Datasheet TDA8444 Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA8444

Octuple 6-bit DAC with I

Product speciﬁcation File under Integrated Circuits, IC01

C-bus

March 1991

Page 2

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

GENERAL DESCRIPTION

The TDA8444 comprises eight digital-to-analogue converters (DACs) each controlled via the two-wire I2C-bus. The DACs are individually programmed using a 6-bit word to select an output from one of 64 voltage steps. The maximum output voltage of all DACs is set by the input V

and the resolution is approximately V

max

At power-on all DAC outputs are set to their lowest value. The I2C-bus slave receiver has a 7-bit address of which 3 bits are programmable via pins A0, A1 and A2.

Features

• Eight discrete DACs

C-bus slave receiver

• I

• 16-pin DIL package.

QUICK REFERENCE DATA

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage V Supply current no loads; V

all data = 00 I

Total power dissipation no loads; V

all data = 00 P

Effective range of

input VP= 12 V V

max

DAC output voltage

range V

Step value of 1 LSB V

max

/64.

max

= VP;

max

= VP;

max

= VP;

= −2 mA V

tot

max

LSB

TDA8444

10.8 12.0 13.2 V

81215mA

− 150 − mW

1 − 10.5 V

0.1 − VP−0.5 V

70 160 250 mV

PACKAGE OUTLINE

16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 23.

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

TDA8444

Fig.1 Block diagram.

PINNING

PIN SYMBOL DESCRIPTION

1V 2V

3 SDA I

4 SCL I 5A0 6A1 7A2 8 GND ground 9-16 DAC0-7 analogue voltage outputs

P max

positive supply voltage control input for DAC

maximum output voltage

C-bus serial data

input/output

C-bus serial data clock

programmable address bits

C-bus slave receiver

for I

Fig.2 Pinning diagram

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

FUNCTIONAL DESCRIPTION

C-bus

The TDA8444 I2C-bus interface is a receive-only slave. Data is accepted from the I2C-bus in the following format:

S0100A2A1A00AI3I2I1I0SDSCSBSAAXXD5D4D3D2D1D0AP

<----- address byte ----> <----- instruction byte ----> <----- ﬁrst data byte ----> Where: S = start condition A2, A1, A0 = programmable address bits P = stop condition I3, I2, I1, I0 = instruction bits A = acknowledge SD, SC, SB, SA = subaddress bits X = don’t care D5, D4, D3, D2, D1, D0 = data bits

Fig.3 Data format.

Address byte

Valid addresses are 40, 42, 44, 46, 48, 4A, 4C, 4E (hexadec), depending on the programming of bits A2, A1 and A0. With these addresses, up to eight TDA8444 ICs can be operated independently from one I are acknowledged by the TDA8444.

C-bus. No other addresses

TDA8444

Instruction and data bytes

Valid instructions are 00 to 0F and F0 to FF (hexadec); the TDA8444 will not respond to other instruction values. Instructions 00 to 0F cause auto-incrementing of the subaddress (bits SD to SA) when more than one data byte is sent

within one transmission. With auto-incrementing, the first data byte is written into the DAC addressed by bits SD to SA and then the subaddress is automatically incremented by one position for the next data byte in the series.

Auto-incrementation does not occur with instructions F0 to FF. Other than auto-incrementation there is no difference between instructions 00 to 0F and F0 to FF. When only one data byte per transmission is present, the DAC addressed by the subaddress will always receive the data.

Valid subaddresses (bits SD to SA) are 0 to 7 (hexadec) relating numerically to DAC0 to DAC7. When the auto-incrementing function is used, the subaddress will sequence through all possible values (0 to F, 0 to F, etc.).

C-bus

Input SCL (pin 3) and input/output SDA (pin 4) conform to I2C-bus specifications. Pins 3 and 4 are protected against positive voltage pulses by internal zener diodes connected to the ground plane and therefore the normal bus line voltage should not exceed 5.5 V.

The address inputs A0, A1, A2 are programmed by a connection to GND for An = 0 or to VP for An = 1. If the inputs are left floating, An = 1 will result.

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

Input V

Input V voltage is restricted to approximately V

max

(pin 2) provides a means of compressing the output voltage swing of the DACs. The maximum DAC output

max

while the 6-bit resolution is maintained, so giving a finer voltage resolution of

max

TDA8444

smaller output swings.

