2 × 1 W BTL audio amplifier with
output channel switching
Preliminary specification
File under Integrated Circuits, IC01
1997 Oct 07
Page 2
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
FEATURES
• Selection between output channels
• Flexibility in use
• Few external components
• Low saturation voltage of output stage
• Gain can be fixed with external resistors
• Standby mode controlled by CMOS compatible levels
• Low standby current
• No switch-on/switch-off plops
• High supply voltage ripple rejection
• Protected against electrostatic discharge
• Outputs short-circuit safe to ground, V
load
• Thermally protected.
and across the
CC
TDA8547
APPLICATIONS
• Telecommunication equipment
• Portable consumer products
• Personal computers
• Motor-driver (servo).
GENERAL DESCRIPTION
The TDA8547(T) is a two channel audio power amplifier
for an output power of 2 × 1 W with an 8 Ω load at a 5 V
supply. The circuit contains two BTL amplifiers with a
complementary PNP-NPN output stage and standby/mute
logic. The operating condition of all channels of the device
(standby, mute or on) is externally controlled by the
MODE pin. With the SELECT pin one of the output
channels can be switched in the standby condition. This
feature can be used for loudspeaker selection and also
reduces the quiescent current consumption.
The TDA8547T comes in a SO16 package and the
TDA8547 in a DIP16 package.
The TDA8547(T) is a 2 × 1 W BTL audio power amplifier
capable of delivering 2 × 1 W output power to an 8 Ω load
at THD = 10% using a 5 V power supply. Using the
MODE pin the device can be switched to standby and
mute condition. The device is protected by an internal
thermal shutdown protection mechanism. The gain can be
set within a range from 6 to 30 dB by external feedback
resistors.
Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the
negative side the saturation voltage of a NPN power
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and an 8 Ω loudspeaker an output power of
1 W can be delivered.
1997 Oct 074
MODE pin
The whole device (both channels) is in the standby mode
(with a very low current consumption) if the voltage at the
MODE pin is >(VCC− 0.5 V), or if this pin is floating. At a
MODE voltage level of less than 0.5 V the amplifier is fully
operational. In the range between 1.5 V and VCC− 1.5 V
the amplifier is in mute condition. The mute condition is
useful to suppress plop noise at the output caused by
charging of the input capacitor.
SELECT pin
If the voltage at the SELECT pin is in the range between
1.5 V and V
− 1.5 V, or if it is kept floating, then both
CC
channels can be operational. If the SELECT pin is set to a
LOW voltage or grounded, then only channel 2 can
operate and the power amplifier of channel 1 will be in the
standby mode. In this case only the loudspeaker at
channel 2 can operate and the loudspeaker at channel 1
will be switched off. If the SELECT pin is set to a
HIGH level or connected to VCC, then only channel 1 can
Page 5
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
operate and the power amplifier of channel 2 will be in the
standby mode. In this case only the loudspeaker at
channel 1 can operate and the loudspeaker at channel 2
will be switched off. Setting the SELECT pin to a LOW or
a HIGH voltage results in a reduction of quiescent current
consumption by a factor of approximately 2.
Switching with the SELECT pin during operating is not
plop-free, because the input capacitor of the channel
which is coming out of standby needs to be charged first.
Table 1 Control pins MODE and SELECT versus status of output channels
Voltage levels at control pins at V
= 5 V; for other supply voltages see Figs. 14 and 15.
P
CONTROL PINSTATUS OF OUTPUT CHANNEL
MODESELECTCHANNEL 1CHANNEL 2
(1)
HIGH
HVP
HVP
HVP
HVP
LOW
(4)
/LOW
(4)
/LOW
(4)
/LOW
/NC
(4)
(5)
(2)
(5)
(5)
(5)
HVP
HVP
HIGH
HVP
X
(4)
(4)
(4)
LOW
(3)
/NC
/NC
(1)
/NC
(5)
For plop-free channel selecting the device has first to be
set in mute condition with the MODE pin (between 1.5 V
and VCC− 1.5 V), then set the SELECT pin to the new
level, after a delay set the MODE pin to a LOW level.
The delay needed depends on the values of the input
capacitor and the feedback resistors. Time needed is
approx. 10 × C1 × (R1 + R2), so approximately 0.6 s. for
the values in Fig.4.
standbystandby0
(2)
(2)
mute/onstandby8
(2)
mute/onmute/on15
standbymute/on8
TDA8547
TYP. I
(mA)
mutemute15
onon15
q
Notes
1. HIGH = V
pin>VCC
− 0.5 V.
