Datasheet TDA8547TS Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA8547TS
2 × 0.7 W BTL audio amplifier with output channel switching
Product specification Supersedes data of 1997 Oct 14 File under Integrated Circuits, IC01
1998 Apr 01
Page 2
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching

FEATURES

Selection between output channels
Flexibility in use
Few external components
Low saturation voltage of output stage
Gain can be fixed with external resistors
Standby mode controlled by CMOS compatible levels
Low standby current
No switch-on/switch-off plops
High supply voltage ripple rejection
Protected against electrostatic discharge
Outputs short-circuit safe to ground, V
load
Thermally protected.

APPLICATIONS

and across the
CC
TDA8547TS

GENERAL DESCRIPTION

The TDA8547TS is a two channel audio power amplifier for an output power of 2 × 0.7 W with a 16 load at a 5 V supply. At a low supply voltage of 3.3 V an output power of
0.6 W with an 8 load can be obtained. The circuit contains two BTL amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The operating condition of all channels of the device (standby, mute or on) is externally controlled by the MODE pin. With the SELECT pin one of the output channels can be switched in the standby condition. This feature can be used for loudspeaker selection and also reduces the quiescent current consumption. When only one channel is used the maximum output power is 1.2 W.
Telecommunication equipment
Portable consumer products
Personal computers
Motor-driver (servo).

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
I
q
I
stb
P
o
THD total harmonic distortion P
supply voltage 2.2 5 18 V quiescent current VCC= 5 V; 2 channels 15 22 mA
= 5 V; 1 channel 812mA
V
CC
standby current −−10 µA output power
two channels THD = 10%; R
THD = 10%; R
one channel THD = 10%; R
THD = 10%; R
= 0.4 W 0.15 %
o
=8Ω; VCC= 3.3 V 0.5 0.6 W
L
=16Ω; VCC= 5 V 0.6 0.7 W
L
=8Ω; VCC=5V 1 1.2 W
L
=4Ω; VCC= 3.3 V 1 1.2 W
L
SVRR supply voltage ripple rejection 50 −−dB

ORDERING INFORMATION

TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA8547TS SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
1998 Apr 01 2
Page 3
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching

BLOCK DIAGRAM

handbook, full pagewidth
IN1 IN1+
17 16
V
CC1
− +
20 k
TDA8547TS
V
V
CC1
CC2
11
20
18
OUT1
R
R
− +
3
OUT1+
IN2 IN2+
SVRR
MODE
SELECT
n.c.
14 15
5
4 6
2, 7, 9, 12, 19
5
20 k
STANDBY/MUTE LOGIC
− +
V
CC2
20 k
20 k
STANDBY/MUTE LOGIC
TDA8547TS
R
R
− +
GND1
13
8
110
GND2
OUT2
OUT2+
MGK984
Fig.1 Block diagram.
1998 Apr 01 3
Page 4
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching

PINNING

SYMBOL PIN DESCRIPTION
GND1 1 ground, channel 1 n.c. 2 not connected OUT1+ 3 positive loudspeaker terminal,
channel 1
MODE 4 operating mode select (standby, mute,
operating)
SVRR 5 half supply voltage, decoupling ripple
rejection SELECT 6 input for selection of operating channel n.c. 7 not connected OUT2+ 8 positive loudspeaker terminal,
channel 2 n.c. 9 not connected GND2 10 ground, channel 2 V
CC2
n.c. 12 not connected OUT2 13 negative loudspeaker terminal,
IN2 14 negative input, channel 2 IN2+ 15 positive input, channel 2 IN1+ 16 positive input, channel 1 IN1 17 negative input, channel 1 OUT1 18 negative loudspeaker terminal,
n.c. 19 not connected V
CC1
11 supply voltage, channel 2
channel 2
channel 1
20 supply voltage, channel 1
handbook, halfpage
GND1
1
n.c.
2
OUT1+
SELECT
OUT2+
MODE
SVRR
n.c.
n.c.
GND2
3 4 5
TDA8547TS
6 7 8 9
10
MGK998
Fig.2 Pin configuration.
TDA8547TS
V
20
CC1
19
n.c.
18
OUT1
17
IN1
16
IN1+
15
IN2+ IN2
14
OUT2
13
n.c.
12
V
11
CC2

