Datasheet TDA8444T-N4, TDA8444P-N4, TDA8444AT-N4 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of March 1991
File under Integrated Circuits, IC01

1999 Apr 29

INTEGRATED CIRCUITS

TDA8444; TDA8444T;
TDA8444AT

Octuple 6-bit DACs with I

2

C-bus

1999 Apr 29 2

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

FEATURES

• Eight DACs with 6-bit resolution

• Adjustable common output swing

• Push-pull outputs

• Outputs short-circuit protected

• Three programmable slave address bits

• Large supply voltage range

• Low temperature coefficient.

GENERAL DESCRIPTION

The interface circuit is a bipolar IC in a DIP16, SO16, or
SO20 package made in an I2L-compatible 18 V process.

The TDA8444 contains eight programmable 6-bit DAC
outputs, an I

2

C-bus slave receiver with three (two for

SO16) programmable address bits and one input (V

MAX

) to
set the maximum output voltage. Each DAC can be
programmed separately by a 6-bit word to 64 values, but
V

MAX

determines the maximum output voltage for all

DACs. The resolution will be approximately1⁄64V

MAX

.

At power-on all DACs are set to their lowest value.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

supply voltage 4.5 12 13.2 V

I

CC

supply current VCC=12V − 14 − mA
P power dissipation − 170 − mW
V

VMAX

input effective voltage 1 − VCC− 2.0 V
V

o(DACn)

DAC output voltage V

MAX=VCC

0.1 − VCC− 0.5 V

V

o(DACn)(max)

maximum DAC output voltage 1 < V

MAX<VCC

− 2.0 − V

MAX

+ 0.3 − V

I

source(min)

minimum DAC source current data = 1FH 2 −−mA
I

sink(min)

minimum DAC sink current data = 1FH 2 −−mA

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA8444 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TDA8444T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
TDA8444AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1999 Apr 29 3

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGH513

REFERENCE

VOLTAGE

GENERATOR

DAC0

DAC0

9

DAC1

DAC1

10

DAC2

DAC2

11

DAC3

DAC3

12

DAC4

DAC4

13

DAC5

DAC5

14

DAC6

DAC6

15

DAC7

DAC7

16

A0 A1 A2

567

18

SDA

SCL

3
4

V

MAX

2

V

CC

V

EE

TDA8444

I2C BUS

SLAVE RECEIVER

1999 Apr 29 4

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

PINNING

SYMBOL

PIN

DESCRIPTION

TDA8444

(DIP16)

TDA8444T

(SO16)

TDA8444AT

(SO20)

V

CC

1 1 1 supply voltage

V

MAX

2 2 2 control input for DAC maximum output voltage

SDA 3 3 3 I

2

C-bus serial data input/output

SCL 4 4 4 I

2

C-bus serial clock

A0 5 6 7 programmable address bit 0 for I

2

C-bus slave receiver

A1 6 7 8 programmable address bit 1 for I

2

C-bus slave receiver

A2 7 − 9 programmable address bit 2 for I

2

C-bus slave receiver

V

EE

8 8 10 ground
DAC0 9 9 11 analog voltage output 0
DAC1 10 10 13 analog voltage output 1
DAC2 11 11 14 analog voltage output 2
DAC3 12 12 15 analog voltage output 3
DAC4 13 13 16 analog voltage output 4
DAC5 14 14 17 analog voltage output 5
DAC6 15 15 18 analog voltage output 6
DAC7 16 16 20 analog voltage output 7
n.c. − 5 5, 6, 12, 19 not connected

Fig.2 Pin configuration (TDA8444; DIP16).

handbook, halfpage

TDA8444

MGH512

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

V

EE

DAC0

A2 DAC1

A1 DAC2

DAC3

DAC4

DAC5

DAC6

DAC7

A0

SCL

SDA

V

MAX

V

CC

Fig.3 Pin configuration (TDA8444T; SO16).

handbook, halfpage

TDA8444T

MGL531

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

V

EE

DAC0

A1 DAC1

A0 DAC2

DAC3

DAC4

DAC5

DAC6

DAC7

n.c.

SCL

SDA

V

MAX

V

CC

1999 Apr 29 5

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

Fig.4 Pin configuration (TDA8444AT; SO20).

handbook, halfpage

TDA8444AT

MGL532

1
2
3
4
5
6
7
8
9

10

V

CC

V

MAX

SDA

SCL

n.c.
n.c.

