2 × 0.7 W BTL audio amplifier with
output channel switching
Product specification
Supersedes data of 1997 Oct 14
File under Integrated Circuits, IC01
1998 Apr 01
Page 2
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
FEATURES
• Selection between output channels
• Flexibility in use
• Few external components
• Low saturation voltage of output stage
• Gain can be fixed with external resistors
• Standby mode controlled by CMOS compatible levels
• Low standby current
• No switch-on/switch-off plops
• High supply voltage ripple rejection
• Protected against electrostatic discharge
• Outputs short-circuit safe to ground, V
load
• Thermally protected.
APPLICATIONS
and across the
CC
TDA8547TS
GENERAL DESCRIPTION
The TDA8547TS is a two channel audio power amplifier
for an output power of 2 × 0.7 W with a 16 Ω load at a 5 V
supply. At a low supply voltage of 3.3 V an output power of
0.6 W with an 8 Ω load can be obtained. The circuit
contains two BTL amplifiers with a complementary
PNP-NPN output stage and standby/mute logic.
The operating condition of all channels of the device
(standby, mute or on) is externally controlled by the
MODE pin. With the SELECT pin one of the output
channels can be switched in the standby condition. This
feature can be used for loudspeaker selection and also
reduces the quiescent current consumption.
When only one channel is used the maximum output
power is 1.2 W.
The TDA8547TS is a 2 × 0.7 W BTL audio power amplifier
capable of delivering 2 × 0.7 W output power to a 16 Ω
load at THD = 10% using a 5 V power supply. Using the
MODE pin the device can be switched to standby and
mute condition. The device is protected by an internal
thermal shutdown protection mechanism. The gain can be
set within a range from 6 to 30 dB by external feedback
resistors.
Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the
negative side the saturation voltage of a NPN power
1998 Apr 014
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and a 16 Ω loudspeaker an output power of
0.7 W can be delivered, when two channels are operating.
If only one channel is operating then an output power of
1.2 W can be delivered (5 V, 8 Ω).
MODE pin
The whole device (both channels) is in the standby mode
(with a very low current consumption) if the voltage at the
MODE pin is >(V
− 0.5 V), or if this pin is floating. At a
CC
MODE voltage level of less than 0.5 V the amplifier is fully
operational. In the range between 1.5 V and V
CC
− 1.5 V
the amplifier is in mute condition. The mute condition is
useful to suppress plop noise at the output caused by
charging of the input capacitor.
Page 5
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
SELECT pin
If the voltage at the SELECT pin is in the range between
1.5 V and VCC− 1.5 V, or if it is kept floating, then both
channels can be operational. If the SELECT pin is set to a
LOW voltage or grounded, then only channel 2 can
operate and the power amplifier of channel 1 will be in the
standby mode. In this case only the loudspeaker at
channel 2 can operate and the loudspeaker at channel 1
will be switched off. If the SELECT pin is set to a
HIGH level or connected to VCC, then only channel 1 can
operate and the power amplifier of channel 2 will be in the
standby mode. In this case only the loudspeaker at
channel 1 can operate and the loudspeaker at channel 2
will be switched off. Setting the SELECT pin to a LOW or
Table 1 Control pins MODE and SELECT versus status of output channels
Voltage levels at control pins at V
= 5 V; for other supply voltages see Figs. 14 and 15.
P
CONTROL PIN
MODESELECTCHANNEL 1 CHANNEL 2
(1)
HIGH
HVP
HVP
HVP
HVP
LOW
(4)
(4)
(4)
/NC
(4)
(5)
/LOW
/LOW
/LOW
(2)
(5)
(5)
(5)
HVP
HVP
HIGH
HVP
LOW
a HIGH voltage results in a reduction of quiescent current
consumption by a factor of approximately 2.
Switching with the SELECT pin during operating is not
plop-free, because the input capacitor of the channel
which is coming out of standby needs to be charged first.
For plop-free channel selecting the device has first to be
set in mute condition with the MODE pin (between 1.5 V
and V
− 1.5 V), then set the SELECT pin to the new
CC
level, after a delay set the MODE pin to a LOW level.