FUNCTIONAL DESCRIPTION

The TDA8547TS is a 2 × 0.7 W BTL audio power amplifier capable of delivering 2 × 0.7 W output power to a 16 load at THD = 10% using a 5 V power supply. Using the MODE pin the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range from 6 to 30 dB by external feedback resistors.
Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor, on the negative side the saturation voltage of a NPN power
1998 Apr 01 4
transistor. The total voltage loss is <1 V and with a 5 V supply voltage and a 16 loudspeaker an output power of
0.7 W can be delivered, when two channels are operating. If only one channel is operating then an output power of
1.2 W can be delivered (5 V, 8 Ω).

MODE pin

The whole device (both channels) is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is >(V
0.5 V), or if this pin is floating. At a
CC
MODE voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1.5 V and V
CC
1.5 V the amplifier is in mute condition. The mute condition is useful to suppress plop noise at the output caused by charging of the input capacitor.
Page 5
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching

SELECT pin

If the voltage at the SELECT pin is in the range between
1.5 V and VCC− 1.5 V, or if it is kept floating, then both channels can be operational. If the SELECT pin is set to a LOW voltage or grounded, then only channel 2 can operate and the power amplifier of channel 1 will be in the standby mode. In this case only the loudspeaker at channel 2 can operate and the loudspeaker at channel 1 will be switched off. If the SELECT pin is set to a HIGH level or connected to VCC, then only channel 1 can operate and the power amplifier of channel 2 will be in the standby mode. In this case only the loudspeaker at channel 1 can operate and the loudspeaker at channel 2 will be switched off. Setting the SELECT pin to a LOW or
Table 1 Control pins MODE and SELECT versus status of output channels Voltage levels at control pins at V
= 5 V; for other supply voltages see Figs. 14 and 15.
P
CONTROL PIN
MODE SELECT CHANNEL 1 CHANNEL 2
(1)
HIGH
HVP HVP HVP
HVP
LOW
(4) (4) (4)
/NC
(4) (5)
/LOW /LOW /LOW
(2)
(5) (5) (5)
HVP HVP
HIGH
HVP
LOW
a HIGH voltage results in a reduction of quiescent current consumption by a factor of approximately 2.
Switching with the SELECT pin during operating is not plop-free, because the input capacitor of the channel which is coming out of standby needs to be charged first. For plop-free channel selecting the device has first to be set in mute condition with the MODE pin (between 1.5 V and V
1.5 V), then set the SELECT pin to the new
CC
level, after a delay set the MODE pin to a LOW level. The delay needed depends on the values of the input capacitor and the feedback resistors. Time needed is approx. 10 × C1 × (R1 + R2), so approximately 0.6 s. for the values in Fig.4.
(3)
X
(4)
(2)
/NC
(4)
(2)
/NC
(1)
(4)
(2)
/NC
(5)
TDA8547TS
STATUS OF OUTPUT
CHANNEL
standby standby 0
mute mute 15
on on 15 mute/on standby 8 mute/on mute/on 15 standby mute/on 8
TYP. I
(mA)
q
Notes
1. HIGH = V
pin>VCC
0.5 V.
2. NC = not connected or floating.
3. X = don’t care.
4. HVP = 1.5 V < V
5. LOW = V
pin
< 0.5 V.
pin<VCC
1.5 V.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
V
I
I
ORM
T
stg
T
amb
V
Psc
P
tot
supply voltage operating 0.3 +18 V input voltage 0.3 VCC+ 0.3 V repetitive peak output current 1A storage temperature 55 +150 °C operating ambient temperature 40 +85 °C AC and DC short-circuit safe voltage 10 V power dissipation 1.1 W
1998 Apr 01 5
Page 6
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with
TDA8547TS
output channel switching

