Datasheet TDA8540T-C2, TDA8540-C2 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02

1995 Feb 06

INTEGRATED CIRCUITS

Philips Semiconductors

TDA8540

4 × 4 video switch matrix

1995 Feb 06 2

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

FEATURES

• I2C-bus or non-I2C-bus mode (controlled by
DC voltages)

• S-VHS or CVBS processing

• 3-state switches for all channels

• Selectable gain for the video channels

• sub-address facility

• Slave receiver in the I2C mode

• Auxiliary logic outputs for audio switching

• System expansion possible up to 7 devices

(28 sources)

• Static short-circuit proof outputs

• ESD protection.

APPLICATIONS

• Colour Television (CTV) receivers

• Peritelevision sets

• Satellite receivers.

GENERAL DESCRIPTION

The TDA8540 has been designed for switching between
composite video signals, therefore the minimum of four
input lines are provided as requested for switching
between two S-VHS sources. Each of the four outputs can
be set to a high impedance state, to enable parallel
connection of several devices.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

supply voltage 7.2 − 8.8 V

I

CC

supply current − 20 30 mA

I

SO

isolation ‘OFF’ state at f = 5 MHz 60 80 − dB

B 3 dB bandwidth 12 −−MHz

α

ct

crosstalk attenuation between
channels

60 70 − dB

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8540 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1

TDA8540T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1995 Feb 06 3

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

BLOCK DIAGRAM

handbook, full pagewidth

PEAK-

CLAMP

PEAK-

CLAMP

PEAK-

CLAMP/

BIAS

SUPPLY

PEAK-

CLAMP/

BIAS

DECODER

1 OF 4

DECODER

1 OF 4

DECODER

1 OF 4

DECODER

1 OF 4

SWITCH MATRIX

DRIVER

3

DRIVER

2

DRIVER

1

DRIVER

0

IN3

IN2

IN1

IN0

V

CC

12

10

8

6

13
20

9

11 7 5 18 19

DGND
AGND

S0 S1 S2 SCL SDA

3

1

14

16

17

2

OUT3

OUT2

OUT1

OUT0

D1
D0

V

CC(D0,1)

V

CC(D2,3)

415

I

2

C RECEIVER

MLA279 - 2

TDA8540

EN0 to EN3

4

GAIN

GAIN

GAIN

GAIN

G0 to G3

4

2222

4444

2

CL0 to CL1

power reset

Fig.1 Block diagram.

1995 Feb 06 4

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

PINNING

SYMBOL PIN DESCRIPTION

OUT2 1 video output 2
D0 2 control output 0
OUT3 3 video output 3
V

CC(D2,3)

4 driver supply voltage; for

drivers 2 and 3
S2 5 sub-address input 2
IN0 6 video input 0 (CVBS or

chrominance signal)
S1 7 sub-address input 1
IN1 8 video input 1 (CVBS or

chrominance signal)
AGND 9 analog ground
IN2 10 video input 2 (CVBS or luminance

signal)
S0 11 sub-address input 0
IN3 12 video input 3 (CVBS or luminance

signal)
V

CC

13 general supply voltage
OUT1 14 video output 1
V

CC(D0,1)

15 driver supply voltage; for

drivers 0 and 1
OUT0 16 video output 0
D1 17 control output 1
SCL 18 serial clock input
SDA 19 serial data input/output
DGND 20 digital ground

handbook, halfpage

1
2
3
4
5
6
7
8
9

10

20
19
18
17
16
15
14
13
12
11

OUT2

D0

OUT3

V

CC(D2,3)

S2

IN0

S1

IN1

AGND

IN2

DGND

SDA

SCL

D1

OUT0
V

CC(D0,1)
OUT1
V

CC

IN3
S0

TDA8540

MLA277 - 2

Fig.2 Pinning configuration.