A0
A1
A2

V

EE

DAC7
n.c.
DAC6
DAC5
DAC4
DAC3
DAC2
DAC1
n.c.
DAC0

20
19
18
17
16
15
14
13
12
11

FUNCTIONAL DESCRIPTION
I

2

C-bus interface

The I2C-bus interface is a receive-only slave, which accepts data according the format shown in Table 1.

Table 1 I

2

C-bus format (see note 1)

Note

1. S = START condition; A2 to A0 = programmable address bits; A = Acknowledge; I3 to I0 = Instruction bits;
SD to SA = subaddress bits; X = don’t care; D5 to D0 = data bits; P = STOP condition.

Valid addresses are:

TDA8444 and TDA8444AT: 40H, 42H, 44H, 46H, 48H, 4AH, 4CH and 4EH
TDA8444T: 48H, 4AH, 4CH and 4EH (A2 is always logic 1).

All other addresses cannot be acknowledged by the circuit. The actual slave address depends on the programmable
address bits A2, A1 and A0. This way up to eight circuits can be used on one I

2

C-bus.

Valid instructions are: 00H to 0FH; F0H to FFH.

S 0 1 0 0 A2 A1 A0 0 A I3 I2 I1 I0 SD SC SB SA A X X D5 D4 D3 D2 D1 D0 A P

1999 Apr 29 6

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

The circuit will not react to other combinations of the
4 instruction bits I3 to I0 than 0 or F, but will still generate
an acknowledge. The difference between
instruction 0 and F is only important when more than one
data byte is sent within one transmission. Instruction 0
causes the data bytes to be written into the DAC-latches
with consecutive subaddresses starting with the
subaddress given in the instruction byte (auto-increment of
subaddress), while instruction F will cause a consecutive
writing of the data bytes into the same DAC-latch whose
subaddress was given in the instruction byte. In case of
only one data byte the DAC-latch with the subaddress
equal to the subaddress in the instruction byte will receive
the data.

Valid subaddresses are: 0H to 7H.
The subaddresses correspond to DAC0 to DAC7.

The Auto-Increment (AI) function of instruction 0,
however, works on all possible subaddresses 0 to F in
such a way that next to subaddress F, subaddress 0 will
follow, and so on.

The data will be latched into the DAC-latch on the
positive-going edge of the acknowledge related clock
pulse.

The specification of the SCL and SDA I/O meets the
I2C-bus specification. For protection against positive
voltage pulses on pins 3 and 4, zener diodes are

connected between these pins and VEE. This means that
normal bus line voltage should not exceed 5.5 V.

The address inputs A0, A1 and A2 can be easily
programmed by either a connection to VEE (An = 0) or V

CC

(An = 1). If the inputs are left floating the result will be
An = 1.

V

MAX

The V

MAX

input gives a means of compressing the DAC
output voltage swing. The maximum DAC output voltage
will be equal to V

MAX+VDAC(min)

, while the 6-bit resolution
is maintained. This enables a higher voltage resolution for
smaller output swings.

DACs

The DACs consist of a 6-bit data-latch, current switches
and an opamp. The current sources connected to the
switches have values with weights 2

0

to 25. The sum of the
switched on currents is converted by the opamp into a
voltage between approximately 0.5 and 10.5 V if
V

MAX=VCC

= 12 V. The DAC outputs are short-circuit
protected against VCC and VEE. Capacitive load on the
DAC outputs should not exceed 2 nF in order to prevent
possible oscillations at certain levels. The temperature
coefficient for each of the outputs remains in all possible
conditions well below 0.1 LSB per Kelvin.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611-E”

.

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

supply voltage −0.5 +18 V

I

CC

supply current −10 +40 mA

P

(max)

maximum power dissipation − 500 mW

V

i(n)

input voltage −0.5 +5.9 V

pins SDA and SCL −0.5 +5.9 V
pins V

MAX

, A0 to A2 and DAC0 to DAC7 −0.5 VCC+ 0.5 V

I

n

current in all pins except VCC and V

EE

−±10 mA

T

stg

storage temperature −65 +150 °C

T

amb

operating ambient temperature −20 +70 °C

1999 Apr 29 7

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

THERMAL CHARACTERISTICS

Note

1. When mounted on a Printed-Circuit Board (PCB).

CHARACTERISTICS

V

CC

= 12 V; T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

TDA8444 75 K/W
TDA8444T note 1 100 K/W
TDA8444AT note 1 85 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CC