QUALITY SPECIFICATION

In accordance with

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
“SNW-FQ-611-E”
.
thermal resistance from junction to ambient in free air 110 K/W
2.0
handbook, halfpage
P
(W)
1.6
1.2
0.8
MGK987
0.4
0
0 40 80 160
120
T
amb
(°C)
Fig.3 Power derating curve.
Table 2 Maximum ambient temperature at different conditions
CONTINUOUS SINE WAVE DRIVEN
V
(V)
CC
R
()
L
APPLICATION
P
(W)
o
(1)
P
max
(W)
3.3 4 1 channel 1.2 0.58 86
3.3 4 2 channels 2 × 1.2 1.12 27
3.3 8 1 channels 0.6 0.3 117
3.3 8 2 channels 2 × 0.6 0.60 84 5 8 1 channel 1.2 0.67 76 5 8 2 channels 2 × 1.2 1.33 5 16 1 channel 0.7 0.35 112 5 16 2 channels 2 × 0.7 0.70 73
T
amb(max)
(°C)
Note
1. At THD = 10%.
1998 Apr 01 6
Page 7
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with
TDA8547TS
output channel switching

DC CHARACTERISTICS

V
=5V; T
CC
otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
I
q
I
stb
V
O
OUT+
, I
IN
MODE
SELECT
V
V
I
IN+
V
I
MODE
V
I
SELECT
=25°C; RL=8Ω; V
amb
supply voltage operating 2.2 5 18 V quiescent current BTL 2 channels;
standby current V DC output voltage note 2 2.2 V
differential output voltage
OUT
offset input bias current −−500 nA input voltage MODE pin operating 0 0.5 V
input current MODE pin 0 V < V input voltage SELECT pin channel 1 = standby;
input current SELECT pin V
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless
MODE
15 22 mA
note 1 BTL 1 channel;
812mA
note 1
MODE=VCC
−−10 µA
−−50 mV
mute 1.5 V standby V
MODE<VCC
0.5 V
CC
−−20 µA 0 1V
channel 2 = on channel 1 = on;
V
1 V
CC
channel 2 = standby
SELECT
=0V −−100 µA
1.5 V
CC CC
CC
V
V
Notes
1. Measured with R
= . With a load connected at the outputs the quiescent current will increase, the maximum of this
L
increase being equal to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VCC.
1998 Apr 01 7
Page 8
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with
TDA8547TS
output channel switching

AC CHARACTERISTICS

V
=5V; T
CC
unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
P
o
THD total harmonic distortion Po= 0.4 W 0.15 0.3 % G
v
Z
i
V
no
SVRR supply voltage ripple rejection note 3 50 −−dB
V
o
α
cs
Notes
1. Gain of the amplifier is in BTL application circuit Fig.4.
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of R
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS=0Ω at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS=0Ω at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail.
5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz, so including noise.
6. Channel separation is measured at the output with a source impedance of RS=0Ω at the input and a frequency of 1 kHz. The output power in the operating channel is set to 0.5 W.
=25°C; RL=8Ω; f = 1 kHz; V
amb
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4;
MODE
output power, one channel THD = 10% 1 1.2 W
THD = 0.5% 0.6 0.9 W
closed loop voltage gain note 1 6 30 dB differential input impedance 100 k noise output voltage note 2 −−100 µV
note 4 40 −−dB output voltage note 5 −−200 µV channel separation V
R2
×
2
------- ­R1
=0Ω at the input.
S
SELECT
= 0.5VCC; note 6 40 −−dB
1998 Apr 01 8
Page 9
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
TEST AND APPLICATION INFORMATION Test conditions
Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately.
The thermal resistance = 110 K/W for the SSOP20; the maximum sine wave power dissipation for T
150 25
is:
---------------------­110
For T
amb
150 60
---------------------­110
1.14 W=
=60°C the maximum total power dissipation is:
0.82 W=