The delay needed depends on the values of the input
capacitor and the feedback resistors. Time needed is
approx. 10 × C1 × (R1 + R2), so approximately 0.6 s. for
the values in Fig.4.
offset
input bias current−−500nA
input voltage MODE pinoperating0−0.5V
input current MODE pin0 V < V
input voltage SELECT pinchannel 1 = standby;
input current SELECT pinV
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless
MODE
−1522mA
note 1
BTL 1 channel;
−812mA
note 1
MODE=VCC
−−10µA
−−50mV
mute1.5−V
standbyV
MODE<VCC
− 0.5 −V
CC
−−20µA
0−1V
channel 2 = on
channel 1 = on;
V
− 1−V
CC
channel 2 = standby
SELECT
=0V−−100µA
− 1.5 V
CC
CC
CC
V
V
Notes
1. Measured with R
= ∞. With a load connected at the outputs the quiescent current will increase, the maximum of this
L
increase being equal to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VCC.
1998 Apr 017
Page 8
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
TDA8547TS
output channel switching
AC CHARACTERISTICS
V
=5V; T
CC
unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
P
o
THDtotal harmonic distortionPo= 0.4 W−0.150.3%
G
v
Z
i
V
no
SVRRsupply voltage ripple rejectionnote 350−−dB
V
o
α
cs
Notes
1. Gain of the amplifier is in BTL application circuit Fig.4.
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a
source impedance of R
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS=0Ω at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS=0Ω at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz,
so including noise.
6. Channel separation is measured at the output with a source impedance of RS=0Ω at the input and a frequency of
1 kHz. The output power in the operating channel is set to 0.5 W.
=25°C; RL=8Ω; f = 1 kHz; V
amb
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4;
2 × 0.7 W BTL audio amplifier with
output channel switching
TEST AND APPLICATION INFORMATION
Test conditions
Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each
application are shown separately.
The thermal resistance = 110 K/W for the SSOP20; the
maximum sine wave power dissipation for T
150 25–
is:
---------------------110
For T
amb
150 60–
---------------------110
1.14 W=
=60°C the maximum total power dissipation is:
0.82 W=
Thermal Design Considerations
The ‘measured’ thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different Semiconductor manufacturers because the
application boards and test methods are not (yet)
standardized. Also, the thermal performance of packages
for a specific application may be different than presented
here, because the configuration of the application boards
(copper area!) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper
traces with solder coating.
The SSOP package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.24) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to about 80 K/W.
For T
this PCB layout is:
=60°C the maximum total power dissipation at
amb
150 60–
---------------------80
1.12 W=
Please note that this two channel IC is mentioned for
application with only one channel active. For that reason
the curves for worst case power dissipation are given for
the condition of only one of the both channels driven with
a 1 kHz sine wave signal.
BTL application
amb
=25°C
TDA8547TS
The quiescent current has been measured without any
load impedance and both channels driven. When one
channel is active the quiescent current will be halved.
The total harmonic distortion as a function of frequency
was measured using a low-pass filter of 80 kHz.
The value of capacitor C3 influences the behaviour of the
SVRR at low frequencies: increasing the value of C3
increases the performance of the SVRR.
The figure of the MODE voltage (V
the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depend on the supply
voltage level. The figure of the SELECT voltage (V
as a function of the supply voltage shows the voltage
levels for switching the channels in the active, mute or
standby mode.
SE application
T
=25°C if not specially mentioned, VCC= 7.5 V,
amb
f = 1 kHz, RL=4Ω, Gv= 20 dB, audio band-pass
22 Hz to 22 kHz.
The SE application circuit is illustrated in Fig.16.
Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive
output is not designed for high output current (2 × Io) at
low load impedance (≤16 Ω), the SE application with
output capacitors connected to ground is advised.
The capacitor value of C6/C7 in combination with the load
impedance determines the low frequency behaviour.
The THD as a function of frequency was measured using
a low-pass filter of 80 kHz. The value of capacitor C3
influences the behaviour of the SVRR at low frequencies:
increasing the value of C3 increases the performance of
the SVRR.
General remark
The frequency characteristic can be adapted by
connecting a small capacitor across the feedback
resistor. To improve the immunity to HF radiation in radio
circuit applications, a small capacitor can be connected in
parallel with the feedback resistor (56 kΩ); this creates a
low-pass filter.
) as a function of
MODE
SELECT
)
T
=25°C if not specially mentioned, VCC=5V,
amb
f = 1 kHz, RL=8Ω, Gv= 20 dB, audio band-pass
22 Hz to 22 kHz.
The BTL application circuit is illustrated in Fig.4.