1995 Feb 06 5

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

FUNCTIONAL DESCRIPTION

The TDA8540 is controlled via a bidirectional I2C-bus.
3 bits of the I2C address can be selected via the address
pin, thus providing a facility for parallel connection of
7 devices.

Control options via the I2C-bus:

• The input signals can be clamped at their negative peak
(top sync).

• The gain factor of the outputs can be selected between
1× or 2×.

• Each of the four outputs can individually be connected
to one of the four inputs.

• Each output can individually be set in a high impedance
state.

• Two binary output data lines can be controlled for
switching accompanying sound signals.

The SDA and SCL pins (pins 19 and 18) can be connected
to the I

2

C-bus or to DC switching voltage sources. Address
inputs S0 to S2 (pins 11, 7 and 5) are used to select
sub-addresses or switching to the non-I2C mode. Inputs
S0 to S2 can be connected to the supply voltage (HIGH) or
the ground (LOW). In this way no peripheral components
are required for selection.

Table 1 I

2

C-bus sub-addressing

I

2

C-bus control

After power-up the outputs are initialized in the high
impedance state, and D0 and D1 are at a LOW level.

Detailed description of the I2C-bus specification, with
applications, is given in brochure

“The I2C-bus and how to

use it”

. This brochure may be ordered using the code

9398 393 40011.
The TDA8540 is aslave receiver and the protocol is given

in Table 2.

S2 S1 S0

SUB-ADDRESS

A2 A1 A0

LLL000
LLH001
LHL010

LHH011
HLL100
HLH101
HHL110
H H H non I

2

C addressable

Table 2 The TDA8540 protocol

Notes

1. S = START condition.

2. Data transmission to the TDA8540 starts with the slave address (SLV).

3. A = acknowledge bit, generated by TDA8540.

4. P = STOP condition.

Table 3 Data transmission to the TDA8540 begins with SLV

Notes

1. A2 to A0: pin programmable slave address bits.

2. R/

W = 0; write only.

After the SLV, a second byte, SUB, is required for selecting the functions, as shown in Table 4.

SEQUENCE

S

(1)

SLV

(2)

A

(3)

SUB A

(3)

DATA A

(3)

DATA A

(3)

P

(4)

A6

MSB

A5 A4 A3 A2 A1 A0

R/W
LSB

1001A2

(1)

A1

(1)

A0

(1)

0

(2)

1995 Feb 06 6

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

Table 4 The second byte: SUB

Options for SUB:

If SUB = 00H: access to switch control (SW1)
If SUB = 01H: access to gain/clamp/data control (GCO)
If SUB = 02H: access to output enable control (OEN).

Remarks:

If more than one data byte is sent, the SUB byte will be automatically incremented.
If more than 3 data bytes are sent, the internal counter will roll over and the device will then rewrite the first register.

Data Bytes

SWI (SUB = 00H): selects which input is connected to the different outputs, as shown in Table 5.

Table 5 SWI (SUB = 00H) selection of inputs connected to outputs

Table 6 Selection of inputs

Note

1. For j = 0 to 3.
Example: if S21 = 0 and S20 = 1, then OUT2 is connected to IN1.

GCO (SUB = 01H):

• Selects the gain of each output.

• Selects the clamp action or mean value on inputs 0 and 1.

• Determines the value of the auxiliary outputs D1 and D0.

Table 7 GCO byte

Notes

1. For j = 0 to 3: if Gj = 0 (1), then output j has a gain of 2 (1).

2. If CL0 (CL1) = 0, then input signal on IN0 (IN1) is clamped.

3. For j = 0 or 1: if Dj = 0 (1), then logical output j is LOW (HIGH).

7MSB6543210LSB

000000RS1RS0

7MSB6543210LSB

S31 S30 S21 S20 S11 S10 S01 S00

OUTPUT

Sj1 AND Sj0

(1)

00 01 10 11

OUTj IN0 IN1 IN2 IN3

7MSB6543210LSB

G3

(1)

G2

(1)

G1

(1)

G0

(1)

CL1

(2)

CL0

(2)

D1

(3)

D0

(3)

1995 Feb 06 7

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

OEN (SUB = 02H): selects, for each output, if the output is active or high impedance, see Table 8.