Thermal Design Considerations

The ‘measured’ thermal resistance of the IC package is highly dependent on the configuration and size of the application board. Data may not be comparable between different Semiconductor manufacturers because the application boards and test methods are not (yet) standardized. Also, the thermal performance of packages for a specific application may be different than presented here, because the configuration of the application boards (copper area!) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating.
The SSOP package has improved thermal conductivity which reduces the thermal resistance. Using a practical PCB layout (see Fig.24) with wider copper tracks to the corner pins and just under the IC, the thermal resistance from junction to ambient can be reduced to about 80 K/W. For T
this PCB layout is:
=60°C the maximum total power dissipation at
amb
150 60
---------------------­80
1.12 W=
Please note that this two channel IC is mentioned for application with only one channel active. For that reason the curves for worst case power dissipation are given for the condition of only one of the both channels driven with a 1 kHz sine wave signal.

BTL application

amb
=25°C
TDA8547TS
The quiescent current has been measured without any load impedance and both channels driven. When one channel is active the quiescent current will be halved. The total harmonic distortion as a function of frequency was measured using a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies: increasing the value of C3 increases the performance of the SVRR. The figure of the MODE voltage (V the supply voltage shows three areas; operating, mute and standby. It shows, that the DC-switching levels of the mute and standby respectively depend on the supply voltage level. The figure of the SELECT voltage (V as a function of the supply voltage shows the voltage levels for switching the channels in the active, mute or standby mode.

SE application

T
=25°C if not specially mentioned, VCC= 7.5 V,
amb
f = 1 kHz, RL=4Ω, Gv= 20 dB, audio band-pass 22 Hz to 22 kHz.
The SE application circuit is illustrated in Fig.16. Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive output is not designed for high output current (2 × Io) at low load impedance (16 ), the SE application with output capacitors connected to ground is advised. The capacitor value of C6/C7 in combination with the load impedance determines the low frequency behaviour. The THD as a function of frequency was measured using a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies: increasing the value of C3 increases the performance of the SVRR.

General remark

The frequency characteristic can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity to HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k); this creates a low-pass filter.
) as a function of
MODE
SELECT
)
T
=25°C if not specially mentioned, VCC=5V,
amb
f = 1 kHz, RL=8Ω, Gv= 20 dB, audio band-pass 22 Hz to 22 kHz.
The BTL application circuit is illustrated in Fig.4.
1998 Apr 01 9
Page 10
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching

BTL APPLICATION

handbook, full pagewidth
Gain channel1 2
Gain channel 2 2
C1
R2
R1
R3
R4
50 k
IN1 IN1+
C3
47 µF
OUT2
50 k
IN2 IN2+
SVRR
MODE
SELECT
1 µF
10 k
V
i1
C2
1 µF
10 k
V
i2
R2
×=
------- ­R1
R4
×=
------- ­R3
20 11
17 16
TDA8547TS
14 15
5 4 6
110
GND
TDA8547TS
V
C4
100 nF
OUT1
18
R
OUT1+
3
OUT2
13
OUT2+
8
MGK985
L1
R
L2
C5 100 µF
CC
30
handbook, halfpage
I
q
(mA)
20
10
0
0
RL= .
Fig.4 BTL application.
MGD890
420
81216
VCC (V)
10
handbook, halfpage
THD
(%)
1
1
10
2
10
2
10
f = 1 kHz; Gv=20dB. (1) VCC= 5 V; RL=8Ω.
MGK988
(1)
1
10
1
Po (W)
10
Fig.5 Iq as a function of VCC.
1998 Apr 01 10
Fig.6 THD as a function of Po.
Page 11
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
10
handbook, halfpage
THD
(%)
1
1
10
2
10
10 10
Po= 0.5 W; Gv= 20 dB. (1) VCC= 5 V; RL=8Ω.
Fig.7 THD as a function of frequency.
(1)
2
3
10
MGK989
4
10
f (Hz)
10
TDA8547TS
60
ndbook, halfpage
α
cs
(dB)
70
80
90
5
100 10 10
VCC= 5 V; Vo= 2 V; RL=8Ω. (1) Gv=30dB. (2) Gv=20dB. (3) Gv= 6 dB.
2
3
10
Fig.8 Channel separation as a function of
frequency.
MGK699
(1)
(2)
(3)
4
10
f (Hz)
5
10
20
handbook, halfpage
SVRR
(dB)
40
60
80
10 10
VCC= 5 V; RS=0Ω; Vr= 100 mV. (1) Gv=30dB. (2) Gv=20dB. (3) Gv= 6 dB.
2
10
Fig.9 SVRR as a function of frequency.
VCC (V)
MGK990
12
MGD894
(1)
(2)
(3)
3
4
10
f (Hz)
5
10
handbook, halfpage
2
P
o
(W)
1.5
(1) (2)
1
0.5
0
048
THD = 10%. (1) RL=8Ω. (2) RL=16Ω.
Fig.10 Po as a function of VCC.
1998 Apr 01 11
Page 12
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
1.5
handbook, halfpage
P
(W)
1.0
0.5
0
0
(1) RL=8Ω. (2) RL=16Ω.
(2)
(1)
4812
MGK991
VCC (V)
1.5
handbook, halfpage
P
(W)
1
0.5
0
0
Sine wave of 1 kHz. (1) VCC= 5 V; RL=8Ω.
0.5
TDA8547TS
MGK992
(1)
1 1.5
Po (W)
Fig.11 Worst case power dissipation as a function
of VCC (one channel active).
V
MODE
MGL211
(V)
10
handbook, halfpage
V
o
(V)
1
1
10
2
10
3
10
4
10
5
10
6
10
1
10
Band-pass = 22 Hz to 22 kHz. (1) VCC=3V. (2) VCC=5V. (3) VCC=12V.
(1) (2) (3)
1
10 10
Fig.12 Power dissipation as a function of P
o
(one channel active).
mute
12
MGL210
operating
VP (V)
16
16
handbook, halfpage
V
MODE
(V)
12
8
4
2
0
048
standby
Fig.13 Vo as a function of V
MODE
.
1998 Apr 01 12
Fig.14 V
as a function of VP.
MODE
Page 13
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
20
handbook, full pagewidth
V
SELECT
(V)
16
12
8
4
0
02468 12141618
V
P
channel 1
on
channel 1
standby
10
channel 2
standby
channel 2
on
TDA8547TS
MGK700
channel 1 + 2
on
VP (V)
20