Digital-to-analogue converters

Each DAC comprises a 6-bit data latch, current switches and an output driver. Current sources with values weighted by

up to 25 are switched according to the data input so that the sum of the selected currents gives the required analogue

voltage from the output driver. The range of the output voltage is approximately 0.5 to 10.5 V when V

max

= VP. The DAC outputs are protected against short-circuits to VP and GND. To avoid the possibility of oscillations, capacitive loading at the DAC outputs should not exceed 2 nF.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

PARAMETER SYMBOL MIN. MAX. UNIT

Supply voltage V Supply current (source) I

I2C-bus line voltage V Input voltage V Output voltage V Maximum current on any pin (except pins 1 and 8) ±I Total power dissipation P Operating ambient temperature range T Storage temperature range T

P P

= V

= I = I

3,4 I O

max tot amb stg

1 1 I

−0.5 18 V

−−10 mA

− 40 mA

−0.5 5.9 V

−0.5 VP+ 0.5 V

− 10 mA

− 500 mW

−20 +70 °C

−55 +150 °C

THERMAL RESISTANCE

From junction to ambient R

March 1991 5

th j-a

75 K/W

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

CHARACTERISTICS

All voltages are with respect to GND; T

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage V Voltage level for power-on

reset Supply current no loads; V

all data = 00

Total power dissipation no loads; V

all data = 00

Effective range of

input (pin 2)

max

Pin 2 current V

VP = 12 V V

= 1 V I

= VP I

SDA, SCL inputs (pins 3 and 4) Input voltage range V

Input voltage LOW V Input voltage HIGH V Input current LOW V Input current HIGH V

3;4 3;4

SDA output (pin 3) Output voltage LOW I

= 3 mA V

Sink current I Address inputs (pins 5 to 7) Input voltage range V

Input voltage LOW V Input voltage HIGH V Input current LOW I Input current HIGH I

=25°C; VP = 12 V unless otherwise speciﬁed

amb

= VP;

max

= VP;

max

= 0.3 V I = 6 V I

IP = I

tot

max

2 2

I IL

IH IL IH

OL OL

IH IL IH

= V

TDA8444

10.8 12.0 13.2 V 1 − 4.8 V

8 1215mA

− 150 − mW

1.0 − 10.5 V

−−−10 µA

−−10 µA

0 − 5.5 V

−−1.5 V

3.0 −−V

−−−10 µA

−−±10 µA

−−0.4 V

38−mA

05V

−−1V

2.1 −−V

−−7−12 µA

−−1µA

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

DAC outputs (pins 9 to 16)

Output voltage range V Minimum output voltage data = 00; I Maximum output voltage data = 3F; I

at Vmax = VP V

at 1 < Vmax < 10.5 V V Output sink current V = V Output source current V = 0 V; data = 1F I Output impedance data = 1F;

-2 < I

Step value of 1 LSB V Deviation from linearity I Deviation from linearity I

= VP; IO = -2 mA V

max

= -2 mA; N ≠ 32 0 − 50 mV

= -2 mA; N = 32 0 − 70 mV

Note to the Characteristics

1. VO = 0.95 V

max

+ V

Omin

= −2 mA VOmin 0.1 0.4 0.8 V

= −2 mA

; data = 1F I

< +2 mA

O O

Omax Omax

LSB

TDA8444

0.1 − VP− 0.5 V

10 10.5 11.5 V

see note 1 V

2 8 15 mA

−2 −−6mA

− 450Ω

70 160 250 mV

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

APPLICATION INFORMATION

TDA8444

Fig.4 Graph showing output voltage as a function of the input data value for V

VP = 12 V.

March 1991 8

values of 1, 6, 10 and 12 V;

max

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

seating plane

w M

TDA8444

SOT38-1

(e )

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

4.7 0.51 3.7

OUTLINE

VERSION

SOT38-1

min.

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

1.40

1.14

0.055

0.045

0.53

0.38

0.021

0.015

REFERENCES

cEe M

0.32

0.23

0.013

0.009

21.8

21.4

0.86

0.84

scale

(1) (1)

6.48

6.20

0.26

0.24

(1)

0.30

0.15

0.13

3.9

3.4

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02 95-01-19

max.

2.2

0.087

March 1991 9

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Philips Semiconductors Product speciﬁcation

Octuple 6-bit DAC with I2C-bus

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact

DEFINITIONS

(order code 9398 652 90011).

TDA8444

with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.

March 1991 10

C components conveys a license under the Philips’ I2C patent to use the