Datasheet TDA8446, TDA8446T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8446

Fast RGB/YC switch for digital
decoding

Product specification
Supersedes data of August 1992
File under Integrated Circuits, IC02

Philips Semiconductors

1995 Feb 16

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

FEA TURES

• R, G, B clamped inputs

• Luminance and chrominance difference matrix

• Y-clamped inputs

• Fast switching between internal and external Y

• Chrominance input

• Amplifier with selectable gain

• 3-state switch for chrominance output.

APPLICATIONS

• Digital TV systems

• Desktop video architecture.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

T

amb

ORDERING INFORMATION

supply voltage 10.8 − 13.2 V
operating ambient temperature 0 − +70 °C

DESCRIPTION

The TDA8446 is a video switch which has been designed
for use in Digital Multistandard System Decoders (DMSD)
in digital video system. The device is intended for matrixing
incoming RGB signals and for switching between
luminance signals. It generates a SYNC signal and TTL
clamping pulses from any video signal with sync pulses.

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA8446 DIP20 plastic dual in-line package; 20 leads; (300 mil) SOT146-1
TDA8446T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

PACKAGE

1995 Feb 16 2

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

BLOCK DIAGRAM

Fig.1 Block diagram (TDA8446).

1995 Feb 16 3

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

PINNING

SYMBOL

SOUT 1 1 synchronization signal output; this output provides the synchronization information

SIN 2 2 synchronization signal input; CSYNC or CVBS signal from the peri-connector
CCL 3 3 clamping capacitor connection; the clamping pulse is generated by external circuitry

n.c. − 4 not connected
CLO 4 5 clamping pulse output
n.c. − 6 not connected
BIN 5 7 B-signal input
GIN 6 8 G-signal input
RIN 7 9 R-signal input
SW1 8 10 clamping control signal input; this TTL signal is used to select the clamp signal, a LOW

n.c. − 11 not connected
CLI 9 12 clamping pulse input; this TTL signal indicates the black level clamping period for the

CIN 10 13 chrominance signal input
COUT 11 14 chrominance signal output
YIN 12 15 luminance signal input; this input also accepts the CVBS signal
FS 13 16 fast switching signal input; this signal is used to control fast switching of the luminance

n.c. − 17 not connected
n.c. − 18 not connected
SW2 14 19 gain control signal input; this TTL signal is used to set the gain of the chrominance

n.c. − 20 not connected

−(R-Y) 15 21 −(R−Y) signal output
YOUT 16 22 luminance signal output

−(B−Y) 17 23 −(B−Y) signal output
n.c. − 24 not connected
n.c. − 25 not connected
V

CC

VINT 19 27 internal decoupling
V

EE

PIN

DESCRIPTION

DIP20 SO28

extracted from the incoming signal at pin 2 (SIN).

connected to this pin, the generated pulse clamps the RGB inputs.

level at this input forces the circuit to output the generated clamping pulse.

incoming Y signal (active-HIGH).

signals, a HIGH level at this input forces the circuit to output the internal Y signal.

amplifiers (A), a LOW level at this input forces the gain A to 6 dB (HIGH forces to 0 dB).

18 26 positive supply voltage (+12 V)

20 28 ground

1995 Feb 16 4

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

Fig.2 Pin configuration (DIP20). Fig.3 Pin configuration (SO28).

1995 Feb 16 5

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

V

I

T

stg

HANDLING

Each pin will withstand the ESD test in accordance with MIL-STD-883C class 2 (2000 V to 2999 V). Method 3015
(Human body model: R = 1500 Ω; C = 100 pF) 3 pulses positive and 3 pulses negative on each pin as a function of
ground. The IC will withstand 500 V in accordance with UZW-BO/FQ-B302 (Machine model: R = 0 Ω; C = 200 pF;
L = 2.5 µH) 3 pulses positive and 3 pulses negative.

OPERATING CHARACTERISTICS

supply voltage −0.3 +14 V
input voltage −0.3 +12.3 V
storage temperature −55 +125 °C

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

Supply/temperature

V

CC

T

amb

supply voltage 10.8 − 13.2 V
operating ambient temperature 0 − +70 °C

TTL inputs (SW1, SW2 and CLI)

V

IH

V

IL

HIGH level input voltage 2 − V

CC

LOW level input voltage −0.3 − +0.8 V

V

SYNC signal (SIN)

V

S(p-p)

sync amplitude (peak-to-peak value) 0.2 − 2.5 V

Fast Switching input (FS)

V

IH

V

IL

HIGH level input voltage 1 − 3V
LOW level input voltage 0 − 0.4 V

Video inputs (RIN, GIN, BIN, CIN, YIN)

V

i(p-p)

video amplitude on RIN, GIN and BIN inputs

− 0.7 1 V

(peak-to-peak value)

C

I

input capacitance − 100 − nF

Clamping pulse generator (CCL)

