Datasheet TDA8395 Datasheet (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

TDA8395

SECAM decoder

Preliminary speciﬁcation File under Integrated Circuits, IC02

October 1991

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

FEATURES

• Fully integrated filters

• Alignment free

• For use with baseband delay

GENERAL DESCRIPTION

The TDA8395 is a self-calibrating, fully integrated SECAM decoder. The IC should preferably be used in conjunction with the PAL/NTSC decoder TDA8362 or TDA8366 and with the switched capacitor baseband delay circuit TDA4660. The IC incorporates HF and LF filters, a demodulator and an identification circuit (luminance is not processed in this IC). The IC needs no adjustments and very few external components are required. A highly stable reference frequency is required for calibration and a two-level sandcastle pulse for blanking and burst gating.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

tot

16(p-p)

O(p-p)

positive supply voltage; pin 3 7.2 − 8.8 V total power dissipation −−220 mW composite video input voltage

− 1.0 1.5 V

(peak-to-peak value); pin 16

−(R−Y) output voltage amplitude

− 1.05 − V

(peak-to-peak value); pin 9

−(B−Y) output voltage amplitude

− 1.33 − V

(peak-to-peak value); pin 10

ORDERING INFORMATION

PACKAGE

EXTENDED TYPE NUMBER

PINS PIN POSITION MATERIAL CODE

TDA8395 16 DIL plastic SOT38GE1

Note

1. SOT38-1; 1996 December 3.

(1)

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

Fig.2 Pin configuration

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

IDENT 1 reference frequency

ref/

TEST 2 test output V

n.c. 4 not connected n.c. 5 not connected GND 6 ground CLOCHE PLL

ref

−(R−Y) 9 −(R−Y) output

−(B−Y) 10 −(B−Y) output

n.c. 11 not connected n.c. 12 not connected n.c. 13 not connected n.c. 14 not connected SAND 15 sandcastle pulse input CVBS 16 video (chrominance) input

ref

input/identiﬁcation input

3 positive supply voltage

7 Cloche reference ﬁlter 8 PLL reference

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

FUNCTIONAL DESCRIPTION

The TDA8395 is a self-calibrating SECAM decoder designed for use with a baseband delay circuit.

During frame retrace a 4.433619 MHz reference frequency is used to calibrate the filters and the demodulator. The reference frequency should be very stable during this period.

The Cloche filter is a gyrator-capacitor type filter the resonance frequency of which is controlled during the calibration period and offset during scan; this ensures the correct frequency during calibration.

The demodulator is a Phase-Locked Loop (PLL) type demodulator which uses the frequency reference and the bandgap reference to force the PLL to the required demodulation characteristic. The low frequency de-emphasis is matched to the PLL and is controlled by the tuning voltage of the PLL.

A digital identification circuit scans the incoming signal for SECAM (only line-identification is implemented). The identification circuit needs to communicate with the TDA8362 to guarantee that the output signal from the decoder is only available when no PAL signal has been identified. If a SECAM signal is decoded a request for

colour-on is transmitted to pin 1 (current is sunk). If the signal request is granted (i.e. pin 1 is HIGH therefore no PAL) the colour difference outputs (−(B−Y) and −(R−Y)) from the TDA8362 are high impedance and the output signals from the TDA8395 are switched ON.

If no SECAM signal is decoded during a two-frame period the demodulator will be initialized before another attempt is made also during a two-frame period. The CD outputs will be blanked or high-impedance depending on the logic level at pin 1.

A two-level sandcastle pulse generates the required blanking periods and, also, clocks the digital identification pulse on the falling edge of the burst gate pulse. To enable the calibration period to be defined the vertical retrace is discriminated from the horizontal retrace, this is achieved by measuring the width of the blanking period.

