Datasheet TDA8511J-N1 Datasheet (Philips)

DATA SH EET

Preliminary specification
Supersedes data of 1999 Jun 14
File under Integrated Circuits, IC01

2000 Mar 10

INTEGRATED CIRCUITS

TDA8511J

4 × 13 W single-ended power
amplifiers

2000 Mar 10 2

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

FEATURES

• Requires very few external components

• High output power

• Fixed gain

• Diagnostic facility (distortion, short-circuit and

temperature detection)

• Good ripple rejection

• Mode select switch (operating, mute and standby)

• AC and DC short-circuit safe to ground and to V

P

• Low power dissipation in any short-circuit condition

• Thermally protected

• Reverse polarity safe

• Electrostatic discharge protection

• No switch-on/switch-off plop

• Flexible leads

• Low thermal resistance

• Identical inputs.

APPLICATIONS

The device is primarily developed for multi-media
applications and active speaker systems.

GENERAL DESCRIPTION

The TDA8511Jis an integrated class-B output amplifier in
a 17-lead DIL-bent-SIL power package. It contains
4 × 13 W single-ended amplifiers.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage 6 15 18 V

I

ORM

repetitive peak output current −−4A

I

q(tot)

total quiescent current − 80 − mA

I

stb

standby current − 0.1 100 µA

P

o

output power THD = 10%

R

L

=4Ω−7−W

R

L

=2Ω−13 − W
SVRR supply voltage ripple rejection 46 −−dB
V

n(o)

noise output voltage Rs=0Ω−50 −µV

Z

i

 input impedance 50 −−kΩ

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8511J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1

2000 Mar 10 3

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

mode
select

switch

MGL497

output 1

15 kΩ

15 kΩ

x1

VA

stand-by

switch

V

P

mute
switch

stand-by
reference
voltage

5

13

V

P1

V

P2

18 kΩ

2

kΩ

mute switch

VA

C

m

power stage

18 kΩ

mute switch

VA

C

m

power stage

6

8

14

18 kΩ

mute switch

VA

C

m

power stage

18 kΩ

mute switch

VA

C

m

power stage

10

12

2711

ground
(signal)

GND1 GND2

power ground (substrate)

output 3

output 4

output 2

input 1

input 3

15

1

TDA8511J

mute
reference
voltage

input
reference
voltage

2

kΩ

60
kΩ

60
kΩ

input 2

3

PROTECTIONS

thermal

short-circuit

diagnostic

output

16

4

supply voltage

ripple rejection

input 4

17

2

kΩ

60
kΩ

2

kΩ

60
kΩ

9

not connected

2000 Mar 10 4

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

PINNING

SYMBOL PIN DESCRIPTION

IN1 1 input 1
SGND 2 signal ground
IN2 3 input 2
RR 4 supply voltage ripple rejection
V

P1

5 supply voltage
OUT1 6 output 1
GND1 7 power ground 1
OUT2 8 output 2
n.c. 9 not connected
OUT3 10 output 3
GND2 11 power ground 2
OUT4 12 output 4
V

P2

13 supply voltage
MODE 14 mode select switch input
IN3 15 input 3
V

DIAG

16 diagnostic output
IN4 17 input 4

Fig.2 Pin configuration.

handbook, halfpage

TDA8511J

MGL498

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17

IN1

SGND

IN2

RR

V

P1

OUT1

GND1

OUT2

n.c.

OUT3

GND2

OUT4

V

P2

MODE

IN3

V

DIAG

IN4

FUNCTIONAL DESCRIPTION

The TDA8511J contains four identical amplifiers and can
be used for single-ended applications. The gain of each
amplifier is fixed at 20 dB. Special features of the device
are:

• Mode select switch (pin 14)

• Diagnostic output (pin 16).

Mode select switch (pin 14)

• Low standby current (<100 µA)

• Low switching current (low cost supply switch)

• Mute facility.

Toavoidswitch-onplops,itisadvisedtokeeptheamplifier
in the mute mode during ≥100 ms (charging of the input
capacitors at pin 1, 3, 15 and pin 17).