R
C

clamp
clamp

clamping resistance − 4.7 − kΩ
clamping capacitance − 1 − nF

1995 Feb 16 6

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

CHARACTERISTICS

V

=12V; T

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

CC

SVRR supply voltage rejection ratio note 1 30 −− dB

Y and R, G, B channels

I

CL

I

I

G

A

G

B

∆G

diff

|∆G| maximum gain variation 100 kHz < f
R

O

∆t time difference at output f
V

O

t

fsd

t

fs

I

IFS

Chrominance channel (CIN, COUT)

R

i

V

O

G

A

|∆G| maximum gain variation 100 kHz < f
α

off

Z

o

R

o

TTL inputs (SW1, SW2, CLI)

I

IH

I

IL

=25°C; unless otherwise specified.

amb

supply current −−75 mA

input clamping current VCC=6V; VI=0V 0.3 −− mA
input current VI=9V −1.5 +0.5 +1.5 µA
gain of amplifier A fi= 1 MHz; V

= 1 MHz; V

f

i

=2V −1 0 +1 dB

SW2

= 0.8 V 5 6 7 dB

SW2

gain of amplifier B fi= 1 MHz −1 0 +1 dB
RGB matrixed according to the

following equations:

Y = 0.30R + 0.59G + 0.11B
R−Y = 0.70R − 0.59G − 0.11B
B−Y=−0.30R − 0.59G + 0.89B

relative gain difference note 2 − 010 %

< 8 MHz − 3 − dB

i

output resistance − 15 −Ω

= 1 MHz; note 3 −−25 ns

i

DC output level V

=6V − 4.2 − V

CCL

fast switching delay see Fig.4 − 20 − ns
fast switching time see Fig.4 − 10 − ns
input current on fast switching

control (pin 13)

VI= 0.4 V − 0.7 −µA

=1V − 0.5 −µA

V

I

internal input resistance − 50 − kΩ
DC output level II=0 − 5 − V
gain of amplifier A fi= 1 MHz; V

= 1 MHz; V

f

i

isolation (off state) fi= 5 MHz; V
output impedance V

SW1=VSW2

SW1=VSW2

= 0.8 V 5 6 7 dB

SW2

< 8 MHz − 3 − dB

i

SW1=VSW2

= 0.8 V 100 −− kΩ

=2V −1 0 +1 dB

= 0.8 V − 60 − dB

output resistance − 7 −Ω

HIGH level input current VIH=2V −−10 µA
LOW level input current VIL= 0.8 V −−−600 µA

1995 Feb 16 7

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Clamp output (CLO)

V

OL

V

OH

Synchronization channel (SOUT)

V

o(p-p)

Notes

1. Supply voltage rejection ratio =

2. The relative gain difference is measured when only one input signal (R, G or B) is present.

3. The inputs RIN, GIN and BIN are interconnected; ∆t is the maximum time coincidence error between the luminance
and the chrominance signals.

LOW level output voltage IOL=2mA −−0.4 V
HIGH level output voltage IOH=10µA 2.4 −− V

output amplitude

0.2 − 1.5 V

(peak-to-peak value)

V

20log

RCC()

------------------­V

RO()

Fig.4 Fast switching times.

1995 Feb 16 8

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

APPLICATION INFORMATION

Fig.5 Typical application circuit.

1995 Feb 16 9

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

PACKAGE OUTLINES

DIP20: plastic dual in-line package; 20 leads (300 mil)

D

seating plane

L

Z

20

pin 1 index

e

b

SOT146-1

M

E

A

2

A

A

1

w

b

1

11

M

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A 

A 

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE
VERSION

SOT146-1

1 2

min.

max.

1.73

1.30

0.068

0.051

IEC JEDEC EIAJ

  SC603

b

b

1

0.53

0.38

0.021

0.015

0.36

0.23

0.014

0.009

REFERENCES

cD E e M

(1) (1)

26.92

26.54

1.060

1.045

1995 Feb 16 10

6.40

6.22

0.25

0.24

10

(1)

M

e

L

1

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

H

E

10.0

0.2542.54 7.62

8.3

0.39

0.010.10 0.30

0.33

ISSUE DATE

w

92-11-17
95-05-24

Z

max.

2.04.2 0.51 3.2

0.0780.17 0.020 0.13

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

pin 1 index

1

e

15

14

w

b

p

M

SOT136-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v

M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

(1)E(1) (1)

cD

18.1

7.6

7.4

0.30

0.29

1.27

0.050

17.7

0.71

0.69

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE
VERSION

SOT136-1

IEC JEDEC EIAJ

075E06 MS-013AE

REFERENCES

1995 Feb 16 11

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

91-08-13
95-01-24

o

8

o

0

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

SOLDERING
Plastic dual in-line packages

Y DIP OR WAVE

B
The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron below the seating plane

(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.

Plastic small outline packages

YWAVE

B
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

Y SOLDER PASTE REFLOW

B
Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

R

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.59+

1995 Feb 16 12

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1995 Feb 16 13

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

NOTES

1995 Feb 16 14

Philips Semiconductors Product specification

Fast RGB/YC switch for digital decoding TDA8446

NOTES

1995 Feb 16 15

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533061/1500/01/pp16 Date of release: 1995 Feb 16
Document order number: 9397 750 00009

Philips Semiconductors