1998 Apr 019
Page 10
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
BTL APPLICATION
handbook, full pagewidth
Gain channel12
Gain channel 22
C1
R2
R1
R3
R4
50 kΩ
IN1−
IN1+
C3
47 µF
OUT2−
50 kΩ
IN2−
IN2+
SVRR
MODE
SELECT
1 µF
10 kΩ
V
i1
C2
1 µF
10 kΩ
V
i2
R2
×=
------- R1
R4
×=
------- R3
2011
17
16
TDA8547TS
14
15
5
4
6
110
GND
TDA8547TS
V
C4
100 nF
OUT1−
18
R
OUT1+
3
OUT2−
13
OUT2+
8
MGK985
L1
R
L2
C5
100 µF
CC
30
handbook, halfpage
I
q
(mA)
20
10
0
0
RL= ∞.
Fig.4 BTL application.
MGD890
420
81216
VCC (V)
10
handbook, halfpage
THD
(%)
1
−1
10
−2
10
−2
10
f = 1 kHz; Gv=20dB.
(1) VCC= 5 V; RL=8Ω.
MGK988
(1)
−1
10
1
Po (W)
10
Fig.5 Iq as a function of VCC.
1998 Apr 0110
Fig.6 THD as a function of Po.
Page 11
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
2 × 0.7 W BTL audio amplifier with
output channel switching
12
MGK994
VCC (V)
16
handbook, halfpage
2
P
o
(W)
1.6
1.2
0.8
0.4
0
0
THD = 10%.
(1) RL=4Ω.
(2) RL=8Ω.
(3) RL=16Ω.
(1)(2)(3)
48
Fig.21 Po as a function of VCC.
TDA8547TS
1.5
handbook, halfpage
P
(W)
1.0
(1)(2)(3)
0.5
0
0
(1) RL=4Ω.
(2) RL=8Ω.
(3) RL=16Ω.
48
Fig.22 Worst case power dissipation as a function
of VCC (one channel active).
MGK995
VCC (V)
1612
1.2
handbook, halfpage
P
(W)
0.8
0.4
0
0
Sine wave of 1 kHz.
(1) VCC= 12 V; RL=16Ω.
(2) VCC= 7.5 V; RL=4Ω.
(3) VCC= 9 V; RL=8Ω.
0.40.81.6
(1)
(2)
(3)
1.2
Fig.23 Power dissipation as a function of P
(one channel active).
MGK996
Po (W)
o
1998 Apr 0115
Page 16
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
handbook, full pagewidth
TDA8547TS
IN1
IN2
a. Top view copper layout.
1 µF
1 µF
−OUT1
11 kΩ
11 kΩ
−OUT2
56 kΩ
56 kΩ
+V
CC
20
11
8542/47TS
100 µF
100 nF
TDA
GND
10 kΩ
1
10
b. Top view components layout.
+OUT1
10 kΩ
47 µF
+OUT2
TDA
8542TS
8547TS
MODE
SELECT
CIC
Nijmegen
MGK997
Fig.24 Printed-circuit board layout (BTL).
1998 Apr 0116
Page 17
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
20
D
c
y
Z
11
E
H
TDA8547TS
SOT266-1
A
X
v M
E
A
pin 1 index
110
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNITA1A
mm
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
1.5
0.1501.4
1.2
A
0.25
b
3
p
0.32
0.20
2
p
02.55 mm
scale
(1)E(1)
cD
0.20
6.6
6.4
4.5
4.3
0.13
eHELLpQZywv θ
0.651.00.2
6.6
6.2
Q
A
2
A
1
detail X
0.75
0.65
0.45
0.45
(A )
L
p
L
A
3
θ
0.130.1
0.48
0.18
(1)
o
10
o
0
OUTLINE
VERSION
SOT266-1
IEC JEDEC EIAJ
REFERENCES
1998 Apr 0117
EUROPEAN
PROJECTION
ISSUE DATE
90-04-05
95-02-25
Page 18
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
output channel switching
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
DIP
SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA8547TS
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Apr 0118
Page 19
Philips SemiconductorsProduct specification
2 × 0.7 W BTL audio amplifier with
TDA8547TS
output channel switching
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Apr 0119
Page 20
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands545102/00/02/pp20 Date of release: 1998 Apr01Document order number: 9397 75003347
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