is switched off.
DAX bits AX5 to AX0
The digital-to-analogue converter selected corresponds to the decimal equivalent of the two bits X1 and X0. The output
voltage of the selected DAC is programmed using bits AX5 to AX0, the lowest value being with all data AX5 to AX0 at
logic 0 or when power-down-reset has been activated.
March 19914
Page 5
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERSYMBOLMIN.MAX.UNIT
Supply voltage range (pin 9)V
Input/output voltage ranges
pin 4V
pin 5V
pin 6V
pin 11V
pin 12V
pin 1 to 3 and pin 16V
Total power dissipationP
Operating ambient temperature rangeT
Storage temperature rangeT
Note
1. Pin voltage may exceed V
if the current in that pin is limited to 10 mA.
P
P
SDA
SCL
P2
P1
P2N
DAX
tot
amb
stg
TDA8442
−0.3+13.2V
−0.3+13.2V
−0.3+13.2V
−0.3VP; note 1V
−0.3VP; note 1V
−0.3VP; note 1V
−0.3VP; note 1V
−1W
−20+70°C
−55+150°C
CHARACTERISTICS
= 12 V; T
V
P
= +25 °C; unless otherwise specified
amb
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supplies
Supply voltage (pin 9)V
Supply current (pin 9)no outputs loadedI
2
I
C-bus inputs
SDA (pin 4); SCL (pin 5)
Input voltage HIGHnote 1V
Input voltage LOWV
Input current HIGHnote 1I
Input current LOWnote 1I
2
I
C-bus output
SDA (pin 4)open collector
Output voltage LOWIOL = 3.0 mAV
Maximum output sink currentI
P
IH
IL
OL
P
IH
IL
OL
10.812.013.2V
8 1318mA
3.0−VP− 1V
−0.3−1.5V
−−10µA
−−10µA
−−0.4V
35−mA
March 19915
Page 6
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
P ARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Ports P2 and P2N
(pins 6 and 12)npn collector output with
pull-up resistor to V
Internal pull-up resistor to V
Output voltage switched
P
I
= 2 mAV
OL
on (LOW)
Maximum output sink currentI
Leakage current output
switched off
Port P1 (pin 11)
Output current switched onV
Leakage current switched off V
Digital-to-analogue
open npn emitter output
= 0 to 5 VI
O
= 0 to V
O
P
note 2
outputs
DAC0 (pin 16)
Maximum output voltageunloaded; note 3V
Minimum output voltageunloaded; note 3V
Positive value of smalles
I
= 2 mA (1 lsb); note 3V
O
step
Deviation from linearityI
Output impedanceI
= 2 mA∆V−−45mV
O
= −2 to +2 mAZ
O
Maximum output source
current
Maximum output sink currentI
DAC1 (pin 1)
Maximum output voltageunloaded; note 3V
Minimum output voltageunloaded; note 3V
Positive value of smallest
I
= 2 mA (1 lsb); note 3V
O
step
Deviation from linearityI
Output impedanceI
= 2 mA∆V−−50mV
O
= −2 to +2 mAZ
O
Maximum output source
current
Maximum output sink currentI
P
R
O
OL
OL
− I
O
± I
O max
O min
O lsb
O
−I
OH
OL
O max
O min
O lsb
O
−I
OH
OL
leak
leak
TDA8442
5 1015kΩ
−−0.4V
25−mA
−−25µA
14−−mA
−−100µA
3.0−4.25V
0.15−1.0V
16−72mV
−−30Ω
2−6mA
28−mA
4.0−5.0V
1.0−1.7V
18−86mV
−−30Ω
2−6mA
28−mA
March 19916
Page 7
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
DAC2 (pin 2)
Maximum output voltageunloaded; note 3V
Minimum output voltageunloaded; note 3V
Positive value of smallest
step
Deviation from linearityI
Output impedanceI
Maximum output source
current
Maximum output sink currentI
DAC3 (pin 3)
Maximum output voltageunloaded; note 3V
Minimum output voltageunloaded; note 3V
Positive value of smallest
step
Deviation from linearityI
Output impedanceI
Maximum output source
current
Maximum output sink currentI
Power-down reset
Maximum value of VP at
which power-down reset is
active
Rise time of V
during
P
power-on
I
= 2 mA (1 lsb); note 3V
O
= 2 mA∆V−−50mV
O
= −2 to +2 mAZ
O
I
= 2 mA (1 lsb); note 3V
O
= 2 mA∆V−−150mV
O
= −2 to +2 mAZ
O
VP rising from 0 V to VPDt
O max
O min
O lsb
O
−I
OH
OL
O max
O min
O lsb
O
−I
OH
OL
V
PD
r
TDA8442
4.0−5.0V
1.0−1.7V
18−86mV
−−30Ω
2−6mA
28−mA
10.0−11.2V
0.1−1.0V
70−250mV
−−30Ω
2−6mA
28−mA
6−10V
5−−µs
Notes to the Characteristics
1. If VP < 1 V, the input current is limited to 10 µA at input voltages up to 13.2 V.
2. Pure capacitive load should be avoided because of possible oscillations.
3. Values are proportional to VP.
March 19917
Page 8
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
I2C-BUS TIMING
Bus loading conditions: 4kΩ pull-up resistor to +5 V; 200 pF capacitor to GND.
All values are referred to V
PARAMETERSYMBOLMIN.TYP.MAX.UNIT
Bus free before startt
Start condition set-up timet
Start condition hold timet
LOW period SCL, SDAt
HIGH period SCLt
Rise time SCL, SDAt
Fall time SCL, SDAt
Data set-up time (write)t
Data hold time (write)t
Acknowledge (from TDA8442) set-up time t
Acknowledge (from TDA8442) hold timet
Stop condition set-up timet
= 3 V and VIL = 1.5 V.
IH
BUF
SU; STA
HD; STA
LOW
HIGH
r
f
SU; DAT
HD; DAT
SU; ACK
HD; ACK
SU; STO
4.0−−µs
4.0−−µs
4.0−−µs
4.0−−µs
4.0−−µs
−−1.0µs
−−0.30µs
1−−µs
1−−µs
−−3.5µs
0−−µs
4.0−−µs
TDA8442
Reference levels are 10 and 90%.
Fig.5 I2C-bus timing; TDA8442.
March 19918
Page 9
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
w M
TDA8442
SOT38-1
M
E
A
2
A
1
c
(e )
1
M
H
pin 1 index
1
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEeM
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1)(1)
6.48
6.20
0.26
0.24
E
(1)
Z
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
w
H
0.2542.547.62
0.010.100.0200.19
ISSUE DATE
92-10-02
95-01-19
max.
2.2
0.087
March 19919
Page 10
Philips SemiconductorsProduct specification
I2C-bus interface for colour decoders
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
(order code 9398 652 90011).
TDA8442
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
March 199110
2
C components conveys a license under the Philips’ I2C patent to use the
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