SE APPLICATION

handbook, full pagewidth
Gain channel 1
Gain channel 2
=
=
R2
------- ­R1
R4
------- ­R3
C1
1 µF
V
C2
1 µF
V
i1
i2
R1
10 k
R3
10 k
R2
R4
100 k
C3
47 µF
100 k
OUT2
Fig.15 V
IN1 IN1+
IN2 IN2+
SVRR
MODE
SELECT
as a function of VP.
SELECT
20 11
17 16
TDA8547TS
14 15
5 4 6
110
GND
V
R
L1
R
L2
C5 100 µF
CC
C4
100 nF
OUT1
18
OUT1+
3
OUT2
13
OUT2+
8
MGK986
C6
470 µF
C7
470 µF
Fig.16 SE application.
1998 Apr 01 13
Page 14
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
Po (W)
MGD899
10
10
handbook, halfpage
THD
(%)
1
1
10
2
10
2
10
f = 1 kHz; Gv=20dB. (1) VCC= 7.5 V; RL=4Ω. (2) VCC= 9 V; RL=8Ω. (3) VCC= 12 V; RL=16Ω.
(1) (2) (3)
1
10
1
10
handbook, halfpage
THD
(%)
1
1
10
2
10
10 10
Po= 0.5 W; Gv= 20 dB. (1) VCC= 7.5 V; RL=4Ω. (2) VCC= 9 V; RL=8Ω. (3) VCC= 12 V; RL=16Ω.
TDA8547TS
MGD900
(1)
(2) (3)
2
3
10
4
10
f (Hz)
5
10
Fig.17 THD as a function of Po.
40
handbook, halfpage
α
cs
(dB)
60
(1) (2)
80
100
10
2
10
(3) (4)
3
10
10
Vo= 1 V; Gv=20dB. (1) VCC= 7.5 V; RL=4Ω. (2) VCC= 9 V; RL=8Ω. (3) VCC= 12 V; RL=16Ω. (4) VCC= 5 V; RL=32Ω.
Fig.19 Channel separation as a function of
frequency.
4
MGK993
f (Hz)
Fig.18 THD as a function of frequency.
20
handbook, halfpage
SVRR
(dB)
40
(1) (2)
60
(3)
5
10
80 10 10
2
3
10
VCC= 7.5 V; RL=4Ω; RS=0Ω; Vr= 100 mV. (1) Gv=24dB. (2) Gv=20dB. (3) Gv= 0 dB.
MGD902
4
10
f (Hz)
5
10
Fig.20 SVRR as a function of frequency.
1998 Apr 01 14
Page 15
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
12
MGK994
VCC (V)
16
handbook, halfpage
2
P
o
(W)
1.6
1.2
0.8
0.4
0
0
THD = 10%. (1) RL=4Ω. (2) RL=8Ω. (3) RL=16Ω.
(1) (2) (3)
48
Fig.21 Po as a function of VCC.
TDA8547TS
1.5
handbook, halfpage
P
(W)
1.0
(1) (2) (3)
0.5
0
0
(1) RL=4Ω. (2) RL=8Ω. (3) RL=16Ω.
48
Fig.22 Worst case power dissipation as a function
of VCC (one channel active).
MGK995
VCC (V)
1612
1.2
handbook, halfpage
P
(W)
0.8
0.4
0
0
Sine wave of 1 kHz. (1) VCC= 12 V; RL=16Ω. (2) VCC= 7.5 V; RL=4Ω. (3) VCC= 9 V; RL=8Ω.
0.4 0.8 1.6
(1)
(2) (3)
1.2
Fig.23 Power dissipation as a function of P
(one channel active).
MGK996
Po (W)
o
1998 Apr 01 15
Page 16
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
handbook, full pagewidth
TDA8547TS
IN1
IN2
a. Top view copper layout.
1 µF
1 µF
OUT1
11 k
11 k
OUT2
56 k
56 k
+V
CC
20
11
8542/47TS
100 µF
100 nF
TDA
GND
10 k
1
10
b. Top view components layout.
+OUT1
10 k
47 µF
+OUT2
TDA 8542TS 8547TS
MODE
SELECT
CIC
Nijmegen
MGK997
Fig.24 Printed-circuit board layout (BTL).
1998 Apr 01 16
Page 17
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching

PACKAGE OUTLINE

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
20
D
c
y
Z
11
E
H
TDA8547TS

SOT266-1

A
X
v M
E
A
pin 1 index
110
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNIT A1A
mm
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
1.5
0.1501.4
1.2
A
0.25
b
3
p
0.32
0.20
2
p
0 2.5 5 mm
scale
(1)E(1)
cD
0.20
6.6
6.4
4.5
4.3
0.13
eHELLpQZywv θ
0.65 1.0 0.2
6.6
6.2
Q
A
2
A
1
detail X
0.75
0.65
0.45
0.45
(A )
L
p
L
A
3
θ
0.13 0.1
0.48
0.18
(1)
o
10
o
0
OUTLINE
VERSION
SOT266-1
IEC JEDEC EIAJ
REFERENCES
1998 Apr 01 17
EUROPEAN
PROJECTION
ISSUE DATE
90-04-05 95-02-25
Page 18
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with output channel switching
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
DIP
SOLDERING BY DIPPING OR BY WA VE The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA8547TS
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
AVE SOLDERING
W Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
1998 Apr 01 18
Page 19
Philips Semiconductors Product specification
2 × 0.7 W BTL audio amplifier with
TDA8547TS
output channel switching

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Apr 01 19
Page 20
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997 SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 545102/00/02/pp20 Date of release: 1998 Apr01 Document order number: 9397 75003347
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