Table 8 OEN (SUB = 02H) determines which output is active or high impedance

Notes

1. X = don’t care.

2. For j = 0 to 3: if ENj = 0 (1), then OUT j is high impedance (active).

After a power-on reset:

• The outputs are set to a high impedance state; the outputs are connected to IN0; the gains are set at two and inputs

IN0 and IN1 are clamped.

• Programming of the device is necessary because the outputs are in high impedance state.

Non-I

2

C-bus control

If the S0, S1 and S2 pins are all connected to VCC the device will enter the non-I2C-bus mode.
After a power-on reset:

• Gain is set at two for all outputs.

• All inputs are clamped.

• All outputs are active.

• The matrix position is given by the SDA and SCL voltage level.

Table 9 Non-I

2

C-bus control

SCL and SDA act as normal input pins:

SCL interchanges (OUT3 and OUT2) with (OUT1 and OUT0).
SDA interchanges OUT3 with OUT2 and OUT1 with OUT0.

Remark: For use with chrominance signals, the clamp action must be overruled by external bias.

7MSB6543210LSB

X

(1)

X

(1)

X

(1)

X

(1)

EN3

(2)

EN2

(2)

EN1

(2)

EN0

(2)

OUTPUT

SCL AND SDA

00 01 10 11

OUT3 IN3 IN2 IN1 IN0
OUT2 IN2 IN3 IN0 IN1
OUT1 IN1 IN0 IN3 IN2
OUT0 IN0 IN1 IN2 IN3

1995 Feb 06 8

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

Notes

1. Human Body Model (HBM): in accordance with UZW-BO/FQ-A302.

2. Machine Model (MM): in accordance with UZW-BO/FQ-B302 (stress reference pins: AGND and DGND
short-circuited and V

CC

).

THERMAL CHARACTERISTICS

OPERATING CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

supply voltage (pin 13) −0.3 +9.1 V

P

tot

total power dissipation − 750 mW

V

CC(D0,1)

, V

CC(D2,3)

driver supply voltage −0.3 +13.8 V
IN0 to IN3 video input voltage −0.3 +7.2 V
OUT0 to OUT3 video output voltage −0.3 +7.2 V
D0, D1 control output voltage −0.3 +7.2 V
SDA, SDL I

2

C input/output voltage −0.3 +8.8 V
S0 to S2 sub-address input voltage −0.3 +8.8 V
T

stg

IC storage temperature −55 +125 °C

T

j

junction temperature − +150 °C

V

es

electrostatic handling HBM; note 1 −1500 +1500 V

MM; note 2 −200 +200 V

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SOT146-1 60 (typ.) K/W
SOT163-1 85 (typ.) K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

General

V

CC

supply voltage (pin 13) 7.2 − 8.8 V

T

amb

operating ambient temperature 0 − 70 °C

Video inputs (pins 6, 8, 10 and 12)

C

I

external capacitor − 100 − nF

V

I(p-p)

C signal amplitude (peak-to-peak value) note 1 −−1V

V

I(p-p)

CVBS or Y-signal amplitude
(peak-to-peak value)

note 2 −−1.5 V

Video drivers (pins 4 and 15)

R

D

external collector resistor note 3 − 25 −Ω

C

D

external decoupling capacitor note 4 − 22 −µF

1995 Feb 06 9

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

Notes

1. Only for pins 6 and 8 when clamp action is not selected for these pins.

2. On all the video input pins, when non-I2C-bus control mode is selected or when clamp action is selected on
pins 6 and 8 (by I2C-bus control).

3. Connected between VCC and pin 4 or pin 15.

4. Connected between AGND and pin 4 or pin 15.

CHARACTERISTICS

V

CC

=8V; T

amb

=25°C; gain condition, clamp condition and OFF state are controlled by the I2C-bus;

unless otherwise specified.