This can be achieved by:

• Microprocessor control

• External timing circuit (see Fig.7).

Diagnostic output (pin 16)

DYNAMIC DISTORTION DETECTOR (DDD)
At the onset of clipping of one or more output stages, the

dynamic distortion detector becomes active and pin 16
goes LOW. This information can be used to drive a sound
processor or DC volume control to attenuate the input
signal and thus limit the distortion. The output level of
pin 16 is independent of the number of channels that are
clipping (see Fig.3).

2000 Mar 10 5

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

SHORT-CIRCUIT PROTECTION
When a short-circuit occurs at one or more outputs to

ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device is switched on again, with a delay of approximately
20 ms, after removal of the short-circuit. During this
short-circuit condition, pin 16 is continuously LOW.

When a short-circuit across the load of one or more
channels occurs the output stages are switched off during
approximately 20 ms. After that time it is checked during
approximately 50 µs to see whether the short-circuit is still
present. Due to this duty cycle of 50 µs/20 ms the average
current consumption during this short-circuit condition is
very low (approximately 40 mA).

During this short-circuit condition, pin 16 is LOW for 20 ms
and HIGH for 50 µs (see Fig.4).

The power dissipation in any short-circuit condition is very
low.

TEMPERATURE DETECTION
When the virtual junction temperature Tvjreaches 150 °C,

pin 16 will be active LOW.

OPEN COLLECTOR OUTPUT
Pin 16 is an open collector output, which allows that more

devices can be connected together (pins 16).

Fig.3 Distortion detector waveform.

handbook, halfpage

0

V

P

V

O

t

0

MGA706

V

16

Fig.4 Short-circuit waveform.

handbook, full pagewidth

MGL508

short-circuit over the load

20 ms

50 µs

t

t

V

P

current

in

output

stage

V

16

2000 Mar 10 6

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

LIMITING VALUES

In accordance with the absolute maximum system (IEC 134).

THERMAL CHARACTERISTICS

In accordance with IEC 747-1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage operating − 18 V

no signal − 20 V

I

OSM

non-repetitive peak output current − 6A

I

ORM

repetitive peak output current − 4A

V

psc

AC and DC short-circuit safe voltage − 18 V

V

pr

reverse polarity − 6V

P

tot

total power dissipation − 60 W

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature −40 +85 °C

T

vj

virtual junction temperature − 150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 40 K/W

R

th(j-c)

thermal resistance from junction to case see Fig.5 1.3 K/W

Fig.5 Equivalent thermal resistance network.

handbook, halfpage

3.0 K/W

0.7 K/W

3.0 K/W

virtual junction

output 1 output 2

case

3.0 K/W

0.7 K/W

3.0 K/W

output 3 output 4

MEA860 - 2

0.2 K/W

2000 Mar 10 7

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

DC CHARACTERISTICS

VP= 15 V; T

amb

=25°C; measured in Fig.6; unless otherwise specified.

Note

1. The circuit is DC adjusted at V

P

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage note 1 6 15 18 V

I

P

quiescent current − 80 160 mA

V

O

DC output voltage − 6.9 − V

Mode select switch

V

on

switch-on voltage level 8.5 −−V
MUTE CONDITION
V

mute

mute voltage 3.3 − 6.4 V
V

O

output voltage in mute position V

i(max)

= 1 V; f = 1 kHz −−2mV
STANDBY CONDITION
V

stb

standby voltage 0 − 2V

I

stb

standby current −−100 µA

I

sw(on)

switch-on current − 12 40 µA

Diagnostic output (pin 16)

V

DIAG

diagnostic output voltage any short-circuit or clipping −−0.6 V

2000 Mar 10 8

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

AC CHARACTERISTICS

VP= 15 V; RL=4Ω; f = 1 kHz; T

amb

=25°C; measured in Fig.6; unless otherwise specified.

Notes

1. Output power is measured directly at the output pins of the IC.

2. Frequency response externally fixed.

3. Ripple rejection measured at the output with a source-impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
at a frequency between 100 Hz and 10 kHz.