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER MIN. MAX. UNIT

stg

amb

positive supply voltage − 8.8 V storage temperature range −25 +150 °C operating ambient temperature range −25 +70 °C

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

CHARACTERISTICS

= 8.0 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin 3)

tot

CVBS input (pin 16) V

16(p-p)

CLOCHE (pin 7) V

B bandwidth 241 268 295 kHz

= 25 °C; unless otherwise speciﬁed

amb

positive supply voltage 7.2 8.0 8.8 V supply current − 18 25 mA total power dissipation − 144 220 mW

composite video input voltage

− 1.0 1.5 V

(peak-to-peak value) chrominance input voltage

note 1 15 − 300 mV

(peak-to-peak value) input impedance note 2 − 15 − kΩ

tuning voltage 2.5 3.5 4.5 V resonance frequency note 3 4.266 4.286 4.306 MHz

Demodulator

V V

td O(p-p)

tuning voltage; pin 8 3.5 − 4.8 V output voltage amplitude

100/75 colour bar 0.97 1.05 1.13 V

(peak-to-peak value); pin 9

O(p-p)

output voltage amplitude

100/75 colour bar 1.23 1.33 1.43 V

(peak-to-peak value); pin 10

NLE non-linearity error 100/75 colour bar;

−−3%

note 4

−(B−Y)/−(R−Y) ratio of −(B−Y) and −(R−Y) 1.23 1.27 1.32 f

be−(R−Y)

be−(B−Y)

black-level error −(R−Y) note 5 −−5 kHz black-level error −(B−Y) note 5 −−7 kHz output voltage level during

− 2.8 − V

blanking

output bandwidth − 1.3 − MHz S/N signal-to-noise ratio note 6 40 −−dB f

pole-frequency LF

77 85 93 kHz

de-emphasis f

p/f0

ratio of pole and zero

− 3 −

frequency V

rh(p-p)

residual harmonic voltage

−−10 mV

(peak-to-peak value) Z

O(e)

output impedance SECAM

pin 1 HIGH −−600 Ω

enabled Z

O(d)

output impedance SECAM

pin 1 LOW 1 −−MΩ

disabled

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Sandcastle pulse

Reference/communication

ref

ref(p-p)

blanking detection level 1.0 1.25 1.5 V

burst gate detection level 3.5 3.85 4.2 V

falling edge of burst gate to

8.5 9.0 9.5 µs

start sync

reference frequency note 7 − 4.4336 − MHz

reference voltage amplitude

0.20 − 0.50 V

(peak-to-peak value)

SECAM enable detection

− 2.8 3.3 V

level; pin 1

SECAM disabled detection

note 8 1.5 2.0 − V

level; pin 1

sink current at SECAM

note 9 − 150 −µA

identiﬁcation; pin 1

Identiﬁcation

identiﬁcation time − 4 − frames H colour on/off hysteresis 3 −−dB

Notes to the characteristics

1. If measured in the burst-period of a blue line.

2. The video input is AC-coupled.

3. During scan.

4. Measured as 100% x (IVuI - IVII) / (IVuI + IVlI); see Fig.3.

5. Converted to input frequency error.

6. Defined as the ratio between the peak-to-peak value of the B−Y component of the demodulated 100/75 colour bar and the peak-to-peak value of the noise.

7. The reference should be stable during frame blanking.

8. The SECAM enable and disable timing should preferably be at the end of the frame blanking.

9. The externally supplied voltage should exceed 0.5 V.

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

Fig.3 Non-linearity definition.

TIMING

Fig.4 Timing waveforms.

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

APPLICATION INFORMATION

The leakage current at pin 8 should be well below 20 nA to meet the specification of the black levels (C8 = 220 nF). The leakage current at pin 7 should be well below 60 nA to meet the specification of the Cloche resonance frequency (C7 = 100 nF).

The capacitors C7 and C8 should be connected to the ground pin as close as possible to the package. If not, this can result in a black level error for both channels.

TEST INFORMATION

The performance of the Cloche filter can be measured at pin 2. The use of a FET-probe is advised for low capacitive loading.

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

seating plane

pin 1 index

w M

SOT38-1

(e )

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

4.7 0.51 3.7

OUTLINE VERSION

SOT38-1

min.

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

1.40

1.14

0.055

0.045

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

21.8

21.4

0.86

0.84

October 1991 9

6.48

6.20

0.26

0.24

0.30

0.15

0.13

3.9

3.4

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

92-10-02 95-01-19

max.

2.2

0.087

(1)

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Philips Semiconductors Preliminary speciﬁcation

SECAM decoder TDA8395

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T be necessary immediately after soldering to keep the temperature within the permissible limit.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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