2. NC = not connected or floating.
3. X = don’t care.
4. HVP = 1.5 V < V
5. LOW = V
pin
< 0.5 V.
pin<VCC
− 1.5 V.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
V
I
I
ORM
T
stg
T
amb
V
Psc
P
tot
supply voltageoperating−0.3+18V
input voltage−0.3VCC+ 0.3V
repetitive peak output current−1A
storage temperature−55+150°C
operating ambient temperature−40+85°C
AC and DC short-circuit safe voltage−10V
total power dissipationSO16−1.2W
DIP16−2.2W
QUALITY SPECIFICATION
In accordance with
Handbook”
. The handbook can be ordered using the code 9397 750 00192.
“SNW-FQ-611-E”
. The number of the quality specification can be found in the
1997 Oct 075
“Quality Reference
Page 6
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
TDA8547
channel switching
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th(j-a)
thermal resistance from junction to ambientin free air
TDA8547T (SO16)100K/W
TDA8547 (DIP16)55K/W
2.5
handbook, halfpage
P
(W)
2.0
1.5
1.0
DIP16
SO16
MGK698
0.5
0
04080160
120
T
amb
(°C)
Fig.3 Power derating curve.
Table 2 Maximum ambient temperature at different conditions
offset
input bias current−−500nA
input voltage MODE pinoperating0−0.5V
input current MODE pin0 V < V
input voltage SELECT pinchannel 1 = standby;
input current SELECT pinV
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless
MODE
−1522mA
note 1
BTL 1 channel;
−812mA
note 1
MODE=VCC
−−10µA
−−50mV
mute1.5−V
standbyV
MODE<VCC
− 0.5 −V
CC
−−20µA
CC
CC
0−1V
channel 2 = on
channel 1 = on;
V
− 1−V
CC
CC
channel 2 = standby
=0V−−100µA
SELECT
− 1.5 V
V
V
Notes
1. Measured with R
= ∞. With a load connected at the outputs the quiescent current will increase, the maximum of this
L
increase being equal to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VCC.
1997 Oct 077
Page 8
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
TDA8547
channel switching
AC CHARACTERISTICS
V
=5V; T
CC
unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
P
o
THDtotal harmonic distortionPo= 0.5 W−0.150.3%
G
v
Z
i
V
no
SVRRsupply voltage ripple rejectionnote 350−−dB
V
o
α
cs
Notes
1. Gain of the amplifier is in BTL application circuit Fig.4.
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a
source impedance of R
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS=0Ω at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS=0Ω at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz,
so including noise.
6. Channel separation is measured at the output with a source impedance of RS=0Ω at the input and a frequency of
1 kHz. The output power in the operating channel is set to 0.5 W.
=25°C; RL=8Ω; f = 1 kHz; V
amb
= 0 V; gain = 20 dB; measured in BTL application circuit Fig.4;
2 × 1 W BTL audio amplifier with output
channel switching
TEST AND APPLICATION INFORMATION
Test conditions
Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each
application are shown separately.
The thermal resistance = 55 K/W for the DIP16; the
maximum sine wave power dissipation for T
150 25–
is:
----------------------
For T
amb
150 60–
---------------------55
55
2.3 W=
=60°C the maximum total power dissipation is:
1.7 W=
BTL application
=25°C if not specially mentioned, VCC=5V,
T
amb
f = 1 kHz, RL=8Ω, Gv= 20 dB, audio band-pass
22 Hz to 22 kHz.
The BTL application circuit is illustrated in Fig.4.
The quiescent current has been measured without any
load impedance and both channels driven. When one
channel is active the quiescent current will be halved.
The total harmonic distortion as a function of frequency
was measured using a low-pass filter of 80 kHz.
The value of capacitor C3 influences the behaviour of the
SVRR at low frequencies: increasing the value of C3
increases the performance of the SVRR.
The figure of the MODE voltage (V
) as a function of
MODE
the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depend on the supply
voltage level. The figure of the SELECT voltage (V
as a function of the supply voltage shows the voltage
levels for switching the channels in the active, mute or
standby mode.
amb
=25°C
SELECT
TDA8547
SE application
=25°C if not specially mentioned, VCC= 7.5 V,
T
amb
f = 1 kHz, RL=4Ω, Gv= 20 dB, audio band-pass
22 Hz to 22 kHz.
The SE application circuit is illustrated in Fig.16.
Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive
output is not designed for high output current (2 × Io) at
low load impedance (≤16 Ω), the SE application with
output capacitors connected to ground is advised.
The capacitor value of C6/C7 in combination with the load
impedance determines the low frequency behaviour.
The THD as a function of frequency was measured using
a low-pass filter of 80 kHz. The value of capacitor C3
influences the behaviour of the SVRR at low frequencies:
increasing the value of C3 increases the performance of
the SVRR.
General remark
The frequency characteristic can be adapted by
connecting a small capacitor across the feedback
resistor. To improve the immunity to HF radiation in radio
circuit applications, a small capacitor can be connected in
parallel with the feedback resistor (56 kΩ); this creates a
low-pass filter.
)
1997 Oct 079
Page 10
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
2 × 1 W BTL audio amplifier with output
channel switching
12
MGD903
VCC (V)
16
handbook, halfpage
2
P
o
(W)
1.6
1.2
0.8
0.4
0
0
THD = 10%.
(1) RL=4Ω.
(2) RL=8Ω.
(3) RL=16Ω.
(1)(2)(3)
48
Fig.21 Po as a function of VCC.
TDA8547
handbook, halfpage
3
P
(W)
2
1
0
0
(1) RL=4Ω.
(2) RL=8Ω.
(3) RL=16Ω.
(1)(2)(3)
48
Fig.22 Worst case power dissipation as a function
of VCC (both channels on).
MGD904
VCC (V)
1612
1.2
MGD905
Po (W)
2.4
handbook, halfpage
P
(W)
1.6
0.8
0
0
Sine wave of 1 kHz.
(1) VCC= 12 V; RL=16Ω.
(2) VCC= 7.5 V; RL=4Ω.
(3) VCC= 9 V; RL=8Ω.
(1)
(2)
(3)
0.40.81.6
Fig.23 Power dissipation as a function of Po (both
channels on).
1997 Oct 0715
Page 16
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
handbook, full pagewidth
TDA8547
MODE
12 kΩ
TDA
8547
SELECT
+
OUT2
a. Top view without components.
+
100 µF
100 nF
V
CC
D&A AUDIO POWER
−
OUT1
56 kΩ
16
11 kΩ
11 kΩ
9
56 kΩ
12 kΩ
P3
12 kΩ
+
OUT1
47 µF
GND
12
kΩ
1
8
TDA8547
b. Top view with components.
CIC NIJMEGEN
1 µF
1 µF
−
OUT2
IN1
IN2
MGK703
Fig.24 Printed-circuit board layout (BTL and SE).
1997 Oct 0716
Page 17
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 7.5 mm
D
c
y
Z
16
9
TDA8547
SOT162-1
E
H
E
A
X
v M
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A
2
2.45
2.25
0.096
0.089
A
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
8
w M
b
p
0510 mm
scale
(1)E(1)(1)
cD
10.5
10.1
0.41
0.40
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
A
2
10.65
10.00
0.419
0.394
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
0.043
0.039
1.1
1.0
Q
3
0.250.1
0.01
A
θ
ywvθ
0.004
Z
0.9
0.4
0.035
0.016
o
8
o
0
(A )
L
p
L
0.25
0.01
OUTLINE
VERSION
SOT162-1
IEC JEDEC EIAJ
075E03 MS-013AA
REFERENCES
1997 Oct 0717
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 18
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
w M
TDA8547
SOT38-1
M
E
A
2
A
1
c
(e )
1
M
H
pin 1 index
1
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
1
0.53
0.38
0.021
0.015
REFERENCES
cEeM
0.32
0.23
0.013
0.009
D
21.8
21.4
0.86
0.84
8
scale
(1)(1)
6.48
6.20
0.26
0.24
E
(1)
Z
e
0.30
1
M
L
3.9
3.4
0.15
0.13
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
w
H
0.2542.547.62
0.010.100.0200.19
ISSUE DATE
92-10-02
95-01-19
max.
2.2
0.087
1997 Oct 0718
Page 19
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
DIP
SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA8547
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Oct 0719
Page 20
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
TDA8547
channel switching
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Oct 0720
Page 21
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
NOTES
TDA8547
1997 Oct 0721
Page 22
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
NOTES
TDA8547
1997 Oct 0722
Page 23
Philips SemiconductorsPreliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
NOTES
TDA8547
1997 Oct 0723
Page 24
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands547027/25/01/pp24 Date of release: 1997 Oct 07Document order number: 9397 750 02338
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.