Sub-address S0, S1 and S2 (pins 5, 7 and 11)

V

IH

HIGH level input voltage 4 − V

CC

V

V

IL

LOW level input voltage 0 − 1V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

CC

supply current without load − 20 30 mA

OFF state − 12 − mA
Video inputs: IN0 to IN3 when the clamp is active (see Figs 3 and 4)
I

LI

input leakage current VI=3V − 0.4 1 µA

V

clamp

input clamping voltage II=5µA − 2.2 − V

I

clamp

input clamping current VI=0V 1.2 −−mA
Video inputs: IN0 and IN2 when the clamp is not active (see Fig.3)
V

bias

DC input bias level II=0 − 2.9 − V
R

I

input resistance − 10 − kΩ
Video outputs: OUT0 to OUT3 (see Fig.5)
Z

O

output impedance OFF state 100 −−kΩ
R

O

output resistance − 5 −Ω
ISO isolation OFF state; f = 5 MHz 60 −−dB
V

O

output top sync level; (Y or CVBS) 0.4 0.7 1 V
V

bias

output mean value for chrominance

signals

G = 2; load = 150 Ω 1.5 1.9 2.2 V
G = 1; without load 1 1.3 1.6 V

G

v

voltage gain G = 1; f=1MHz −1 0 +1 dB

G=2; f=1MHz 567dB

G

diff

differential gain note 1 − 0.5 3 %

ϕ

diff

differential phase note 1 − 0.6 − deg
NL non linearity note 2 − 0.5 2 %

α

ct

crosstalk attenuation between channels note 3 60 70 − dB
SVRR supply voltage rejection note 4 36 55 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1995 Feb 06 10

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

Notes

1. Gain set at 2; RL= 150 Ω; test signal D2 from CCIR 330.

2. Gain set at 2; RL= 150 Ω; test signal D1 from CCIR 17.

3. Measured from any selected input to output; f = 5 MHz; RL= 150 Ω; gain set at 2; VI= 1.5 V (peak-to-peak value).
This measurement requires an optimized board.

4. Supply voltage ripple rejection: ;
measured at f = 1 kHz with V

ripple (supply max)

= 100 mV (peak-to-peak value).

The supply voltage rejection ratio is >36 dB at f

max

= 100 kHz.

∆G maximum gain variation 100 kHz < f < 5 MHz − 0.5 − dB

100 kHz < f < 8.5 MHz − 1 − dB
100 kHz < f < 12 MHz − 3 − dB

α

ct

crosstalk attenuation of I2C-bus signals 60 −−dB

Auxiliary outputs D0 and D1 (open collector)

I

OH

HIGH level output current VOH= 5.5 V −−10 µA

V

OL

LOW level output voltage IOL=4mA −−0.4 V

I

2

C-bus inputs SCL and SDA

I

IH

HIGH level input current VIH= 3.0 V −−10 µA

I

IL

LOW level input current VIL= 1.5 V −10 −−µA

C

i

input capacitance −−10 pF

I

2

C-bus output SDA

V

OL

LOW level output voltage IOL=3mA −−0.4 V

Sub-address S0, S1 and S2

I

IH

HIGH level input current VIH=V

CC

−−10 µA

I

IL

LOW level input current VIL=0V −−10 µA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

20 log

V

ripple (supply)

V

ripple (on output)

------------------------------------- -

1995 Feb 06 11

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

Fig.3 IN0 and IN1 inputs.

ook, full pagewidth

V

ref =

2.2 V + V

be

6 V

IN0 or
IN1

MLA282 - 1

CLAMP
CONTROL

TDA8540

handbook, halfpage

V

ref =

2.2 V + V

be

6 V

IN2 or
IN3

MLA280

TDA8540

Fig.4 IN2 and IN3 inputs.

handbook, halfpage

MLA281 - 1

OUT0 (OUT2)

OUT1 (OUT3)

VCCV

CC(D0,1)VCC(D2,3)

TDA8540

()

Fig.5 Driver output stage.