supply voltage 4.5 12 13.2 V

I

CC

supply current V

MAX=VCC

=12V;

data = 00H

12 14 19 mA

P power dissipation − 170 250 mW
V

rst

power reset voltage 1 − 4V

Pin V

MAX

V

i(VMAX)

input effective voltage 1 − VCC− 2.0 V

I

i

input current V

MAX=VCC

−−10 µA

V

MAX

=1V −−10 µA

Pins SDA and SCL

V

I

input voltage 0 − 5.5 V

V

IL

LOW-level input voltage −−1.0 V

V

IH

HIGH-level input voltage 3.0 −−V

I

IL

LOW-level input current V

SDA=VSCL

= −0.3 V −−−10 µA

I

IH

HIGH-level input current V

SDA=VSCL

=6V −−±10 µA
PIN SDA
V

OL

LOW-level output voltage IL=3mA −−0.4 V

I

o(sink)

output sink current 3 8 − mA

Address bits (A0 to A2)

V

I

input voltage 0 − V

CC

V

V

IL

LOW-level input voltage −−1.0 V

V

IH

HIGH-level input voltage 2.2 −−V

I

IL

LOW-level input current VAn=V

EE

−10 −15 −µA

I

IH

HIGH-level input current VAn=V

CC

−−1µA

1999 Apr 29 8

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

Note

1. The output voltage is typically: with V

swing=Vo(3FH)

− V

o(00H)

for V

MAX=VCC

.

DACs (DAC0 to DAC7)

V

o

DAC output voltage V

MAX=VCC

0.1 − VCC− 0.5 V

V

o(min)

minimum output voltage data = 00H;

IL= −2mA

0.1 0.28 0.5 V

V

o(max)

maximum output voltage data = 3FH;

IL= −2mA

V

MAX=VCC

10.0 10.5 11.5 V

1<V

MAX

<10V − note 1 − V

I

o(sink)

output sink current V

DAC=VCC

;

data = 1FH

2815mA

I

o(source)

output source current V

DAC=VEE

;

data = 1FH

−2 −−6mA

Z

o

output impedance −2 ≤ IL≤ +2 mA;

data = 1FH

− 450Ω

DNL differential non-linearity V

MAX=VCC

;

IL= −2mA

−−±0.5 LSB

INL integral non-linearity V

MAX=VCC

;

IL= −2mA

−−±0.5 LSB

∆G

FS

DC gain match at full-scale data = 3FH;

IL= −2mA

−−5%

∆G/∆data DC gain versus other DAC

data change

data = 3FH;
I

L

= −2mA

− <±0.5 − LSB

TC temperature coefficient data = 3FH;

I

L

= −2mA

− <±0.1 − LSB/K

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

swing

V

CC

2.0–()

------------------------------- -

V

MAXVo00H()

+×

1999 Apr 29 9

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

TEST AND APPLICATION INFORMATION

Fig.5 DAC output voltage as a function of

programmed value.

VCC=12V.

handbook, halfpage

0

00 05 0F0A

MGH514

4

8

12

14 19 1E 23 28 2D 32 37 3C 3F

data (hex)

V

O(DAC)

(V)

V

MAX

= 12 V

V

MAX

= 10 V

V

MAX

= 6 V

V

MAX

= 1 V

Fig.6 DAC output voltage as a function of

programmed value.

V

MAX=VCC

.

handbook, halfpage

0

00 05 0F0A

MGL533

4

8

12

14 19 1E 23 28 2D 32 37 3C 3F

data (hex)

V

O(DAC)

(V)

VCC = 12 V

VCC = 8 V

VCC = 5 V

1999 Apr 29 10

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

cEe M

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

92-10-02
95-01-19

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15

0.021

0.015

0.013

0.009

0.010.100.0200.19

050G09 MO-001AE

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

16

1

9

8

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

1999 Apr 29 11

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

8

16

w M

b

p

D

detail X

Z

e

9

1

y

0.25

075E03 MS-013AA

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.41

0.40

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

95-01-24
97-05-22

1999 Apr 29 12

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

UNIT

A

max.

A

1

A2A3b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

1999 Apr 29 13

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Apr 29 14

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1999 Apr 29 15

Philips Semiconductors Product specification

Octuple 6-bit DACs with I2C-bus

TDA8444; TDA8444T;

TDA8444AT

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1999 SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Printed in The Netherlands 545002/750/03/pp16 Date of release: 1999 Apr 29 Document order number: 9397 750 04699