4. Noise measured in a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage independent of R

s

(Vi= 0 V).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

O

output power note 1

THD = 0.5% 4 5.5 − W
THD = 10% 5.5 7 − W

THD total harmonic distortion P

O

=1W − 0.06 − %

P

O

output power RL=2Ω; note 1

THD = 0.5% − 10 − W
THD = 10% − 13 − W

f

l

low frequency roll-off at −1 dB; note 2 − 25 − Hz

f

h

high frequency roll-off at −1dB 20 −−kHz

G

v

closed loop voltage gain 19 20 21 dB

SVRR supply voltage ripple rejection note 3

on 48 −−dB
mute 46 −−dB
standby 80 −−dB

Z

i

 input impedance 50 60 75 kΩ

V

n(o)

noise output voltage

on; R

s

=0Ω; note 4 − 50 −µV

on; R

s

=10kΩ; note 4 − 70 100 µV

mute; notes 4 and 5 − 50 −µV

α

CS

channel separation Rs=10kΩ 40 60 − dB

∆G

v

 channel unbalance −−1dB

Dynamic distortion detector

THD total harmonic distortion V

16

≤ 0.6 V;

no short-circuit

− 10 − %

2000 Mar 10 9

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

TEST/APPLICATION INFORMATION

Fig.6 Application diagram.

handbook, full pagewidth

MGL499

100

nF

16 5 13

220 nF

1

R

L

R

L

R

L

R

L

6

8

711

V

P

TDA8511J

2200

µF

60
kΩ

2

ground (signal)

10

kΩ

9

not connected

3

input 2

60
kΩ

60

kΩ

reference

voltage

220 nF

15

10

60
kΩ

input 3

4

17

12

power ground (substrate)

input 1

supply
voltage
ripple
rejection

input 4

220 nF

V /2

p

1000 µF

220 nF

100

µF

14

diagnostic

1000 µF

1000 µF

1000 µF

mode

switch

2000 Mar 10 10

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

Mode select switch

Toavoidswitch-onplops,itisadvisedtokeeptheamplifier
in the mute mode during >100 ms (charging of the input
capacitors at pins 1, 3, 15 and 17.

The circuit in Fig.7 slowly ramps up the voltage at the
mode select switch pin when switching on and results in
fast muting when switching off.

Fig.7 Mode select switch circuitry.

handbook, halfpage

100 kΩ

MGA708

47 µF

10 kΩ 100 Ω

mode
select
switch

V

P

2000 Mar 10 11

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

PACKAGE OUTLINE

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT243-1

0 5 10 mm

scale

D

L

E

A

c

A

2

L

3

Q

w M

b

p

1

d

D

Z

e

e

x

h

117

j

E

h

non-concave

97-12-16
99-12-17

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

SOT243-1

view B: mounting base side

m

2

e

v M

B

UNIT A e

1

A2bpcD

(1)

E

(1)

Z

(1)

deD

h

LL3m

mm

17.0

15.5

4.6

4.4

0.75

0.60

0.48

0.38

24.0

23.6

20.0

19.6

10 2.54

v

0.8

12.2

11.8

1.27

e

2

5.08

2.4

1.6

E

h

6

2.00

1.45

2.1

1.8

3.4

3.1

4.3

12.4

11.0

Qj

0.4w0.03

x

2000 Mar 10 12

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.Amorein-depthaccountofsolderingICscanbe
found in our

“Data Handbook IC26; Integrated Circuit

Packages”

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Thetotalcontacttimeofsuccessivesolder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

DIPPING WAVE

DBS, DIP, HDIP, SDIP, SIL suitable suitable

(1)

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

2000 Mar 10 13

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

NOTES

2000 Mar 10 14

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

NOTES

2000 Mar 10 15

Philips Semiconductors Preliminary specification

4 × 13 W single-ended power amplifiers TDA8511J

NOTES

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable andmaybechanged
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Internet: http://www.semiconductors.philips.com

2000

69

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Printed in The Netherlands 753503/03/pp16 Date of release: 2000 Mar 10 Document order number: 9397 750 06921