1995 Feb 06 12

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

APPLICATION INFORMATION

handbook, full pagewidth

V

CC(D2,3)

IN3

100 nF

IN2

100 nF

IN1

100 nF

IN0

100 nF

V

CC

video

sources

DGND AGND

S0 S1 S2 SCL SDA

address

inputs

serial data

and

clock signals

12

10

8

6

13

20

911751819

TDA8540

415

3

1

14

16

17

2

V

CC(D0,1)

OUT3

OUT2

OUT1

OUT0

D1
D0

10 
kΩ

10
kΩ

outputs

digital 
supply
(+5 V)

audio
source
control

V

CC

V

CC

100 µF

22 µF 22 µF

25 Ω 25 Ω

MLA278 - 3

C

i

R

D

C

D

C

i

C

i

C

i

R

D

C

D

Fig.6 Application diagram.

VCC= analog supply (+8 V).

1995 Feb 06 13

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

PACKAGE OUTLINES

MSA258

2.54
(9x)

0.254

M

0.53
max

seating plane

3.60

3.05

2.0

max

26.92

26.54

4.2

max

3.2

max

0.51
min

8.25

7.80

0.38 max

7.62

10.0

8.3

11

10

6.40

6.22

1.73 max

20

1

Fig.7 Plastic dual in-line package; 20 leads (300 mil); DIP20; SOT146-1.

Dimensions in mm.

1995 Feb 06 14

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

handbook, full pagewidth

7.6

7.4

10.65

10.00

A

MBC234 - 1

0.3

0.1

2.45

2.25

1.1

0.5

0.32

0.23

1.1

1.0

0 to 8

o

2.65

2.35

detail A

S

13.0

12.6

0.1 S

110

1120

pin 1
index

0.9

0.4

(4x)

0.25 M

(20x)

0.49

0.36

1.27

Fig.8 Plastic small outline package; 20 leads; body width 7.5 mm (SO20; SOT163-1).

Dimensions in mm.

1995 Feb 06 15

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

SOLDERING
Plastic small outline packages

B

YWAVE

During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

B

Y SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

R

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

Plastic dual in-line packages

BY DIP OR WAVE
The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.

1995 Feb 06 16

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1995 Feb 06 17

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

NOTES

1995 Feb 06 18

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

NOTES

1995 Feb 06 19

Philips Semiconductors Product specification

4 × 4 video switch matrix TDA8540

NOTES

Philips Semiconductors

Philips Semiconductors – a worldwide company

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BUENOS AIRES, Tel. [phone], Fax. [phone]

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Tel. [phone], Fax. [phone]

Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]

Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,

Tel. [phone], Fax. [phone]

Brazil: Rua do Rocio 220 - 5

th

floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil.
P.O. Box 7383 (01064-970).
Tel. [phone], Fax. [phone]

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Tel. [phone], Fax. [phone].

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg.,

24-28 Kung Yip St., KWAI CHUNG, N.T.,
Tel. [phone], Fax. [phone] 6009

India: Philips INDIA Ltd, Shivsagar Estate, A Block ,

Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. [phone], Fax. [phone]

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

P.O. Box 4252, JAKARTA 12950,
Tel. [phone], Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS S.r.l.,

Piazza IV Novembre 3, 20124 MILANO,
Tel. [phone], Fax. [phone]

Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]

Korea: (Republic of) Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Tel. [phone], Fax. [phone]

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. [phone],
Fax. [phone].

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. [phone], Fax. [phone].

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone].

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone].

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. [phone], Fax. [phone].

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. [phone], Fax. [phone]

United States:811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. [phone], Fax. [phone]

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. [phone], Fax. [phone]

Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCD38 © Philips Electronics N.V. 1994

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533061/1500/03/pp20 Date of release: 1995 Feb 06
Document order number: 9397 747 30011